CN103476234A - Electronic device and method for manufacturing same - Google Patents
Electronic device and method for manufacturing same Download PDFInfo
- Publication number
- CN103476234A CN103476234A CN201310361811XA CN201310361811A CN103476234A CN 103476234 A CN103476234 A CN 103476234A CN 201310361811X A CN201310361811X A CN 201310361811XA CN 201310361811 A CN201310361811 A CN 201310361811A CN 103476234 A CN103476234 A CN 103476234A
- Authority
- CN
- China
- Prior art keywords
- barrier shield
- distance
- height
- electronic installation
- electromagnetic interference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 11
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 6
- 230000004888 barrier function Effects 0.000 claims abstract description 125
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000009434 installation Methods 0.000 claims description 38
- 230000008859 change Effects 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000005764 inhibitory process Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 238000012216 screening Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Images
Abstract
The invention discloses an electronic device and a method for manufacturing the same. The electronic device comprises a substrate, a first element, a second element and a barrier shield. The first element and the second element are both arranged on the substrate. The barrier shield is independently arranged between the first element and the second element for inhibiting the electromagnetic interference that the second element has on the first element.
Description
Technical field
The invention relates to a kind of electronic installation, and particularly relevant for a kind of electronic installation with barrier shield.
Background technology
In recent years, due to the progress of every mechanics of communication, manufacturer, in research and development, while manufacturing electronic installation, generally can pay attention to the problem of electromagnetic interference (Electromagnetic Interference, EMI).Briefly, be arranged on chip, radio-frequency (RF) component or metallic circuit on printed circuit board (PCB) etc., likely be subject to being arranged on the impact of the other electron component electromagnetic interference on same circuit board, cause the integrated circuit running that problem is arranged.Tradition is for preventing the method for electromagnetic interference, normally arranges on chip, radio-frequency (RF) component or the metallic circuit that shielding box covers the wish protection, to stop the electromagnetic interference from from all directions fully.
The structure of traditional shielding box is a structure of container, comprise upper cover and underframe, although can be used as then part (Surface Mounted Device of surface with the contacted underframe of printed circuit board (PCB), SMD) piece, but underframe is usually because material is too soft, structure is too very thin, and easily cause distortion or distortion in the process of transporting.Even distortion or the degree of distortion are slight, SMD produces on line still easily to cause and eats that tin is bad and the problems such as drift more cause conforming product rate to descend when serious.In addition, upper cover part still must produce line by assembling and cover with manual, causes the assembling product time to lengthen.
Moreover, for the design of the shielding box that prevents electromagnetic interference, be surdimensionnement, namely supposed that the interference source of complete the unknown can affect the main electronic component of the wish protection on product, then surrounds its four directions up and down up hill and dale with metal-back.At electromagnetic compatibility (Electromagnetic Compatibility, EMC) in field, it is exactly anti-blocking with leading off processing the topmost two kinds of ways of electromagnetic interference, in the design and debug process of actual case, often can know the source of interference source, as long as make effectively anti-blockingly for this interference source, and need not stop blindly surrounding, can effectively prevent electromagnetic interference and then improving product quality.
Summary of the invention
A kind of method that the object of the present invention is to provide electronic installation and make electronic installation.
In order to solve the above problems, an aspect of of the present present invention is that a kind of electronic installation is being provided, and comprises substrate, the first element, the second element and barrier shield.The first element and the second element are separately positioned on substrate.The barrier shield Independent is placed between the first element and the second element, and in order to shield the electromagnetic interference of the second element to the first element.Wherein, the height of barrier shield be by the first element to the first distance of barrier shield, the second element to the second distance of barrier shield and the second element to the electromagnetic interference value decision of the first element.
According to one embodiment of the invention, wherein aforementioned barrier shield also comprises extension, and extension is from the direction horizontal-extending of past aforementioned first element of an end of aforementioned barrier shield.
According to one embodiment of the invention, wherein aforementioned electronic has a door sill height, and the summation of the length of door sill height and aforementioned extension is substantially equal to an equivalence height of aforementioned barrier shield.
Another aspect of the present invention is that a kind of method of making electronic installation is being provided.Manufacture method comprises: the first element and the second element are set respectively on substrate; Barrier shield independently is set between the first element and the second element; Determine first distance and second element second distance to barrier shield of the first element to barrier shield; The electromagnetic interference value of the first element is obtained to the height equivlent of barrier shield according to the first distance, second distance and the second element.
In sum, see through application the above embodiments, the barrier shield of electronic installation can suppress the electromagnetic interference of main interference source (the second element) to main electronic component (the first element) effectively.Also need not additionally in main electronic component surrounding, screening arrangement all be set in addition, simplify assembling required cost and complexity.
The accompanying drawing explanation
For above and other purpose of the present invention, feature, advantage and embodiment can be become apparent, appended the description of the drawings is as follows:
Fig. 1 is the schematic diagram of the electronic installation that illustrates according to one embodiment of the invention;
Fig. 2 is the graph of a relation of the barrier shield height electromagnetic interference value quenchable with it that illustrate according to one embodiment of the invention;
Fig. 3 is the schematic diagram of the electronic installation that illustrates according to one embodiment of the invention;
Fig. 4 is the graph of a relation of the barrier shield height electromagnetic interference value quenchable with it with extension that illustrate according to one embodiment of the invention;
Fig. 5 is the schematic diagram of the electronic installation that illustrates according to one embodiment of the invention;
Fig. 6 is the contour map of the elevation angle theta electromagnetic interference value quenchable with it that illustrate according to one embodiment of the invention; And
Fig. 7 is the flow chart that barrier shield is set illustrated according to one embodiment of the invention.
Embodiment
Please refer to Fig. 1, Fig. 1 is the schematic diagram of the electronic installation that illustrates according to one embodiment of the invention.As shown in Figure 1, electronic installation 100 comprises substrate 120, the first element 140, the second element 160 and barrier shield 180.Substrate 120 can be printed circuit board (PCB) etc. for the pedestal of various different electronic components is set, and the first element 140 and the second element 160 are the electronic components be separately positioned on substrate 120.The first element 140 and the second element 160 can be the elements such as chip, radio-frequency (RF) component or plain conductor, wherein the first element 140 is main electronic components of wanting to prevent electromagnetic interference, the second element 160 is to produce the element of electromagnetic interference, i.e. main interference source in electronic installation 100.180 of barrier shields are that Independent is placed between the first element 140 and the second element 160, in order to shield the electromagnetic interference of 160 pairs of the first elements 140 of the second element.Barrier shield 180 can be comprised of metal.In the present embodiment, the central point of the first element 140 equates to the distance to barrier shield 180 apart from the central point with the second element 160 of barrier shield 180.
In the process of design protection device; due to the rear protective device that just arranges normally all arranged at all electronic components, therefore can know the relative position of main interference source (as the second element 160) and main electronic component (as the first element 140).Then for the impact of main interference source, between main interference source and main electronic component, a barrier shield independently is set, can effectively shield the electromagnetic interference that main electronic component is subject to, and around noting be used in main electronic component, screening arrangement all is set, shielding box for example is set and covers whole main electronic component, increase extra cost.
Please in the lump with reference to Fig. 2, Fig. 2 is the graph of a relation of the barrier shield height electromagnetic interference value quenchable with it that illustrate according to one embodiment of the invention.If the central point of the first element 140 is d to the relative distance of the second element 160 central points, the height of substrate 120 is hsub, the transverse axis of Fig. 2 is representing the ratio of relative distance d and substrate height hsub, and the longitudinal axis is representing the quenchable electromagnetic interference value of barrier shield 180, and unit is decibel.Curve A 1, A2, A3 are the ratios that represents respectively different barrier shield height h1 and substrate height hsub.
As shown in Figure 2, fixedly the time, can see in curve A 1, A2, A3 the decibels maximum of curve A 3 quenchable electromagnetic interference when the relative distance d of the first element 140 and the second element 160.Furthermore, when the first element 140 with the second element 160 distance when identical, the height h1 of barrier shield 180 and the ratio of substrate height hsub higher (height that is barrier shield is higher), the effect of quenchable electromagnetic interference is better.In other words, the height h1 of barrier shield 180 can be determined by the decibels of the electromagnetic interference of 160 pairs of the first elements 140 of the second element.When the decibels of the electromagnetic interference of 160 pairs of the first elements 140 of the second element is larger, the height h1 that barrier shield 180 is set just needs higher.
In addition, for the same curve, for example curve A 1, and when relative distance d and the substrate height hsub ratio of the first element 140 and the second element 160 are larger, the decibels of barrier shield 180 suppressible electromagnetic interference is less.Furthermore, when second element 160 (main interference source) distance the first element 140 (main electronic component) far away, its electromagnetic interference that can affect also just reduces thereupon, be namely that main interference source impacts main electronic component be not very remarkable, so the decibels of the suppressible electromagnetic interference of barrier shield also just reduce thereupon.In other words, the height h1 of barrier shield 180 can the relative distance d to the central point of the second element 160 determine by the central point of the first element 140, and when relative distance d is larger, the height h1 that barrier shield 180 is set just can reduce, to reduce unnecessary cost.
It is worth mentioning that, although the decibels of higher its suppressible electromagnetic interference of height of barrier shield is just larger, because the height of electronic installation 100 has the door sill height of its certain limitation, so the height of barrier shield can not increase ad lib.Yet, when the height that barrier shield can be set and can't meet the decibels of electromagnetic interference of required inhibition the time, for example in Fig. 2, the ratio as relative distance d and substrate height hsub is 5, be 40 o'clock and want the decibels of the electromagnetic interference of inhibition, can find out that curve A 1, A2, A3 can't be all to obtain the inhibition of 40dB at 5 o'clock at d/hsub.In other words, if obtain the inhibition of 40dB, must continue to increase the height h1 of barrier shield 180, continue to increase barrier shield height h1 and can cause barrier shield 180 to surpass the door sill height of electronic installation 100 regulations.
Please refer to Fig. 3, Fig. 3 is the schematic diagram of the electronic installation that illustrates according to one embodiment of the invention.As shown in Figure 3, electronic installation 200 comprises substrate 120, the first element 140, the second element 160 and barrier shield 220.Wherein barrier shield 220 also comprises extension 222, and an end of extension 222 self-shileding walls 220 is toward the direction horizontal-extending of the first element 140.Extension 222 has length t, if the height of barrier shield 220 is h2, and capable of suppressing electromagnetic interference effect when the height that the capable of suppressing electromagnetic interference effect of barrier shield 220 is substantially equal to barrier shield 180 in Fig. 1 is h1=h2+t.
Please in the lump with reference to Fig. 4, Fig. 4 is the graph of a relation of the barrier shield height electromagnetic interference value quenchable with it with extension that illustrate according to one embodiment of the invention.Similarly, the transverse axis of Fig. 4 is representing that the central point of the first element 140 is to the relative distance d of the second element 160 central points and the ratio of substrate height hsub, and the longitudinal axis is representing the decibels of barrier shield 220 quenchable electromagnetic interference.Curve M 1 is respectively representing to have corresponding identical barrier shield height h2 under with curve L2, curve M 3 with curve L3 with curve L1, curve M 2, has the curve of the barrier shield 220 of different eaves length t.Curve L1, L2, L3 are the ratios that represents respectively different barrier shield height h2 and substrate height hsub from curve M 1, M2, M3.
As shown in Figure 4, in the situation that identical d/hsub (the central point of the first element 140 is identical to the relative distance d of the central point of the second element 160), curve M 1, M2, M3 with t/hsub higher (having longer extension), the decibels of its quenchable electromagnetic interference is than having identical barrier shield height h but lower curve L1, L2, the L3 of t/hsub is also large.Furthermore, have the barrier shield of longer eaves, the height equivlent of its barrier shield is higher, and capable of suppressing electromagnetic interference effect is also just better.
Therefore, when between the first element 140 and the second element 160, barrier shield 220 being set, due to the relative distance d and the substrate height hsub that know between the first element 140 and the second element 160, therefore can, according on the value of the d/hsub on Fig. 4 transverse axis and the longitudinal axis, suppressing the decibels of electromagnetic interference, decide the height h2 of the barrier shield 220 that will arrange and the length t of extension 222.
In other words, if wish arranges the door sill height that the height of barrier shield 220 is greater than electronic installation 200 restrictions, in the time of can reaching door sill height at an end of barrier shield 220, change toward the direction horizontal-extending of the first element 140 and form extension 222, and the script wish that the length t of extension 222 can be barrier shield 220 suppresses the height equivlent of the decibels of electromagnetic interference and deducts door sill height and be worth.In other words, the summation of the length of door sill height and this extension is substantially equal to the height equivlent of this barrier shield.Accordingly, the barrier shield of setting can, when being no more than door sill height, reach the decibels that wish suppresses electromagnetic interference equally.
Please refer to Fig. 5, Fig. 5 is the schematic diagram of the electronic installation that illustrates according to one embodiment of the invention.Electronic installation 300 comprises substrate 320, the first element 340, the second element 360 and barrier shield 380, and wherein the central point of the first element 340 is not identical to the distance of barrier shield 380 with the central point of the second element 360 to the distance of barrier shield 380.Can obtain an elevation angle theta at the central point of the first element 340 and the top of barrier shield 380, when elevation angle theta is larger, represent that the height h3 of barrier shield 380 is higher, capable of suppressing electromagnetic interference effect is better.
Please in the lump with reference to Fig. 6, Fig. 6 is the contour map of the elevation angle theta electromagnetic interference value quenchable with it that illustrate according to one embodiment of the invention.Wherein the relative distance of the central point of the first element 340 and the second element 360 central points is d, the height of substrate 320 is hsub, and the transverse axis of contour map is representing the ratio of relative distance d and substrate height hsub, the longitudinal axis is representing the elevation angle theta of the central point of the first element 340 to the top of barrier shield 380, curve K1, K1 ' represent that capable of suppressing electromagnetic interference decibels is 5, and curve K2, K2 ' represent that capable of suppressing electromagnetic interference decibels is 15.
Similarly, when the relative distance d of the first element 340 and the second element 360, fixedly the time, if elevation angle theta is larger, representing that the height h3 of barrier shield 380 is higher, the decibels of quenchable electromagnetic interference is larger.In other words, elevation angle theta can determine by the decibels of the electromagnetic interference of 360 pairs of the first elements 340 of the second element, and when the decibels of the electromagnetic interference of 360 pairs of the first elements 340 of the second element is larger, the elevation angle theta of required setting is also just larger.
In addition, in the present embodiment, the central point of the first element 340 is not identical to the distance of barrier shield 380 with the central point of the second element 360 to the distance of barrier shield 380.If the central point of the first element 340 is a to the distance of barrier shield 360, the central point of the second element 360 can have a relative scale r with distance a to the distance of barrier shield 380, namely the central point of the second element 360 is ra to the distance of barrier shield 380, wherein (1+r) a=d.
As shown in Figure 6, the contour of the elevation angle theta electromagnetic interference quenchable with it that curve K1, K2 are illustrating while representing r=1, and curve K1 ', K2 ' etc., the contour of the elevation angle theta electromagnetic interference quenchable with it illustrated while representing r=2.In the situation that the decibels of identical inhibition electromagnetic interference, there is curve K1 and K1 ', curve K2 and the K2 ' of different relative scale r, the elevation angle theta of its required setting is also different.Because the difference of relative scale r is representing that barrier shield 380 is from the first element 340 with from the difference of the relative position of the second element 360, the decibels of the electromagnetic interference that can suppress is also just and then different.In other words, the elevation angle theta of the central point of the first element 340 and barrier shield 380 also can be determined by relative scale r, and elevation angle theta can further determine the height of the barrier shield of setting.
Accordingly, when between the first element 340 and the second element 360, barrier shield 380 being set, except knowing the relative distance d between the first element 340 and the second element 360, the central point that can also know the first element 340 to the central point apart from a and the second element 360 of barrier shield 380 to barrier shield 380 apart from ra, the position that namely 380 wishs of barrier shield arrange, add substrate height hsub, can be according to the value of d/hsub on Fig. 6 transverse axis, relative scale r, and the decibels that will suppress electromagnetic interference, decide the elevation angle theta of the central point of the first element 340 to barrier shield 380 tops, the value that then will be multiplied by the tangent value (tan θ) of elevation angle theta apart from a is added substrate height hsub, can obtain the height h3 of the barrier shield that will arrange.
Please refer to Fig. 7, Fig. 7 is the flow chart that barrier shield is set illustrated according to one embodiment of the invention.At first, the first element and the second element are separately positioned on substrate, then barrier shield independently are set between the first element and the second element.Then, at step S702, judge that whether barrier shield is identical to the second distance of the second element with barrier shield to the first distance of the distance of the first element.Namely first determine that barrier shield is arranged on the position of substrate and the first element relative distance to the second element.If the first distance is identical with second distance, arrive step S704, the electromagnetic interference value (being decibels in the present embodiment) of the first element is obtained to the height equivlent of barrier shield according to the interelement relative distance of the first element to the second and the second element.Then at step S706, judge whether the height equivlent of barrier shield is greater than the door sill height of electronic installation, if the height equivlent of barrier shield is less than door sill height, arrive step S708, judge that the height of barrier shield is the height equivlent obtained.If the height equivlent of barrier shield is more than or equal to door sill height, arrive step S710, the part that barrier shield is greater than to door sill height changes toward the first component level extension in an end of barrier shield, on the first element, forms extension.In other words, the summation of the length of extension and door sill height is substantially equal to the height equivlent of barrier shield.
In addition, if barrier shield is not identical to the distance (second distance) of the second element with barrier shield to the distance (the first distance) of the first element, arrive step S712, determine the relative scale of second distance and the first distance, and according to relative scale and the second element, the electromagnetic interference value (being decibels in the present embodiment) of the first element is decided to the elevation angle of the first element to the barrier shield top.Then, at step S714, according to the first element, to the tangent value apart from being multiplied by the elevation angle of barrier shield, add the height equivlent that substrate height obtains barrier shield.After obtaining the height equivlent of barrier shield, then to step S706 and step afterwards, go to judge that the door sill height whether barrier shield is greater than electronic installation determines whether increasing the steps such as extension.
In sum, see through application the above embodiments, the barrier shield be placed on electronic installation by Independent can suppress the electromagnetic interference of main interference source (the second element) to main electronic component (the first element) effectively.In addition, see through the design that barrier shield adds extension, when effectively increasing capable of suppressing electromagnetic interference decibels, also can make electronic installation can not violate the specification of restriction.And need to screening arrangement all be set in main electronic component surrounding, simplify cost and complexity required while assembling.
Although the present invention discloses as above with execution mode; so it is not in order to limit the present invention; anyly be familiar with this skill person; without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations, so protection scope of the present invention is as the criterion when looking the scope that appending claims defines.
Claims (10)
1. an electronic installation, is characterized in that, comprises;
One substrate;
One first element;
One second element, be separately positioned on this substrate with this first element; And
One barrier shield, Independent is placed between this first element and this second element, and in order to shield the electromagnetic interference of this second element to this first element;
Wherein the height of this barrier shield be by this first element to one first distance of this barrier shield, this second element to a second distance of this barrier shield and this second element to the electromagnetic interference value decision of this first element.
2. electronic installation according to claim 1, is characterized in that, this barrier shield also comprises an extension, and this extension is from the direction horizontal-extending of past this first element of an end of this barrier shield.
3. electronic installation according to claim 2, is characterized in that, this electronic installation has a door sill height, and the summation of the length of this door sill height and this extension equals an equivalence height of this barrier shield.
4. electronic installation according to claim 1, is characterized in that, this first distance equates with this second distance.
5. electronic installation according to claim 1, it is characterized in that, it is that the electromagnetic interference value to this first element determines by this second element that the central point of this first element and the top of this barrier shield form a ，Gai elevation angle, the elevation angle, and this elevation angle determines the height of this barrier shield.
6. electronic installation according to claim 5, is characterized in that, this second distance and this first distance have a relative scale, and this elevation angle is still determined by this relative scale.
7. electronic installation according to claim 1, is characterized in that, this first element and this second element are chip, radio-frequency (RF) component or plain conductor.
8. a method of making electronic installation, is characterized in that, comprises:
One first element and one second element are set respectively on a substrate;
One barrier shield independently is set between this first element and this second element;
Determine one first distance and this second an element second distance to this barrier shield of this first element to this barrier shield; And
According to this first distance, this second distance and this second element, the electromagnetic interference value of this first element is obtained an equivalence height of this barrier shield.
9. the method for making electronic installation according to claim 8, is characterized in that, also comprises:
Highly whether this equivalence that judges this barrier shield is greater than a door sill height; And
When the height equivlent of this barrier shield is greater than this door sill height, change toward this first component level and extend in an end of this barrier shield, form an extension on this first element, the length of this extension adds that this door sill height equals this equivalence height.
10. the method for making electronic installation according to claim 8, is characterized in that, determines that this first element during to this second distance of this barrier shield, also comprises with this second element to this first distance of this barrier shield:
When this first distance is different from this second distance, according to the ratio of this second distance and this first distance and this second element, the electromagnetic interference value of this first element is determined to the elevation angle of this first element to this barrier shield, and obtain this equivalence height of this barrier shield according to this elevation angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310361811XA CN103476234A (en) | 2013-08-19 | 2013-08-19 | Electronic device and method for manufacturing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310361811XA CN103476234A (en) | 2013-08-19 | 2013-08-19 | Electronic device and method for manufacturing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103476234A true CN103476234A (en) | 2013-12-25 |
Family
ID=49800879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310361811XA Pending CN103476234A (en) | 2013-08-19 | 2013-08-19 | Electronic device and method for manufacturing same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103476234A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102037714A (en) * | 2008-04-17 | 2011-04-27 | 莱尔德电子材料(深圳)有限公司 | Integrated antenna and EMI shielding support member for portable communications terminals |
| US20120025356A1 (en) * | 2010-08-02 | 2012-02-02 | Kuo-Hsien Liao | Semiconductor device packages having electromagnetic interference shielding and related methods |
| CN102781199A (en) * | 2011-05-10 | 2012-11-14 | 华为终端有限公司 | Protective method and terminal device for electronic component |
-
2013
- 2013-08-19 CN CN201310361811XA patent/CN103476234A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102037714A (en) * | 2008-04-17 | 2011-04-27 | 莱尔德电子材料(深圳)有限公司 | Integrated antenna and EMI shielding support member for portable communications terminals |
| US20120025356A1 (en) * | 2010-08-02 | 2012-02-02 | Kuo-Hsien Liao | Semiconductor device packages having electromagnetic interference shielding and related methods |
| CN102781199A (en) * | 2011-05-10 | 2012-11-14 | 华为终端有限公司 | Protective method and terminal device for electronic component |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2632234A1 (en) | Multilayer wiring board and electronic device | |
| US8227709B2 (en) | Printed wiring board, and design method for printed wiring board | |
| US8907739B2 (en) | Differential signal line structure | |
| US20140204550A1 (en) | Module board | |
| CN206181715U (en) | Mobile terminal shield assembly | |
| CN102779811B (en) | Chip package and chip packaging method | |
| CN105472864A (en) | Printed board with wiring pattern for detecting deterioration, and manufacturing method of the same | |
| US7843703B2 (en) | Multilayer printed circuit board | |
| US7999195B2 (en) | Circuit board having isolation cover and assembling method thereof | |
| US10225924B2 (en) | Electronic component | |
| TW201419663A (en) | Loop antenna | |
| CN103476234A (en) | Electronic device and method for manufacturing same | |
| US20150264797A1 (en) | Electronic apparatus | |
| JP5577716B2 (en) | Circuit module and method for manufacturing circuit module | |
| CN102769472B (en) | Wireless communication device | |
| US9178321B2 (en) | Modular tuner and method for manufacturing the same | |
| JP5633582B2 (en) | Module board | |
| US9521740B2 (en) | Electronic device and manufacturing method thereof | |
| US9510448B2 (en) | Maximizing surface area of surface mount contact pads of circuit board also having via contact pads | |
| TWI536902B (en) | An electronic device and manufacturing method thereof | |
| US10143077B1 (en) | Printed circuit board structure | |
| US10504853B2 (en) | Electronic device capable of suppressing electromagnetic radiation and manufacturing method thereof | |
| WO2015191380A1 (en) | Set top box having paste-in-hole tuner shield | |
| CN111315117B (en) | Printed circuit board | |
| US8975539B2 (en) | Lead frame package structure with low electromagnetic interference |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131225 |