CN102709281A - Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source - Google Patents
Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source Download PDFInfo
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- CN102709281A CN102709281A CN2012101567693A CN201210156769A CN102709281A CN 102709281 A CN102709281 A CN 102709281A CN 2012101567693 A CN2012101567693 A CN 2012101567693A CN 201210156769 A CN201210156769 A CN 201210156769A CN 102709281 A CN102709281 A CN 102709281A
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Abstract
The invention discloses a double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source which comprises a planar wafer type substrate, LED chips and two fluorescent thin films. A plurality of LED combination regions are designed on the planar wafer type substrate; the LED chips are arranged on the LED combination regions to form LED patch structures; and the two fluorescent thin films are packaged outside the LED patch structures in plastic package manner. According to the double fluorescent thin film two-sided light-emitting planar wafer LED array light source provided by the invention, the full-page type structure is adopted, the heat dissipation capacity of a product is also improved and the low heat dissipation capacity caused by nonuniform mixing of silica gel and fluorescent powder is effectively avoided; and due to the application of a transparent soft substrate or a hollow-out non-substrate substrate structure, the two-sided light-emitting is implemented and the light-emitting efficiency of the product is effectively improved.
Description
Technical field
The present invention relates to led light source, relate in particular to a kind of led array light source, become the array light source of array arrangement structure for a plurality of led chips with great heat radiation effect.
Background technology
Because light-emitting diode is a kind of high efficiency cold light light-emitting component that converts electrical energy into luminous energy, and have advantages such as power consumption is low, the life-span is long, so light-emitting diode is used for electronic product indication purposes mostly.But how light-emitting diode is used for commerce and domestic lighting or decorates still have very big space requirement to fill up.
The novel patent I229948 in Taiwan has disclosed a kind of flip-over type LED package array and encapsulation unit thereof, mainly discloses a light-emitting diode chip for backlight unit and is arranged on the ceramic substrate, and connect the metal connecting line layer on this ceramic substrate; This porcelain substrate is to utilize heat-conducting glue to attach in the depression with a metal body.Under this way; Because this light-emitting diode chip for backlight unit and metal connecting line layer; And it is also two-layer between this metal body across this ceramic substrate and this heat-conducting glue etc.; Therefore, the heat on this light-emitting diode chip for backlight unit and the metal connecting line layer can't be transmitted to soon on this metal body and dispel the heat.Thereby relevant heat radiation way partly in this case, still have again in addition improved space, to meet the high-capacity LED product to the qualitative high request that dispels the heat.
Single simultaneously traditional encapsulation automaticity still has bigger room for promotion, and the light extraction efficiency that on the basis that solves heat dissipation problem, how significantly to improve LED is also very important.
Summary of the invention
Goal of the invention: in order to overcome the deficiency that exists in the prior art, the present invention provides a kind of two-sided bright dipping flat, thin of two fluorescence membranes chip led array light source that in use has great heat radiation effect.
Technical scheme: for solving the problems of the technologies described above, the technical scheme that the present invention adopts is:
A kind of pair of two-sided bright dipping flat, thin of fluorescence membrane chip led array light source; Comprise flat, thin chip substrate, led chip and two fluorescence membranes; Be designed with an above LED land on the said flat, thin chip substrate; Led chip is arranged on the LED land and constitutes the LED paster structure, and two fluorescence membrane plastic packagings are in the outside of LED paster structure.
Owing to adopt the plane formula substrat structure, thereby the final LED device that forms can have better heat radiating effect; Simultaneously, because it be the sheet type substrat structure, thereby the final LED device that forms is softwood matter, can be curled into different shape as required, and not damage the circuit connection of led chip, satisfies the requirement of different industries to wick structure.In a word, not across insulating barrier of the prior art (glue), heat-conducting glue or gap,, the heat on this led chip and the conductive layer dispels the heat between this led chip and the substrate so can being transmitted on the substrate soon.
Preferably, said fluorescence membrane is the transparent organic material that contains fluorescent material, like silica gel or resin; Because fluorescence membrane contains fluorescent material, thereby the led chip of its cooperation respective color, can realize white light LEDs easily; Said fluorescent material can be evenly distributed in the transparent organic material, or non-uniform Distribution is in transparent organic material, and cooperated with LED chip light-emitting structure is with the utilization rate that improves fluorescent material and the light extraction efficiency of whole light source.
Preferably, through vacuum or inert gas sealing-in, specifically can realize between said fluorescence membrane and the LED paster structure through the cold film plastic packaging technology of mounting of vacuum.
Said flat, thin chip substrate can be for being covered with the transparent flexible film of conductive pattern; Concrete, said transparent flexible film can be polyester film, polyimide film or PMMA material; Said conductive pattern can use conductive material such as copper, silver, gold; This kind flat, thin chip substrate can be referred to as the soft base plate substrate; Owing to adopt the transparent flexible film, thereby can improve light transmission efficiency, increase the printing opacity angle.
The substrate of said structure can make through dry film → exposure → development → etching → striping → zinc-plated splicer's skill; This is the preparation technology of a kind of similar FPCB; Reduced the operation that covers rete but difference is the preparation process of this case, this is in order to increase the light transmission of entire substrate.
Said flat, thin chip substrate can also be merely the tinsel that forms conductive pattern; Conductive foil like Copper Foil, aluminium foil or other materials; This kind flat, thin chip substrate can be referred to as not have the substrate substrate; Because no other materials, thereby its hollow out place printing opacity fully, still realized the purpose of transparent two sides.
The tinsel of above-mentioned formation conductive pattern can be made through over etching, engraving or punch machining process by the foil material of corresponding material.
Surface printing at the tinsel that forms conductive pattern has solder mask, to make accurate in size LED land.
The shape of the tinsel of the formation conductive pattern of the conductive pattern of soft base plate substrate and no substrate substrate can adopt computer simulation method to come optimal design, to improve optics, electricity and the thermal property of whole LED device.
Preferably, said led chip is fixed on the LED land through the mode of welding or gummed.
Beneficial effect: the provided by the invention pair of two-sided bright dipping flat, thin of fluorescence membrane chip led array light source; Adopt justifying formula structure; Broken the notion of single traditional packaged LED, helped quick, High-efficient Production, automaticity is high; Can justifying encapsulate fast, the reliability of encapsulating products is high, high conformity; Conductive pattern is through printed circuit or directly use the Copper Foil of conductive pattern to realize, the problem of single product needed wire jumper has been saved in the employing of conductive pattern simultaneously; And the justifying structure helps improving the heat-sinking capability of product, avoids silica gel to mix the uneven low heat emission ability that causes, the useful life of improving the LED device with fluorescent material; Transparent soft base plate or hollow out do not have the use of substrate substrat structure, have realized two-sided bright dipping, have effectively improved the light extraction efficiency of product.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the LED paster structure sketch map of soft base plate substrate;
Fig. 3 is the LED paster structure sketch map of no substrate substrate.
Embodiment
Below in conjunction with accompanying drawing the present invention is done explanation further.
Be illustrated in figure 1 as a kind of pair of two-sided bright dipping flat, thin of fluorescence membrane chip led array light source, comprise flat, thin chip substrate 1, some led chips 3 and two fluorescence membranes 4, said fluorescence membrane 4 is for containing the transparent organic material of fluorescent material; Be designed with on the said flat, thin chip substrate 1 and led chip 3 the same number of LED lands; Led chip 3 is arranged on the LED land through the mode of welding or gummed; Led chip 3 and substrate 1 common formation LED paster structure, two fluorescence membranes 4 are through the cold outside of mounting film plastic packaging technology plastic packaging at the LED paster structure of vacuum.
As shown in Figure 2; Said flat, thin chip substrate 1 can be the soft base plate substrate; Can realize that through being covered with (copper) conductive pattern this substrate can make through dry film → exposure → development → etching → striping → zinc-plated splicer's skill on transparent polyester class (PET) film or polyimide (PI) film 2 surfaces.
As shown in Figure 3, said flat, thin chip substrate 1 can also be no substrate substrate, and it only comprises the Copper Foil that forms conductive pattern; The Copper Foil of said formation conductive pattern is to be made through over etching, engraving or punch machining process by copper foil material, can make the LED land at its surface printing solder mask.
The shape of the Copper Foil of the formation conductive pattern of the conductive pattern of soft base plate substrate and no substrate substrate can adopt computer simulation method to come optimal design, to improve optics, electricity and the thermal property of whole LED device.
The concrete step that makes the above-mentioned pair of two-sided bright dipping flat, thin of fluorescence membrane chip led array light source is following:
(1) selects PET material preparation transparent polyester class film for use; On thin-film material, use the method for calendering to cover copper again; And then carry out the exposure → development → etching → striping → zinc-plated plumbous step of conductive pattern 2; The conductive pattern 2 that obtains being scheduled to has the LED land on this conductive pattern 2, promptly is used to connect the P of led chip 3, the pad of N electrode;
(2) led chip 3 is passed through heat-conducting glue or scolding tin, be fixed on the LED land, the P of led chip 3, N electrode are directly connected on the pad through Au metallization extension layer, form the LED paster structure; Said led chip 3 can be selected ruddiness, green glow or blue-light LED chip for use, if hope to send white light, it is adaptive to use high-power blue-light LED chip to carry out;
(3) with two fluorescence membranes 4 through the cold outside of mounting film plastic packaging technology plastic packaging of vacuum at the LED paster structure; Compare with traditional handicraft, the thickness of silica gel layer is selected to be fixed as criterion with encapsulation, has avoided attaching the defective that variable thickness causes the capacity of heat transmission difference that problem such as system brings because of mixing fluorescent material and being coated with.
What above-mentioned steps adopted is the soft base plate substrate; As use no substrate substrate, then step (1) can be replaced by: copper foil material is carried out etching, laser engraving or punch process, make conductive pattern 2; On conductive pattern, print solder mask again, form the LED land.
The above only is a preferred implementation of the present invention; Be noted that for those skilled in the art; Under the prerequisite that does not break away from the principle of the invention, can also make some improvement and retouching, these improvement and retouching also should be regarded as protection scope of the present invention.
Claims (10)
1. the two two-sided bright dipping flat, thin of fluorescence membrane chip led array light source; It is characterized in that: this array light source comprises flat, thin chip substrate (1), led chip (3) and two fluorescence membranes (4); Be designed with an above LED land on the said flat, thin chip substrate (1); Led chip (3) is arranged in and constitutes the LED paster structure on the LED land, and two fluorescence membranes (4) plastic packaging is in the outside of LED paster structure.
2. the two-sided bright dipping flat, thin of pair fluorescence membrane according to claim 1 chip led array light source is characterized in that: said fluorescence membrane (4) is for containing the transparent organic material of fluorescent material.
3. the two-sided bright dipping flat, thin of pair fluorescence membrane according to claim 2 chip led array light source is characterized in that: said fluorescent material be evenly distributed in the transparent organic material or non-uniform Distribution in transparent organic material.
4. the two-sided bright dipping flat, thin of pair fluorescence membrane according to claim 1 chip led array light source is characterized in that: pass through vacuum or inert gas sealing-in between said fluorescence membrane (4) and the LED paster structure.
5. the two-sided bright dipping flat, thin of pair fluorescence membrane according to claim 1 chip led array light source is characterized in that: said flat, thin chip substrate (1) is for being covered with the transparent flexible film of conductive pattern (2).
6. the two-sided bright dipping flat, thin of pair fluorescence membrane according to claim 5 chip led array light source, it is characterized in that: said transparent flexible film is polyester film, polyimide film or PMMA material.
7. the two-sided bright dipping flat, thin of pair fluorescence membrane according to claim 1 chip led array light source is characterized in that: said flat, thin chip substrate (1) is for forming the tinsel of conductive pattern (2).
8. the two-sided bright dipping flat, thin of pair fluorescence membrane according to claim 7 chip led array light source is characterized in that: the tinsel of said formation conductive pattern (2) is that the foil material by corresponding material makes through over etching, engraving or punch machining process.
9. the two-sided bright dipping flat, thin of pair fluorescence membrane according to claim 7 chip led array light source, it is characterized in that: the surface printing of said tinsel has solder mask.
10. the two-sided bright dipping flat, thin of pair fluorescence membrane according to claim 1 chip led array light source is characterized in that: said led chip (3) is fixed on the LED land through the mode of welding or gummed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012101567693A CN102709281A (en) | 2012-05-21 | 2012-05-21 | Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source |
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| CN2012101567693A CN102709281A (en) | 2012-05-21 | 2012-05-21 | Double fluorescent thin film two-sided light-emitting planar wafer LED (Light-Emitting Diode) array light source |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102723324A (en) * | 2012-05-25 | 2012-10-10 | 苏州晶品光电科技有限公司 | Double-face light emitting planar wafer type LED (Light-Emitting Diode) packaging structure |
| CN103307532A (en) * | 2013-06-07 | 2013-09-18 | 南京世彩光电有限公司 | Integrated ultrathin high-luminance omnibearing automotive LED outline marker lamp |
| CN103629575A (en) * | 2013-11-29 | 2014-03-12 | 华南理工大学 | LED lamp with flexible transparent substrate |
| CN103633080A (en) * | 2013-11-29 | 2014-03-12 | 华南理工大学 | LED (light emitting diode) lamp with flexible substrate and manufacturing method |
| CN104835901A (en) * | 2015-04-09 | 2015-08-12 | 苏州晶品新材料股份有限公司 | Ultrathin flexible double-sided light-emitting LED light source based on secondary optical design |
| CN104964195A (en) * | 2015-06-24 | 2015-10-07 | 苏州佳亿达电器有限公司 | Foldable LED lamp band based on ITO transparent conductive film |
| CN105042389A (en) * | 2015-06-23 | 2015-11-11 | 苏州佳亿达电器有限公司 | Flexible LED lamp band based on ITO transparent conducting film |
| CN106097908A (en) * | 2016-07-30 | 2016-11-09 | 深圳浩翔光电技术有限公司 | The attachment structure of LED display top layer plastic packaging film and lamp plate and process |
| CN107230741A (en) * | 2017-07-11 | 2017-10-03 | 黄琴 | A kind of FPC types flexible LED filament crystal solidifying apparatus |
| CN110350064A (en) * | 2013-07-01 | 2019-10-18 | 晶元光电股份有限公司 | Light-emitting diode component and production method |
| CN110429040A (en) * | 2019-08-07 | 2019-11-08 | 厦门华联电子股份有限公司 | Optical detection pretreatment method of semiconductor packaging device |
| CN111107710A (en) * | 2019-12-26 | 2020-05-05 | 浙江清华柔性电子技术研究院 | Flexible luminous patch and preparation method and equipment thereof |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103307532B (en) * | 2013-06-07 | 2016-06-29 | 南京世彩光电有限公司 | The integration comprehensive automobile-used LED clearance lamps of Ultrathin high-brightness degree |
| CN110350064A (en) * | 2013-07-01 | 2019-10-18 | 晶元光电股份有限公司 | Light-emitting diode component and production method |
| CN103629575A (en) * | 2013-11-29 | 2014-03-12 | 华南理工大学 | LED lamp with flexible transparent substrate |
| CN103633080A (en) * | 2013-11-29 | 2014-03-12 | 华南理工大学 | LED (light emitting diode) lamp with flexible substrate and manufacturing method |
| CN104835901B (en) * | 2015-04-09 | 2018-04-10 | 苏州晶品新材料股份有限公司 | Ultrathin flexible double-side LED light source based on secondary optical design |
| CN104835901A (en) * | 2015-04-09 | 2015-08-12 | 苏州晶品新材料股份有限公司 | Ultrathin flexible double-sided light-emitting LED light source based on secondary optical design |
| CN105042389A (en) * | 2015-06-23 | 2015-11-11 | 苏州佳亿达电器有限公司 | Flexible LED lamp band based on ITO transparent conducting film |
| CN104964195A (en) * | 2015-06-24 | 2015-10-07 | 苏州佳亿达电器有限公司 | Foldable LED lamp band based on ITO transparent conductive film |
| CN106097908A (en) * | 2016-07-30 | 2016-11-09 | 深圳浩翔光电技术有限公司 | The attachment structure of LED display top layer plastic packaging film and lamp plate and process |
| CN107230741A (en) * | 2017-07-11 | 2017-10-03 | 黄琴 | A kind of FPC types flexible LED filament crystal solidifying apparatus |
| CN110429040A (en) * | 2019-08-07 | 2019-11-08 | 厦门华联电子股份有限公司 | Optical detection pretreatment method of semiconductor packaging device |
| CN111107710A (en) * | 2019-12-26 | 2020-05-05 | 浙江清华柔性电子技术研究院 | Flexible luminous patch and preparation method and equipment thereof |
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Application publication date: 20121003 |