CN104270892B - A kind of flexible printed circuit board manufacturing process - Google Patents
A kind of flexible printed circuit board manufacturing process Download PDFInfo
- Publication number
- CN104270892B CN104270892B CN201410370811.0A CN201410370811A CN104270892B CN 104270892 B CN104270892 B CN 104270892B CN 201410370811 A CN201410370811 A CN 201410370811A CN 104270892 B CN104270892 B CN 104270892B
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- Prior art keywords
- fpc
- barrel
- heated
- injection
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/77—Measuring, controlling or regulating of velocity or pressure of moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
- B29C45/78—Measuring, controlling or regulating of temperature
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a kind of flexible printed circuit board manufacturing process, including：Step 1, it is fabricated to traditional FPC；Step 2, obtain solid plate FPC；Step 3, solid plate FPC；Also include：Step 4, baking material；Step 5, injection moulding machine mould open, FPC is placed on the mould in injection machine；Step 6, colloidal sol, the direction of injecting machine material tube charging aperture to injection nozzle are followed successively by 3 sections of barrel, 2 sections of barrel, 1 section of barrel, and the resin being added in barrel is heated to molten condition；Step 7, matched moulds；Step 8, project；Step 9, first cool down, cool time 4s；Then mold, open time 2s；Finally it is stripped；Step 10, finished product FPC gum fitting；Step 11, bending；Step 12, finished product packing.The present invention has the advantages of production quality that good good drop resistant fall performance, water resistance, FPC sweep resistance performanc, rework rate are low, dimensional accuracy is high and lift later stage FPC.
Description
Technical field
The present invention relates to a kind of circuit board manufacturing process, more particularly to a kind of flexible printed circuit board manufacturing process.
Background technology
FPC (Flexible Printed Circuit, abbreviation FPC), it is made of flexible insulating substrate
Printed circuit, there is the advantages of many rigid printed circuit boards do not possess., can be according to such as it can be with free bend, winding, folding
Any arrangement is required according to space layout, and is arbitrarily moved and flexible in three dimensions, is connected so as to reach components and parts assembling and wire
The integration connect.Electronics FPC volume can be substantially reduced using FPC, is applicable electronics FPC to high density, miniaturization, highly reliable side
To the needs of development.Therefore, FPC is in space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera etc.
It is widely used on field or FPC.
The general production operation flow process of existing FPC is as follows：Step 1：FPC hollow plate makes；Step 2：FPC electricity
Sub- part SMT pieces, step 3：The processing assembling of FPC solid plates back segment；Existing production technology, no FPC injection molding technique；Hollow plate
FPC, become solid plate FPC after the completion of SMT electronic component piece piece, solid plate FPC directly gives assembly plant's assembling, and solid plate FPC is in group
Filling in the mechanism of factory needs to use various mechanism members and adhesive tape to be fixed；It is fixed using mechanism member and gum, due to FPC
Body is irregular, soft, vulnerable to external deformation, is assembled on actual FPC, easily causes the displacement of integrated circuit, and does not resist
Drop, influence terminal consumer electronics FPC service lifes；Without FPC injection molding technique, can cause to waste people in assembling process
Power, rework rate height, poor dimensional precision, the production quality for influenceing later stage FPC.
The content of the invention
In order to solve the above technical problems, it is an object of the invention to provide a kind of price it is low, it is fixed after be avoided that and used
The displacement of integrated circuit is caused in journey, has good good drop resistant fall performance, water resistance, moulding and FPC adhesions are good, FPC resists
Displacement performance is good, manpower wastes, rework rate is low, size in lifting terminal consumer electronics FPC service lifes, saving assembling process
Precision is high, the flexible printed circuit board manufacturing process of the production quality in lifting later stage FPC.
To reach above-mentioned purpose, technical scheme is as follows：A kind of flexible printed circuit board manufacturing process, including：
Step 1, the copper foil base material of web-like is cut into fixed dimension, by drilling, copper facing, circuit etching, diaphragm pressing, weldering
Point PAD and finger surface processing, stamp etc. are fabricated to traditional FPC；Step 2, traditional FPC after electronic component is welded/mounted,
Obtain solid plate FPC；Step 3, after electronic component is welded/mounted, obtain solid plate FPC；Also include：Step 4, baking material, it will set
Fat is placed on temperature and is set as in 120 DEG C of hopper, and 4h is dried；Step 5, injection moulding machine mould open, open time 2s, by FPC
It is placed on the mould in injection machine, FPC is fixed by location pin；Step 6, colloidal sol, injecting machine material tube charging aperture to injection
The direction of nozzle is followed successively by 3 sections of barrel, 2 sections of barrel, 1 section of barrel, and injection machine temperature is heated into 295-305 DEG C, will be expected
3 sections of cylinder is heated to 300-310 DEG C, and by barrel, 2 sections are heated to 285-300 DEG C, and by barrel, 1 section is heated to 275-290 DEG C, and will add
The resin being added in barrel is heated to molten condition；Step 7, matched moulds, burn close time 2s；Step 8, project, by molten
The resin of state is expelled in mould by nozzle, and injection process is divided into two stages：First stage stage screw rod translational speed is 50-
60rpm, injection pressure 0.4-0.6Mpa, second stage stage screw rod translational speed are 40-50rpm, injection pressure 0.35-
0.5Mpa；Injection time 5s；Step 9, first cool down, cool time 4s；Then mold, open time 2s；Finally it is stripped,
Demoulding time is 1s；Step 10, finished product FPC gum are bonded, and gum is fitted in FPC FX；Step 11, bending,
FPC bending tool is by being repeatedly bent into customer demand shape；Step 12, finished product packing.
Preferably, the injection machine is vertical injection molding machine, and solid plate FPC level is put on the mould in vertical injection molding machine, row
Put neatly, gently pressed with finger, make itself and mould tight fits.
Preferably, the injection machine is horizontal injection press, and solid plate FPC is vertically disposed on horizontal injection press, horizontal injection
Machine has getter device, and getter device automatic sucking FPC prevents solid plate FPC from coming off.
Preferably, the resin is PC resin.
Preferably, in step 6, injection machine temperature is heated to 295 DEG C, 3 sections are heated to 300 DEG C by barrel, will
2 sections of barrel is heated to 285 DEG C, and by barrel, 1 section is heated to 275 DEG C.
Preferably, in step 8, first stage stage screw rod translational speed is 50rpm, injection pressure 0.4Mpa, second-order
Section stage screw rod translational speed is 40rpm, injection pressure 0.35Mpa.
Preferably, in step 6, injection machine temperature is heated to 305 DEG C, 3 sections are heated to 310 DEG C by barrel, will
2 sections of barrel is heated to 300 DEG C, and by barrel, 1 section is heated to 290 DEG C.
Preferably, in step 8, first stage stage screw rod translational speed is 60rpm, injection pressure 0.6Mpa, second-order
Section stage screw rod translational speed is 50rpm, injection pressure 0.5Mpa.
It is using the beneficial effect of the technical program：Compared to traditional FPC manufacturing process, step 4 is added to 11,
The multiple demand of more clients is met, increases Products competitiveness；Printed using moulding and customer facility fixing flexible
Printed circuit board, applied to all kinds of wearable consumption electronic products, con-ventional handheld consumption electronic product is substituted, price is relative
It is relatively low, the displacement that integrated circuit is caused during use had both been avoided that after fixed, has there is good good drop resistant fall performance and waterproof again
Performance；Increase injection step, with FPC adhesions more preferably, product anti-shift performance is more preferable for moulding, lifts terminal consumer electronics
Product service life；Increase FPC injection molding technique, can save in assembling process that manpower wastes and rework rate is low, dimensional accuracy
High, lifting later product production quality；Product has the design method of difference using vertical and horizontal machine, therefore vertical, sleeping
Formula machine can make such injection FPC.
Embodiment
The technical scheme in the embodiment of the present invention is clearly and completely described below in conjunction with the embodiment of the present invention,
Obviously, described embodiment is only part of the embodiment of the present invention, rather than whole embodiments.Based in the present invention
Embodiment, the every other embodiment that those of ordinary skill in the art are obtained under the premise of creative work is not made, all
Belong to the scope of protection of the invention.
A kind of flexible printed circuit board manufacturing process, including：Step 1, the copper foil base material of web-like is cut into fixed ruler
It is very little, it is fabricated to tradition by drilling, copper facing, circuit etching, diaphragm pressing, solder joint PAD and finger surface processing, stamp etc.
FPC；Step 2, traditional FPC obtain solid plate FPC after electronic component is welded/mounted；Step 3, weld/paste through electronic component
After dress, solid plate FPC is obtained；Also include：Step 4, baking material, resin is placed on temperature and is set as in 120 DEG C of hopper, is done
Dry 4h；Step 5, injection moulding machine mould open, open time 2s, FPC is placed on the mould in injection machine, FPC passes through positioning
Pin is fixed；Step 6, colloidal sol, the direction of injecting machine material tube charging aperture to injection nozzle are followed successively by 3 sections of barrel, 2 sections of barrel, material
1 section of cylinder, 295-305 DEG C is heated to by injection machine temperature, and by barrel, 3 sections are heated to 300-310 DEG C, by 2 sections of heating of barrel
To 285-300 DEG C, by barrel, 1 section is heated to 275-290 DEG C, and is added to the resin in barrel and is heated to molten condition；Step
Rapid seven, matched moulds, burn close time 2s；Step 8, project, the resin of molten condition is expelled in mould by nozzle, injection
Process is divided into two stages：First stage stage screw rod translational speed is 50-60rpm, injection pressure 0.4-0.6Mpa, second stage
Stage screw rod translational speed is 40-50rpm, injection pressure 0.35-0.5Mpa；Injection time 5s；Step 9, first cool down, during cooling
Between be 4s；Then mold, open time 2s；Finally it is stripped, demoulding time 1s；Step 10, finished product FPC gum fitting will
Gum is fitted in FPC FX；Step 11, bending, FPC bending tool is by being repeatedly bent into customer demand shape
Shape；Step 12, finished product packing.
Injection machine is vertical injection molding machine, and solid plate FPC level is put on the mould in vertical injection molding machine, and discharge is neat, uses hand
Refer to light pressure, make itself and mould tight fits.
Injection machine is horizontal injection press, and solid plate FPC is vertically disposed on horizontal injection press, and horizontal injection press has air-breathing dress
Put, getter device automatic sucking FPC prevents solid plate FPC from coming off.
Resin is PC resin.The material property and moulding process makrolon (PC) of PC resin, PC resin is a kind of performance
Excellent thermoplastic engineering plastic, has prominent impact resistance, creep resistance and a good stability of the dimension, it is heat-resisting, water absorption rate is low,
It is nontoxic, dielectric properties are excellent.
Embodiment one, in step 6,295 DEG C are heated to by injection machine temperature, and by barrel, 3 sections are heated to 300 DEG C,
By barrel, 2 sections are heated to 285 DEG C, and by barrel, 1 section is heated to 275 DEG C.In step 8, first stage stage screw rod translational speed is
50rpm, injection pressure 0.4Mpa, second stage stage screw rod translational speed are 40rpm, injection pressure 0.35Mpa.
Implement two, in step 6, injection machine temperature is heated to 305 DEG C, 3 sections are heated to 310 DEG C by barrel, will
2 sections of barrel is heated to 300 DEG C, and by barrel, 1 section is heated to 290 DEG C.In step 8, first stage stage screw rod translational speed is
60rpm, injection pressure 0.6Mpa, second stage stage screw rod translational speed are 50rpm, injection pressure 0.5Mpa.
The foregoing description of the disclosed embodiments, professional and technical personnel in the field are enable to realize or using the present invention.
A variety of modifications to these embodiments will be apparent for those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and principles disclosed herein and features of novelty phase one
The most wide scope caused.
Claims (6)
1. a kind of flexible printed circuit board manufacturing process, including：Step 1, the copper foil base material of web-like is cut into fixed ruler
It is very little, it is fabricated to traditional FPC by drilling, copper facing, circuit etching, diaphragm pressing, solder joint PAD and finger surface processing, stamp；
Step 2, traditional FPC obtain solid plate FPC after electronic component welds or mounts；Step 3, through electronic component welding or
After attachment, solid plate FPC is obtained；Characterized in that, also include：
Step 4, baking material, resin is placed on temperature and is set as in 120 DEG C of hopper, 4h is dried；
Step 5, injection moulding machine mould open, open time 2s, FPC is placed on the mould in injection machine, FPC passes through location pin
It is fixed；The injection machine is horizontal injection press, and solid plate FPC is vertically disposed on horizontal injection press, and horizontal injection press has air-breathing
Device, getter device automatic sucking FPC prevent solid plate FPC from coming off；
Step 6, colloidal sol, the direction of injecting machine material tube charging aperture to injection nozzle are followed successively by 3 sections of barrel, 2 sections of barrel, barrel 1
Section, is heated to 295-305 DEG C, 3 sections are heated to 300-310 DEG C by barrel, and 2 sections are heated to by barrel by injection machine temperature
285-300 DEG C, by barrel, 1 section is heated to 275-290 DEG C, and is added to the resin in barrel and is heated to molten condition；
Step 7, matched moulds, burn close time 2s；
Step 8, project, the resin of molten condition is expelled in mould by nozzle, injection process is divided into two stages：The
One stage stage screw rod translational speed is 50-60rpm, and injection pressure 0.4-0.6Mpa, second stage stage screw rod translational speed is 40-
50rpm, injection pressure 0.35-0.5Mpa；Injection time 5s；
Step 9, first cool down, cool time 4s；Then mold, open time 2s；Finally it is stripped, demoulding time 1s；
Step 10, finished product FPC gum are bonded, and gum is fitted in FPC FX；
Step 11, bending, FPC bending tool is by being repeatedly bent into customer demand shape；
Step 12, finished product packing.
A kind of 2. flexible printed circuit board manufacturing process according to claim 1, it is characterised in that：The resin is PC trees
Fat.
A kind of 3. flexible printed circuit board manufacturing process according to claim 2, it is characterised in that：, will in step 6
Injection machine temperature is heated to 295 DEG C, and by barrel, 3 sections are heated to 300 DEG C, and by barrel, 2 sections are heated to 285 DEG C, by 1 section of barrel
It is heated to 275 DEG C.
A kind of 4. flexible printed circuit board manufacturing process according to claim 3, it is characterised in that：In step 8, the
One stage stage screw rod translational speed is 50rpm, injection pressure 0.4Mpa, and second stage stage screw rod translational speed is 40rpm, injection pressure
Power is 0.35Mpa.
A kind of 5. flexible printed circuit board manufacturing process according to claim 2, it is characterised in that：, will in step 6
Injection machine temperature is heated to 305 DEG C, and by barrel, 3 sections are heated to 310 DEG C, and by barrel, 2 sections are heated to 300 DEG C, by 1 section of barrel
It is heated to 290 DEG C.
A kind of 6. flexible printed circuit board manufacturing process according to claim 5, it is characterised in that：In step 8, the
One stage stage screw rod translational speed is 60rpm, injection pressure 0.6Mpa, and second stage stage screw rod translational speed is 50rpm, injection pressure
Power is 0.5Mpa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410370811.0A CN104270892B (en) | 2014-07-31 | 2014-07-31 | A kind of flexible printed circuit board manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410370811.0A CN104270892B (en) | 2014-07-31 | 2014-07-31 | A kind of flexible printed circuit board manufacturing process |
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| Publication Number | Publication Date |
|---|---|
| CN104270892A CN104270892A (en) | 2015-01-07 |
| CN104270892B true CN104270892B (en) | 2017-12-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410370811.0A Expired - Fee Related CN104270892B (en) | 2014-07-31 | 2014-07-31 | A kind of flexible printed circuit board manufacturing process |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106937482A (en) * | 2017-03-31 | 2017-07-07 | 柳州译海网络科技有限公司 | A kind of electronic product method for manufacturing of energy-saving and emission-reduction |
| US10498085B2 (en) * | 2018-03-01 | 2019-12-03 | Te Connectivity Corporation | Molded interconnect substrate for a cable assembly |
| CN108480922B (en) * | 2018-03-13 | 2020-05-19 | 广东长盈精密技术有限公司 | Flexible substrate and processing method and system thereof |
| CN112454809A (en) * | 2020-09-27 | 2021-03-09 | 鹰潭荣嘉集团医疗器械实业有限公司 | Infusion apparatus injection molding device and method |
| CN115071048A (en) * | 2022-07-25 | 2022-09-20 | 保融盛维(沈阳)科技有限公司 | Automatic injection molding method and injection molding device for digital electronic module |
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| CN102785323A (en) * | 2012-08-20 | 2012-11-21 | 江西科伦医疗器械制造有限公司 | Injection moulding process of polypropylene (PP) material pieces for syringe |
| CN102785340A (en) * | 2012-08-20 | 2012-11-21 | 江西科伦医疗器械制造有限公司 | Plastic injection process for PVC (polyvinyl chloride) parts of infusion apparatuses |
| CN102785324A (en) * | 2012-08-20 | 2012-11-21 | 江西科伦医疗器械制造有限公司 | Injection moulding process of polyethylene (PE) material pieces for infusion apparatus |
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2014
- 2014-07-31 CN CN201410370811.0A patent/CN104270892B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102785323A (en) * | 2012-08-20 | 2012-11-21 | 江西科伦医疗器械制造有限公司 | Injection moulding process of polypropylene (PP) material pieces for syringe |
| CN102785340A (en) * | 2012-08-20 | 2012-11-21 | 江西科伦医疗器械制造有限公司 | Plastic injection process for PVC (polyvinyl chloride) parts of infusion apparatuses |
| CN102785324A (en) * | 2012-08-20 | 2012-11-21 | 江西科伦医疗器械制造有限公司 | Injection moulding process of polyethylene (PE) material pieces for infusion apparatus |
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| CN104270892A (en) | 2015-01-07 |
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