CN103456689B - 用于将柔性基板与玻璃基板分离的装置及生产设备 - Google Patents

用于将柔性基板与玻璃基板分离的装置及生产设备 Download PDF

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CN103456689B
CN103456689B CN201310351487.3A CN201310351487A CN103456689B CN 103456689 B CN103456689 B CN 103456689B CN 201310351487 A CN201310351487 A CN 201310351487A CN 103456689 B CN103456689 B CN 103456689B
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roller
board
flexible base
sunk area
wafer
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CN103456689A (zh
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毛雪
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BOE Technology Group Co Ltd
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Priority to JP2016533779A priority patent/JP6437547B2/ja
Priority to KR1020147012863A priority patent/KR101749795B1/ko
Priority to US14/355,072 priority patent/US9508585B2/en
Priority to EP13848120.5A priority patent/EP3035380B1/en
Priority to PCT/CN2013/089470 priority patent/WO2015021713A1/zh
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Abstract

本发明提供的一种用于将柔性基板与玻璃基板分离的装置，以及一种柔性基板的生产设备，用以实现在柔性基板与玻璃基板分离过程中柔性基板上的驱动晶片不会受到辊子挤压，避免了柔性基板在分离过程中造成损坏。本发明提供的一种用于将柔性基板与玻璃基板分离的装置包括：圆柱体形状的辊子，以及与该辊子相连的用于控制该辊子转动从而通过辊子带动柔性基板与玻璃基板分离的控制单元，该装置还包括在所述辊子的柱面上设置有凹陷区域，用于在辊子转动过程中，使柔性基板上的驱动晶片嵌入所述凹陷区域内，避免辊子与柔性基板上的驱动晶片相接触。

Description

用于将柔性基板与玻璃基板分离的装置及生产设备
技术领域
本发明涉及显示器技术领域，尤其涉及一种用于将柔性基板与玻璃基板分离的装置，以及一种柔性基板的生产设备。
背景技术
柔性基板（例如塑料材料），由于其柔韧性，在制造工序过程中容易变化，很难精确进行柔性基板的制造工序。一般来说，柔性基板的制作方式是先将柔性基板固定在玻璃基板上，待显示组件制造完成形成显示面板之后，再将柔性基板从玻璃基板上分离。
如图1所示，在柔性基板与玻璃基板分离时，通常可采用机械剥离方式：将柔性基板13一端固定在一定曲率半径的辊子15上，转动辊子15将柔性基板13带起，实现与玻璃基板11的分离。而在分离过程中，由于柔性基板13上的驱动晶片（Driver IC）14的部位突起，辊子15挤压时容易造成柔性基板13所受应力过大造成器件损坏，甚至导致驱动晶片14的损坏。
发明内容
本发明实施例提供了一种用于将柔性基板与玻璃基板分离的装置，以及一种柔性基板的生产设备，用以实现在柔性基板与玻璃基板分离过程中柔性基板上的驱动晶片不会受到辊子挤压，避免了柔性基板在分离过程中造成损坏。
本发明实施例提供的一种用于将柔性基板与玻璃基板分离的装置，包括：圆柱体形状的辊子，以及与该辊子相连的用于控制该辊子转动从而通过辊子带动柔性基板与玻璃基板分离的控制单元，该装置还包括，在所述辊子的柱面上设置有凹陷区域，用于在辊子转动过程中，使柔性基板上的驱动晶片嵌入所述凹陷区域内，避免辊子与柔性基板上的驱动晶片相接触。
本发明通过在辊子上设置用于在辊子转动过程中，使柔性基板上的驱动晶片嵌入所述凹陷区域内，避免辊子与柔性基板上的驱动晶片相接触的凹陷区域，使得在柔性基板与玻璃基板分离过程中柔性基板上的驱动晶片不会受到辊子挤压，避免了柔性基板在分离过程中造成损坏。
较佳地，辊子上设置有一个或多个凹陷区域，这样，当辊子转动到驱动晶片部位时，驱动晶片嵌入到所述的凹陷区域中，不会受到辊子的挤压，避免了柔性基板在分离过程中造成损坏。
较佳地，当柔性基板上设置有多个驱动晶片时，辊子上分别对应每一驱动晶片设置有相应的凹陷区域，这样，当辊子转动到驱动晶片部位时，多个驱动晶片分别嵌入到相应的凹陷区域中，不会受到辊子的挤压，避免了柔性基板在分离过程中造成损坏。
较佳地，对应每一驱动晶片设置的凹陷区域的尺寸，与对应驱动晶片的尺寸相匹配，这样，凹陷区域的尺寸刚好对应驱动晶片的尺寸，使辊子转动到驱动晶片部位时，驱动晶片嵌入到凹陷区域中。
较佳地，凹陷区域的尺寸比驱动晶片的尺寸大，这样，使辊子转动到驱动晶片部位时，驱动晶片可以嵌入到凹陷区域中。
较佳地，当柔性基板上设置有多个驱动晶片，并且多个驱动晶片位于同一行时，辊子上设置与该行位置对应的一个凹陷区域，该凹陷区域用于在辊子转动过程中避免辊子与位于该行的多个驱动晶片相接触，这样，辊子上设置一个凹陷区域，避免了辊子上分别对应每一驱动晶片设置有多个凹陷区域的麻烦，减低了制造工艺。
较佳地，辊子上设置的与该行位置对应的一个凹陷区域，凹陷区域为长方体形状，其尺寸为宽度2mm、深度2mm，其长度不小于同一行的多个驱动晶片所占长度，这样，凹陷区域的尺寸刚好对应该行的多个驱动晶片的尺寸，使辊子转动到驱动晶片部位时，同一行的多个驱动晶片嵌入到凹陷区域中。
较佳地，辊子包括第一段、第二段和设置有凹陷区域的第三段；第三段活动连接于第一段和第二段之间，且可绕圆柱体的轴线旋转；在辊子转动带动柔性基板与玻璃基板分离的过程中，通过旋转第三段，使柔性基板上的驱动晶片嵌入所述凹陷区域内，这样，由于不同尺寸的柔性基板上驱动晶片所在位置不同，通过旋转第三段，可以使柔性基板上的驱动晶片嵌入凹陷区域内，使得分离装置能够适用于不同尺寸、驱动晶片设置在不同位置的柔性基板。
本发明实施例提供的一种柔性基板的生产设备，包括上述任一装置。
附图说明
图1为现有技术用于将柔性基板与玻璃基板分离的装置示意图；
图2为本发明实施例提供的一种用于将柔性基板与玻璃基板分离装置结构的侧视图；
图3为本发明实施例提供的一种用于将柔性基板与玻璃基板分离装置结构的俯视图；
图4为本发明实施例提供的辊子结构的立体图；
图5为本发明实施例提供的一种用于将柔性基板与玻璃基板分离的方法流程示意图。
具体实施方式
本发明实施例提供了一种用于将柔性基板与玻璃基板分离的装置，以及一种柔性基板的生产设备，用以实现在柔性基板与玻璃基板分离过程中柔性基板上的驱动晶片不会受到辊子挤压，避免了柔性基板在分离过程中造成损坏。
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一段实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
参见图2，本发明实施例提供了一种用于将柔性基板与玻璃基板分离的装置，该装置包括：圆柱体形状的辊子15，以及与该辊子相连的用于控制该辊子转动从而通过辊子带动柔性基板与玻璃基板分离的控制单元（未图示），该装置还包括在所述辊子15的柱面上设置的凹陷区域16，用于在辊子15转动过程中，使柔性基板13上的驱动晶片14嵌入所述凹陷区域16内，避免辊子15与柔性基板13上的驱动晶片14相接触。
其中，控制单元（未图示）与辊子15相连，用于带动该辊子15转动从而通过辊子15带动柔性基板13与玻璃基板11分离，控制单元可以为电机等设备；凹陷区域16用于在辊子15转动过程中避免辊子15与柔性基板13上的驱动晶片14相接触；
较佳地，辊子15上设置有一个或多个凹陷区域16；
较佳地，当柔性基板13上设置有多个驱动晶片14时，辊子15上分别对应每一驱动晶片14设置有相应的凹陷区域16；
较佳地，对应每一驱动晶片14设置的凹陷区域16的尺寸，与对应驱动晶片14的尺寸相匹配；
较佳地，凹陷区域16的尺寸比驱动晶片14的尺寸大；
较佳地，当柔性基板13上设置有多个驱动晶片14，并且多个驱动晶片14位于同一行时，辊子15上设置与该行位置对应的一个凹陷区域16，该凹陷区域16用于在辊子15转动过程中避免辊子15与位于该行的多个驱动晶片14相接触；
较佳地，辊子15上设置的与该行位置对应的一个凹陷区域16，凹陷区域为长方体形状，其尺寸为宽度2mm、深度2mm，其长度不小于同一行的多个驱动晶片14所占长度；
较佳地，如图3所示，辊子15的圆柱体包括第一段1、第二段2和设置有凹陷区域16的第三段3；结合图4，第三段3活动连接于第一段1和第二段2之间，且可绕圆柱体的轴线5旋转；由于不同尺寸的柔性基板13上设置的驱动晶片14位置不同，在辊子15转动带动柔性基板13与玻璃基板11分离的过程中，通过旋转所述第三段3，使柔性基板13上的驱动晶片14嵌入所述凹陷区域16内，这样本发明实施例提供的分离装置能够适用于不同尺寸的柔性基板13；
参见图4，圆柱体辊子15上的第一段1和第二段2用于固定第三段3的固定方式可采用从第一段1与第二段2侧面***顶丝4的固定方式；需要说明的是，辊子结构只是设想的其中一种可实现方式，本发明不局限于这一种结构；
一种柔性基板的生产设备，包括上述装置。
其中，图2中所示的弱接着界面12为柔性基板13与玻璃基板11之间的接触界面。
参见图5，本发明实施例提供的一种用于将柔性基板与玻璃基板分离的方法步骤如下：
S1、将柔性基板一端固定在设置有凹陷区域的圆柱体形状的辊子上；
S2、控制单元转动辊子将柔性基板带起，实现柔性基板与玻璃基板的分离；
具体的，控制单元用于控制所述辊子转动，从而通过辊子带动柔性基板与玻璃基板分离，控制单元可以是电机等设备；
当辊子转动到设置在柔性基板上的驱动晶片部位时，驱动晶片嵌入到设置在辊子的凹陷区域中，使驱动晶片不会受到辊子的挤压，避免了柔性基板在分离过程中造成损坏；
所述辊子包括第一段、第二段和设置有凹陷区域的第三段；第三段活动连接于第一段和第二段之间，且可绕圆柱体的轴旋转；由于不同尺寸的柔性基板上设置的驱动晶片位置不同，在辊子转动带动柔性基板与玻璃基板分离的过程中，通过旋转第三段，使柔性基板上的驱动晶片嵌入凹陷区域内，这样本发明实施例提供的分离装置能够适用于不同尺寸的柔性基板；
圆柱体辊子上的第一段和第二段用于固定第三段的固定方式可采用从第一段与第二段侧面***顶丝的固定方式；需要说明的是，所述的辊子结构只是设想的其中一种可实现方式，本发明不局限于这一种结构；
较佳地，辊子上设置有一个或多个凹陷区域；
较佳地，当柔性基板上设置有多个驱动晶片时，辊子上分别对应每一驱动晶片设置有相应的凹陷区域；
较佳地，对应每一驱动晶片设置的凹陷区域的尺寸，与对应驱动晶片的尺寸相匹配；
较佳地，凹陷区域的尺寸比驱动晶片的尺寸大；
较佳地，当柔性基板上设置有多个驱动晶片，并且多个驱动晶片位于同一行时，辊子上设置与该行位置对应的一个凹陷区域，该凹陷区域用于在辊子转动过程中避免辊子与位于该行的多个驱动晶片相接触；
较佳地，辊子上设置的与该行位置对应的一个凹陷区域，所述凹陷区域为长方体形状，其尺寸为宽度2mm、深度2mm，其长度不小于同一行的多个驱动晶片所占长度设置。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (9)

1.一种用于将柔性基板与玻璃基板分离的装置，包括圆柱体形状的辊子，以及与该辊子相连的用于控制该辊子转动带动柔性基板与玻璃基板分离的控制单元，其特征在于，在所述辊子的柱面上设置有凹陷区域，用于在辊子转动过程中，使柔性基板上的驱动晶片嵌入所述凹陷区域内，避免辊子与柔性基板上的驱动晶片相接触。
2.如权利要求1所述的装置，其特征在于，所述辊子上设置有一个或多个凹陷区域。
3.如权利要求1所述的装置，其特征在于，当所述柔性基板上设置有多个驱动晶片时，所述辊子上分别对应每一驱动晶片设置有相应的凹陷区域。
4.如权利要求3所述的装置，其特征在于，对应每一驱动晶片设置的凹陷区域的尺寸，与对应驱动晶片的尺寸相匹配。
5.如权利要求4所述的装置，其特征在于，所述的凹陷区域的尺寸比驱动晶片的尺寸大。
6.如权利要求1所述的装置，其特征在于，当所述柔性基板上设置有多个驱动晶片，并且多个驱动晶片位于同一行时，所述辊子上设置与该行位置对应的一个凹陷区域，该凹陷区域用于在辊子转动过程中避免辊子与位于该行的多个驱动晶片相接触。
7.如权利要求6所述的装置，其特征在于，所述辊子上设置的与该行位置对应的一个凹陷区域，所述凹陷区域为长方体形状，其尺寸为宽度2mm，深度2mm，长度大于同一行的多个驱动晶片所占长度。
8.如权利要求1-7任一权项所述的装置，其特征在于，所述辊子包括第一段、第二段和设置有凹陷区域的第三段；所述第三段活动连接于第一段和第二段之间，且可绕圆柱体的轴线旋转；在辊子转动带动柔性基板与玻璃基板分离的过程中，通过旋转所述第三段，使柔性基板上的驱动晶片嵌入所述凹陷区域内。
9.一种柔性基板的生产设备，其特征在于，包括权利要求1-8任一权项所述的装置。
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JP6437547B2 (ja) 2018-12-12
KR20150029605A (ko) 2015-03-18
WO2015021713A1 (zh) 2015-02-19
US20160358806A1 (en) 2016-12-08
EP3035380A1 (en) 2016-06-22
CN103456689A (zh) 2013-12-18
JP2016534394A (ja) 2016-11-04
EP3035380B1 (en) 2021-06-30
EP3035380A4 (en) 2017-04-05
US20160118286A1 (en) 2016-04-28
US9508585B2 (en) 2016-11-29

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