CN201295821Y - Diamond micropore-processing machine adopting all-solid-state laser - Google Patents
Diamond micropore-processing machine adopting all-solid-state laser Download PDFInfo
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- CN201295821Y CN201295821Y CN 200820058943 CN200820058943U CN201295821Y CN 201295821 Y CN201295821 Y CN 201295821Y CN 200820058943 CN200820058943 CN 200820058943 CN 200820058943 U CN200820058943 U CN 200820058943U CN 201295821 Y CN201295821 Y CN 201295821Y
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Abstract
The utility model discloses a diamond micropore-processing machine adopting an all-solid-state laser, which is characterized in that the diamond micropore-processing machine comprises a cooling water tank, an all-solid-state laser, a light path system, a three-dimensional workpiece displacement platform, an industrial computer, a workpiece illuminator, a camera, a sliding guideway and a workpiece clamp; wherein, the cooling water tank is connected with the all-solid-state laser; the all-solid-state laser is connected with the light path system and arranged on the sliding guideway; the laser beam emitted by the all-solid-state laser becomes a vertical laser beam after passing through the light path system, and is focused by a combined lens to form a micron-sized light spot as a processing laser source; the camera is arranged over an optical prism; the workpiece illuminator is arranged on the outer ring under the combined lens; the workpiece clamp is arranged on the top of the Z axis of the three-dimensional workpiece displacement platform; and the industrial computer is respectively connected with the all-solid-state laser and the three-dimensional workpiece displacement platform. With the micron-sized light spot formed by the focused laser beam emitted by the all-solid-state laser and the high-precision workpiece displacement platform, the utility model can implement high-quality micropore processing on a diamond mould.
Description
Technical field
The utility model relates to a kind of laser micropore system of processing, is specifically related to a kind of all-solid state laser capillary processing machine that is applied to diamond grinding tool capillary processing (aperture reaches 10 μ m for a short time), belongs to laser technology field.
Background technology
Hole processing is one bigger important manufacturing procedure of proportion in the machining.According to statistics, hole processing accounts for 1/3rd of machining total amount, accounts for 1/4th of machining time.Especially the processing with aperture is the most difficult in the processing of hole.Along with space flight, aviation, electronics, machinery, instrument and meter, chemical fibre, science and technology such as control and medicine equipment and industrial development automatically, the application of aperture is extensive day by day.Not only the aperture is little but also aspect ratio is also bigger for these apertures.It is that difficulties such as high rigidity, high-strength heat-resistant steel, stainless steel, carbide alloy, pottery, diamond add material that the material of these parts of while has many.These have proposed new requirement to the aperture process technology, press for a kind of novel, aperture process technology efficiently.At present, developed the processing method of kind of the small hole of approximately having a surplus, to be used for the aperture process technology of different situations.
Along with developing rapidly of The modern industry and science and technology, use hardness is big, intensity is high, fragility is big, dystectic material is more and more, and traditional processing method can not satisfy the requirement of technology.For example, the processing tasks of processing micron-sized aperture this class is difficult to obtain with the method for conventional machining on the diamond grinding tool, sometimes or even impossible, then is not difficult to realize with laser boring.Laser beam the space and the time ask high concentration, utilize lens to focus on, thereby the reduced of hot spot can be obtained 10 to micron order
-3--10
-5W/cm
210
5--10
15W/cm
2Laser power density.So high power density almost can be asked material implementation laser boring to thousand.With other method such as machine drilling, compare towards the conventional means of aperture, spark machined, Ultrasonic machining, electron beam processing, Electrolyzed Processing etc., have following significant advantage:
1. the speed of laser boring is fast, efficient is high, good in economic efficiency.
2. laser boring can obtain big aspect ratio.
3. laser boring can be carried out on hard, crisp, soft etc. various types of materials.
4. laser boring does not have tool loss.
5. laser boring is suitable for many, the highdensity groups of quantity hole processing.
6. can on the difficult-to-machine material inclined plane, process aperture with laser.
Except that above-mentioned advantage, because laser drilling process does not contact with workpiece, the workpiece cleaning that therefore processes and does not pollute.Because this punching is a kind of evaporation type, non-contacting process, it has eliminated the residue that conventional heated filament is bored a hole and machine drilling brings, thereby the ten minutes health.And the Laser Processing time is short, and is all less to machined material oxidation, distortion, heat-affected zone, do not need special protection.Laser can not only be opposite to the punching of airborne workpiece, and can be opposite in the vacuum or the workpiece under other condition punches.This shows, laser micropore processing be a kind of high-quality, fast, the capillary processing mode of accurate, environmental protection.
Summary of the invention
The utility model is at process micron-sized aperture and development and Design on the diamond mould, provide a kind of and guaranteeing to carry out all solid state Solid State Laser diamond capillary processing machine that micron order is processed on the footpath is deeply than the basis of quality requirements such as roughness, with respect to drilling precision height hand-manipulated, perforating efficiency height.
The technical solution of the utility model is: a kind of diamond capillary processing machine of using all solid state laser, comprise: cooling water tank, all solid state laser, light path system, 3 D workpiece displacement platform, industrial computer, workpiece lighting device, camera, rail plate and Workpiece clamping head, cooling water tank links to each other with all solid state laser, all solid state laser is connected with light path system and places on the rail plate, and described light path system is made up of grating, beam collimation mirror, compound lens, optical prism; The laser beam that is sent by described all solid state laser enters the beam collimation mirror by grating, through collimation and shaping, by optical prism reflection, forms normal beam, then by compound lens with its hot spot that is focused into 8-15 μ m diameters as the processing lasing light emitter; Described camera places the optical prism top, and focal length is consistent with light source for processing; The workpiece lighting device places outer ring, compound lens below, is used for the illumination of finished surface; Workpiece clamping head places can be at X, and the Z axle top of the 3 D workpiece displacement platform that Y, Z three direction of principal axis independently move also can at the uniform velocity rotate around the Z axle; Industrial computer is connected with the 3 D workpiece displacement platform with all solid state laser respectively.Three-dimensional high-precision workpiece displacement platform can be realized X, Y, the straight line of Z axle moves to regulate the locus and overlaps with laser beam foucing, and the motion of all solid state laser output of control coordination high light beam quality and three-dimensional high-precision workpiece displacement platform realizes the processing of micropore.
Characteristics of the present utility model are all solid state single mode output laser of application of advanced, reach micron-sized spot size through shaping, cooperate high-precision workpiece displacement platform (error 2um) simultaneously, carry out high-quality capillary processing on the diamond mould thereby be implemented in.
Description of drawings
Fig. 1 is a diamond capillary processing machine structural representation;
Fig. 2 is the light path system structural representation;
Fig. 3 is a diamond capillary processing machine system block diagrams.
The specific embodiment
As shown in Figure 1-Figure 3, a kind of diamond capillary processing machine of using all solid state laser, characteristics are that it comprises: cooling water tank 1, all solid state laser 2, light path shape system 3,3 D workpiece displacement platform 4, industrial computer 5, workpiece lighting device 6, camera 7, optics guide rail 8 and Workpiece clamping head 13.In the laser micropore processing machine all solid state laser 2 being connected with light path system 3 places on the optics guide rail 8, and light path system 3 is by grating 9, beam collimation mirror 10, and lens combination 11, optical prism 12 is formed.The laser beam that all solid state laser 2 sends enters beam collimation mirror 10 by grating 9, through collimation and shaping, by optical prism 12 reflection, forms normal beam, then by compound lens 11 with its hot spot that is focused into 10 μ m diameters as the processing lasing light emitter.Camera 7 places optical prism 12 tops, and focal length is consistent with light source for processing, implements the observation process, and camera is the CCD camera.Workpiece lighting device 6 places outer ring, compound lens 11 below, is used for the illumination of finished surface.3 D workpiece displacement platform 4 can be at X, and Y, Z three direction of principal axis independently move, and Workpiece clamping head 13 places Z axle top and can at the uniform velocity rotate around the Z axle.Industrial computer 5 respectively with all solid state laser 2 and three-dimensional high-precision workpiece displacement platform 4, the motion that 2 outputs of high light beam quality all solid state laser and three-dimensional high-precision workpiece displacement platform 4 are coordinated in control realizes the processing of micropore.
The utility model is operated under windows by industrial computer, uses special-purpose software to set in advance laser output power, modulating frequency, working depth, pore size.Drive high light beam quality all solid state laser 2 and 4 work of three-dimensional high-precision workpiece displacement platform by the control integrated circuit board then, processing is finished automatically.
Claims (1)
1. a diamond capillary processing machine of using all solid state laser is characterized in that it comprises: cooling water tank, all solid state laser, light path system, 3 D workpiece displacement platform, industrial computer, workpiece lighting device, camera, rail plate and Workpiece clamping head; Cooling water tank links to each other with all solid state laser, and all solid state laser is connected with light path system and places on the rail plate, and described light path system is made up of grating, beam collimation mirror, compound lens, optical prism; The laser beam that is sent by described all solid state laser enters the beam collimation mirror by grating, through collimation and shaping, by optical prism reflection, forms normal beam, then by compound lens with its hot spot that is focused into 8-15 μ m diameters as the processing lasing light emitter; Described camera places the optical prism top, and focal length is consistent with light source for processing; The workpiece lighting device places outer ring, compound lens below, is used for the illumination of finished surface; Workpiece clamping head places can be at X, and the Z axle top of the 3 D workpiece displacement platform that Y, Z three direction of principal axis independently move also can at the uniform velocity rotate industrial computer around the Z axle and be connected with the 3 D workpiece displacement platform with all solid state laser respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820058943 CN201295821Y (en) | 2008-05-26 | 2008-05-26 | Diamond micropore-processing machine adopting all-solid-state laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200820058943 CN201295821Y (en) | 2008-05-26 | 2008-05-26 | Diamond micropore-processing machine adopting all-solid-state laser |
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| Publication Number | Publication Date |
|---|---|
| CN201295821Y true CN201295821Y (en) | 2009-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200820058943 Expired - Fee Related CN201295821Y (en) | 2008-05-26 | 2008-05-26 | Diamond micropore-processing machine adopting all-solid-state laser |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101905378A (en) * | 2010-08-19 | 2010-12-08 | 上海市激光技术研究所 | Fiber laser metal sheet welding device |
| CN103181655A (en) * | 2011-12-27 | 2013-07-03 | 武汉金运激光股份有限公司 | Vamp laser-punching system |
| CN105478997A (en) * | 2014-09-15 | 2016-04-13 | 荣刚材料科技股份有限公司 | Laser processing device lever focusing module |
| CN106513986A (en) * | 2016-12-31 | 2017-03-22 | 东莞理工学院 | Laser and ultrasound combined type drilling system and machining method thereof |
| CN109648196A (en) * | 2019-01-31 | 2019-04-19 | 湖南大科激光有限公司 | A kind of multi-axis numerical control laser process equipment and its processing method |
| CN110014232A (en) * | 2017-12-30 | 2019-07-16 | 大族激光科技产业集团股份有限公司 | A kind of laser processing device for de-plating |
-
2008
- 2008-05-26 CN CN 200820058943 patent/CN201295821Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101905378A (en) * | 2010-08-19 | 2010-12-08 | 上海市激光技术研究所 | Fiber laser metal sheet welding device |
| CN103181655A (en) * | 2011-12-27 | 2013-07-03 | 武汉金运激光股份有限公司 | Vamp laser-punching system |
| CN105478997A (en) * | 2014-09-15 | 2016-04-13 | 荣刚材料科技股份有限公司 | Laser processing device lever focusing module |
| CN105478997B (en) * | 2014-09-15 | 2017-04-12 | 荣刚材料科技股份有限公司 | Laser processing device lever focusing module |
| CN106513986A (en) * | 2016-12-31 | 2017-03-22 | 东莞理工学院 | Laser and ultrasound combined type drilling system and machining method thereof |
| CN110014232A (en) * | 2017-12-30 | 2019-07-16 | 大族激光科技产业集团股份有限公司 | A kind of laser processing device for de-plating |
| CN110014232B (en) * | 2017-12-30 | 2022-02-08 | 大族激光科技产业集团股份有限公司 | Laser processing device for removing coating |
| CN109648196A (en) * | 2019-01-31 | 2019-04-19 | 湖南大科激光有限公司 | A kind of multi-axis numerical control laser process equipment and its processing method |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090826 Termination date: 20130526 |