CN103406665A - Laser processing device - Google Patents
Laser processing device Download PDFInfo
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- CN103406665A CN103406665A CN2013103029149A CN201310302914A CN103406665A CN 103406665 A CN103406665 A CN 103406665A CN 2013103029149 A CN2013103029149 A CN 2013103029149A CN 201310302914 A CN201310302914 A CN 201310302914A CN 103406665 A CN103406665 A CN 103406665A
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Abstract
The invention provides a laser processing device which comprises a lathe bed, a beam and a laser processing system. The laser processing system comprises a laser processing assembly, wherein at least two movable positioning working platforms are arranged on the lathe bed, and the laser processing assembly is movably arranged on the beam and positioned above the positioning working platforms. Workpieces to be processed on the at least two positioning working platforms are continuously processed through the laser processing assembly, replacing time of the workpieces to be processed is saved, the laser processing assembly can work continuously, and therefore processing efficiency is improved substantially.
Description
Technical field
The present invention relates to laser technology field, relate in particular to a kind of laser processing device.
Background technology
Along with the demand of machine and instrument and equipment increases severely day by day, such as, at electronics, automobile, the industries such as space flight and experiments of measuring equipment, the demand of wiring board also increases day by day, its application is also more and more extensive, miniaturization due to machine and instrument and equipment, and the required precision of processing, requirement to PCB is also more and more higher, yet, the processing method of pcb board of the prior art is that pcb board is placed on a workbench, after processing, by artificial or complicated conveyer, sending into subsequent processing again adds, laser-processing system need to stop, treat that next workbench is sent to machining area and carries out the processing of next round again.At present, also have in the industry pcb board is arranged on a plurality of workbenches, but it is to adopt many cover laser-processing systems to process, need equally the laser-processing system break-off, thereby make product in process, need to process discontinuously, the efficiency of product processing is also low, demand that can not satisfying the market.
Summary of the invention
The technical problem to be solved in the present invention is: for the deficiencies in the prior art, and provide a kind of laser processing device, it can solve the inefficient problem of Laser Processing in prior art.
The technical solution adopted for the present invention to solve the technical problems is: a kind of laser processing device is provided, comprise lathe bed, crossbeam and laser-processing system, this laser-processing system comprises the Laser Processing assembly, wherein: on described lathe bed, be provided with at least two and movably locate workbench; Described Laser Processing assembly is movably set on crossbeam, and is positioned at the top of location workbench.
The further preferred version of the present invention is: described Laser Processing assembly is a set of, by this a set of Laser Processing assembly, the workpiece on the workbench of plural at least location is processed.
The further preferred version of the present invention is: on described crossbeam, be provided with the X-axis unit of laser optical path transmission and location, be provided with the Z axis unit on this X unit, described Laser Processing assembly is arranged on this Z axis unit; On described lathe bed, be provided be used to carrying the Y-axis unit of location workbench.
The further preferred version of the present invention is: described X-axis unit comprises X-axis guide assembly, X-axis power set, X-axis fixed head, and described Z axis unit is arranged on this X-axis fixed head, and these X-axis power set drive the Z axis unit and do the X-direction motion.
The further preferred version of the present invention is: described Laser Processing assembly comprises device laser instrument, CCD navigation system, focus lamp, and galvanometer scanning system, described CCD navigation system, focus lamp and galvanometer scanning system are installed on the Z axis unit, and described laser instrument is installed on crossbeam.
The further preferred version of the present invention is: described laser-processing system also comprises the optics conducting system, it comprises beam expanding lens, the first speculum, the second speculum, the 3rd speculum and the 4th speculum, described beam expanding lens, the first speculum, the second speculum are installed on crossbeam, described the 3rd speculum is installed on the X-axis unit, and described the 4th speculum is installed on the Z axis unit.
The further preferred version of the present invention is: described Z axis unit comprises Z axis power set and Z axis base plate, described the 4th speculum, CCD navigation system, galvanometer scanning system and focus lamp are arranged on this Z axis base plate, and these Z axis power set drive the Z axis base plate and do the Z-direction motion.
The further preferred version of the present invention is: described Y-axis unit comprises Y-axis guide assembly and Y-axis power set, and described location workbench is movably set on this Y-axis guide assembly, drives by the Y-axis power set motion that the location workbench is made Y direction.
The further preferred version of the present invention is: described Y-axis unit comprises Y1 axle unit and Y2 axle unit, and this Y1 axle unit comprises Y1 axle power set and Y1 axis rail assembly, and this Y2 axle unit comprises Y2 axle power set and Y2 axis rail assembly; Described location workbench is two, is arranged at respectively on this Y1 guide assembly and Y2 axis rail assembly, by Y1 axle power set and Y2 axle power set, drives this two location workbench motions respectively.
The further preferred version of the present invention is: also be provided with dust exhaust apparatus on described Z axis base plate.
Implement technical scheme of the present invention, have following beneficial effect: the present invention arranges to be processed of at least two carryings and movably locates workbench on lathe bed, and activity arranges the Laser Processing assembly on crossbeam, after the Laser Processing assembly processes the workpiece on an one location workbench, can on crossbeam, move, the processing next one is located the workpiece on workbench continuously, thereby, save the replacing time of workpiece, but the continuous operation of Laser Processing assembly, increased substantially working (machining) efficiency.
The accompanying drawing explanation
The invention will be further described below in conjunction with drawings and Examples, in accompanying drawing:
Fig. 1 is the structural representation of the laser processing device of the embodiment of the present invention;
Fig. 2 be the embodiment of the present invention laser processing device face structural representation;
Fig. 3 is the side structure schematic diagram of the laser processing device of the embodiment of the present invention;
Fig. 4 is the plan structure schematic diagram of the laser processing device of the embodiment of the present invention;
Fig. 5 is the structural representation of the optics conducting system of the embodiment of the present invention.
The specific embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
Refer to Fig. 1 and shown in Figure 5, the embodiment of the present invention provides a kind of laser processing device, comprise lathe bed 1, crossbeam 3, laser-processing system and software control system (not shown), this laser-processing system comprises optics conducting system 2 and Laser Processing assembly, on described lathe bed 1, is provided with at least two and movably locates workbench 8; The Laser Processing assembly is arranged on crossbeam 1, and can on crossbeam 1, move back and forth, and after this Laser Processing assembly processes the workpiece on an one location workbench 8, then moves to next positioning table 8 and processes; This Laser Processing assembly is arranged at the top of location workbench 8, it is adding man-hour, be positioned at required processing location workbench 8 directly over, be convenient to the processing of Laser Processing assembly to workpiece, now the Laser Processing assembly be positioned at other the location workbenches oblique upper.The described Laser Processing assembly of the embodiment of the present invention is a set of, by this a set of Laser Processing assembly, the workpiece on plural at least location workbench 8 is processed, thereby has greatly been improved working (machining) efficiency.
As Figure 1-4, the described processing unit (plant) of the embodiment of the present invention comprises in order to the optic path of optics conducting system 2 laser beams and the X-axis unit 5 of location, on this X unit 5, be provided with Z axis unit 7, described laser processing device is arranged on this Z axis unit 7, on described lathe bed 1, is provided with carrying location workbench and makes it mobile Y-axis unit 6.
As shown in Figure 1 and Figure 5, the described optics conducting system 2 of the embodiment of the present invention comprises beam expanding lens 22, the first speculum 23, the second speculum 24, the 3rd speculum 25 and the 4th speculum 26; Described beam expanding lens 22, the first speculum 23, the second speculum 24 are installed on crossbeam 3, and described the 4th speculum 26 is installed on Z axis unit 7; As shown in Figure 5, it is the laser beam process beam expanding lens 22 of launching by laser instrument 21 that the light path of optics conducting system 2 passes, and expands rear laser beam and enters galvanometer scanning system 27 through the first speculum 23, the second speculum 24, the 3rd speculum 25 and the 4th speculum 26 again.
As shown in Figure 1 and Figure 5, the described Laser Processing assembly of the embodiment of the present invention comprises laser instrument 21, CCD navigation system 9, galvanometer scanning system 27 and focus lamp 28, the preferred ultraviolet laser of described laser instrument 21, its setting is installed on crossbeam 3, and described CCD navigation system 9 comprises CCD scanning means 91, camera lens 92 and light source 93, and described CCD navigation system 9, focus lamp 28 and galvanometer scanning system 27 are arranged on Z axis unit 7.The embodiment of the present invention, by laser-processing system being arranged on X-axis unit 5 and Z axis unit 7, can making laser beam be transmitted preferably and locates and realize processing effect accurately.
As Figure 1-Figure 4, the described location of embodiment of the present invention workbench 8 is vacuum suction location workbenches, for by be processed, being adsorbed in this location workbench 8, this location workbench 8 can be a plurality of, the present embodiment take two be example, it comprises the location workbench 81 and 82 be movably set on Y-axis unit 6.Described Y-axis unit 6 comprises Y1 axle unit 61 and Y2 axle unit 62, and described drive unit is the Y-axis power set, and these Y-axis power set comprise Y1 axle power set 612 and Y2 axle power set 622; Described two location workbenches 81 and 82 are arranged at respectively on this Y1 axle unit 61 and Y2 axle unit 62, by Y1 axle power set 612 and Y2 axle power set 622, drive its motion respectively, in process, galvanometer scanning system 27 is done relative motion with location workbench 8, to guarantee the accuracy of processing.
As Figure 1-4, the described X-axis of embodiment of the present invention unit 5 comprises X-axis guide assembly, X-axis grating scale 52, X-axis power set 53 and X-axis fixed head 54, this X-axis guide assembly comprises X-axis guide rail 51 and X-axis slide block 54, described X-axis guide assembly, X-axis grating scale 52 are arranged on crossbeam 3, described X-axis power set 53 are movably set on this X-axis guide assembly, and the 3rd speculum 23 is arranged on this X-axis fixed head 54.
As Figure 1-4, the described Y-axis of embodiment of the present invention unit 6 comprises Y1 axle unit 61 and Y2 axle unit 62, described Y1 axle unit 61 comprises Y1 axis rail assembly, Y1 axle power set 612, Y1 axle grating scale 613 and Y1 spindle motor fixed head 614, this Y1 axis rail assembly comprises Y1 axis rail 611 and Y1 axle slide block 615; Described Y2 axle unit 62 comprises Y2 axis rail assembly, Y2 axle power set 622, Y2 axle grating scale 623 and Y2 spindle motor fixed head 624, and this Y2 axis rail assembly comprises Y2 axis rail 621 and Y2 axis rail slide block 625; Described Y1 axis rail assembly, Y2 axis rail assembly, Y1 axle grating scale and Y2 axle grating scale are installed on lathe bed 1, and described Y1 axle power set 612 and Y2 axle power set 622 are arranged at respectively on Y1 axis rail assembly and Y2 axis rail assembly.Described Y1 axle power set 612 and Y2 axle power set 622 drive respectively 8 motions of two location workbenches.
As Figure 1-4, the described Z axis of embodiment of the present invention unit 7 is arranged on X-axis fixed head 54, this Z axis unit 7 comprises Z axis power set 71, Z axis base plate 72, Z axis guide rail 73 and Z axis slide block 74, these Z axis power set 71 are arranged on X-axis fixed head 54, and described the 4th speculum 26, galvanometer scanning system 27 and focus lamp 28 are arranged on this Z axis base plate 72; On the described X-axis guide assembly of the embodiment of the present invention, be movably set with X-axis fixed head 54, this X-axis fixed head 54 can move back and forth on the X-axis guide assembly, and described Z axis unit 7 is arranged on X-axis unit 5 by this X-axis fixed head 54.On described Z axis base plate, also be provided with dust exhaust apparatus 10, this dust exhaust apparatus 10 for process to the location workbench 8 dust suction.
The embodiment of the present invention can be applicable to the laser cutting of field of lasers, laser marking, and laser drill etc., below take the laser cutting of pcb board and its operating process be described as example.
As shown in Figure 1 and Figure 5, the processing unit (plant) of the embodiment of the present invention also comprises software control system, when pcb board is carried out to cutting processing, pcb board carries out paster in advance, at first the laser beam that laser instrument 21 penetrates enters galvanometer scanning system 27 by 2 reflections of optics conducting system, then by galvanometer scanning system 27 reflections, enter focus lamp 28, focus lamp 28 becomes very little hot spot to the laser beam focusing that laser instrument 21 penetrates again, two-dimensional coordinate and the precision of spot on the workbench 8 of location controlled in the swing of galvanometer scanning system 27, the hot spot that galvanometer scanning system 27 utilizes focus lamp 28 to focus on is processed.Embodiment of the present invention software control system arranges the initial parameter of pcb board to be processed, and the laser energy of described laser instrument 21 outputs is set, the location of the figure of processing, CCD navigation system 9, alternately the movement of loading and unloading workbench 8 is by the software control system unified allocation of resources.
The embodiment of the present invention, when pcb board is cut, is applicable to the PCB soft board of SMT paster industry, the Laser cutting of hardboard and Rigid Flex, adopt 2 above workbench alternate turns to process, a set of laser-processing system is processed, and adopts linear electric motors to drive, fast response time, can save the loading and unloading time, significantly improved working (machining) efficiency, and the Laser Processing neat in edge is clean, without burr, form accuracy is high, can reach +/-0.020mm.Simultaneously the present invention can additional lambda line manipulator, realizes automatic loading/unloading, saves manually, realizes automated production fully.
As depicted in figs. 1 and 2, the processing unit (plant) operating process of the present embodiment is: first will need the SMT paster of processing pcb board, be adsorbed on the workbench 8 of location, the file of the required processing of SMT paster PCB is imported to software control system, just can start to arrange the initial parameter of processing, main initial parameter comprises the thickness of laser frequency, pulse width, process velocity, plate.Set after parameter the location light that just can utilize Laser output, find the starting point that needs processing, after choosing, click and start button.One of them location workbench drives and will need the SMT paster of processing PCB to deliver to machining area by linear motor, and software control system controls laser instrument 21 Emission Lasers, galvanometer scanning system 27 simultaneously, locate workbench 8 moves to process.Add man-hour, the laser beam that laser instrument 21 is launched is through beam expanding lens 22, expand rear laser beam and enter galvanometer scanning system 27 through the first speculum 23, the second speculum 24, the 3rd speculum 25 and the 4th speculum 26, outgoing beam enters focus lamp 28 again.Focus lamp 28 becomes a little luminous point by laser beam focusing, then utilizes this little luminous point to process.After machining, click conversion processing button, another location workbench 8 drives by linear motor equally, the SMT paster PCB of needs processing is delivered to machining area, the SMT paster PCB simultaneously a first location workbench 8 processed sends out, then changes the SMT paster PCB that needs processing.Repeat aforesaid operations, save the loading and unloading time.CCD navigation system 9 makes to process plate and platform can not produce and relatively move; The laser instrument 21 of high frequency can reach the good processing effect that obtains; The galvanometer scanning system 27 run up has improved the speed of processing; High-precision galvanometer scanning system 27 and location workbench 8 relative motions have guaranteed the high accuracy of workpiece size.Dust exhaust apparatus 10 has been taken away the dust produced, thereby has avoided dust to the pollution of environment and the injury that human body is produced.
The described laser instrument of the embodiment of the present invention is ultraviolet laser, green laser or optical fiber laser; Described power set are drive unit or transmission device, but described drive unit linear drive motor, screw mandrel drive motors etc.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., within all should being included in claim scope of the present invention.
Claims (10)
1. a laser processing device, comprise lathe bed, crossbeam and laser-processing system, and this laser-processing system comprises the Laser Processing assembly, it is characterized in that: on described lathe bed, be provided with at least two and movably locate workbench; Described Laser Processing assembly is movably set on crossbeam, and is positioned at the top of location workbench.
2. laser processing device according to claim 1, it is characterized in that: described Laser Processing assembly is a set of, by this a set of Laser Processing assembly, the workpiece on the workbench of plural at least location is processed.
3. laser processing device according to claim 1 and 2 is characterized in that: on described crossbeam, be provided with the X-axis unit of laser optical path transmission and location, be provided with the Z axis unit on this X unit, described Laser Processing assembly is arranged on this Z axis unit; On described lathe bed, be provided be used to carrying the Y-axis unit of location workbench.
4. laser processing device according to claim 3, it is characterized in that: described X-axis unit comprises X-axis guide assembly, X-axis power set, X-axis fixed head, described Z axis unit is arranged on this X-axis fixed head, and these X-axis power set drive the Z axis unit and do the X-direction motion.
5. laser processing device according to claim 4, it is characterized in that: described Laser Processing assembly comprises device laser instrument, CCD navigation system, focus lamp, and galvanometer scanning system, described CCD navigation system, focus lamp and galvanometer scanning system are installed on the Z axis unit, and described laser instrument is installed on crossbeam.
6. laser processing device according to claim 5, it is characterized in that: described laser-processing system also comprises the optics conducting system, it comprises beam expanding lens, the first speculum, the second speculum, the 3rd speculum and the 4th speculum, described beam expanding lens, the first speculum, the second speculum are installed on crossbeam, described the 3rd speculum is installed on the X-axis unit, and described the 4th speculum is installed on the Z axis unit.
7. laser processing device according to claim 5, it is characterized in that: described Z axis unit comprises Z axis power set and Z axis base plate, described the 4th speculum, CCD navigation system, galvanometer scanning system and focus lamp are arranged on this Z axis base plate, and these Z axis power set drive the Z axis base plate and do the Z-direction motion.
8. laser processing device according to claim 3, it is characterized in that: described Y-axis unit comprises Y-axis guide assembly and Y-axis power set, described location workbench is movably set on this Y-axis guide assembly, drives by the Y-axis power set motion that the location workbench is made Y direction.
9. laser processing device according to claim 8, it is characterized in that: described Y-axis unit comprises Y1 axle unit and Y2 axle unit, this Y1 axle unit comprises Y1 axle power set and Y1 axis rail assembly, and this Y2 axle unit comprises Y2 axle power set and Y2 axis rail assembly; Described location workbench is two, is arranged at respectively on this Y1 guide assembly and Y2 axis rail assembly, by Y1 axle power set and Y2 axle power set, drives this two location workbench motions respectively.
10. laser processing device according to claim 7, is characterized in that: also be provided with dust exhaust apparatus on described Z axis base plate.
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| CN104526743A (en) * | 2015-01-15 | 2015-04-22 | 成都金大立科技有限公司 | PCB-V groove cutting device |
| CN105364315A (en) * | 2014-08-19 | 2016-03-02 | 深圳市普尔信通讯设备有限公司 | Automatic laser machine |
| CN106475681A (en) * | 2015-08-31 | 2017-03-08 | 株式会社理光 | Optical machining device and the production method of light machining object |
| CN107160034A (en) * | 2017-07-03 | 2017-09-15 | 大族激光科技产业集团股份有限公司 | A kind of dual stage face laser cutting machine and its cutting method |
| CN107755894A (en) * | 2017-10-25 | 2018-03-06 | 佛山市宏石激光技术有限公司 | A kind of laser processing device |
| CN107984087A (en) * | 2018-01-26 | 2018-05-04 | 南京魔迪多维数码科技有限公司 | Laser Processing detent mechanism and laser-processing system |
| CN108015432A (en) * | 2017-12-04 | 2018-05-11 | 大族激光科技产业集团股份有限公司 | Laser cutting machine |
| CN108057959A (en) * | 2018-01-26 | 2018-05-22 | 南京魔迪多维数码科技有限公司 | Laser process equipment |
| CN109290702A (en) * | 2017-07-24 | 2019-02-01 | 广州松合智能科技有限公司 | Four-head machine automatic welding mechanism and its welding method |
| CN109530932A (en) * | 2017-09-20 | 2019-03-29 | 深圳市牧激科技有限公司 | A kind of fingerprint mould group laser cutting machine |
| CN109926736A (en) * | 2019-04-10 | 2019-06-25 | 英诺激光科技股份有限公司 | A kind of device and method using high frequency nanosecond optical-fiber laser cutting battery pole piece |
| CN110286613A (en) * | 2019-05-13 | 2019-09-27 | 大族激光科技产业集团股份有限公司 | A kind of two-axis laser control system |
| CN110394562A (en) * | 2019-07-09 | 2019-11-01 | 福莱特玻璃集团股份有限公司 | A kind of three laser head glass punching devices |
| CN110719696A (en) * | 2019-10-22 | 2020-01-21 | 东莞三润田智能科技股份有限公司 | PCB solder-resisting windowing method and PCB laser windowing machine |
| CN112077456A (en) * | 2020-07-30 | 2020-12-15 | 大族激光科技产业集团股份有限公司 | Laser processing device |
| CN114248017A (en) * | 2021-12-30 | 2022-03-29 | 深圳市易安锐智能装备有限责任公司 | Double-vision positioning double-laser cloth cutting device and cloth cutting method thereof |
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| CN105364315A (en) * | 2014-08-19 | 2016-03-02 | 深圳市普尔信通讯设备有限公司 | Automatic laser machine |
| CN104526743A (en) * | 2015-01-15 | 2015-04-22 | 成都金大立科技有限公司 | PCB-V groove cutting device |
| CN106475681A (en) * | 2015-08-31 | 2017-03-08 | 株式会社理光 | Optical machining device and the production method of light machining object |
| CN106475681B (en) * | 2015-08-31 | 2019-03-15 | 株式会社理光 | The production method of optical machining device and light machining object |
| CN107160034A (en) * | 2017-07-03 | 2017-09-15 | 大族激光科技产业集团股份有限公司 | A kind of dual stage face laser cutting machine and its cutting method |
| CN109290702A (en) * | 2017-07-24 | 2019-02-01 | 广州松合智能科技有限公司 | Four-head machine automatic welding mechanism and its welding method |
| CN109530932A (en) * | 2017-09-20 | 2019-03-29 | 深圳市牧激科技有限公司 | A kind of fingerprint mould group laser cutting machine |
| CN107755894A (en) * | 2017-10-25 | 2018-03-06 | 佛山市宏石激光技术有限公司 | A kind of laser processing device |
| CN108015432A (en) * | 2017-12-04 | 2018-05-11 | 大族激光科技产业集团股份有限公司 | Laser cutting machine |
| CN108057959A (en) * | 2018-01-26 | 2018-05-22 | 南京魔迪多维数码科技有限公司 | Laser process equipment |
| CN107984087A (en) * | 2018-01-26 | 2018-05-04 | 南京魔迪多维数码科技有限公司 | Laser Processing detent mechanism and laser-processing system |
| CN108057959B (en) * | 2018-01-26 | 2024-01-30 | 南京魔迪多维数码科技有限公司 | Laser processing apparatus |
| CN107984087B (en) * | 2018-01-26 | 2024-01-30 | 南京魔迪多维数码科技有限公司 | Positioning mechanism for laser processing and laser processing system |
| CN109926736A (en) * | 2019-04-10 | 2019-06-25 | 英诺激光科技股份有限公司 | A kind of device and method using high frequency nanosecond optical-fiber laser cutting battery pole piece |
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