CN103384812B - 印刷焊料检查装置 - Google Patents
印刷焊料检查装置 Download PDFInfo
- Publication number
- CN103384812B CN103384812B CN201280008482.4A CN201280008482A CN103384812B CN 103384812 B CN103384812 B CN 103384812B CN 201280008482 A CN201280008482 A CN 201280008482A CN 103384812 B CN103384812 B CN 103384812B
- Authority
- CN
- China
- Prior art keywords
- solder
- mentioned
- illumination
- length direction
- check device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 89
- 238000005286 illumination Methods 0.000 claims abstract description 98
- 239000000758 substrate Substances 0.000 claims description 40
- 238000007689 inspection Methods 0.000 claims description 26
- 230000003287 optical effect Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 description 40
- 238000003384 imaging method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 239000006071 cream Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 230000001678 irradiating effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000004040 coloring Methods 0.000 description 4
- 230000008034 disappearance Effects 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 244000283207 Indigofera tinctoria Species 0.000 description 1
- 240000007711 Peperomia pellucida Species 0.000 description 1
- 235000012364 Peperomia pellucida Nutrition 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Quality & Reliability (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (6)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-027999 | 2011-02-11 | ||
JP2011027999A JP5945386B2 (ja) | 2011-02-11 | 2011-02-11 | 印刷半田検査装置 |
PCT/JP2012/052912 WO2012108483A1 (ja) | 2011-02-11 | 2012-02-09 | 印刷半田検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103384812A CN103384812A (zh) | 2013-11-06 |
CN103384812B true CN103384812B (zh) | 2017-07-21 |
Family
ID=46638695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280008482.4A Expired - Fee Related CN103384812B (zh) | 2011-02-11 | 2012-02-09 | 印刷焊料检查装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5945386B2 (zh) |
KR (1) | KR101877592B1 (zh) |
CN (1) | CN103384812B (zh) |
WO (1) | WO2012108483A1 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9335157B2 (en) * | 2014-10-14 | 2016-05-10 | Electronics For Imaging, Inc. | Differential lighting |
CN104330419A (zh) * | 2014-11-20 | 2015-02-04 | 北京凌云光技术有限责任公司 | 菲林检测方法及装置 |
WO2016194992A1 (ja) * | 2015-06-05 | 2016-12-08 | 中外製薬株式会社 | 免疫活性化剤の併用 |
WO2018056341A1 (ja) * | 2016-09-21 | 2018-03-29 | 株式会社小森コーポレーション | 印刷品質検査装置及び印刷品質検査方法 |
JP6306230B1 (ja) * | 2017-02-09 | 2018-04-04 | Ckd株式会社 | 半田印刷検査装置、半田印刷検査方法、及び、基板の製造方法 |
TWI758383B (zh) | 2017-07-19 | 2022-03-21 | 日商日本電產理德股份有限公司 | 攝影裝置、凸塊檢查裝置以及攝影方法 |
KR102449124B1 (ko) * | 2020-06-12 | 2022-10-06 | 투아이시스(주) | 2d 및 3d 구성을 이용한 콘크리트 균열 검측시스템 |
CN112834528A (zh) * | 2021-01-06 | 2021-05-25 | 深圳格兰达智能装备股份有限公司 | 3d缺陷检测***及方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1901794A (zh) * | 2005-07-22 | 2007-01-24 | 株式会社理光 | 焊点确定方法、焊料检查方法和焊料检查装置 |
CN101310172A (zh) * | 2005-11-15 | 2008-11-19 | 欧姆龙株式会社 | 焊料检查装置 |
CN100481362C (zh) * | 2004-01-23 | 2009-04-22 | 株式会社瑞萨科技 | 半导体集成电路器件的制造方法 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61265513A (ja) * | 1985-05-20 | 1986-11-25 | Fujitsu Ltd | 部品形状検知法および部品形状検知装置 |
JPS63109307A (ja) * | 1986-10-27 | 1988-05-14 | Sharp Corp | チツプ部品の装着検査装置 |
JPH02287150A (ja) * | 1989-04-27 | 1990-11-27 | Komatsu Ltd | はんだ接合部の検査装置およびその検査方法 |
JPH02307006A (ja) * | 1989-05-23 | 1990-12-20 | Fujitsu Ltd | 表面形状測定装置 |
JPH04250346A (ja) * | 1991-01-25 | 1992-09-07 | Nec Ibaraki Ltd | 半田付検査装置 |
JPH0618239A (ja) * | 1992-06-30 | 1994-01-25 | Matsushita Electric Ind Co Ltd | クリーム半田印刷検査装置 |
JP3162872B2 (ja) * | 1993-05-10 | 2001-05-08 | 三洋電機株式会社 | 電子部品の輪郭認識装置及びその輪郭認識方法 |
JPH0772064A (ja) * | 1993-06-24 | 1995-03-17 | Sony Corp | 電子部品のハンダ付け性試験方法及び装置 |
KR0140663B1 (ko) * | 1994-12-22 | 1998-08-17 | 이종수 | 인쇄회로기판의 솔더 도포형상 감지장치 |
JPH08233546A (ja) * | 1995-02-28 | 1996-09-13 | Mitsubishi Heavy Ind Ltd | ハンダ付け外観検査装置 |
KR19980028751U (ko) * | 1996-11-25 | 1998-08-05 | 구자홍 | 디스크 재생 장치의 디스크 클램핑 장치 |
KR19980028749U (ko) * | 1996-11-25 | 1998-08-05 | 문정환 | 자동차 시계장치 |
KR19980072951A (ko) * | 1997-03-10 | 1998-11-05 | 김광호 | 인쇄회로기판의 크림 솔더 도포상태 오류 검사장치 및 방법 |
KR100275496B1 (ko) * | 1998-07-01 | 2000-12-15 | 정선종 | 이종접합 쌍극자 트랜지스터 제조 방법 |
JP3685667B2 (ja) * | 1999-10-27 | 2005-08-24 | 株式会社日立製作所 | 立体形状検出方法及び装置、並びに検査方法及び装置 |
JP2002267415A (ja) * | 2001-03-08 | 2002-09-18 | Nec Corp | 半導体測定装置 |
JP3878023B2 (ja) * | 2002-02-01 | 2007-02-07 | シーケーディ株式会社 | 三次元計測装置 |
JP2005030774A (ja) * | 2003-07-07 | 2005-02-03 | Art Denshi Kk | クリーム半田バンプの形状測定方法および形状測定装置 |
JP3878165B2 (ja) * | 2003-11-05 | 2007-02-07 | シーケーディ株式会社 | 三次元計測装置 |
KR100689850B1 (ko) * | 2006-02-13 | 2007-03-08 | 삼성전자주식회사 | 기판검사장치 |
KR20070093679A (ko) * | 2006-03-15 | 2007-09-19 | 삼성전자주식회사 | 솔더 검사 장치 및 이를 이용한 검사 방법 |
JP2007248410A (ja) * | 2006-03-20 | 2007-09-27 | Toshiba Corp | バンプ検査装置及びバンプ検査方法 |
JP4877100B2 (ja) * | 2007-06-29 | 2012-02-15 | トヨタ自動車株式会社 | 実装基板の検査装置および検査方法 |
KR100944535B1 (ko) * | 2007-12-26 | 2010-03-05 | 주식회사 에이디피엔지니어링 | 웨이퍼 범핑 공정에서 전자빔을 이용하여 솔더 범프 형성및 전이 상태를 검사하는 장치 및 방법 |
KR101005591B1 (ko) * | 2008-10-28 | 2011-01-05 | (주)워프비전 | 통합 광학검사장치 |
KR101241175B1 (ko) * | 2010-02-01 | 2013-03-13 | 주식회사 고영테크놀러지 | 실장기판 검사장치 및 검사방법 |
KR20130008187A (ko) * | 2011-07-12 | 2013-01-22 | (주)정인시스템 | 솔더링을 위한 플럭스 검사 장치 및 그 검사 방법 |
-
2011
- 2011-02-11 JP JP2011027999A patent/JP5945386B2/ja not_active Expired - Fee Related
-
2012
- 2012-02-09 KR KR1020137022885A patent/KR101877592B1/ko active IP Right Grant
- 2012-02-09 WO PCT/JP2012/052912 patent/WO2012108483A1/ja active Application Filing
- 2012-02-09 CN CN201280008482.4A patent/CN103384812B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100481362C (zh) * | 2004-01-23 | 2009-04-22 | 株式会社瑞萨科技 | 半导体集成电路器件的制造方法 |
CN1901794A (zh) * | 2005-07-22 | 2007-01-24 | 株式会社理光 | 焊点确定方法、焊料检查方法和焊料检查装置 |
CN101310172A (zh) * | 2005-11-15 | 2008-11-19 | 欧姆龙株式会社 | 焊料检查装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2012167967A (ja) | 2012-09-06 |
JP5945386B2 (ja) | 2016-07-05 |
WO2012108483A1 (ja) | 2012-08-16 |
KR101877592B1 (ko) | 2018-07-11 |
CN103384812A (zh) | 2013-11-06 |
KR20140012984A (ko) | 2014-02-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103384812B (zh) | 印刷焊料检查装置 | |
JP3878023B2 (ja) | 三次元計測装置 | |
CN111750806B (zh) | 一种多视角三维测量***及方法 | |
JP3878033B2 (ja) | 三次元計測装置 | |
JP5562407B2 (ja) | 基板検査装置及び検査方法 | |
KR101207198B1 (ko) | 기판 검사장치 | |
US20190226837A1 (en) | Three-dimensional shape measurement apparatus | |
CN104937367A (zh) | 用于电路板的三维成像的多照相机传感器 | |
TWI608229B (zh) | 選擇性檢測組件側壁的裝置和方法 | |
US20180128603A1 (en) | Three-dimensional shape measurement apparatus | |
JP2005140584A (ja) | 三次元計測装置 | |
JP4808072B2 (ja) | フィルタ格子縞板、三次元計測装置及び照明手段 | |
KR20130141345A (ko) | 땜납 높이 검출 방법 및 땜납 높이 검출 장치 | |
CN110248056A (zh) | 图像检查装置 | |
JP2002048523A (ja) | 三次元計測装置 | |
KR20120014765A (ko) | 결함 검사장치 및 이를 이용한 결함 검사방법 | |
JP5890953B2 (ja) | 検査装置 | |
JP6152395B2 (ja) | 光学検出システム | |
CN208536839U (zh) | 图像采集设备 | |
JP2018040761A (ja) | 被検査物の外観検査装置 | |
JP2009002796A (ja) | 検査装置 | |
WO2019117802A1 (en) | A system for obtaining 3d images of objects and a process thereof | |
JP3774395B2 (ja) | 凹凸パターン検知装置、凹凸パターン検知処理装置 | |
JP7124569B2 (ja) | 検査装置 | |
WO2021095596A1 (ja) | 三次元計測装置及び三次元計測方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
CB02 | Change of applicant information |
Address after: Tokyo, Japan Applicant after: First, the United States and Canada Feldman Address before: Saitama Prefecture, Japan Applicant before: DJTECH Co.,Ltd. |
|
COR | Change of bibliographic data | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20150921 Address after: Aichi Prefecture, Japan Applicant after: DJTECH CO.,LTD. Address before: Tokyo, Japan Applicant before: First, the United States and Canada Feldman |
|
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170721 Termination date: 20220209 |
|
CF01 | Termination of patent right due to non-payment of annual fee |