CN103335549B - Phase separation micro-channel condenser - Google Patents
Phase separation micro-channel condenser Download PDFInfo
- Publication number
- CN103335549B CN103335549B CN201310290608.8A CN201310290608A CN103335549B CN 103335549 B CN103335549 B CN 103335549B CN 201310290608 A CN201310290608 A CN 201310290608A CN 103335549 B CN103335549 B CN 103335549B
- Authority
- CN
- China
- Prior art keywords
- micro
- rib
- channel condenser
- separated
- flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Micromachines (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a phase separation micro-channel condenser and belongs to the field of the heat transfer enhancement technology. A plurality of parallel micro-channels are etched on a silicon substrate and are separated by rib sheets. A plurality of rib strips are etched in the downstream area of each micro-channel. The rib strips of each micro-channel form, in an enclosing mode, a rib strip net with an opening toward the downstream. A cover plate packages on the micro-channels. The phase separation micro-channel condenser overcomes the defect that a traditional micro-channel condenser can not modulate a two phase flow pattern. Different from other reinforcing condensing heat conduction devices, due to the fact that an air phase and a liquid phase flow in branch paths after flow pattern modulation, the phase separation micro-channel condenser can greatly reduce the thickness of a liquid film, improve condensing heat exchange performance, reduce flow resistance and flow instability, and be applied to an electronic element heat-sink cooling system.
Description
Technical field
The invention belongs to enhanced heat exchange technical field, particularly one is separated micro-channel condenser.The enhanced heat exchange device for cooling electronic component cooling system specifically.
Background technology
In recent years, electronic industry fast development, the integrated level of electronic circuit significantly improves, and caloric value constantly increases, and people are in the urgent need to the cooling electronic component cooling system of development towards high heat flux.
In condensation process in microchannel, mainly there is annular flow, slug flow and bubble flow equal flow type in vehicle repair major.Present ring-type flow pattern at microchannel inlet vehicle repair major, condensing heat-exchange performance is good; Along with the carrying out of condensation, flow pattern progressively changes slug flow into by annular flow, and then changes bubble flow into, and due to the appearance with liquid bridge that thickens of liquid film, condensing heat-exchange performance runs down.Draw, between condensation flow pattern and heat transfer, there is inevitable inner link by analyzing above.The measure of strengthening condensing heat-exchange is exactly: retain condensation process initial segment high heat-transfer performance flow pattern-ring-type flow pattern; Regulation and control downstream low heat transfer flow pattern-slug flow and bubble flow, realizes the collaborative of flow pattern and heat transfer, finally reaches the object strengthening condensing heat-exchange.Usual conventional microchannel condenser cannot regulate and control two phase flow signals, in order to improve the thermal efficiency of this system, reduces its volume simultaneously, is badly in need of micro-channel evaporator and condenser that exploitation has high heat-exchanging performance.A kind of micro-channel condenser that is efficiently separated of controllable two phase flow signals is this invention exploits in order to overcome this shortcoming.
Summary of the invention
The object of the invention is to propose one to be efficiently separated micro-channel condenser, it is characterized in that, described in the micro-channel condenser that is separated be a kind of micro-channel condenser that vehicle repair major flow pattern is regulated and controled, there is enhanced heat exchange and reduce the function of flow resistance; The described micro-channel condenser that is separated is on silicon chip 1, etch many parallel microchannels 1.1, is separated between microchannel by fin 2; In the downstream area 5 of microchannel, etch a large amount of ribs 3, and surround opening towards the rib mesh of 100 μm of downstream wide; Encapsulated by cover plate 4 above microchannel.
The width of described every bar microchannel is 200 μm, and the degree of depth is 100 μm.
Described every bar rib diameter is 10 μm, and rib heights is 100 μm, and spaced between rib is 10 μm.
Described silicon chip is bottom heat radiation face, microchannel, and integrates with water cooling equipment.
Microchannel streamwise be divide into two regions by described rib mesh, and the region that front end does not arrange rib mesh is light pipe region, and for ring-type flow pattern, the region that rear end arranges rib mesh is flow pattern regulation and control regions, for regulating and controlling slug flow.
The described micro-channel condenser that is separated comprises the step that vehicle repair major flow pattern regulates and controls:
1) first steam enters the light pipe region of front end, and form ring-type flow pattern, along with the carrying out of condensation, ring-type flow pattern gradates as vapour slug flow; Due to capillary effect, vapour bullet cannot through the mesh of rib mesh, and therefore rib mesh has the effect of logical liquid resistance vapour, thus has flow pattern adjusting function;
2) vapour bullet cannot pass rib mesh through flow pattern regulation and control region, be forced into the vapour phase path between rib mesh and fin, and liquid can pass rib mesh, enter the liquid phase path that rib mesh is surrounded, vehicle repair major bifurcated flow; One side significantly reducer film thickness, improves condensing heat-exchange performance; Reduce the unstability of flow resistance and flowing on the other hand.
The invention has the beneficial effects as follows that can overcome conventional microchannel condenser cannot regulate and control this shortcoming of two phase flow signals.Different from other enforcing condensation heat transfer, the present invention is after flow pattern regulation and control, and liquid and vapor capacity bifurcated flow, on the one hand can significantly reducer film thickness, improves condensing heat-exchange performance; The unstability of flow resistance and flowing can be reduced on the other hand, for cooling electronic component cooling system.
Accompanying drawing explanation
Fig. 1 is the external structure schematic diagram of the micro-channel condenser that is separated of the present invention;
Fig. 2 is the internal structure schematic diagram of Fig. 1;
Fig. 3 is the A-A sectional view of Fig. 1;
Fig. 4 is the B-B sectional view of Fig. 3;
Fig. 5 is the slug flow figure in common microchannel;
Fig. 6 is the flow pattern be separated in microchannel after rib mesh regulation and control.
Detailed description of the invention
The present invention proposes one and to be efficiently separated micro-channel condenser.The described micro-channel condenser that is separated is a kind of micro-channel condenser regulated and controled vehicle repair major flow pattern, has the function of enhanced heat exchange and reduction flow resistance; Be further described below in conjunction with drawings and Examples.
Embodiment
Fig. 1, Figure 2 shows that the structural representation of the micro-channel condenser that is separated of the present invention.The micro-channel condenser that is separated shown in figure is on silicon chip 1, etch many parallel microchannels 1.1, is separated between microchannel by fin 2; In the downstream area 5 of microchannel, etch a large amount of ribs 3, and surround the rib mesh of opening towards downstream; Encapsulated by cover plate 4 above microchannel; Be separated micro-channel condenser external structure as shown in Figure 1, internal structure is as shown in Figure 2, Figure 3 and Figure 4.First this micro-channel condenser that is separated processes many parallel microchannels 1.1 by etch process on semiconductor silicon substrate 1, and silicon chip 1 is bottom heat radiation face, microchannel.The width of every bar microchannel is 200 μm, and the degree of depth is 100 μm; Then etch a large amount of ribs 3 at the downstream area 5 of microchannel, every bar rib diameter is 10 μm, and rib heights is 100 μm, and spaced between rib is 10 μm, and surrounds opening towards the rib mesh of 100 μm of downstream wide; Finally adopt high-voltage electrostatic field bonding techniques to be encapsulated in above microchannel 1.1 by cover plate 4, namely complete the making of the micro-channel condenser that is originally separated.
Fig. 5 shows the slug flow in common microchannel.This slug flow after rib mesh regulation and control, liquid and vapor capacity bifurcated flow, the vapour phase flow channels of gas between rib mesh and fin, liquid phase flow channels that liquid surrounds in rib mesh (Fig. 6 is shown as shown).Vehicle repair major bifurcated flow, on the one hand can significantly reducer film thickness, improves condensing heat-exchange performance; The unstability of flow resistance and flowing can be reduced on the other hand.The micro-channel condenser that is separated need integrate use by bottom heat radiation face and other water cooling equipment.
Claims (4)
1. be separated a micro-channel condenser, described in the micro-channel condenser that is separated be a kind of micro-channel condenser that vehicle repair major flow pattern is regulated and controled, there is enhanced heat exchange and reduce the function of flow resistance; It is characterized in that, described in the micro-channel condenser that is separated be on silicon chip (1), etch many parallel microchannels (1.1), separated by fin (2) between microchannel; In the downstream area (5) of microchannel, etch a large amount of ribs (3), and surround opening towards the rib mesh of 100 μm of downstream wide; Encapsulated by cover plate (4) above microchannel; Described silicon chip is bottom heat radiation face, microchannel, and integrates with water cooling equipment; Microchannel streamwise be divide into two regions by described rib mesh, and the region that front end does not arrange rib mesh is light pipe region, and for ring-type flow pattern, the region that rear end arranges rib mesh is flow pattern regulation and control regions, for regulating and controlling slug flow.
2. one according to claim 1 is separated micro-channel condenser, and it is characterized in that, the width of described every bar microchannel is 200 μm, and the degree of depth is 100 μm.
3. one according to claim 1 is separated micro-channel condenser, and it is characterized in that, described every bar rib diameter is 10 μm, and rib heights is 100 μm, and spaced between rib is 10 μm.
4. the method that regulates and controls vehicle repair major flow pattern of a kind of micro-channel condenser that is separated according to claim 1, is characterized in that, described in the micro-channel condenser that is separated the step that vehicle repair major flow pattern regulates and controls is comprised:
1) first steam enters the light pipe region of front end, and form ring-type flow pattern, along with the carrying out of condensation, ring-type flow pattern gradates as vapour slug flow; Due to capillary effect, vapour bullet cannot through the mesh of rib mesh, and therefore rib mesh has the effect of logical liquid resistance vapour, thus has flow pattern adjusting function;
2) vapour bullet cannot pass rib mesh through flow pattern regulation and control region, be forced into the vapour phase path between rib mesh and fin, and liquid can pass rib mesh, enter the liquid phase path that rib mesh is surrounded, vehicle repair major bifurcated flow; One side significantly reducer film thickness, improves condensing heat-exchange performance; Reduce the unstability of flow resistance and flowing on the other hand.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310290608.8A CN103335549B (en) | 2013-07-11 | 2013-07-11 | Phase separation micro-channel condenser |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310290608.8A CN103335549B (en) | 2013-07-11 | 2013-07-11 | Phase separation micro-channel condenser |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103335549A CN103335549A (en) | 2013-10-02 |
CN103335549B true CN103335549B (en) | 2015-06-10 |
Family
ID=49243759
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310290608.8A Active CN103335549B (en) | 2013-07-11 | 2013-07-11 | Phase separation micro-channel condenser |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103335549B (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104028050B (en) * | 2014-06-06 | 2016-02-24 | 华北电力大学 | Self-action minute yardstick gas-liquid phase separator |
CN104154787A (en) * | 2014-08-29 | 2014-11-19 | 电子科技大学 | Multi-stage evaporation micro-channel heat pipe heat transferring and radiating device |
CN105865089B (en) * | 2016-04-19 | 2018-05-25 | 华北电力大学 | A kind of pin rib wall surface micro-channel heat exchanger |
US11252847B2 (en) | 2017-06-30 | 2022-02-15 | General Electric Company | Heat dissipation system and an associated method thereof |
CN107702566A (en) * | 2017-09-14 | 2018-02-16 | 华北电力大学 | A kind of dot matrix heat exchanger |
CN109671688B (en) * | 2017-10-16 | 2020-08-28 | 中车株洲电力机车研究所有限公司 | Refrigerant phase change cold plate |
CN107894179A (en) * | 2017-11-13 | 2018-04-10 | 中国科学院空间应用工程与技术中心 | Free hot and cold side gravity micro heat pipe and its method of work |
CN108461460B (en) * | 2017-12-15 | 2020-02-21 | 天津津航计算技术研究所 | Two-phase separation microchannel heat sink |
CN109758786B (en) * | 2018-12-29 | 2020-12-01 | 四川大学 | Micro-channel device for forming stable annular flow |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7540475B2 (en) * | 2005-09-16 | 2009-06-02 | Battelle Memorial Institute | Mixing in wicking structures and the use of enhanced mixing within wicks in microchannel devices |
CN102062502B (en) * | 2009-11-12 | 2014-03-12 | 乐金电子(天津)电器有限公司 | Flat-pipe heat exchanger structure and assembling table thereof |
CN101782346B (en) * | 2010-01-14 | 2011-12-07 | 华南理工大学 | Heat exchange plate with alternate intercommunicating microchannel net structure and manufacturing method thereof |
CN102109291B (en) * | 2011-01-06 | 2013-11-13 | 北京化工大学 | Metal and conductive plastic composite micro heat exchanger |
CN102278904B (en) * | 2011-07-29 | 2013-03-06 | 华北电力大学 | Internal liquid-dividing hood-type condensed heat-exchanging pipe |
-
2013
- 2013-07-11 CN CN201310290608.8A patent/CN103335549B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN103335549A (en) | 2013-10-02 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103335549B (en) | Phase separation micro-channel condenser | |
CN106033749B (en) | Parallel parallel microchannels multicore sheet heat radiator | |
CN109671688B (en) | Refrigerant phase change cold plate | |
CN101311662B (en) | Flat type evaporator radiation system | |
CN100582637C (en) | Micro heat pipe with wedge capillaries | |
CN103307917B (en) | A kind of microchannel heat sink | |
US20140160677A1 (en) | Electronic device cooling with microjet impingement and method of assembly | |
CN107241887B (en) | A kind of micro-channel evaporator with staggeredly sawtooth pattern rib wall | |
WO2021253813A1 (en) | Thermal superconducting heat dissipation plate, heat dissipation device and 5g base station device | |
CN104979307B (en) | Microchannel heat sink cools down multichip system device | |
CN209045535U (en) | Micropin rib cluster array microchannel micro heat exchanger | |
CN104834366A (en) | CPU (central processing unit) integrated heating pipe radiator structure | |
CN105161473A (en) | Micro silicon-based capillary pump loop cooler | |
CN101995183A (en) | Flat heat pipe | |
CN104576573A (en) | Micro-channel heat exchanger for drop-shaped pin fins | |
CN107062963B (en) | A kind of alternating expression micro-channel condenser for hair cell regeneration | |
CN106102306B (en) | A kind of circuit board and heat dissipating method, communication equipment of communication equipment | |
CN100580362C (en) | Modified duct heater heat dispersion system | |
CN203983257U (en) | Complicated microchannel micro heat exchanger misplaces | |
CN101576360A (en) | Low-level energy recycling efficient combined type heat exchange device based on heat pipes and finned tubes | |
CN103345563B (en) | A kind of microchannel minimum thermal resistance structural optimization method based on entrance developing characteristics | |
CN103453792A (en) | Bottom enhanced heat transfer structure of gravity assisted heat pipe | |
CN106802099A (en) | A kind of heat exchanger | |
CN109003954A (en) | Radiator | |
CN204695201U (en) | Cpu integrated heat pipe radiator structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |