CN103438710B - Substrate processing system - Google Patents
Substrate processing system Download PDFInfo
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- CN103438710B CN103438710B CN201310302882.2A CN201310302882A CN103438710B CN 103438710 B CN103438710 B CN 103438710B CN 201310302882 A CN201310302882 A CN 201310302882A CN 103438710 B CN103438710 B CN 103438710B
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- 239000000758 substrate Substances 0.000 title claims abstract description 74
- 238000012545 processing Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 claims abstract description 176
- 238000011068 loading method Methods 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 11
- 238000009423 ventilation Methods 0.000 description 11
- 238000000137 annealing Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention provides a substrate processing system, which comprises a conveying part, a first processing chamber, a second processing chamber, a conveying manipulator, a moving-in part, a moving-out part and a control part. The processing chamber comprises a multi-layer frame capable of supporting substrates on each layer; and a door which opens or closes in corresponding to the desired layer of the multi-layer frame when the substrate is moved in and moved out. The control part is used for controlling the process that the substrate is moved out from the first processing chamber by the conveying manipulator and stored in the moving-out part over a preset period since the substrate is moved into the first processing chamber, subsequently the conveying manipulator moves to the moving-in part, holds the substrate to be processed and moves the substrate into the first processing chamber, and then the substrate is moved out from the second processing chamber by the conveying manipulator and stored in the moving-out part over a preset period since the substrate is moved into the second processing chamber, subsequently the conveying manipulator moves to the moving-in part, holds the substrate to be processed and moves the substrate into the second processing chamber, and moreover the door closes during the process that the conveying manipulator leaves the processing chambers, and the actions are continuously and sequentially performed in the first processing chamber and the second processing chamber.
Description
The application number that the application is the applying date is on 03 09th, 2010, denomination of invention is " base plate processing system and substrate processing method using same " is the divisional application of 201010132170.7 patent applications.
Technical field
The present invention relates to and the heat treated base plate processing systems such as roasting (baked one-tenth) are carried out to substrates such as liquid-crystalline glasses.
Background technology
When heat-treating substrates such as liquid-crystalline glasses in chromatic filter manufacturing engineering etc., in order to effectively carry out moving into, process and taking out of of substrate, often use the structure of systematization.
The control content of the substrate conveying in Fig. 1 simple declaration base plate processing system is in the past used at this.In the past, from the conveying mechanical arm 22 that the loading unit figure takes out untreated workpiece, such as, take out of from the superiors of the multi-layer rack 166 of the first process chamber 16 workpiece processed, then untreated work-piece is moved in this layer be available.After this conveying mechanical arm 22 is transported to the workpiece processed and takes out of portion outside figure.Then, conveying mechanical arm 22 takes out untreated work-piece from loading unit again, takes out of the workpiece processed specifically from the multi-layer rack 166 of the first process chamber 16 from the second layer of upper number, then untreated work-piece is moved in this layer be available.Repeatedly carry out same action, conveying mechanical arm 22 taking out of the process of the workpiece processed from the superiors to undermost each layer and moving into the process of untreated work-piece first to the multi-layer rack of the first process chamber 16.Complete to the multi-layer rack 166 of the first process chamber 16 from the superiors to the process taking out of the workpiece processed of undermost each layer and move into untreated work-piece process after, same as described above, taking out of the process of the workpiece processed from the superiors to undermost each layer and moving into the process of untreated work-piece the multi-layer rack 186 of the second process chamber 18.
In this base plate processing system, when heat-treating substrate, be coated in composition (composition with distillation character such as containing the photoresist) gasification with distillation character on substrate, because this sublimate causes the cleanliness factor in stove to reduce.
Therefore, in the past to utilizing ventilating duct etc. that the sublimate produced has been thought various way from the gas extraction system of sucking-off in stove.Such as there is a kind of annealing device to reduce the concentration of sublimation gases, after the air of ventilation is heated, import to the upstream section of the circulating air by workpiece, and a part is discharged (such as with reference to flat No. 10-141868 of Japanese Laid-Open Patent Publication) by the air of workpiece.
In the annealing device in the past of annealing device comprising flat No. 10-141868 of above-mentioned Japanese Laid-Open Patent Publication, if boosted productivity (throughput), just must shorten time interval substrate moved in stove as far as possible, if but shorten the time interval moving into substrate, then in order to make the concentration of sublimate gas low, just capacity must be increased.
And with the increase of capacity, the heating capacity of heat exhaust or air feed also will increase, and its result remains on design temperature in order to make in stove, just must provide more heat from heater in stove.
Therefore, in the annealing device in the past of annealing device comprising flat No. 10-141868 of above-mentioned Japanese Laid-Open Patent Publication, the inevitable increase proportional with the raising of productivity ratio of power consumption, thus will cut down power consumption will sacrifice productivity ratio.
Summary of the invention
The object of this invention is to provide a kind of productivity ratio of can not sacrificing and just can realize cutting down the base plate processing system of power consumption.
Base plate processing system of the present invention is heat-treated substrate.Example as substrate can be enumerated: the semiconductor wafer etc. used in the glass substrate of liquid crystal display and plasma scope, semiconductor device.
This base plate processing system comprises delivery section, multiple process chamber, loading unit, takes out of portion and control part.Delivery section has the conveying mechanical arm of conveying substrate.Multiple process chamber is configured in around delivery section respectively.Chambers has the door that can open or close when moving into and take out of substrate.
Control part at least controls delivery section and process chamber.Control part controls the action of conveying mechanical arm and door, makes conveying mechanical arm not be move into same process chamber or take out of continuously, but moves into multiple process chamber or take out of in turn.
The invention provides a kind of base plate processing system, for heat-treating substrate, described base plate processing system comprises: multiple process chamber, heat-treats substrate, conveying mechanical arm, once only carries a substrate, loading unit, holds the untreatment base will moving into described process chamber, take out of portion, hold the substrate after taking out of from described process chamber, and control part, control described process chamber and described conveying mechanical arm, described process chamber has: multi-layer rack, can substrate supporting on each layer, and door, when moving into and take out of substrate, the layer corresponded to desired by multi-layer rack can open or close, described control part controls the action of described conveying mechanical arm and described door, the substrate of stipulated time is have passed through by described conveying mechanical arm being moved to after in a process chamber, take out of from this process chamber and take out of portion described in being left in by the substrate taken out of, then described conveying mechanical arm is made to move to described loading unit and grip untreatment base, untreatment base is moved in this process chamber, then, be moved to have passed through the stipulated time after in another process chamber substrate by described conveying mechanical arm, take out of from this another process chamber and take out of portion described in depositing in, then described conveying mechanical arm is made to move to described loading unit and grip untreatment base, untreatment base is moved in this another process chamber, during described conveying mechanical arm leaves from described process chamber, described door is closed, and by also continuing such action in turn to described multiple process chamber later, the all substrates be bearing on described multi-layer rack in described multiple process chamber are carried out to the heat treatment of stipulated time.
In addition, the invention provides a kind of base plate processing system, for heat-treating substrate, described base plate processing system comprises: multiple process chamber, heat-treats substrate, conveying mechanical arm, is configured to once can carry at least two substrates, loading unit, holds the untreatment base will moving into described process chamber, take out of portion, hold the substrate after taking out of from described process chamber, and control part, control described process chamber and described conveying mechanical arm, described process chamber has: multi-layer rack, can substrate supporting on each layer, and door, when moving into and take out of substrate, the layer corresponded to desired by multi-layer rack can open or close, described control part controls the action of described conveying mechanical arm and described door, described conveying mechanical arm is made to grip at least one untreatment base in described loading unit, the substrate of stipulated time is have passed through by described conveying mechanical arm being moved to after in a process chamber, take out of from this process chamber, and the untreatment base that described conveying mechanical arm grips is moved in this process chamber, then portion is taken out of described in the substrate taken out of from this process chamber being deposited in, described conveying mechanical arm is made to grip at least one untreatment base in described loading unit, be moved to have passed through the stipulated time after in another process chamber substrate by described conveying mechanical arm, take out of from this another process chamber, and the untreatment base that described conveying mechanical arm grips is moved in this another process chamber, then portion is taken out of described in the substrate taken out of from this another process chamber being stored in, described manipulator is made to grip at least one untreatment base in described loading unit, by later, also such action is continued in turn to described multiple process chamber, the all substrates be bearing on described multi-layer rack in described multiple process chamber are carried out to the heat treatment of stipulated time.
In such an embodiment, what each productive temp time (tact time) carried out different process chamber doors opens or closes action, for different process chambers substrate is moved in order or takes out of.By changing the order that substrate is dropped into multiple process chamber like this, the growing amount of the sublimate gas of time per unit in single process chamber can be suppressed, reducing the concentration of the sublimate gas in stove.
Its result is compared with the past, can reduce capacity and air demand during running, and can cut down the heat extraction with exhaust.That is, productivity ratio can not be reduced and just can carry out energy-saving operation.The frequency of maintenance that removal also can be made in addition to be attached to sublimate in stove etc. reduces.
According to the present invention, productivity ratio can not be sacrificed and just can realize significantly reducing power consumption.
Accompanying drawing explanation
Fig. 1 is the figure of the content of the base plate processing system control substrate conveying represented in the past.
Fig. 2 is the top view of the base plate processing system summary representing embodiment of the present invention.
Fig. 3 is the sectional view representing the first process chamber, the second process chamber and conveying mechanical arm summary.
Fig. 4 is the block diagram representing base plate processing system summary.
Fig. 5 represents that master control part controls the figure of content.
Fig. 6 is the top view of the base plate processing system brief configuration representing the embodiment that the present invention is other.
Fig. 7 briefly expresses the figure with the effect of the base plate processing system of n process chamber.
Fig. 8 is the figure of the process chamber brief configuration representing the embodiment that the present invention is other.
Detailed description of the invention
Fig. 2 is the summary of the base plate processing system 10 representing embodiment of the present invention.In this embodiment, base plate processing system 10 carries out the manufacturing engineering of chromatic filter, but range of application of the present invention is not limited to the manufacturing engineering of chromatic filter.
Base plate processing system 10 comprises loading unit 12, takes out of portion 14, delivery section 15, first process chamber 16 and the second process chamber 18.Loading unit 12, taking out of portion 14 and delivery section 15, to be configured in the cleaning unit covered with transparent component inner.
Loading unit 12 works as the mouth of moving into of untreated work-piece (substrate) 20.In the present embodiment, workpiece 20 is rectangle glass substrates of about 2.5 meters, long limit, minor face about 2.2 meters, but the kind of the workpiece 20 of heat treatment system 10 process is not limited thereto.Take out of portion 14 and can load the workpiece 20 processed.
Delivery section 15 is positioned at the central portion of heat treatment system 10, be configured to respectively with loading unit 12, take out of portion 14, first process chamber 16 and the second process chamber 18 adjoins.Delivery section 15 is provided with conveying mechanical arm 22 in inside.Conveying mechanical arm 22 in loading unit 12, take out of conveying workpieces 20 between portion 14, first process chamber 16 and the second process chamber 18.First process chamber 16 and the second process chamber 18 are heat-treated the workpiece 20 moved into.
Fig. 3 represents the Sketch of the first process chamber 16, second process chamber 18 and conveying mechanical arm 22.First process chamber 16 comprises: body of heater 164, has the opening portion that workpiece 20 is moved into and taken out of; And door 162, block opening portion selectively.
Body of heater 164 has multi-layer rack 166, and this multi-layer rack 166 can be bearing in workpiece 20 on each layer.Door 162 is made up of multiple baffle plate sheet, and described multiple baffle plate sheet is supported to can respectively along the axle lifting extended in vertical direction.Each baffle plate sheet can be cooperated with each other and is elevated, and such as, by making adjacent two baffle plate sheets be separated or contact, layer desired by multi-layer rack 166 can be moved into and taken out of to workpiece 20.
Second process chamber 18 is identical with the first process chamber 16, also at least comprises body of heater 184, door 182 and multi-layer rack 186.Their structure is in fact identical with the first process chamber 16, so in this description will be omitted.
Conveying mechanical arm 22 has hand 225, and this hand 225 can holding workpieces 20.Conveying mechanical arm 22 is elevated by making hand 225 and rotates, and can move into and take out of workpiece 20 relative to the arbitrary layer of multi-layer rack 166 and multi-layer rack 186.
Fig. 4 is the block diagram of the summary representing base plate processing system 10.As shown in Figure 4, the first process chamber 16 at least comprises a drive division 169, ventilation portion 168, heat treatment portion 167 and control part 165.What door drive division 169 can carry out above-mentioned door 166 opens or closes action.Ventilation portion 168 has: introduction part, and extraneous gas is imported in body of heater 164; And exhaust portion, the gas of body of heater 164 inside is discharged.Ventilation portion 168 sets the capacity and air demand that are applicable to indoor sublimate gas concentration.Heat treatment portion 167 heats body of heater 164 at the temperature (such as 230 DEG C) of setting, can heat-treat the workpiece 20 moved in body of heater 164.Control part 165, according to the control information provided by master control part 30, controls the action in the first each portion of process chamber 16.
Second process chamber 18 at least has a drive division 189, ventilation portion 188, heat treatment portion 187 and control part 185.Their structure and above-mentioned door drive division 169, ventilation portion 168, heat treatment portion 167 are identical with control part 165, in this description will be omitted.
Conveying mechanical arm 22 comprises portion of travel mechanism 226, hand-drive portion 224 and control part 222.Portion of travel mechanism 226 at least comprises the mechanism making the mechanism of conveying mechanical arm 22 movement in the horizontal direction and conveying mechanical arm 22 is rotated.Hand-drive portion 224 can make hand 225 carry out lifting action, horizontal direction movement, rotational action and gripping or unclamp workpiece 20.Control part 222, according to the control information from master control part 30, controls the action in each portion of conveying mechanical arm 22.
Fig. 5 is the figure controlling content for illustration of master control part 30.In the base plate processing system 10 of present embodiment, master control part 30 makes conveying mechanical arm 22 alternately move into the first process chamber 16 or the second process chamber 18 or take out of.Therefore, not as shown in Figure 1 at this, after the process taking out of the workpiece 20 processed and the process moving into untreated work-piece 20 are completed to undermost each layer to the superiors of the multi-layer rack 166 from the first process chamber 16, the process of the workpiece 20 processed taken out of to undermost each layer to the superiors of the multi-layer rack 186 from the second process chamber 18 and moves into the process of untreated work-piece 20, but carrying out taking out of the process of the workpiece 20 processed and moving into the process of untreated work-piece 20 the first process chamber 16 in turn; And taking out of the process of the workpiece 20 processed and moving into the process of untreated work-piece 20 the second process chamber 18.
Specifically, master control part 30 makes conveying mechanical arm 22 take out the untreated work-piece 20 of loading unit 12.Then, master control part 30 is according to the position about moving into and storage information sequentially, open the door 162 of the first process chamber 16, after this by controlling the action of conveying mechanical arm 22, take out of the workpiece 20 processed from the layer of multi-layer rack 166 correspondence, untreated work-piece 20 is moved in the same layer becoming the layer be available.Wherein the so-called workpiece 20 processed refers to being moved to the workpiece 20 through the Overheating Treatment necessary stipulated time after in the first process chamber.
After this, master control part 30 makes conveying mechanical arm 22 that the workpiece 20 processed is discharged to the portion of taking out of 14, makes conveying mechanical arm 22 move to before loading unit 12, takes out the untreated work-piece 20 of loading unit 12.
Then, master control part 30 is according to the position about moving into and storage information sequentially, open the door 182 of the second process chamber 18, after this, by controlling the action of conveying mechanical arm 22, take out of the workpiece 20 processed from the layer of multi-layer rack 186 correspondence, untreated work-piece 20 is moved in the same layer becoming the layer be available.
After this, master control part 30 makes conveying mechanical arm 22 that the workpiece 20 processed is discharged to the portion of taking out of 14, makes conveying mechanical arm 22 move to before loading unit 12, takes out untreated work-piece 20 from loading unit 12.
Control the action of conveying mechanical arm 22 and door 162,182, also by continuing to carry out above-mentioned action to the first process chamber 16 and the second process chamber 18 in turn after making, all workpiece 20 on the multi-layer rack 166,186 be bearing in the first process chamber 16 and the second process chamber 18 are carried out to the heat treatment of stipulated time.
The example wherein represented is: conveying mechanical arm 22 by the superiors → multi-layer rack 166 of the superiors → multi-layer rack 186 of multi-layer rack 166 from the second layer → multi-layer rack 186 of upper number from the second layer →... of upper number ... the undermost order of the orlop → multi-layer rack 186 of → multi-layer rack 166 carries out moving into or taking out of, but the order moved into or take out of is not limited to this example.
Fig. 6 represents the Sketch of the base plate processing system 11 with six process chambers 17.Base plate processing system 11 comprises loading unit 12, takes out of portion 14, delivery section 150 and six process chambers 17.Base plate processing system 11 except the number of process chamber 17 be except six, its basic structure is identical with base plate processing system 10.
In base plate processing system 11, conveying mechanical arm 22 is controlled so as to move into six process chambers 17 or take out of in turn, instead of moves into same process chamber 17 or take out of continuously.
Wherein, master control part 30 is according to the position about moving into and storage information, the process one in six process chambers 17 being taken out of to the workpiece 20 processed and process untreated work-piece 20 is moved in the same layer becoming the layer be available sequentially.After this, master control part 30 makes conveying mechanical arm 22 that the workpiece 20 processed is discharged to the portion of taking out of 14, makes conveying mechanical arm 22 move to before loading unit 12, takes out the untreated work-piece 20 of loading unit 12.Then, same action is carried out to the next one in six process chambers 17.Controlling the action of conveying mechanical arm 22 and door 162,182, also by continuing above-mentioned action in turn to six process chambers 17 after making, all workpiece 20 on the multi-layer rack be bearing in six process chambers 17 being carried out to the heat treatment of stipulated time.
As mentioned above, when process chamber is two, to the workpiece 20 that the first process chamber processes take out of and untreated work-piece 20 move into so paired operation, after this same paired operation is carried out to the second process chamber, the first process chamber and the second process chamber are hocketed this operation repeatedly later.In addition, six process chambers are set in base plate processing system, carry out above-mentioned operation in pairs by the order of the first ~ six process chamber, after this also carry out same operation.
If have the situation of n platform to be described to which generally being changed into process chamber, then master control part 30 to the workpiece 20 that the first process chamber processes take out of and untreated work-piece 20 move into so paired operation, then same operation is carried out to the second process chamber, same operation is carried out to the (n-1)th process chamber, then after same process being carried out to the n-th process chamber, again same operation is carried out to the first process chamber again, continue such operation in turn later.The quantity of its result and process chamber has nothing to do, and them can both be made identical in the time of indoor delay for all workpiece 20.
Generally speaking, if the process chamber quantity in base plate processing system increases, then the capacity of capacity and heater can more be reduced.Such as compared with the base plate processing system 10 shown in Fig. 2, the base plate processing system 11 shown in Fig. 6 can reduce the capacity of capacity and heater further.
Such as, as shown in Figure 6, in the base plate processing system 11 arranging multiple process chamber, by distributing the ordering in launching of workpiece 20, the maximum input number equalization of time per unit can be made, and the growing amount of the sublimate gas of time per unit in single process chamber 17 can be suppressed.In addition, the capacity of heater can be cut down, cut down operating cost.And owing to can easily prevent sublimate to be attached in process chamber 17, so the maintainability of process chamber 17 can be improved.
Fig. 7 briefly expresses the effect with the base plate processing system 10 of n process chamber.Wherein, be described to be all front topic as the productivity ratio of base plate processing system 10 entirety mutually with base plate processing system in the past.As shown in Figure 7, in base plate processing system 10, for each the first ~ the n-th process chamber, n can be amplified doubly (n is the process chamber quantity arranged in systems in which) in the making time interval of workpiece 20.Its result can be suppressed to 1/n with the growing amount dropping into the sublimation gases that workpiece 20 produces in theory.And, for the ventilation volume required for the cleanliness factor in order to make each the first ~ the n-th process chamber remain on to allow separately that is capacity, in theory also can 1/n be suppressed to.Therefore, the structure in ventilation portion 168 and ventilation portion 188 can be simplified, in addition, the electricity consumed in ventilation portion 168 and ventilation portion 188 can be reduced in.
Therefore, due to the capacity making to remain in each the first ~ the n-th process chamber the heater required for design temperature, in theory also 1/n can be suppressed to, so the power consumption of base plate processing system 10 significantly can be cut down.
Such as, in the base plate processing system 10 with the first process chamber 16 or the second process chamber 18, if substrate is in the past moved into the time interval be amplified to 120 seconds from the degree of 60 seconds, then the growing amount of sublimate gas can be made to reduce to 15ppm from 30ppm.Therefore, when making indoor pollution level adopt standard as in the past to run, due to capacity can be made from 40m
3/ minute be reduced to 20m
3/ minute, so the capacity that can be used in the heater of supplementary discharge portion heat is in theory reduced to 45kw from 90kw.That is, can not reduce about productivity ratio just can be suppressed to half in the past power consumption in theory.
In addition, except the action illustrated in the above-described embodiment, in base plate processing system of the present invention, multiple running can be carried out according to the arm of conveying mechanical arm 22 and the structure of hand.Such as in the above-described embodiment, conveying mechanical arm 22 is while taking out the workpiece 20 processed from process chamber, carry out the action untreated work-piece 20 that hold being moved into process chamber, but use once can only grip the conveying mechanical arm of single workpiece 20 time, conveying mechanical arm 22 also can be made by taking out of the workpiece 20 that processes → move to the portion of taking out of 14 → move → move into the such flow process action of untreated work-piece 20 to loading unit 12.In addition, in this case, the preferably door of closing process room during conveying mechanical arm 22 leaves process chamber.
In addition, in the above-described embodiment, the situation that conveying mechanical arm 22 makes workpiece 20 one by one pass in and out process chamber is illustrated, but conveying mechanical arm 22 also can be made once to make multiple (such as close two) workpiece 20 pass in and out process chamber.
In addition, the structure of the process chamber used in base plate processing system of the present invention is not limited to above-mentioned structure.Such as shown in Fig. 8, also can use such process chamber in base plate processing system of the present invention: rotary wicket 40 is set corresponding to each layer, and utilize air cylinder driven that each wicket 40 is opened or closed.
In the above-described embodiment, the situation that the quantity of the process chamber be arranged in base plate processing system 10,11 is two or six is illustrated, as long as but the number two or more of process chamber, be not limited to above-mentioned example.
The explanation of above-mentioned embodiment is all illustrate, and should not be regarded as the content of restriction.Scope of the present invention is not represented by above-mentioned embodiment, but is represented by claim.In addition, scope of the present invention comprises the content be equal to claim and all changes carried out within the scope of the present invention.
Claims (2)
1. a base plate processing system, is characterized in that: for heat-treating substrate, and described base plate processing system comprises: multiple process chamber, heat-treats substrate; Conveying mechanical arm, once only carries a substrate; Loading unit, holds the untreatment base will moving into described process chamber; Take out of portion, hold the substrate after taking out of from described process chamber; And control part, control described process chamber and described conveying mechanical arm,
Described process chamber has: multi-layer rack, can substrate supporting on each layer; And door, when moving into and take out of substrate, the layer corresponded to desired by multi-layer rack can open or close,
Described control part controls the action of described conveying mechanical arm and described door, the substrate of stipulated time is have passed through by described conveying mechanical arm being moved to after in a process chamber, take out of from this process chamber and take out of portion described in being left in by the substrate taken out of, then described conveying mechanical arm is made to move to described loading unit and grip untreatment base, untreatment base is moved in this process chamber, then, be moved to have passed through the stipulated time after in another process chamber substrate by described conveying mechanical arm, take out of from this another process chamber and take out of portion described in depositing in, then described conveying mechanical arm is made to move to described loading unit and grip untreatment base, untreatment base is moved in this another process chamber, during described conveying mechanical arm leaves from described process chamber, described door is closed, and by also continuing such action in turn to described multiple process chamber later, the all substrates be bearing on described multi-layer rack in described multiple process chamber are carried out to the heat treatment of stipulated time.
2. a base plate processing system, is characterized in that: for heat-treating substrate, and described base plate processing system comprises: multiple process chamber, heat-treats substrate; Conveying mechanical arm, is configured to once can carry at least two substrates; Loading unit, holds the untreatment base will moving into described process chamber; Take out of portion, hold the substrate after taking out of from described process chamber; And control part, control described process chamber and described conveying mechanical arm,
Described process chamber has: multi-layer rack, can substrate supporting on each layer; And door, when moving into and take out of substrate, the layer corresponded to desired by multi-layer rack can open or close,
Described control part controls the action of described conveying mechanical arm and described door, described conveying mechanical arm is made to grip at least one untreatment base in described loading unit, the substrate of stipulated time is have passed through by described conveying mechanical arm being moved to after in a process chamber, take out of from this process chamber, and the untreatment base that described conveying mechanical arm grips is moved in this process chamber, then portion is taken out of described in the substrate taken out of from this process chamber being deposited in, described conveying mechanical arm is made to grip at least one untreatment base in described loading unit, be moved to have passed through the stipulated time after in another process chamber substrate by described conveying mechanical arm, take out of from this another process chamber, and the untreatment base that described conveying mechanical arm grips is moved in this another process chamber, then portion is taken out of described in the substrate taken out of from this another process chamber being stored in, described manipulator is made to grip at least one untreatment base in described loading unit, by later, also such action is continued in turn to described multiple process chamber, the all substrates be bearing on described multi-layer rack in described multiple process chamber are carried out to the heat treatment of stipulated time.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009065793A JP5280901B2 (en) | 2009-03-18 | 2009-03-18 | Substrate processing system and substrate processing method |
| JP2009-065793 | 2009-03-18 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010132170 Division CN101839644B (en) | 2009-03-18 | 2010-03-09 | Substrate processing system and substrate processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103438710A CN103438710A (en) | 2013-12-11 |
| CN103438710B true CN103438710B (en) | 2015-06-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201010132170 Active CN101839644B (en) | 2009-03-18 | 2010-03-09 | Substrate processing system and substrate processing method |
| CN201310302882.2A Expired - Fee Related CN103438710B (en) | 2009-03-18 | 2010-03-09 | Substrate processing system |
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| CN 201010132170 Active CN101839644B (en) | 2009-03-18 | 2010-03-09 | Substrate processing system and substrate processing method |
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| JP (1) | JP5280901B2 (en) |
| CN (2) | CN101839644B (en) |
| TW (2) | TWI471966B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2012212746A (en) * | 2011-03-31 | 2012-11-01 | Tokyo Electron Ltd | Substrate transfer device and substrate transfer method |
| JP7023094B2 (en) * | 2017-12-05 | 2022-02-21 | 日本電産サンキョー株式会社 | robot |
| JP7149748B2 (en) * | 2018-07-04 | 2022-10-07 | 東京エレクトロン株式会社 | SUBSTRATE PROCESSING SYSTEM, SUBSTRATE TRANSFER METHOD, AND CONTROL PROGRAM |
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| JP2000169169A (en) * | 1998-12-01 | 2000-06-20 | Koyo Thermo System Kk | Heat treatment apparatus |
| JP2002190512A (en) * | 2000-10-11 | 2002-07-05 | National Institute Of Advanced Industrial & Technology | Electrostatic chuck and its manufacturing method |
| CN1450346A (en) * | 2002-03-29 | 2003-10-22 | 爱斯佩克株式会社 | Article heat treatment device and device having holden |
| CN1934695A (en) * | 2004-03-25 | 2007-03-21 | 东京毅力科创株式会社 | Vertical heat treating apparatus and automatic teaching method for transfer mechanism |
| CN101016188A (en) * | 2006-02-08 | 2007-08-15 | 光洋热***股份有限公司 | Heat treatment apparatus |
| CN101164156A (en) * | 2005-08-05 | 2008-04-16 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate stage used for the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3959141B2 (en) * | 1996-11-12 | 2007-08-15 | エスペック株式会社 | Heat treatment equipment with sublimation countermeasures |
| JP3462405B2 (en) * | 1998-10-29 | 2003-11-05 | 東京エレクトロン株式会社 | Processing equipment |
| JP3582820B2 (en) * | 2000-03-24 | 2004-10-27 | 東京エレクトロン株式会社 | Processing system and interface device |
| JP5034138B2 (en) * | 2001-01-25 | 2012-09-26 | 東京エレクトロン株式会社 | Heat treatment method and heat treatment apparatus |
| JP2002368030A (en) * | 2001-06-08 | 2002-12-20 | Hitachi Ltd | Resin-sealed semiconductor device and method of manufacturing the same |
-
2009
- 2009-03-18 JP JP2009065793A patent/JP5280901B2/en not_active Expired - Fee Related
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2010
- 2010-03-08 TW TW99106575A patent/TWI471966B/en active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000169169A (en) * | 1998-12-01 | 2000-06-20 | Koyo Thermo System Kk | Heat treatment apparatus |
| JP2002190512A (en) * | 2000-10-11 | 2002-07-05 | National Institute Of Advanced Industrial & Technology | Electrostatic chuck and its manufacturing method |
| CN1450346A (en) * | 2002-03-29 | 2003-10-22 | 爱斯佩克株式会社 | Article heat treatment device and device having holden |
| CN1934695A (en) * | 2004-03-25 | 2007-03-21 | 东京毅力科创株式会社 | Vertical heat treating apparatus and automatic teaching method for transfer mechanism |
| CN101164156A (en) * | 2005-08-05 | 2008-04-16 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate stage used for the same |
| CN101016188A (en) * | 2006-02-08 | 2007-08-15 | 光洋热***股份有限公司 | Heat treatment apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103438710A (en) | 2013-12-11 |
| JP5280901B2 (en) | 2013-09-04 |
| CN101839644A (en) | 2010-09-22 |
| TWI524460B (en) | 2016-03-01 |
| JP2010219383A (en) | 2010-09-30 |
| TWI471966B (en) | 2015-02-01 |
| TW201041074A (en) | 2010-11-16 |
| TW201521145A (en) | 2015-06-01 |
| CN101839644B (en) | 2013-07-31 |
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