CN103426844B - 宽带全密封微波器件封装 - Google Patents
宽带全密封微波器件封装 Download PDFInfo
- Publication number
- CN103426844B CN103426844B CN201210159446.XA CN201210159446A CN103426844B CN 103426844 B CN103426844 B CN 103426844B CN 201210159446 A CN201210159446 A CN 201210159446A CN 103426844 B CN103426844 B CN 103426844B
- Authority
- CN
- China
- Prior art keywords
- ceramic
- pottery
- layer
- wire
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 claims abstract description 56
- 239000002184 metal Substances 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000005538 encapsulation Methods 0.000 claims description 49
- 239000004020 conductor Substances 0.000 claims description 14
- 239000007787 solid Substances 0.000 claims description 13
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical group CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000007789 sealing Methods 0.000 abstract description 13
- 230000003071 parasitic effect Effects 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000008393 encapsulating agent Substances 0.000 description 3
- 229910052573 porcelain Inorganic materials 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000003854 Surface Print Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000010626 work up procedure Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Waveguide Connection Structure (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210159446.XA CN103426844B (zh) | 2012-05-22 | 2012-05-22 | 宽带全密封微波器件封装 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210159446.XA CN103426844B (zh) | 2012-05-22 | 2012-05-22 | 宽带全密封微波器件封装 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103426844A CN103426844A (zh) | 2013-12-04 |
CN103426844B true CN103426844B (zh) | 2017-02-15 |
Family
ID=49651381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210159446.XA Active CN103426844B (zh) | 2012-05-22 | 2012-05-22 | 宽带全密封微波器件封装 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103426844B (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104269382B (zh) * | 2014-08-20 | 2017-04-19 | 中国电子科技集团公司第五十五研究所 | 基于高温共烧陶瓷技术的x波段高可靠表贴型陶瓷外壳 |
CN106206546A (zh) * | 2016-07-14 | 2016-12-07 | 中国电子科技集团公司第五十五研究所 | 一种应用于18GHz的陶瓷墙型外壳 |
CN109950211B (zh) * | 2017-11-22 | 2020-12-18 | 中国电子科技集团公司第五十五研究所 | X波段双面多腔结构陶瓷外壳及多层陶瓷共烧工艺方法 |
CN111712036B (zh) * | 2020-06-17 | 2021-12-14 | 武汉光迅科技股份有限公司 | 光器件及其封装方法 |
CN113066730B (zh) * | 2021-03-25 | 2022-06-10 | 深圳市尚鼎芯科技有限公司 | 一种基于微孔硅陶瓷的大电流mosfet封装工艺 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1503616A (zh) * | 2002-11-25 | 2004-06-09 | 三星电机株式会社 | 陶瓷多层衬底及其制造方法 |
CN101291156A (zh) * | 2007-04-20 | 2008-10-22 | 富士通株式会社 | 天线分离器 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0697319A (ja) * | 1992-09-17 | 1994-04-08 | Fujitsu Ltd | セラミックパッケージ |
-
2012
- 2012-05-22 CN CN201210159446.XA patent/CN103426844B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1503616A (zh) * | 2002-11-25 | 2004-06-09 | 三星电机株式会社 | 陶瓷多层衬底及其制造方法 |
CN101291156A (zh) * | 2007-04-20 | 2008-10-22 | 富士通株式会社 | 天线分离器 |
Also Published As
Publication number | Publication date |
---|---|
CN103426844A (zh) | 2013-12-04 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Broadband full-sealed package of microwave devices Effective date of registration: 20191213 Granted publication date: 20170215 Pledgee: Bank of China Limited by Share Ltd. Guangzhou Tianhe branch Pledgor: GUANGZHOU STARWAY COMMUNICATIONS Inc. Registration number: Y2019440000286 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201209 Granted publication date: 20170215 Pledgee: Bank of China Limited by Share Ltd. Guangzhou Tianhe branch Pledgor: GUANGZHOU STARWAY COMMUNICATIONS Inc. Registration number: Y2019440000286 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Broadband hermetically sealed microwave device package Effective date of registration: 20201217 Granted publication date: 20170215 Pledgee: Bank of China Limited by Share Ltd. Guangzhou Tianhe branch Pledgor: GUANGZHOU STARWAY COMMUNICATIONS Inc. Registration number: Y2020440000409 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20170215 Pledgee: Bank of China Limited by Share Ltd. Guangzhou Tianhe branch Pledgor: GUANGZHOU STARWAY COMMUNICATIONS Inc. Registration number: Y2020440000409 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |