CN103456392B - Transparent conductive body and manufacture method thereof - Google Patents
Transparent conductive body and manufacture method thereof Download PDFInfo
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- CN103456392B CN103456392B CN201310378583.7A CN201310378583A CN103456392B CN 103456392 B CN103456392 B CN 103456392B CN 201310378583 A CN201310378583 A CN 201310378583A CN 103456392 B CN103456392 B CN 103456392B
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Abstract
The invention provides a kind of transparent conductive body and preparation method thereof, this transparent conductive body comprises transparent substrates, be located at the first conductive layer in this transparent substrates and the second conductive layer, first conductive layer and the second conductive layer are by multiple spaced electrode composition, insulated from each other between adjacent two electrodes; Form the electrode of the first conductive layer and the electrode spatially formation Inductance and Capacitance arranged in a crossed manner forming the second conductive layer; Electrode is latticed, and intersected with each other by the conductor wire be positioned on the same face; The grid electrode that conductor wire is formed adopts the mixed ink comprising electric conducting material and resin material, based on exposure imaging technological forming.Conductive grid of the present invention is by having the mixed ink of electric conductivity and photoresist performance concurrently through exposure, development and oven dry preparation, and relative to ito film, manufacture craft is simple, is applicable to large area, production in enormous quantities, can be applicable on larger-size equipment; Production efficiency is higher, reduces production cost.
Description
Technical field
The present invention relates to touch-screen technology of preparing, particularly relate to a kind of transparent conductive body and manufacture method thereof.
Background technology
Touch-screen is the inductive arrangement that can receive the input signals such as touch.Touch-screen imparts the brand-new looks of information interaction, is extremely attractive brand-new information interaction equipment.The development of touch screen technology causes the common concern of domestic and international information medium circle, has become the Chaoyang new high-tech industry that photovoltaic industry is a dark horse.
At present, indium tin oxide (being called for short ITO) layer is vital part in touch-screen module.Although the develop rapidly that the manufacturing technology of touch-screen is at a tremendous pace.But for projecting type capacitor screen, there is not too large change in the basic manufacturing process of ITO layer in recent years.Always inevitably need ITO plated film, ITO pattern.
But the resistivity of ITO is comparatively large, the equipment that pad, AIO (Allinone), NoteBook equidimension are larger limits its usability.
Summary of the invention
The invention provides a kind of transparent conductive body and manufacture method thereof, for overcoming defect of the prior art, simple, the applicable large area of manufacture craft, production in enormous quantities, and conductivity is better, is applicable to larger-size equipment use.
The invention provides a kind of transparent conductive body, comprise be made up of isolation material transparent substrates, be located at the first conductive layer of this transparent substrates upper surface and be fixed on the second conductive layer of this transparent substrates lower surface, described first conductive layer and the second conductive layer are by multiple electrode composition arranged in striped stride, insulated from each other between electrode described in adjacent two; The electrode forming described first conductive layer is spatially arranged in a crossed manner with the electrode forming the second conductive layer; Described electrode is latticed, and described grid is connected to form by the conductor wire be positioned on the same face is intersected with each other; The grid electrode that described conductor wire is formed adopts the mixed ink comprising electric conducting material and resin material, based on exposure imaging technological forming.
Wherein, described conductor wire place intersected with each other forms node, and the distance described in adjacent two between node is between 50 μm ~ 500 μm.
Wherein, the width of described conductor wire is between 0.2 μm ~ 5.0 μm, and the thickness of described conductor wire is between 0.5 μm ~ 10.0 μm.
Further, described first conductive layer and the second conductive layer are all covered with the shadow layer that disappears, described in the shadow layer that disappears cover the hollow region of the grid that described conductor wire and described conductor wire are formed.
Wherein, disappear described on shadow layer and be all covered with protective layer.
Wherein, described first conductive layer and the second conductive layer are all covered with protective layer.
Particularly, described electric conducting material is at least one in the metals such as gold, silver, copper, aluminium, manganese, molybdenum, zinc or carbon dust.
Particularly, described resin material comprises the defoamer that weight content is the film-forming resin of 30 ~ 50 parts, the emulsion of 1 ~ 10 part, the solvent of 10 ~ 40 parts, the stabilizer of 0.1 ~ 5 part, the levelling agent of 0.1 ~ 5 part and 0.1 ~ 5 part;
Described film-forming resin is at least one in linear phenolic resin, epoxy resin;
Emulsion is at least one in diazobenzene quinone, diazo naphthoquinone ester, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, aromatic iodonium salt and ferrocene salt;
Solvent is oxolane, methyl ethyl ketone, cyclohexanone, propylene glycol, N, at least one in dinethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1,6-hexylene glycol methoxyl group mono acrylic ester, ethoxylation neopentyl glycol methoxyl group mono acrylic ester;
Stabilizer is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6-di-t-butyl cresols, phenothiazine and anthraquinone;
Levelling agent is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester and organosilicon.
The present invention also provides a kind of manufacture method of above-mentioned transparent conductive body, comprises the following steps:
Step 1, respectively covers at the upper surface of transparent substrates and lower surface the mixed ink that one deck comprises electric conducting material and resin material; Described mixed ink forms ink layer;
Step 2, carries out exposure-processed under the ink layer on above-mentioned transparent substrates two sides is placed on ultraviolet lamp;
Step 3, carries out development treatment by the product after above-mentioned exposure, makes described ink layer form the waffle-like pattern of hollow out; The ink layer covered in the waffle-like pattern of transparent substrates upper surface forms the first conductive layer, and the ink layer covered in the waffle-like pattern of transparent substrates lower surface forms the second conductive layer.
In such scheme, also comprise between step 1 and step 2:
Step 1S, transparent substrates two sides in step 1 all being scribbled mixed ink carries out preliminary drying.
Preferably, the dominant wavelength of the light that the described ultraviolet lamp in step 2 sends is 300 ~ 400nm, and exposure energy is at 50 ~ 500mJ/cm
2between.
Also comprise after described step 3:
Step 4, the product after step 3 being developed is dried.
As the optimal way of above-described embodiment, also comprise after step 4:
Step 5a, described first conductive layer and the second conductive layer cover insulating resin respectively, and the refractive index of this insulating resin between 1.6 ~ 2.8, and is cured above-mentioned insulating resin, and disappear described in the insulating resin after solidification is formed shadow layer.Further; also can also comprise after step 5a: step 6; the above-mentioned shadow layer that disappears covers heat reactive resin or UV-cured resin respectively; and by heating or UV-irradiation, described heat reactive resin or UV-cured resin are cured, described heat reactive resin or UV resin are cured rear formation protective layer.
For a kind of execution mode arranged side by side of above-described embodiment, also comprise after step 4:
Step 5b; described first conductive layer and the second conductive layer cover heat reactive resin or UV resin respectively; and by heating or UV-irradiation, described heat reactive resin or UV resin are cured, described heat reactive resin or UV resin are cured rear formation protective layer.
In above-described embodiment, the preliminary drying temperature in described step 1S is 60 ~ 120 DEG C, and preliminary drying time is 10 ~ 60 minutes.
Bake out temperature in described step 4 is 100 ~ 150 DEG C, and drying time is 10 ~ 60 minutes.
Exposure-processed in wherein said step 2 comprises:
Step 21, is placed on the ink layer of transparent substrates upper surface by the first mask plate, be placed on by the second mask plate on the ink layer of transparent substrates lower surface, and the first mask plate and the second mask plate are formed by shading light part and light transmission part;
Step 22, is irradiated the first mask plate and the second mask plate by ultraviolet lamp;
Step 23, takes off from ink layer respectively by the first mask plate and the second mask plate.
Development treatment in described step 3 is specially: be positioned in developing solution by above-mentioned ink layer, the just right ink layer of described ink layer and described light transmission part is partially dissolved in described developing solution, or described ink layer and the just right ink layer of described shading light part are partially dissolved in described developing solution, the undissolved part of ink layer being positioned at transparent substrates upper surface forms the first conductive layer, and the undissolved part of ink layer being positioned at transparent substrates lower surface forms the second conductive layer.
Particularly, described mixed ink is the mixture of electric conducting material and resin material, described electric conducting material is at least one in the metals such as gold, silver, copper, aluminium, manganese, molybdenum, zinc or carbon dust, and described resin material comprises the defoamer that weight content is the film-forming resin of 30 ~ 50 parts, the emulsion of 1 ~ 10 part, the solvent of 10 ~ 40 parts, the stabilizer of 0.1 ~ 5 part, the levelling agent of 0.1 ~ 5 part and 0.1 ~ 5 part.
Wherein, described electric conducting material can be nano particle, and the granularity of described nano particle is between 100nm ~ 1000nm.
Wherein, described electric conducting material can also be nano wire, and the diameter of described nano wire is between 20nm ~ 200nm, and the length of described nano wire is between 100nm ~ 10000nm.
Preferably, described film-forming resin is at least one in linear phenolic resin, epoxy resin; Emulsion is at least one in diazobenzene quinone, diazo naphthoquinone ester, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, aromatic iodonium salt and ferrocene salt; Solvent is oxolane, methyl ethyl ketone, cyclohexanone, propylene glycol, N, at least one in dinethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1,6-hexylene glycol methoxyl group mono acrylic ester, ethoxylation neopentyl glycol methoxyl group mono acrylic ester; Stabilizer is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6-di-t-butyl cresols, phenothiazine and anthraquinone; Levelling agent is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester and organosilicon.
Transparent conductive body provided by the invention and preparation method thereof, first conductive layer and the second conductive layer all adopt conductive grid structure, conductive grid is by having the mixed ink of electric conductivity and photoresist performance concurrently through exposure, development and oven dry preparation, relative to ito film, manufacture craft is simple, be applicable to large area, production in enormous quantities, and the electric conductivity of conductive layer comparatively ITO layer is better, can be applicable on the larger equipment of pad, AIO (Allinone), NoteBook equidimension; Above-mentioned transparent conductive body is two-sided conductive structure, can realize two sides and carry out process operations simultaneously, improve production efficiency, reduce production cost.
Accompanying drawing explanation
The perspective exploded view of the transparent conductive body that Fig. 1 provides for the embodiment of the present invention one;
The partial sectional view that in the transparent conductive body that Fig. 2 provides for the embodiment of the present invention one, in first conductive layer and the second conductive layer, single electrode crossing is arranged;
The close-up schematic view one of electrode in the transparent conductive body that Fig. 3 provides for the embodiment of the present invention one;
The close-up schematic view two of electrode in the transparent conductive body that Fig. 4 provides for the embodiment of the present invention one;
The close-up schematic view three of electrode in the transparent conductive body that Fig. 5 provides for the embodiment of the present invention one;
The close-up schematic view four of electrode in the transparent conductive body that Fig. 6 provides for the embodiment of the present invention one;
The manufacture method schematic diagram of the transparent conductive body that Fig. 7 provides for the embodiment of the present invention one;
The close-up schematic view of electrode in the transparent conductive body that Fig. 8 provides for the embodiment of the present invention two;
The partial sectional view of the transparent conductive body that Fig. 9 provides for the embodiment of the present invention three
The partial sectional view of a kind of transparent conductive body that Figure 10 provides for the embodiment of the present invention four;
The partial sectional view of the another kind of transparent conductive body that Figure 11 provides for the embodiment of the present invention four.
Embodiment
Embodiment one
As shown in figures 1 to 6, the embodiment of the present invention one provides a kind of transparent conductive body, comprise the transparent substrates 1 be made up of isolation material, the second conductive layer 20 being located at the first conductive layer 10 on this transparent substrates upper surface 1a and being fixed on this transparent substrates lower surface 1b, first conductive layer 10 and the second conductive layer 20 form by multiple spaced electrode 100, insulated from each other between adjacent two electrodes 100.In the present embodiment, electrode 100 is strip, and in other embodiments, the conductive unit that each electrode 100 also also can be connected by multiple linear array successively forms; The electrode forming the first conductive layer 10 is spatially arranged in a crossed manner with the electrode forming the second conductive layer 30; Electrode 100 is all in latticed, and described grid is connected to form by the conductor wire 101 be positioned on the same face is intersected with each other; The grid electrode that conductor wire 101 is formed adopts the mixed ink comprising electric conducting material and resin material, based on exposure imaging technological forming.The electrode forming the first conductive layer 10 forms Inductance and Capacitance with the electrode forming the second conductive layer 30 is spatially arranged in a crossed manner.
As shown in Figure 7, this present invention also provides a kind of manufacture method of above-mentioned transparent conductive body, comprises the following steps:
Step 1, respectively covers at the upper surface of transparent substrates 1 and lower surface the mixed ink that one deck comprises electric conducting material and resin material, forms ink layer 1c;
Step 2, is placed on ultraviolet lamp by the ink layer on above-mentioned transparent substrates two sides and carries out exposure-processed 2 times; Can expose two ink layeies;
Step 3, carries out development treatment by the product after above-mentioned exposure, makes ink layer form the waffle-like pattern of hollow out; The ink layer covered in the waffle-like pattern of transparent substrates upper surface forms the first conductive layer 10, and the ink layer covered in the waffle-like pattern of transparent substrates lower surface forms the second conductive layer 20.
The first conductive layer on transparent conductive body provided by the invention and the second conductive layer all adopt conductive grid structure, this conductive grid obtains through exposure, development, oven dry by the mixed ink having electric conductivity and photoresist performance concurrently, relative to ito film, manufacture craft is simple, be applicable to large area, production in enormous quantities, and the electric conductivity of conductive layer comparatively ITO is better, can be applicable on the larger equipment of panel computer, computer all-in-one machine, notebook computer equidimension; Above-mentioned transparent conductive body is two-sided conductive structure, can realize two sides and carry out process operations simultaneously, improve production efficiency, reduce production cost.
Because mixed ink surface viscosity is comparatively large, be unfavorable for the operation exposed, also comprise between step 1 and step 2:
Step 1S, transparent substrates two sides in step 1 all being scribbled mixed ink carries out preliminary drying.
Preferably, the dominant wavelength of the light that the described ultraviolet lamp in step 2 sends is 300 ~ 400nm, and exposure energy is at 50 ~ 500mJ/cm
2between.
The grid line formed to make mixed ink is more firmly arranged on a transparent substrate, also comprises after step 3:
Step 4, the product after step 3 being developed is dried.
Wherein, the exposure-processed in step 2 comprises:
Step 21, first mask plate 1d is placed on the mixed ink 1c of transparent substrates 1 upper surface, be placed on by second mask plate 2d on the miscella layer of ink 1c of transparent substrates 1 lower surface, the first mask plate 1d and the second mask plate 2d is formed by shading light part and light transmission part;
Step 22, is irradiated the first mask plate 1d and the second mask plate 2d by uviol lamp 2;
Step 23, takes off from two ink layer 1c respectively by the first mask plate 1d and the second mask plate 2d.
Development treatment in step 3 is specially: be dipped in developing solution by above-mentioned ink layer, the just right ink layer in ink layer and light transmission part is partially dissolved in developing solution, or ink layer and the just right ink layer of shading light part are partially dissolved in developing solution, the ink layer being positioned at transparent substrates upper surface forms the first conductive layer 10, and the ink layer being positioned at transparent substrates lower surface forms the second conductive layer 20.
The material of transparent substrates 1 is the optically transparent materials such as glass, polymethyl methacrylate (PMMA) or PETG (PET).The thickness of transparent base is 0.02mm ~ 1.2mm, is preferably 0.05mm ~ 0.5mm.The basic grid 102 that conductor wire intersects to form mutually can be regular polygon, as square, rhombus, regular hexagon; Or random grid, and grid forms the gap 200 between electrode 100 by break line treatment; Basic grid 102 shown in Fig. 3 is regular hexagons, and the basic grid 102 shown in Fig. 4 is squares, and basic grid 102 shown in Fig. 5 is rhombuses, and basic grid 102 shown in Fig. 6 is random grid; Here basic grid refers to the minimum independent grid forming lattice, and basic grid is foursquare grid, and the implication of representative is exactly cross each other to form by conductor wire the pattern be combined to form by square net; Insulation between electrode is by carrying out break line treatment formation at grid ad-hoc location.
Mixed ink is the mixture of electric conducting material and resin material, electric conducting material is at least one in the metals such as gold, silver, copper, aluminium, manganese, molybdenum, zinc or carbon dust, and resin material comprises the defoamer that weight content is the film-forming resin of 30 ~ 50 parts, the emulsion of 1 ~ 10 part, the solvent of 10 ~ 40 parts, the stabilizer of 0.1 ~ 5 part, the levelling agent of 0.1 ~ 5 part and 0.1 ~ 5 part.Electric conducting material can be nano particle can be also nano wire, and when electric conducting material is nano particle, the granularity of nano particle is between 100nm ~ 1000nm; When electric conducting material is nano wire, the diameter of nano wire is between 20nm ~ 200nm, and the length of nano wire is between 100nm ~ 10000nm.
Film-forming resin is at least one in linear phenolic resin, epoxy resin; Emulsion is at least one in diazobenzene quinone, diazo naphthoquinone ester, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, aromatic iodonium salt and ferrocene salt; Solvent is oxolane, methyl ethyl ketone, cyclohexanone, propylene glycol, N, at least one in dinethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1,6-hexylene glycol methoxyl group mono acrylic ester, ethoxylation neopentyl glycol methoxyl group mono acrylic ester; Stabilizer is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6-di-t-butyl cresols, phenothiazine and anthraquinone; Levelling agent is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester and organosilicon.
The viscosity of mixed ink is 1000cps ~ 50000cps.When it uses, first carry out preliminary drying, preliminary drying temperature 60-120 DEG C, drying time is at 10-60min; Then carry out exposure-processed, Exposure mode is: above-mentioned mixed ink being positioned over dominant wavelength is expose under the ultraviolet lamp of 300nm ~ 400nm, 800 ~ 1200W, and exposure energy is 50 ~ 1000mJ/cm
2; Product after exposure is carried out development treatment, and developing solution is weak base salt solution, as: sodium carbonate, potash, sodium acid carbonate, saleratus, sodium phosphate, phosphoric acid hydrogen is received, and the mass concentration of the solution of weak base salt is 0.1% – 3%; Product after development is admittedly baked at 100-150 DEG C, admittedly roasting time 10-60min.
Mixed ink in the present embodiment has conducting function and photoresist function concurrently, conducting metal realizes conducting function, resin material realizes the function of photoresist, adopt above-mentioned mixed ink, the manufacturing process of transparent conductive body can be enormously simplify, and large area, production in enormous quantities making can be met, the electric conductivity of conductive layer is better, simultaneously two-sidedly can carry out operation simultaneously, improve production efficiency, reduce production cost.
As the optimal enforcement mode of such scheme, preliminary drying temperature, preliminary drying time, bake out temperature and drying time are all relevant with the thickness of the composition of mixed ink and the mixed ink that is coated in the upper and lower surface of transparent substrates, preliminary drying temperature in step 1 is 60 ~ 120 DEG C, and preliminary drying time is 10 ~ 60 minutes.Optimized preliminary drying temperature is 80 DEG C, and optimized preliminary drying time is 10 minutes; Bake out temperature in step 4 is 100 ~ 150 DEG C, and drying time is 10 ~ 60 minutes, and optimized bake out temperature is 130 DEG C, and optimized preliminary drying time is 30 minutes.
In step 2, first mask plate and the second mask plate are by the conductive pattern be combined to form on electrode of shading light part and light transmission part, again by step 3, by the conductive pattern be partly dissolved on last formation electrode below ink layer 1c light transmission part or below shading light part, be under ink layer 1c is positioned at mask plate 1d light transmission part or the composition depending in part on mixed ink under shading light part as what finally dissolve;
Resin material in mixed ink is photoresist, and wherein in an embodiment, this photoresist is eurymeric photoresistance, and its component comprises: film-forming resin, emulsion, solvent, stabilizer, levelling agent and defoamer; Film-forming resin can be linear phenolic resin; Emulsion material is selected from least one in diazonium benzoquinones, the same hydroxy compounds of diazonium sulfonic acid chloride, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester; Solvent material is selected from least one in oxolane, methyl ethyl ketone, cyclohexanone, propylene glycol, DMF, ethyl cellosolve acetate, ethyl acetate, butyl acetate; Stabilizer material is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6-di-t-butyl cresols, phenothiazine, anthraquinone; Levelling agent material is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester or organosilicon; The weight ratio of each component is: film-forming resin: 30-50 part; Emulsion: 1-10 part; Solvent: 10-40 part; Stabilizer: 0.1-5 part; Levelling agent: 0.1-5 part; Defoamer: 0.1-5 part; The above component sum is 100 parts; Above-mentioned eurymeric photoresist preliminary drying temperature 60 ~ 120 DEG C, preliminary drying time 10 ~ 60 minutes; Exposure wavelength 200nm-400nm, exposure energy 50 ~ 1000mJ/cm
2, viscosity is 200cps-20000cps.
In this embodiment, resin material in mixed ink under light transmission part can become mono-crystalline structures after ultra violet lamp, in development step 3, meet developing solution will dissolve, therefore the mixed ink under light transmission part can be dissolved, the mixed ink stayed under shading light part forms conductive pattern, when being elected to the mixed ink with above-mentioned composition, need the shape shading light part on the first mask plate and the second mask plate being designed to the conductive pattern on electrode.
Wherein in another embodiment, this photoresist is minus photoresistance, and its component comprises: film-forming resin, emulsion, solvent, stabilizer, levelling agent and defoamer; Film-forming resin can be epoxy resin; Emulsion material is at least one in aromatic diazo salt, aromatic sulfonium salts, aromatic iodonium salt or ferrocene salt; Solvent material is one or more mixtures following: toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1,6-hexylene glycol methoxyl group mono acrylic ester, ethoxylation neopentyl glycol methoxyl group mono acrylic ester; Stabilizer material is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6-di-t-butyl cresols, phenothiazine, anthraquinone; Levelling agent material is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester or organosilicon; The weight ratio of each component is: film-forming resin: 30-50 part; Emulsion: 1-10 part; Solvent: 10-40 part; Stabilizer: 0.1-5 part; Levelling agent: 0.1-5 part; Defoamer: 0.1-5 part; The above component sum is 100 parts.
Above-mentioned negative light resistance agent preliminary drying temperature 60 ~ 120 DEG C, preliminary drying time 10 ~ 60 minutes; Exposure wavelength 200nm-400nm, exposure energy 50 ~ 1000mJ/cm
2, viscosity is 200cps-20000cps.
In the present embodiment, resin material in mixed ink under shading light part can become mono-crystalline structures after ultra violet lamp, in development step 3, meet developing solution will dissolve, therefore the mixed ink under shading light part can be dissolved, the mixed ink stayed under light transmission part forms conductive pattern, when being elected to the mixed ink with above-mentioned composition, need the shape light transmission part on the first mask plate and the second mask plate being designed to the conductive pattern on electrode.
Embodiment two
As shown in Figure 8, because the conductor wire 101 forming grid is light tight, in order to improve the light transmittance of electric conductor, thus reduce mesh width d and increase the grid line spacing w of metal grill to increase glazed area, conductor wire 101 place intersected with each other forms node 102, and the distance between adjacent two nodes 102 is between 50 μm ~ 500 μm; The width of conductor wire between 0.2 μm ~ 5.0 μm, preferably between 0.5 μm ~ 2.0 μm; The thickness of conductor wire between 0.5 μm ~ 10.0 μm, preferably between 2.0 μm ~ 5.0 μm.
Embodiment three
Because conductive layer in above-described embodiment one is the grid that lighttight electric conducting material is formed, i.e. electric conducting material only region, cover part over the transparent substrate, when the reflectivity of electric conducting material and the refractive index difference of transparent base larger time, the optical effect that light is radiated at the light that conductive material surface and transparent substrate surface reflect can produce larger difference, makes people easily see the grid of conductive layer; Therefore, the present embodiment two by the grid line of conductive layer and transparent substrate surface one deck optical adjustment layer is not set by the region that conductive mesh ruling covers, to reduce electric conductor by the difference in reflectivity in conductive mesh the ruling region covered and the region do not covered by conductive mesh ruling, and then the visibility of the grid of reduction conductive layer.
On the basis of embodiment one or embodiment two, above-mentioned transparent conductive body is because conductive layer is conductive grid, form the conductor wire only region, cover part (as shown in Figure 2) on a transparent substrate of conductive grid, when the reflectivity of conductor wire and the difference in reflectivity of transparent base larger time, namely light is radiated at the optical effect of light that conductor wire surface and transparent substrates surface reflection return can produce larger difference, makes user easily see conductor wire.Based on this, the present invention provides a kind of solution to the problems described above simultaneously, as shown in Figure 9, first conductive layer 10 and the second conductive layer 20 are all covered with the shadow layer 30 that disappears, the shadow layer 30 that disappears covers the hollow region of the grid of conductor wire and conductor wire formation, be irradiated to the difference in reflectivity in transparent substrates the surface region be coated by an electrically conducting material and the region be not capped for reducing light, and then reduce the visibility of conductor wire.The material of shadow layer 30 of disappearing is high refractive index transparent isolation material, can be TiO
2, Nb
2o
5deng inorganic matter, also can be the organic materials such as 1,3,5-triazines-2,4,6-tri-aminated compounds; Refractive index as the shadow layer material that disappear is 1.6-2.8, and thickness is 20nm-2000nm.
Manufacture method is as follows:
Step 1, respectively cover at the upper surface of transparent substrates and lower surface the mixed ink that one deck comprises electric conducting material and resin material, mixed ink forms ink layer;
Step 1S, the transparent substrates above-mentioned two sides all being scribbled mixed ink carries out preliminary drying;
Step 2, above-mentioned pre-baked ink layer is placed on dominant wavelength is 365nm, power is carry out the waffle-like pattern that exposure-processed obtains with colour recognition under the ultraviolet lamp of 1000W simultaneously, exposure energy is at 80 ~ 120mJ/cm
2between;
Step 3, carries out development treatment by the product after above-mentioned exposure, makes ink layer form the waffle-like pattern of hollow out;
Step 4, product after above-mentioned development is dried, bake out temperature is 130 DEG C, drying time is 30min, the ink layer covered in the waffle-like pattern of transparent substrates upper surface forms the first conductive layer, and the ink layer covered in the waffle-like pattern of transparent substrates lower surface forms the second conductive layer;
Step 5a, the first conductive layer and the second conductive layer cover insulating resin respectively, and the refractive index of this insulating resin between 1.6 ~ 2.8, and is cured above-mentioned insulating resin, and the insulating resin after solidification forms the shadow layer 40 that disappears.
Embodiment four
As shown in Figure 10, on the basis of embodiment one or embodiment two, in order to prevent conductive layer scratch in production and use procedure, drop, a protective layer 40 can be respectively set on the surface of the first conductive layer 10 and the second conductive layer 20.
Manufacture method is as follows:
Step 1, respectively cover at the upper surface of transparent substrates and lower surface the mixed ink that one deck comprises electric conducting material and resin material, mixed ink forms ink layer;
Step 1S, the transparent substrates above-mentioned two sides all being scribbled mixed ink carries out preliminary drying;
Step 2, is placed on the ink layer of above-mentioned preliminary drying that dominant wavelength is 365nm, power is carry out exposure-processed under the uviol lamp of 1000W to obtain waffle-like pattern simultaneously, and exposure energy is at 80 ~ 120mJ/cm
2between;
Step 3, carries out development treatment by the product after above-mentioned exposure, makes ink layer form the waffle-like pattern of hollow out;
Step 4, dried by product after above-mentioned development, bake out temperature is 130 DEG C, and drying time is 30min, the waffle-like pattern carburetion layer of ink covered in transparent substrates upper surface forms the first conductive layer, and the waffle-like pattern carburetion layer of ink covered in transparent substrates lower surface forms the second conductive layer;
Step 5b, the first conductive layer and the second conductive layer cover heat reactive resin or UV resin respectively, and are cured heat reactive resin or UV resin by heating or Ultraviolet radiation, and heat reactive resin or UV resin are cured rear formation protective layer 40.
Also can the shadow layer 30 that disappear of electrically conducting transparent surface in embodiment three respectively arrange a protective layer 40; As shown in figure 11.
Manufacture method is as follows:
Step 1, respectively cover at the upper surface of transparent substrates and lower surface the mixed ink that one deck comprises electric conducting material and resin material, mixed ink forms ink layer;
Step 1S, the transparent substrates above-mentioned two sides all being scribbled mixed ink carries out preliminary drying;
Step 2, is placed on above-mentioned pre-baked ink layer that dominant wavelength is 365nm, power is carry out exposure-processed under the uviol lamp of 1000W to obtain waffle-like pattern simultaneously, and exposure energy is at 80 ~ 120mJ/cm
2between;
Step 3, carries out development treatment by the product after above-mentioned exposure, above-mentioned ink layer is partly dissolved to the waffle-like pattern obtaining hollow out;
Step 4, product after above-mentioned development is dried, bake out temperature is 130 DEG C, drying time is 30min, the ink layer covered in the waffle-like pattern of transparent substrates upper surface forms the first conductive layer, and the ink layer covered in the waffle-like pattern of transparent substrates lower surface forms the second conductive layer;
Step 5a, the first conductive layer and the second conductive layer cover insulating resin respectively, and the refractive index of this insulating resin between 1.6 ~ 2.8, and is cured above-mentioned insulating resin, and the insulating resin after solidification forms the shadow layer 40 that disappears.
Step 6, the above-mentioned shadow layer that disappears covers heat reactive resin or UV resin respectively, and is cured heat reactive resin or UV resin by heating or Ultraviolet radiation, and heat reactive resin or UV resin are cured rear formation protective layer 40.
Protective layer 40 is insulating material, and its material can be heat reactive resin or ultraviolet-curing resin; Protective layer 40 away from the one side of transparent base and electric conducting material away from transparent base one side between distance be 0.5um ~ 5um.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (23)
1. a transparent conductive body, comprise be made up of isolation material transparent substrates, be located at the first conductive layer of this transparent substrates upper surface and be fixed on the second conductive layer of this transparent substrates lower surface, it is characterized in that, described first conductive layer and the second conductive layer are by multiple spaced electrode composition, insulated from each other between electrode described in adjacent two; The electrode forming described first conductive layer is spatially arranged in a crossed manner with the conductive unit electrode forming the second conductive layer; Described electrode is latticed, and described grid is connected to form by the conductor wire be positioned on the same face is intersected with each other; The grid electrode that described conductor wire is formed adopts the mixed ink comprising electric conducting material and resin material, based on exposure imaging technological forming;
Described resin material comprises the defoamer that weight content is the film-forming resin of 30 ~ 50 parts, the emulsion of 1 ~ 10 part, the solvent of 10 ~ 40 parts, the stabilizer of 0.1 ~ 5 part, the levelling agent of 0.1 ~ 5 part and 0.1 ~ 5 part.
2. transparent conductive body according to claim 1, is characterized in that, described conductor wire place intersected with each other forms node, and the distance described in adjacent two between node is between 50 μm ~ 500 μm.
3. transparent conductive body according to claim 1, is characterized in that, the width of described conductor wire is between 0.2 μm ~ 5.0 μm, and the thickness of described conductor wire is between 0.5 μm ~ 10.0 μm.
4., according to the arbitrary described transparent conductive body of claim 1-3, it is characterized in that, described first conductive layer and the second conductive layer are all covered with the shadow layer that disappears, described in the shadow layer that disappears cover the hollow region of the grid that described conductor wire and described conductor wire are formed.
5. transparent conductive body according to claim 4, is characterized in that, described in disappear on shadow layer and be all covered with protective layer.
6. transparent conductive body according to claim 1, is characterized in that, described first conductive layer and the second conductive layer are all covered with protective layer.
7. transparent conductive body according to claim 1, is characterized in that, described electric conducting material is at least one in gold, silver, copper, aluminium, manganese, molybdenum, zinc metal or carbon dust.
8. transparent conductive body according to claim 1, is characterized in that, described film-forming resin is at least one in linear phenolic resin, epoxy resin;
Emulsion is at least one in diazobenzene quinone, diazo naphthoquinone ester, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, aromatic iodonium salt and ferrocene salt;
Solvent is oxolane, methyl ethyl ketone, cyclohexanone, propylene glycol, N, at least one in dinethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1,6-hexylene glycol methoxyl group mono acrylic ester, ethoxylation neopentyl glycol methoxyl group mono acrylic ester;
Stabilizer is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6-di-t-butyl cresols, phenothiazine and anthraquinone;
Levelling agent is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester and organosilicon.
9. a manufacture method for transparent conductive body, is characterized in that, comprises the following steps:
Step 1, respectively cover at the upper surface of transparent substrates and lower surface the mixed ink that one deck comprises electric conducting material and resin material, described mixed ink forms ink layer;
Step 2, carries out exposure-processed under the ink layer on above-mentioned transparent substrates two sides is placed on ultraviolet lamp;
Step 3, carries out development treatment by the product after above-mentioned exposure, makes described ink layer form the waffle-like pattern of hollow out; The ink layer covered in the waffle-like pattern of transparent substrates upper surface forms the first conductive layer, and the ink layer covered in the waffle-like pattern of transparent substrates lower surface forms the second conductive layer.
10. the manufacture method of transparent conductive body according to claim 9, is characterized in that, also comprises between step 1 and step 2:
Step 1S, transparent substrates two sides in step 1 all being scribbled mixed ink carries out preliminary drying.
The manufacture method of 11. transparent conductive bodies according to claim 9, is characterized in that, the dominant wavelength of the light that the described ultraviolet lamp in step 2 sends is 300 ~ 400nm, and exposure energy is at 50 ~ 500mJ/cm
2between.
The manufacture method of 12. transparent conductive bodies according to claim 9, is characterized in that, also comprises after described step 3:
Step 4, the product after step 3 being developed is dried.
The manufacture method of 13. transparent conductive bodies according to claim 12, is characterized in that, also comprises after step 4:
Step 5a, described first conductive layer and the second conductive layer cover insulating resin respectively, and the refractive index of this insulating resin between 1.6 ~ 2.8, and is cured above-mentioned insulating resin, and the insulating resin after solidification forms the shadow layer that disappears.
The manufacture method of 14. transparent conductive bodies according to claim 13, is characterized in that, also comprise after step 5a:
Step 6, the above-mentioned shadow layer that disappears covers heat reactive resin or UV-cured resin respectively, and is cured by heating or UV-irradiation described heat reactive resin or UV-cured resin and forms protective layer.
The manufacture method of 15. transparent conductive bodies according to claim 12, is characterized in that, also comprises after step 4:
Step 5b, described first conductive layer and the second conductive layer cover heat reactive resin or UV-cured resin respectively, and are cured by heating or UV-irradiation described heat reactive resin or UV-cured resin and form protective layer.
The manufacture method of 16. transparent conductive bodies according to claim 10, is characterized in that, the preliminary drying temperature in described step 1S is 60 ~ 120 DEG C, and preliminary drying time is 10 ~ 60 minutes.
The manufacture method of 17. transparent conductive bodies according to claim 12, is characterized in that, the bake out temperature in described step 4 is 100 ~ 150 DEG C, and drying time is 10 ~ 60 minutes.
18. according to the manufacture method of the arbitrary described transparent conductive body of claim 9-13, and it is characterized in that, the exposure-processed in described step 2 comprises:
Step 21, is placed on the ink layer of transparent substrates upper surface by the first mask plate, be placed on by the second mask plate on the ink layer of transparent substrates lower surface, and the first mask plate and the second mask plate are formed by shading light part and light transmission part;
Step 22, is irradiated the first mask plate and the second mask plate by ultraviolet lamp;
Step 23, takes off from ink layer respectively by the first mask plate and the second mask plate.
19. according to the manufacture method of the arbitrary described transparent conductive body of claim 9-17, it is characterized in that, development treatment in described step 3 is specially: be dipped in developing solution by above-mentioned ink layer, the just right ink layer of described ink layer and described light transmission part is partially dissolved in described developing solution, or described ink layer and the just right ink layer of described shading light part are partially dissolved in described developing solution, the undissolved part of ink layer being positioned at transparent substrates upper surface forms the first conductive layer, the undissolved part of ink layer being positioned at transparent substrates lower surface forms the second conductive layer.
20. according to the manufacture method of the arbitrary described transparent conductive body of claim 9-17, it is characterized in that, described mixed ink is the mixture of electric conducting material and resin material, described electric conducting material is at least one in gold, silver, copper, aluminium, manganese, molybdenum, zinc metal or carbon dust, and described resin material comprises the defoamer that weight content is the film-forming resin of 30 ~ 50 parts, the emulsion of 1 ~ 10 part, the solvent of 10 ~ 40 parts, the stabilizer of 0.1 ~ 5 part, the levelling agent of 0.1 ~ 5 part and 0.1 ~ 5 part.
The manufacture method of 21. transparent conductive bodies according to claim 20, is characterized in that, described electric conducting material is nano particle, and the granularity of described nano particle is between 100nm ~ 1000nm.
The manufacture method of 22. transparent conductive bodies according to claim 20, is characterized in that, described electric conducting material is nano wire, and the diameter of described nano wire is between 20nm ~ 200nm, and the length of described nano wire is between 100nm ~ 10000nm.
The manufacture method of 23. transparent conductive bodies according to claim 20, is characterized in that,
Described film-forming resin is at least one in linear phenolic resin, epoxy resin;
Emulsion is at least one in diazobenzene quinone, diazo naphthoquinone ester, polyvinyl cinnamate, poly-Chinese cassia tree fork malonic acid glycol ester polyester, aromatic diazo salt, aromatic sulfonium salts, aromatic iodonium salt and ferrocene salt;
Solvent is oxolane, methyl ethyl ketone, cyclohexanone, propylene glycol, N, at least one in dinethylformamide, ethyl cellosolve acetate, ethyl acetate and butyl acetate, toluene, dimethylbenzene, tripropylene glycol diacrylate, trimethylolpropane triacrylate, ethoxylated trimethylolpropane triacrylate, dipentaerythrite six acrylate, 1,6-hexylene glycol methoxyl group mono acrylic ester, ethoxylation neopentyl glycol methoxyl group mono acrylic ester;
Stabilizer is at least one in hydroquinones, p methoxy phenol, 1,4-benzoquinone, 2,6-di-t-butyl cresols, phenothiazine and anthraquinone;
Levelling agent is at least one in polyacrylate, acetate butyrate fiber, nitrocellulose and polyvinyl butyral resin; Defoamer is at least one in phosphate, fatty acid ester and organosilicon.
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Address after: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Effective date of registration: 20210223 Address after: 231323 Building 1, precision electronics industrial park, Hangbu Town, Shucheng County, Lu'an City, Anhui Province Patentee after: Anhui jingzhuo optical display technology Co.,Ltd. Address before: 330013, Nanchang, Jiangxi, north of the Economic Development Zone Huang Jia Hu West Road, the ophelion Technology Park. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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