CN102802365B - Manufacturing method for embedding copper heat sink into circuit board - Google Patents
Manufacturing method for embedding copper heat sink into circuit board Download PDFInfo
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- CN102802365B CN102802365B CN201210306827.6A CN201210306827A CN102802365B CN 102802365 B CN102802365 B CN 102802365B CN 201210306827 A CN201210306827 A CN 201210306827A CN 102802365 B CN102802365 B CN 102802365B
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Abstract
The invention discloses a manufacturing method for embedding a copper heat sink into a circuit board, which comprises the following steps of: a drilling process: drilling a copper heat sink embedding hole on a circuit board subjected to pressing treatment, wherein the rotating speed of a drill bit is controlled to be 20000 revolutions/minute, the board inlet speed is controlled to be 10 inches/minutes, and the board withdraw speed is controlled to be 100 inches/minutes; and an embedding process: installing a milling cutter with a cylindrical end on a milling machine, fixing the circuit board with the copper heat sink embedding hole on the milling machine, placing the copper heat sink into the copper heat sink embedding hole, starting the milling machine, and moving the milling cutter to the copper heat sink required to be pressed, so that the milling cutter presses the copper heat sink downwards in a non-rotating speed mode until a copper sheet is completely embedded into the circuit board. According to the invention, the automation of the embedding pressing process of copper heat sinks can be realized, thereby reducing manpower, increasing the productivity and meeting the mass production requirements.
Description
Technical field
The present invention relates to circuit board production techniques field, particularly relate to a kind of manufacture method copper radiating rib being inlaid into circuit board.
Background technology
The high speed development of modern electronic technology, increasing integrated chip is used in complicated circuit design, and integrated the lot is cast for circuit board simultaneously, and how this dispels the heat and become a larger problem for the assembling of some high performance components in the circuit board.Typically at the surface mount fin of heater element, though such design solves heat dissipation problem, the volume of finished product is increased greatly, be unfavorable for the design requirement of product Highgrade integration and high laminate.Simultaneously can reach great heat radiation effect to reduce small product size, a kind of by copper sheet the theory be embedded in circuit board just arise at the historic moment.
The patent No. is ZL200910041004.3, in the manufacture method of the applying date for a kind of circuit board disclosed in 9 days July in 2009, the copper sheet pressing flow process of its design is manual operation, the method realizes manual pressing by aerostatic press and mould, not only need a large amount of manpower, production capacity is low simultaneously, is difficult to meet volume production demand.
Summary of the invention
Based on this, for the problems referred to above, the present invention proposes a kind of manufacture method copper radiating rib being inlaid into circuit board, and the process for pressing of inlaying of copper radiating rib can be made to realize automation, reduces manpower, increases production capacity and meets volume production demand.
Technical scheme of the present invention is: a kind of manufacture method copper radiating rib being inlaid into circuit board, comprises the following steps:
Drilling operating, the circuit board after the process of pressing plate operation bores and hits copper radiating rib embedded hole, and controlling to bore the rotating speed chewed is 20000 revs/min, and entering plate speed is 10 inch per minute clocks, and moving back plate speed is 100 inch per minute clocks;
Mosaic procedure, be that columniform milling cutter is installed on milling machine by end, again the circuit board with copper radiating rib embedded hole is fixed on milling machine, copper radiating rib is positioned in copper radiating rib embedded hole, start milling machine, milling cutter moves to the copper radiating rib place needing pressing, milling cutter without the downward pressing copper radiating rib of rotating speed until copper sheet is inlaid into circuit board completely.
As a kind of preferred implementation, in drilling operating, described pressing plate operation refers to: by core material, prepreg and outermost layer substrate by heat pressing process and cold-press process pressing, and wherein hot pressing time is 180min, system vacuumizes absolute pressure 20000Pa, and control platen pressure is 5.265Kgf/cm
2-25.207Kgf/cm
2, temperature is 150 DEG C-200 DEG C, and the time of colding pressing is 60min, Stress control 132.6Kgf/cm
2, temperature is 20 DEG C.Can make the precision controlling of circuit board thickness after pressing plate in ± 3%.
As a kind of preferred implementation, before mosaic procedure, further comprising the steps of:
Copper facing operation, carry out except glue, electroless copper, electric plating of whole board, Graphic transitions, graphic plating, etching successively to the circuit board after drilling operating process, wherein, the copper that electric plating of whole board and graphic plating produce is thick is that the total copper of plating is thick, and to electroplate total copper thick be 30 μm-40 μm.The thickness distribution of circuit board can be made even, so that inlay process for pressing to follow-up copper radiating rib to provide condition more easily.
As a kind of preferred implementation, in mosaic procedure, further comprising the steps of: control milling cutter without the downward pressing copper sheet of rotating speed, the pressure that copper sheet surface integral is subject to is 0.3MPa-0.6MPa, and the time controlling to be inlaid into completely from milling cutter ends contact copper sheet to copper sheet circuit board is no more than 5 seconds.Efficient, stable the inlaying of copper radiating rib can be made to enter in circuit board.
In drilling operating, each copper radiating rib embedded hole is chewed by brill and point to be drilled to for three times, and the ratio of three drilling depths is 30%:40%:30%.The burr that can prevent from easily occurring when drilling through large aperture, the breaking of rod such as to chew at the defect, easily control and the aperture consistency got out is high.
The invention has the beneficial effects as follows:
(1) process for pressing of inlaying of copper radiating rib can be made to realize automation, reduce manpower, increase production capacity and meet volume production demand;
(2) milling cutter of milling machine is improved again, the end of milling cutter is made into cylindrical, just effectively the function of milling machine and press can be integrated in one, reach pressing effect;
(3) by controlling the parameter of pressing plate, boring, copper facing, mosaic procedure, making the thickness of slab of circuit board even, facilitating later stage damascene structure, particularly larger copper radiating rib is inlayed, can accurate positioning be ensured, in conjunction with effective, plate surface evenness is high, and flexural deformation is little.
Accompanying drawing explanation
Fig. 1 is the process chart of the embodiment of the present invention;
Fig. 2 is milling cutter construction comparison diagram before and after improving in the embodiment of the present invention;
Fig. 3 is the structural representation being inlaid into copper radiating rib in circuit board in the embodiment of the present invention;
Fig. 4 is the pressing schematic diagram in the embodiment of the present invention, copper radiating rib being inlaid into circuit board;
Fig. 5 is that schematic diagram of holing for three times is divided in the position of damascene copper fin in embodiment of the present invention circuit board;
Fig. 6 is that the contact resistance of copper radiating rib and the circuit board internal layer inlayed in the embodiment of the present invention tests schematic diagram.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the invention are described in detail.
Embodiment:
Be that the copper radiating rib of 8.2 ± 0.005mm and 10.2 ± 0.005mm is as embodiment to inlay diameter on the thick pcb board of 1.7mm.Fig. 1 is the technological process of the complete circuit plate manufacture that the present embodiment adopts.Fig. 2 is milling cutter construction comparison diagram before and after improving in the embodiment of the present invention.Fig. 3 is the structural representation being inlaid into copper radiating rib in circuit board in the embodiment of the present invention, and the diameter of copper radiating rib can between 8mm-12mm.The diameter of the copper radiating rib used in the present embodiment is 8.2 ± 0.005mm and 10.2 ± 0.005mm, two kinds of specifications.
Below in conjunction with Fig. 1, describe embodiments of the present invention in detail, wherein core material making, wet green oil, surface treatment are traditional handicraft, only briefly outline the method used in the present embodiment, but be not limited to the method adopted in this embodiment at this.
As shown in Figure 1, a kind of manufacture method copper radiating rib being inlaid into circuit board
Step S101, the production process of core material, at the one or both sides of insulating substrate coated with Copper Foil, utilizes the film to expose, and has etched the technology of conductive pattern transfer.
Step S102, drilling operating, the circuit board after the process of pressing plate operation bores and hits copper radiating rib embedded hole, and controlling to bore the rotating speed chewed is 20000 revs/min, and entering plate speed is 10 inch per minute clocks, and moving back plate speed is 100 inch per minute clocks.
In drilling operating, each copper radiating rib embedded hole is chewed by brill and point to be drilled to for three times, and the ratio of three drilling depths is 30%:40%:30%.The burr that can prevent from easily occurring when drilling through large aperture, the breaking of rod such as to chew at the defect, easily control and the aperture consistency got out is high.
With the circuit board of copper sheet heat radiation, except normally hole, the position being inlaid into wiring board at copper sheet is also needed to hole in advance.Be directed to macropore and aperture precision requires high situation, the present invention utilizes wammel to chew a point mode for three borings, disposable completing can be avoided well to cause through hole caloric value too much, bore to chew and hold destructible shortcoming with wiring board.1st, the depth scale that 2,3 segmentations are bored is 30%:40%:30%.Fig. 5 gives the boring schematic diagram of aperture at 8mm-12mm.
In this step, the diameter of the copper radiating rib of use has two kinds, 8.2 ± 0.005mm and 10.2 ± 0.005mm.In wiring board corresponding position, the wammel that have employed 8.225mm and 10.225mm is chewed and is holed.Hole tolerance after having bored hole requires it is within ± 0.05mm.
Step S103, pressing plate operation, by core material, prepreg and outermost layer substrate by heat pressing process and cold-press process pressing, wherein hot pressing time is 180min, and system vacuumizes absolute pressure 20000Pa, and control platen pressure is 5.265Kgf/cm
2-25.207Kgf/cm
2, temperature is 150 DEG C-200 DEG C, and the time of colding pressing is 60min, Stress control 132.6Kgf/cm
2, temperature is 20 DEG C.Can make the precision controlling of circuit board thickness after pressing plate in ± 3%.
When operating, core material, prepreg and outermost layer substrate are folded pressing successively.After wherein corresponding technological parameter needs to guarantee pressing, make the thickness of slab precision controlling of wiring board within ± 3%.In the present embodiment, made wiring board design is 1.7mm, and therefore, after pressing plate, its thickness of slab should control between 1.65mm-1.75mm.
Step S104, copper facing operation, carries out except glue, electroless copper, electric plating of whole board, Graphic transitions, graphic plating, etching to the circuit board after drilling operating process, wherein successively, the copper that electric plating of whole board and graphic plating produce is thick is that the total copper of plating is thick, and to electroplate total copper thick be 30 μm-40 μm.The thickness distribution of circuit board can be made even, so that inlay process for pressing to follow-up copper radiating rib to provide condition more easily.
In order to add thick copper layer, certainly a kind of method cited in this step is not only only had, but its obvious feature is: the one-tenth-value thickness 1/10 that on wiring board, the electro-coppering at each position place is thick is all between 30-40 μm, and wherein electro-coppering is thick refers to the thick summation of copper that electric plating of whole board and graphic plating produce.
Step S105, mosaic procedure, be that columniform milling cutter is installed on milling machine by end, diameter 2mm-the 3mm less of the diameter of copper radiating rib embedded hole of columniform milling cutter, again the circuit board with copper radiating rib embedded hole is fixed on milling machine, plug-in unit face (C/S face) milling machine of fitting of circuit board, another side and solder side (S/S face) are placed upward.Copper radiating rib is positioned in copper radiating rib embedded hole, start milling machine, milling cutter moves to the copper radiating rib place needing pressing, milling cutter without the downward pressing copper radiating rib of rotating speed until copper sheet is inlaid into circuit board completely.
In mosaic procedure, also need to control milling cutter without the downward pressing copper sheet of rotating speed, the pressure that copper sheet surface integral is subject to is 0.3MPa-0.6MPa, and the time controlling to be inlaid into completely from milling cutter ends contact copper sheet to copper sheet circuit board is no more than 5 seconds.Efficient, stable the inlaying of copper radiating rib can be made to enter in circuit board.
Inlay in pressing working procedure to copper radiating rib, first need to reequip traditional milling machine, make milling cutter have the function of downward pressing, the shape of milling cutter is also designed to shown in Fig. 2.In the present embodiment, the milling cutter before repacking has rotating speed and terminal-velocity design, and does not have pressing function.To the merit conversion of energy of milling cutter under the so flourishing condition of current automatic technology, to those skilled in the art, almost have no problem, be very easy to realize, belong to prior art, therefore not to repeat here.The topmost depression depths remaining control milling cutter, and depression depths determines according to the thickness of slab of circuit board.Fig. 4 is the pressing schematic diagram in the embodiment of the present invention, copper radiating rib being inlaid into circuit board.Depression depths H equals milling cutter from milling machine horizontal plane platform height H
1deduct wiring board thickness of slab h.
Step S106, the operation of follow-up wet green oil, surface treatment, gong plate, belong to conventional means of the prior art, therefore not to repeat here.
After completing above-mentioned six operations, just can obtain the circuit board that a piece is inlaid with copper radiating rib.
Inventor has carried out some reliability testings to wiring board manufactured in embodiment.As shown in Figure 6, Fig. 6 is that the contact resistance of copper radiating rib and the circuit board internal layer inlayed in the embodiment of the present invention tests schematic diagram.When carrying out reliability testing, adopt the circuit board that the method described in the present invention manufactures, major part all meets Eligibility requirements.Following table is the Reliability Test Data of the circuit board adopting the method for the invention to manufacture.
The above embodiment only have expressed the specific embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (5)
1. copper radiating rib is inlaid into a manufacture method for circuit board, it is characterized in that, comprise the following steps:
Drilling operating, the circuit board after the process of pressing plate operation bores and hits copper radiating rib embedded hole, and controlling to bore the rotating speed chewed is 20000 revs/min, and entering plate speed is 10 inch per minute clocks, and moving back plate speed is 100 inch per minute clocks;
Mosaic procedure, be that columniform milling cutter is installed on milling machine by end, again the circuit board with copper radiating rib embedded hole is fixed on milling machine, copper radiating rib is positioned in copper radiating rib embedded hole, start milling machine, milling cutter moves to the copper radiating rib place needing pressing, milling cutter without the downward pressing copper radiating rib of rotating speed until copper sheet is inlaid into circuit board completely.
2. a kind of manufacture method copper radiating rib being inlaid into circuit board according to claim 1, is characterized in that, in drilling operating, described pressing plate operation refers to:
By core material, prepreg and outermost layer substrate by heat pressing process and cold-press process pressing, wherein hot pressing time is 180min, and system vacuumizes absolute pressure 20000Pa, and control platen pressure is 5.265Kgf/cm
2-25.207Kgf/cm
2, temperature is 150 DEG C-200 DEG C, and the time of colding pressing is 60min, Stress control 132.6Kgf/cm
2, temperature is 20 DEG C.
3. a kind of manufacture method copper radiating rib being inlaid into circuit board according to claim 1 and 2, is characterized in that, before mosaic procedure, further comprising the steps of:
Copper facing operation, carry out except glue, electroless copper, electric plating of whole board, Graphic transitions, graphic plating, etching successively to the circuit board after drilling operating process, wherein, the copper that electric plating of whole board and graphic plating produce is thick is that the total copper of plating is thick, and to electroplate total copper thick be 30 μm-40 μm.
4. a kind of manufacture method copper radiating rib being inlaid into circuit board according to claim 1 and 2, is characterized in that, in mosaic procedure, further comprising the steps of:
Control milling cutter without the downward pressing copper sheet of rotating speed, the pressure that copper sheet surface integral is subject to is 0.3MPa-0.6MPa, and the time controlling to be inlaid into completely from milling cutter ends contact copper sheet to copper sheet circuit board is no more than 5 seconds.
5. a kind of manufacture method copper radiating rib being inlaid into circuit board according to claim 1, is characterized in that, in drilling operating, each copper radiating rib embedded hole is chewed by brill and point to be drilled to for three times, and the ratio of three drilling depths is 30%:40%:30%.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210306827.6A CN102802365B (en) | 2012-08-24 | 2012-08-24 | Manufacturing method for embedding copper heat sink into circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210306827.6A CN102802365B (en) | 2012-08-24 | 2012-08-24 | Manufacturing method for embedding copper heat sink into circuit board |
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| CN102802365A CN102802365A (en) | 2012-11-28 |
| CN102802365B true CN102802365B (en) | 2014-12-17 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103281860A (en) * | 2013-06-13 | 2013-09-04 | 汕头超声印制板（二厂）有限公司 | Heat dissipation conducting circuit board and manufacturing method thereof |
| CN103338593A (en) * | 2013-07-22 | 2013-10-02 | 皆利士多层线路版(中山)有限公司 | Circuit board with large current module and manufacturing method for circuit board |
| CN104105357A (en) * | 2014-07-31 | 2014-10-15 | 开平依利安达电子第三有限公司 | Method of pressing copper block into PCB (Printed Circuit Board) and application thereof |
| CN105407643B (en) * | 2015-12-15 | 2018-04-17 | 皆利士多层线路版(中山)有限公司 | Mount the 6OZ ＆ 12OZ thick copper circuit board manufacturing methods of heat sink |
| CN105430924B (en) * | 2015-12-23 | 2018-03-06 | 皆利士多层线路版(中山)有限公司 | Inlay the preparation method of the high-frequency high-speed wiring board of fin |
| CN108174513B (en) * | 2017-12-28 | 2019-11-08 | 广州兴森快捷电路科技有限公司 | The processing method of wiring board and its processing method, power amplifier slot |
| CN112888181A (en) * | 2020-11-06 | 2021-06-01 | 惠州市盈帆实业有限公司 | Production method of copper-embedded mixed-compression circuit board based on PVC material |
| CN112752445B (en) * | 2020-12-15 | 2022-04-15 | 胜宏科技（惠州）股份有限公司 | Drilling method of circuit board with high aspect ratio |
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| EP0935089A1 (en) * | 1998-02-06 | 1999-08-11 | Suiken Technology Co.,Ltd. | Existing pipe cut-off method, existing pipe slitting method, piping structure, and method for inserting a valve in a line |
| CN101450489A (en) * | 2008-12-25 | 2009-06-10 | 国营红阳机械厂 | Broken membrane numerical-control milling machine stamping device and method |
| CN101600298A (en) * | 2009-07-09 | 2009-12-09 | 皆利士多层线路版(中山)有限公司 | A kind of manufacture method of circuit board |
| CN101652027A (en) * | 2009-09-07 | 2010-02-17 | 皆利士多层线路版(中山)有限公司 | Making process of circuit board with radiation fins |
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2012
- 2012-08-24 CN CN201210306827.6A patent/CN102802365B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0935089A1 (en) * | 1998-02-06 | 1999-08-11 | Suiken Technology Co.,Ltd. | Existing pipe cut-off method, existing pipe slitting method, piping structure, and method for inserting a valve in a line |
| CN101450489A (en) * | 2008-12-25 | 2009-06-10 | 国营红阳机械厂 | Broken membrane numerical-control milling machine stamping device and method |
| CN101600298A (en) * | 2009-07-09 | 2009-12-09 | 皆利士多层线路版(中山)有限公司 | A kind of manufacture method of circuit board |
| CN101652027A (en) * | 2009-09-07 | 2010-02-17 | 皆利士多层线路版(中山)有限公司 | Making process of circuit board with radiation fins |
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| CN102802365A (en) | 2012-11-28 |
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