CN110719696A - PCB solder-resisting windowing method and PCB laser windowing machine - Google Patents
PCB solder-resisting windowing method and PCB laser windowing machine Download PDFInfo
- Publication number
- CN110719696A CN110719696A CN201911010545.XA CN201911010545A CN110719696A CN 110719696 A CN110719696 A CN 110719696A CN 201911010545 A CN201911010545 A CN 201911010545A CN 110719696 A CN110719696 A CN 110719696A
- Authority
- CN
- China
- Prior art keywords
- pcb
- laser
- processed
- windowing
- galvanometer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000012545 processing Methods 0.000 claims abstract description 106
- 230000007246 mechanism Effects 0.000 claims abstract description 84
- 229910000679 solder Inorganic materials 0.000 claims abstract description 32
- 238000012360 testing method Methods 0.000 claims description 64
- 238000012937 correction Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 239000002966 varnish Substances 0.000 claims description 3
- 239000003973 paint Substances 0.000 abstract description 3
- 238000005530 etching Methods 0.000 description 8
- 238000010329 laser etching Methods 0.000 description 5
- 238000010330 laser marking Methods 0.000 description 5
- 230000000903 blocking effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a method for performing solder mask windowing on a PCB, which uses a PCB laser windowing machine with a plurality of laser galvanometer mechanisms to perform solder mask windowing, and comprises the following steps: dividing a drawing of the PCB to be processed into one or more processing areas according to the size of the PCB to be processed and the single processing range of the PCB laser window opener, and dividing each processing area into one or more processing units according to the unit marking range of each laser galvanometer mechanism; the method comprises the steps of (1) positioning a PCB to be processed on a working platform of the PCB laser window opener, (3) moving a processing area to a position corresponding to a laser mirror vibrating mechanism in sequence, and controlling the corresponding laser mirror vibrating mechanism to perform laser window opening to remove insulating paint of the PCB at the corresponding position until solder resist ink of all the processing areas is finished. Compared with the prior art, the invention has the advantages of convenient operation, high efficiency, difficult error, no pollution and labor cost saving. The invention also discloses a corresponding PCB laser window opener.
Description
Technical Field
The invention relates to processing of a PCB (printed circuit board), in particular to a PCB solder mask windowing method and a PCB laser windowing machine.
Background
The PCB is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. With the diversified development of electronic products, the design of the PCB tends to be diversified, and the PCB continuously reduces the volume, reduces the cost and improves the performance, so that the PCB still maintains strong vitality in the development engineering of future electronic devices.
The PCB is generally provided with a solder resist (solder mask), which is a green oil portion on the PCB and is an "isolation tape" for preventing the SMD component pins from short-circuiting during mounting. Solder mask windowing is a measure taken for special requirements, such as front board heat dissipation, good contact with a housing, and the like, and specifically, a solder mask is peeled off at a position where soldering is needed to expose copper, and ink is not covered. However, in the conventional process, characters are printed after a solder resist layer is obtained by etching, and the etching is obtained by chemical corrosion, which not only consumes a large amount of chemicals and causes great environmental pollution, but also increases the risk in the manufacturing process.
For this reason, chinese patent CN201821004783.0 discloses a device for performing solder mask opening by laser etching, in which a laser beam mechanism is used to perform laser etching to peel off a solder mask layer at a place where the solder mask opening is required. However, the existing laser window opening machine generally has only one laser head, and before opening the window each time, the laser head needs to be moved to the position where the window needs to be opened to perform laser etching, so that the efficiency is low and errors are easy to occur.
Therefore, a PCB solder mask windowing method and a corresponding laser windowing machine capable of solving the above problems are urgently needed.
Disclosure of Invention
The invention aims to provide a PCB solder mask windowing method and a corresponding PCB laser windowing machine, which are used for performing solder mask windowing on a PCB, are convenient to operate, have high efficiency and are not easy to make mistakes.
In order to achieve the purpose, the invention discloses a method for performing resistance welding windowing on a PCB, which uses a PCB laser windowing machine with a plurality of laser galvanometer mechanisms to perform resistance welding windowing, and the unit marking ranges of two adjacent laser galvanometer mechanisms are overlapped by a preset distance, wherein the method comprises the following steps: (1) dividing a drawing of the PCB to be processed into one or more processing areas according to the size of the PCB to be processed and the single processing range of the PCB laser window opener, and dividing each processing area into one or more processing units according to the unit marking range of each laser galvanometer mechanism; (2) carry out CCD to the PCB board of treating processing on the work platform of PCB laser machine of windowing and shoot the location, (3) will treat that processing area on the PCB board of processing removes in proper order extremely under the mark position that the mirror mechanism was shaken to the laser or will the mirror that shakes of mirror mechanism that shakes of laser removes in proper order extremely treat processing area on the PCB board, and control corresponds the mirror mechanism that shakes carries out laser in the processing unit that corresponds and windows in order to get rid of the insulating varnish that corresponds PCB board on the position, window until accomplishing all processing area's laser.
Compared with the prior art, the invention uses the multi-laser-beam-oscillating mechanism to perform laser etching on the PCB so as to complete resistance welding windowing, and before each etching, the drawing of the PCB to be processed is divided into one or more processing areas according to the size of the PCB to be processed and the single processing range of the PCB laser windowing machine, so that during etching, the processing areas or the laser-beam-oscillating mechanism are directly and relatively moved, and each processing area is sequentially opposite to the etching position of the laser-beam-oscillating mechanism so as to respectively etch each processing area, and the invention has the advantages of convenient operation, high efficiency and difficult error.
Preferably, the drawings of the PCB to be processed and the PCB to be processed are respectively provided with at least three corresponding marking points, and the position of the PCB to be processed is determined in the step (2) according to the marking points on the PCB to be processed.
Specifically, the step (2) further comprises: and after the PCB to be processed is positioned, calculating the size and the rotation angle of the PCB to be processed, and adjusting the rotation angle and the size of the separated processing area and the PCB drawing paper to be processed of the processing unit according to the size and the rotation angle of the PCB to be processed.
Preferably, there is a step between step (1) and step (2): the method comprises the steps of displaying a drawing of a PCB to be processed, a parting line of a processing area and a parting line of a processing unit, receiving an external control command, and moving the parting line of the processing area or the parting line of the processing unit within a preset range according to the external control command.
Preferably, the PCB to be processed on the working platform is positioned in the step (2) according to a CCD positioning system on the PCB laser windowing machine.
Preferably, the step (1) is preceded by a step of calibrating and correcting the PCB laser windowing machine, which specifically includes: controlling the laser galvanometer mechanism to shoot a target on a test board of the working platform according to a first calibration command which is input from the outside and corresponds to the laser galvanometer mechanism so as to form a first test target, and the working platform or the CCD positioning system is moved according to the first preset phase distance of the laser galvanometer mechanism and the CCD positioning system, so that the first test target is positioned in the grabbing range of the CCD positioning system, the first test target grabbed by the CCD positioning system is obtained, the phase distance La between each galvanometer and the CCD positioning system is calculated according to the center of each test target, the first preset phase distance and the center of the grabbing range, the first preset phase distance and the adjacent phase distance Lb between the galvanometer of the laser galvanometer mechanism and the galvanometer of the adjacent laser galvanometer mechanism are corrected according to the phase distance La, correcting the single processing range and the unit marking range according to the adjacent phase distance Lb;
controlling a plurality of targets preset on the test board by each laser galvanometer mechanism according to an externally input second calibration command to form a second test target, and controls the working platform to move relative to the frame according to the phase distance La corresponding to the laser galvanometer mechanism, so as to move the second test target to the grabbing center of the CCD positioning system, obtain the second test target grabbed by the CCD positioning system, calculate the phase distance Lc between two adjacent second test targets according to the grabbed second test target, and the mark diameter R1 of each second test target and the distance from each test target to the grabbing center are calculated according to the phase distance Lc, the distance from each test target to the grabbing center and the mark diameter R1, the laser angle deviation theta of a galvanometer corresponding to the laser galvanometer mechanism is calculated, and the single processing range and the unit marking range are corrected according to the laser angle deviation theta.
More specifically, in the calibration correction step: and correcting each unit marking range according to the laser angle deviation theta, and correcting the single processing range according to the adjacent phase distance Lb and the corrected unit marking range.
Preferably, the step (1) further comprises the steps of: and importing the drawing of the PCB to be processed, and acquiring the size and the processing area of the PCB to be processed according to the imported drawing of the PCB to be processed. The drawing of the PCB to be processed is directly led in the software system to obtain the relevant information, so that errors are not easy to occur.
The invention also discloses a PCB laser window opener, which comprises a rack, a working platform arranged on the rack, a CCD positioning system arranged on the rack and positioned above the working platform, a laser galvanometer mechanism and a control system, wherein the laser galvanometer mechanism comprises a laser, a field lens, a galvanometer and corresponding optical light paths; the control system comprises one or more processors, a memory, a display and an input module, wherein the input module is used for inputting external commands, one or more programs are stored in the memory, the programs are configured to be executed by the processors and comprise a method for performing the solder mask windowing on the PCB, the processor receives the external commands input by the input module, calls and executes data and programs in the memory, controls the display to display information, receives positioning images input by the CCD positioning system, controls the working platform to move relative to the frame and controls the laser galvanometer mechanism to move.
Compared with the prior art, the invention uses the multi-laser-beam-oscillating mechanism to perform laser etching on the PCB so as to complete resistance welding windowing, and before each etching, the drawing of the PCB to be processed is divided into one or more processing areas according to the size of the PCB to be processed and the single processing range of the PCB laser windowing machine, so that during etching, the processing areas or the laser-beam-oscillating mechanism are directly and relatively moved, and each processing area is sequentially opposite to the etching position of the laser-beam-oscillating mechanism so as to respectively etch each processing area, and the invention has the advantages of convenient operation, high efficiency and difficult error.
Specifically, the laser galvanometer mechanism has two.
Drawings
FIG. 1 is a method for solder mask windowing a PCB according to the present invention.
Fig. 2 is a structural block diagram of the PCB laser windowing machine of the present invention.
Fig. 3 is a schematic perspective view of the PCB laser windowing machine according to the present invention.
Fig. 4 is a side view of the PCB laser windowing machine of the present invention at one angle.
Fig. 5 is a side view of another angle of the PCB laser windowing machine of the present invention.
FIG. 6 is a top view of the PCB laser windowing machine of the present invention.
Detailed Description
In order to explain technical contents, structural features, and objects and effects of the present invention in detail, the following detailed description is given with reference to the accompanying drawings in conjunction with the embodiments.
Referring to fig. 1 and 2, the present invention discloses a method 100 for performing solder mask windowing on a PCB, wherein a PCB laser windowing machine 200 having a plurality of laser galvanometer mechanisms 20 is used for performing solder mask windowing, and unit marking ranges of two adjacent laser galvanometer mechanisms 20 are overlapped by a preset distance, the method comprises the following steps: (S1) dividing the drawing of the PCB to be processed into one or more processing regions according to the size of the PCB to be processed and the single processing range of the PCB laser windowing machine 200, and dividing each processing region into one or more processing units according to the unit marking range of each laser galvanometer mechanism 20; (S2) carrying out CCD photographing and positioning on the PCB to be processed on the working platform of the PCB laser window-opening machine 200, (S3) sequentially moving the processing area on the PCB to be processed to the position under the marking position of the laser mirror-vibrating mechanism 20, and controlling the laser mirror-vibrating mechanism 20 to carry out laser window-opening in the corresponding processing unit so as to remove the insulating paint on the PCB at the corresponding position until the laser window-opening of all the processing areas is completed.
In order to increase the accuracy of the processing, the present embodiment further includes, in step (1): the drawing of the PCB to be processed is led in, and the size of the PCB to be processed and the area to be processed (the area to be marked) are directly obtained according to the led-in drawing of the PCB to be processed.
The PCB to be processed and the drawing of the PCB to be processed are respectively provided with at least three corresponding marking points, and the position of the PCB to be processed is determined in the step (S2) according to the marking points on the PCB to be processed. The present embodiment has four mark points, which are not located on the same straight line.
Wherein the step (S2) further comprises: and after the PCB to be processed is positioned, calculating the size and the rotation angle of the PCB to be processed, and adjusting the rotation angle and the size of the separated processing area and the PCB drawing paper to be processed of the processing unit according to the size and the rotation angle of the PCB to be processed.
Preferably, the step (S1) and the step (S2) further include the steps of: the method comprises the steps of displaying a drawing of a PCB to be processed, a parting line of a processing area and a parting line of a processing unit, receiving an external control command, and moving the parting line of the processing area or the parting line of the processing unit within a preset range according to the external control command.
In the step (S2), the PCB to be processed on the work platform is positioned according to the CCD positioning system 12 on the PCB laser windowing machine 200.
Preferably, the step (S1) further includes a step of calibrating the PCB laser windowing machine 200, which specifically includes: controlling the laser galvanometer mechanism 20 to mark a target on a test board of the working platform according to a first calibration command input from the outside and corresponding to the laser galvanometer mechanism 20 to form a first test target, moving the test board according to a first preset phase distance between the laser galvanometer mechanism 20 and the CCD positioning system 12 (in this embodiment, the test board is moved by moving the working platform on which the test board is mounted), so that the first test target moves into a grabbing range of the CCD positioning system 12, obtaining the first test target grabbed by the CCD positioning system 12, calculating a phase distance La between each galvanometer 23 and the CCD positioning system 12 according to a center of each test target, a first preset phase distance and a center of the grabbing range, correcting the first preset phase distance according to the phase distance La and an adjacent phase distance Lb between the galvanometer 23 of the laser galvanometer mechanism 20 and a galvanometer 23 of an adjacent laser galvanometer mechanism 20, correcting the single processing range and the unit marking range according to the adjacent phase distance Lb; controlling a plurality of targets preset on the test board by each laser galvanometer mechanism 20 according to a second calibration command input from the outside to form a second test target, and controls the working platform to move relative to the frame according to the phase distance La corresponding to the laser galvanometer mechanism 20, so as to move the second test target to the grabbing center of the CCD positioning system 12, obtain the second test target grabbed by the CCD positioning system 12, calculate the phase distance Lc between two adjacent second test targets according to the grabbed second test target, and the mark diameter R1 of each second test target and the distance from each test target to the grabbing center, calculating the laser angle deviation theta of the galvanometer 23 corresponding to the laser galvanometer mechanism 20 according to the phase distance Lc, the distance from each test target to the grabbing center and the mark diameter R1, and correcting the single-time processing range and the unit marking range according to the laser angle deviation theta.
Specifically, in the calibration and correction step: and correcting each unit marking range according to the laser angle deviation theta, and correcting the single processing range according to the adjacent phase distance Lb and the corrected unit marking range.
Referring to fig. 2 to 6, the present invention further discloses a PCB laser window opener 200, which includes a frame 10, a working platform 11 mounted on the frame 10, a CCD positioning system 12 mounted on the frame 10 and located above the working platform 11, a laser galvanometer mechanism 20 and a control system 30, wherein the laser galvanometer mechanism 20 includes a laser 21, a field lens 22, a galvanometer 23 and corresponding optical paths (located between the laser 21 and the field lens 23), the working platform 11 is slidably mounted on the frame 10 and can move along X-axis and Y-axis directions relative to the laser galvanometer mechanism 20 and the CCD positioning system 12, the CCD positioning system 12 scans a PCB board to be processed on the working platform 11 to generate a positioning image, the laser galvanometer mechanism 20 has at least two laser galvanometer mechanisms 20 arranged at a certain interval, overlapping the marking ranges of the units of every two adjacent laser galvanometer mechanisms 20 by a preset phase distance; the control system 30 includes one or more processors 31, a memory 32, a display 33, and an input module 34, the input module 34 is used for inputting external commands, the memory 32 stores one or more programs configured to be executed by the processors and including a method 100 for performing solder mask windowing of PCB boards, the processor 31 receives external commands input by the input module 34, calls and executes data and programs in the memory 32, controls the display 33 to display information, receives positioning images input by the CCD positioning system 12, controls the motion of the working platform 11 relative to the frame 10, and controls the motion of the laser galvanometer mechanism 20.
The method 100 for performing solder mask windowing on the PCB comprises the following steps: (S1) dividing the drawing of the PCB to be processed into one or more processing regions according to the size of the PCB to be processed and the single processing range of the PCB laser windowing machine 200, and dividing each processing region into one or more processing units according to the unit marking range of each laser galvanometer mechanism 20; (S2) positioning the PCB to be processed on the working platform of the PCB laser window-opening machine 200, (S3) moving the processing area on the PCB to be processed to the position under the marking position of the laser mirror-vibrating mechanism 20 in sequence, and controlling the laser mirror-vibrating mechanism 20 to perform laser window-opening in the corresponding processing unit so as to remove the insulating paint on the PCB at the corresponding position until the laser window-opening of all the processing areas is completed.
In this embodiment, the working platform 11 is slidably mounted on the frame 10 through an X-axis guide rail and a Y-axis guide rail, and the X-axis motor and the Y-axis motor respectively drive the working platform 11 to move relative to the frame 10 in the X-axis direction and the Y-axis direction, and the processor 31 controls the X-axis motor and the Y-axis motor to move respectively, so as to control the movement of the working platform 11. In order to facilitate processing, the laser galvanometer mechanism 20 is slidably mounted on the frame 10 through a Z-axis guide rail, and a Z-axis motor drives the laser galvanometer mechanism 20 to move up and down along a vertical direction relative to the frame 10, so that the laser galvanometer mechanism 20 performs resistance welding windowing conveniently, and the processor controls the Z-axis motor to move so as to control the laser galvanometer mechanism 20 to move up and down. Of course, the working platform 11 may be fixed on the frame 10, the laser galvanometer mechanism 20 and the CCD positioning system 12 may be mounted on the frame 10 by a sliding frame, and the control system 30 controls the sliding frame to move relative to the frame 10 so as to move the PCB to be processed on the working platform 11 to the corresponding position of the CCD positioning system 12 and the laser galvanometer mechanism 20.
In this embodiment, the laser galvanometer mechanisms 20 have two, and certainly, the number of the laser galvanometer mechanisms 20 may also be three, four, and the like, and a plurality of laser galvanometer mechanisms 20 may be arranged in a rectangular array, may also be arranged in a row, and may be set according to actual needs. The CCD positioning system 12 has two cameras.
The processor 31 also detects and records the movement stroke of the working platform 11 (the encoder of the driving motor for controlling the movement of the working platform 11) relative to the frame 10.
Referring to fig. 1 to 6, a specific process of the PCB solder mask windowing method 100 using the PCB laser windowing machine 200 is specifically described:
(1) the steps of the invention for calibration correction are described below:
① an operator places a test board (standard board) on the working platform 11 and inputs a start command, the processor 31 receives the start command input from outside, opens a positioning member (positioning suction cup) on the working platform 11 according to the start command, and attaches the test board to the working platform 11 to keep the test board flat;
② the operator inputs a first marking command corresponding to the galvanometer 23 to the processor 31, and the processor receives the first marking command and controls the galvanometer 23 to punch a first test target on the test board;
③, an operator inputs a corresponding CCD moving command to the processor 31 to move the icon of the CCD positioning system 12 to the icon of the galvanometer 23 by displaying the icon of the CCD positioning system 12 and the icon of the galvanometer 23 on the display, the processor 31 receives the CCD moving command and controls the working platform 11 to move a first preset phase distance along a preset direction relative to the frame 10 according to the CCD moving command to move the first test target to the grabbing area of the CCD positioning system 12, the CCD positioning system 12 identifies and grabs the image of the first test target and transmits the grabbed image to the processor 31, the operator inputs an automatic calibration command to the processor 31, the processor 31 calculates a relative position between the grabbing center of the CCD positioning system 12 and the center of the first test target according to the grabbed image to obtain a phase distance La, controls the working platform 11 to move a phase distance along a preset direction relative to the frame 10 according to the automatic calibration command to move the center of the CCD positioning system 12 to a phase distance La, calculates a phase distance between the grabbing center of the first test target 12 and corrects the initial distance of the galvanometer 23 according to the initial laser marking distance and the initial laser marking distance, and corrects the initial laser distance of the galvanometer 23 to the initial laser marking distance and the initial laser marking distance of the single laser marking mechanism 20.
Steps ② and ③ are repeated to correct the spacing between each galvanometer 23 and CCD positioning system 12, and between adjacent galvanometers when CCD positioning system 12 has multiple cameras, step ③ is repeated to calculate and correct the spacing between a galvanometer 23 and each camera in CCD positioning system 12.
④ an operator inputs a second marking command corresponding to the galvanometer 23 to the processor 31, the processor 31 receives the second marking command and controls the galvanometer 23 to punch n ＊ n second test targets on the test board according to the second marking command, where n is an integer greater than or equal to 2, in this embodiment, n is equal to 11, and certainly n may also be other values such as 10, 15, and the like;
⑤ the operator inputs the distance measuring command of the vibrating mirror 23 to the processor 31, the processor 31 receives the distance measuring command and moves the working platform 11 by the first preset phase distance after correction according to the distance measuring command to move the second test target to the grabbing center of the CCD positioning system 12, the CCD positioning system 12 recognizes and grabs the image of the second test target and transmits the grabbed image to the processor 31, the processor 31 calculates the phase distance Lc between each two adjacent test targets, the distance between each test target and the grabbing center, and the standard diameter R1 of each second test target, calculates the integral angle deviation theta of the vibrating mirror 23 according to the phase distance Lc between each two adjacent test targets, the distance between each test target and the grabbing center, and the standard diameter R1 of each second test target, and corrects the single machining range and the unit marking range according to the laser angle deviation theta.
The above steps ④ and ⑤ are repeated to complete the parameter correction for each galvanometer 23.
(2) The following describes the steps of solder mask windowing of the PCB:
①, an operator uploads a drawing of a PCB to be processed to the processor 31 and inputs a blocking command, the processor 31 receives the blocking command and then divides the drawing of the PCB to be processed into one or more processing areas according to the size (pre-stored data) of the PCB to be processed and the single processing range of the PCB laser windowing machine, and each processing area is divided into one or more processing units according to each unit marking range;
② the processor 31 controls the display to display the drawing of the PCB to be processed, the dividing line of the processing area and the dividing line of the processing unit, at this time, the operator can judge whether the dividing line bypasses the area to be windowed or not according to the position of the dividing line and the position of the area to be windowed on the drawing, if the dividing line directly passes through the area to be windowed, the operator inputs the corresponding control command to the processor 31, the processor 31 moves the dividing line of the processing area or the dividing line of the processing unit in the preset range according to the control command, so that the dividing line bypasses the area to be windowed, wherein, the condition of the preset range is that after the dividing line is moved, the processing area composed of the dividing line is less than or equal to the single processing range, the processing unit composed of the dividing line is less than or equal to the corresponding unit marking range, the preset range is calculated by the processor 31 according to the positions of the processing unit, the processing area and the single processing range and the size of the unit marking range, after the confirmation, the operator inputs the uploading command, the processor 31 stores the processing area to be processed and the processing unit to be processed to be operated as.
③ an operator places a PCB to be processed on the working platform 11, the CCD positioning system 12 captures a current image and transmits the current image to the processor 31, the processor 31 controls the display 33 to display the current image, the operator selects a mark point (i.e. mark point information) in the current image and inputs a mark point deviation rectifying command, the processor 31 receives the mark point information and the mark point deviation rectifying command selected by the operator, positions the PCB to be processed according to the mark point information, calculates the size and the rotation angle of the PCB to be processed, adjusts the rotation angle and the size of the PCB to be processed in a separated processing area and a processing unit according to the size and the rotation angle of the PCB to be processed, and controls the display to display the adjusted PCB to be processed.
④ an operator selects a processing area to be processed on the PCB drawing paper to be processed to generate a processing area command, the processor 31 controls the working platform 11 to move relative to the frame 10 according to the processing area command until the corresponding processing area of the PCB to be processed moves to a corresponding position below the galvanometer 23, controls the laser galvanometer mechanism 20 to operate to perform laser windowing in the corresponding processing unit, removes the insulating varnish of the PCB to be processed at the corresponding position, after the operation of the laser galvanometer mechanism 20 is completed, the processor 31 marks the processed area corresponding to the PCB drawing paper to be processed, receives a next processing area command input by the operator until all processing areas are processed, and thus completes laser windowing of all processing areas.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (10)
1. A method for carrying out solder mask windowing on a PCB is characterized by comprising the following steps: the method comprises the following steps of using a PCB laser windowing machine with a plurality of laser galvanometer mechanisms to perform resistance welding windowing, and overlapping the marking ranges of the units of two adjacent laser galvanometer mechanisms by a preset distance, wherein the method comprises the following steps:
(1) dividing a drawing of the PCB to be processed into one or more processing areas according to the size of the PCB to be processed and the single processing range of the PCB laser window opener, and dividing each processing area into one or more processing units according to the unit marking range of each laser galvanometer mechanism;
(2) carrying out CCD photographing and positioning on a PCB to be processed on a working platform of the PCB laser window opener;
(3) and will processing area on the PCB board to be processed moves in proper order to under the marking position of the laser mirror mechanism that shakes or will the mirror that shakes of the laser mirror mechanism moves in proper order to processing area on the PCB board to be processed, and control corresponds the laser mirror mechanism that shakes carries out laser windowing in the processing unit that corresponds in order to get rid of the insulating varnish of PCB board on the corresponding position, windows until accomplishing all processing area's laser.
2. The method of solder resist windowing a PCB board of claim 1, wherein: and (3) at least three corresponding marking points are respectively arranged on the drawings of the PCB to be processed and the PCB to be processed, and the position of the PCB to be processed is determined in the step (2) according to the marking points on the PCB to be processed.
3. The method of solder resist windowing a PCB board of claim 1, wherein: and (3) performing CCD photographing positioning on the PCB to be processed on the working platform according to the CCD positioning system on the PCB laser window opener in the step (2).
4. The method of solder resist windowing a PCB board of claim 1, wherein: the step (2) further comprises: and after the PCB to be processed is positioned, calculating the size and the rotation angle of the PCB to be processed, and adjusting the rotation angle and the size of the separated processing area and the PCB drawing paper to be processed of the processing unit according to the size and the rotation angle of the PCB to be processed.
5. The method of solder resist windowing a PCB board of claim 1, wherein: the step (1) and the step (2) are also provided with the following steps: the method comprises the steps of displaying a drawing of a PCB to be processed, a parting line of a processing area and a parting line of a processing unit, receiving an external control command, and moving the parting line of the processing area or the parting line of the processing unit within a preset range according to the external control command.
6. The method of solder resist windowing a PCB board of claim 3, wherein: the method comprises the following steps of (1) calibrating and correcting the PCB laser window opener, and specifically comprises the following steps:
controlling the laser galvanometer mechanism to shoot a target on a test board of the working platform according to a first calibration command which is input from the outside and corresponds to the laser galvanometer mechanism so as to form a first test target, and the working platform or the CCD positioning system is moved according to the first preset phase distance of the laser galvanometer mechanism and the CCD positioning system, so that the first test target is positioned in the grabbing range of the CCD positioning system, the first test target grabbed by the CCD positioning system is obtained, the phase distance La between each galvanometer and the CCD positioning system is calculated according to the center of each test target, the first preset phase distance and the center of the grabbing range, the first preset phase distance and the adjacent phase distance Lb between the galvanometer of the laser galvanometer mechanism and the galvanometer of the adjacent laser galvanometer mechanism are corrected according to the phase distance La, correcting the single processing range and the unit marking range according to the adjacent phase distance Lb;
controlling a plurality of targets preset on the test board by the laser galvanometer mechanism according to an externally input second calibration command to form a second test target, and controls the working platform to move relative to the frame according to the phase distance La corresponding to the laser galvanometer mechanism, so as to move the second test target to the grabbing center of the CCD positioning system, obtain the second test target grabbed by the CCD positioning system, calculate the phase distance Lc between two adjacent second test targets according to the grabbed second test target, and the mark diameter R1 of each second test target and the distance from each test target to the grabbing center are calculated according to the phase distance Lc, the distance from each test target to the grabbing center and the mark diameter R1, the laser angle deviation theta of a galvanometer corresponding to the laser galvanometer mechanism is calculated, and the single processing range and the unit marking range are corrected according to the laser angle deviation theta.
7. The method of solder resist windowing a PCB board of claim 6, wherein: the calibration and correction step comprises: and correcting each unit marking range according to the laser angle deviation theta, and correcting the single processing range according to the adjacent phase distance Lb and the corrected unit marking range.
8. The method of solder resist windowing a PCB board of claim 1, wherein: the step (1) further comprises the following steps: and importing the drawing of the PCB to be processed, and acquiring the size and the processing area of the PCB to be processed according to the imported drawing of the PCB to be processed.
9. The utility model provides a PCB laser machine of windowing which characterized in that: the laser positioning system is arranged on the frame in a sliding mode and can move along the X-axis direction and the Y-axis direction relative to the laser galvanometer mechanism and the CCD positioning system, the CCD positioning system scans a PCB to be processed on the working platform to generate a positioning image, the laser galvanometer mechanism is provided with at least two laser galvanometer mechanisms which are arranged at a certain interval, and the marking ranges of every two adjacent laser galvanometer mechanisms are overlapped by a preset distance; the control system comprises one or more processors, a memory, a display and an input module, wherein the input module is used for inputting external commands, the memory is stored with one or more programs, the programs are configured to be executed by the processors and comprise the programs for executing the method for conducting the solder mask windowing on the PCB according to any one of claims 1 to 8, and the processors receive the external commands input by the input module, call and execute data and programs in the memory, control the display of information by the display, receive positioning images input by the CCD positioning system, control the action of the working platform relative to the rack and control the action of the laser galvanometer mechanism.
10. The PCB laser windowing machine of claim 9, wherein: the laser galvanometer mechanism has two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911010545.XA CN110719696B (en) | 2019-10-22 | 2019-10-22 | PCB solder-resisting windowing method and PCB laser windowing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911010545.XA CN110719696B (en) | 2019-10-22 | 2019-10-22 | PCB solder-resisting windowing method and PCB laser windowing machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110719696A true CN110719696A (en) | 2020-01-21 |
| CN110719696B CN110719696B (en) | 2021-09-03 |
Family
ID=69213138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911010545.XA Active CN110719696B (en) | 2019-10-22 | 2019-10-22 | PCB solder-resisting windowing method and PCB laser windowing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110719696B (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111642081A (en) * | 2020-06-04 | 2020-09-08 | 江西兆信精密电子有限公司 | PCB solder mask production process |
| CN112165765A (en) * | 2020-10-27 | 2021-01-01 | 惠州市特创电子科技有限公司 | Circuit board and electronic communication device |
| CN112654155A (en) * | 2020-11-24 | 2021-04-13 | 深圳和美精艺半导体科技股份有限公司 | Laser-fired lead windowing method and substrate preparation method |
| CN113795087A (en) * | 2021-11-15 | 2021-12-14 | 深圳市大族数控科技股份有限公司 | Windowing method and windowing equipment |
| CN113814571A (en) * | 2021-09-13 | 2021-12-21 | 温州快刻科技有限公司 | Integrated control method for laser engraving image transfer and pattern detection |
| CN113923886A (en) * | 2021-10-26 | 2022-01-11 | 新华三信息安全技术有限公司 | Method for removing solder resist ink on printed board and solder resist ink removing equipment |
| CN114309976A (en) * | 2021-12-23 | 2022-04-12 | 大族激光科技产业集团股份有限公司 | Laser processing method, laser processing equipment and storage medium |
| CN114393266A (en) * | 2022-02-18 | 2022-04-26 | 惠州一非智能科技有限公司 | Tin soldering method of laser circuit board tin paste welding machine |
| CN114799492A (en) * | 2022-03-21 | 2022-07-29 | 武汉华工激光工程有限责任公司 | Efficient high-precision Mini LED panel windowing method and system |
| CN116140778A (en) * | 2023-04-14 | 2023-05-23 | 宁波尚进自动化科技有限公司 | Bonding welding method and judging method |
| CN116899985A (en) * | 2023-09-14 | 2023-10-20 | 浙江森尼克半导体有限公司 | Lead frame flash removing method and device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2208568A1 (en) * | 2009-01-20 | 2010-07-21 | Synova S.A. | Apparatus and method for processing material by means of laser |
| CN103200784A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Solder mask windowing method for printed circuit board |
| CN103406665A (en) * | 2013-07-18 | 2013-11-27 | 深圳市大族激光科技股份有限公司 | Laser processing device |
| CN108296640A (en) * | 2018-04-26 | 2018-07-20 | 大族激光科技产业集团股份有限公司 | Laser process equipment and method |
| CN207757083U (en) * | 2017-12-20 | 2018-08-24 | 苏州首镭激光科技有限公司 | Multistation automatic laser marking machine |
-
2019
- 2019-10-22 CN CN201911010545.XA patent/CN110719696B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2208568A1 (en) * | 2009-01-20 | 2010-07-21 | Synova S.A. | Apparatus and method for processing material by means of laser |
| CN103200784A (en) * | 2013-04-24 | 2013-07-10 | 梅州市志浩电子科技有限公司 | Solder mask windowing method for printed circuit board |
| CN103406665A (en) * | 2013-07-18 | 2013-11-27 | 深圳市大族激光科技股份有限公司 | Laser processing device |
| CN207757083U (en) * | 2017-12-20 | 2018-08-24 | 苏州首镭激光科技有限公司 | Multistation automatic laser marking machine |
| CN108296640A (en) * | 2018-04-26 | 2018-07-20 | 大族激光科技产业集团股份有限公司 | Laser process equipment and method |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111642081A (en) * | 2020-06-04 | 2020-09-08 | 江西兆信精密电子有限公司 | PCB solder mask production process |
| CN112165765A (en) * | 2020-10-27 | 2021-01-01 | 惠州市特创电子科技有限公司 | Circuit board and electronic communication device |
| CN112165765B (en) * | 2020-10-27 | 2021-12-07 | 惠州市特创电子科技股份有限公司 | Circuit board and electronic communication device |
| CN112654155A (en) * | 2020-11-24 | 2021-04-13 | 深圳和美精艺半导体科技股份有限公司 | Laser-fired lead windowing method and substrate preparation method |
| CN113814571A (en) * | 2021-09-13 | 2021-12-21 | 温州快刻科技有限公司 | Integrated control method for laser engraving image transfer and pattern detection |
| CN113923886A (en) * | 2021-10-26 | 2022-01-11 | 新华三信息安全技术有限公司 | Method for removing solder resist ink on printed board and solder resist ink removing equipment |
| CN113795087A (en) * | 2021-11-15 | 2021-12-14 | 深圳市大族数控科技股份有限公司 | Windowing method and windowing equipment |
| WO2023082511A1 (en) * | 2021-11-15 | 2023-05-19 | 深圳市大族数控科技股份有限公司 | Windowing method and windowing device |
| CN114309976A (en) * | 2021-12-23 | 2022-04-12 | 大族激光科技产业集团股份有限公司 | Laser processing method, laser processing equipment and storage medium |
| CN114393266A (en) * | 2022-02-18 | 2022-04-26 | 惠州一非智能科技有限公司 | Tin soldering method of laser circuit board tin paste welding machine |
| CN114799492A (en) * | 2022-03-21 | 2022-07-29 | 武汉华工激光工程有限责任公司 | Efficient high-precision Mini LED panel windowing method and system |
| CN116140778A (en) * | 2023-04-14 | 2023-05-23 | 宁波尚进自动化科技有限公司 | Bonding welding method and judging method |
| CN116899985A (en) * | 2023-09-14 | 2023-10-20 | 浙江森尼克半导体有限公司 | Lead frame flash removing method and device |
| CN116899985B (en) * | 2023-09-14 | 2023-12-15 | 浙江森尼克半导体有限公司 | Lead frame flash removing method and device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110719696B (en) | 2021-09-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110719696B (en) | PCB solder-resisting windowing method and PCB laser windowing machine | |
| CN110125926B (en) | Automatic workpiece picking and placing method and system | |
| US7181089B2 (en) | Method and apparatus for searching for fiducial marks, and method of detecting positions of the fiducial marks | |
| US6131511A (en) | Screen printing method and screen printing apparatus | |
| US20090007424A1 (en) | Electronic component mounting system and electronic component mounting method | |
| JP2009094283A (en) | Method of producing mounting board, surface mounting machine, and mounting board production control device | |
| CN104885593A (en) | Component mounting machine and component mounting method | |
| CN115555648A (en) | Numerical control cutting method, system, equipment and medium | |
| JP3091424B2 (en) | Perforator | |
| CN112643324A (en) | Automatic screw driving equipment and automatic screw driving method adopting same | |
| US6951175B2 (en) | Method for forming printing inspection data | |
| CN106530357B (en) | Visual alignment control device and calibration method | |
| CN100558554C (en) | A kind of serial multi-axis stepper control method that is used for stencil printer | |
| EP3370493B1 (en) | Base plate position searching device and component mounting machine | |
| JP3265143B2 (en) | Component mounting method and device | |
| JP3600643B2 (en) | Substrate position detection method and substrate position detection device | |
| JP2000211106A (en) | Screen mask aligning method in screen printing | |
| JPH10135686A (en) | Data processing device and electronic components mounting apparatus | |
| JPH0999547A (en) | Automatic instruction device of recognition mark position and instruction method | |
| JP2003101297A (en) | Method for correcting offset in electronic component mounter | |
| JPH10135700A (en) | Data processing device and electronic components mounting apparatus | |
| JP3342196B2 (en) | Image recognition device and image recognition method | |
| JPH0464291A (en) | Mounting method for electronic component | |
| US11328405B2 (en) | Electronic component mounting orientation checking system and electronic component mounting orientation checking method | |
| JPH05210712A (en) | Method for correcting packaged data |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 523000 Room 101, No.39, Dali Xinxing 1st Road, Qingxi Town, Dongguan City, Guangdong Province Applicant after: Dongguan sanruntian Intelligent Technology Co.,Ltd. Address before: 523000 Yukui street, Dali Village, Qingxi Town, Dongguan City, Guangdong Province Applicant before: DONGGUAN SANNIAN INTELLIGENT TECHNOLOGY Co.,Ltd. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240124 Address after: 413064 Yingchun Road, East Industrial Park, High tech Zone, Yiyang City, Hunan Province Patentee after: Hunan Keming Oil Co.,Ltd. Country or region after: China Address before: 523000 Room 101, No.39, Dali Xinxing 1st Road, Qingxi Town, Dongguan City, Guangdong Province Patentee before: Dongguan sanruntian Intelligent Technology Co.,Ltd. Country or region before: China |
|
| OL01 | Intention to license declared |