CN209045535U - Micropin rib cluster array microchannel micro heat exchanger - Google Patents
Micropin rib cluster array microchannel micro heat exchanger Download PDFInfo
- Publication number
- CN209045535U CN209045535U CN201821350485.7U CN201821350485U CN209045535U CN 209045535 U CN209045535 U CN 209045535U CN 201821350485 U CN201821350485 U CN 201821350485U CN 209045535 U CN209045535 U CN 209045535U
- Authority
- CN
- China
- Prior art keywords
- micropin rib
- micropin
- cluster array
- rib cluster
- heat exchanger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Micropin rib cluster array microchannel micro heat exchanger, belongs in microelectric technique enhanced heat exchange field.Present apparatus structure includes stacking gradually the case chip 1 being packaged together), substrate (2)；The fluid inlet (3) and fluid outlet (4) connecting with exterior line are provided on case chip (1)；Substrate front side processes micropin rib cluster array microchannel (5), entrance liquid storage tank and outlet liquid storage tank.Micropin rib cluster unit in-line arrangement in micropin rib cluster array, X-direction spacing L and Y-direction spacing LbAnd micropin rib cluster unit structure size X-direction LaWith Y-direction H, can be realized according to actual needs by optimization design through MEMS processing technology.The utility model compares more general microchannel micro heat exchanger, the heat dissipation of more great-power electronic chip can be met, have onset of boiling wall surface temperature lower, flow boiling pressure drop is lower, the advantages that temperature distribution evenness is higher on chip makes high fever stream electronic device realize more efficient heat management.
Description
Technical field
The utility model belongs to enhanced heat exchange technical field, is related to a kind of micropin rib cluster array microchannel micro heat exchanger.
Background technique
As the microelectronic device that functional form and compact are integrated continues to develop, concentrating solar photovoltaic plate, swashs at radar
Advanced micro- energy such as light weapon magnetic artillery and microelectronics system high modularization and micromation, number of electronic components in limited bulk
It sharply increases, packaging density is continuously improved, and heat flow density constantly increases, and leads to the excessively high problem of microelectronic device local temperature increasingly
It is prominent.According to incompletely statistics, it is to be caused by temperature more than electronic component specified value that electronic operating failure rate, which has 55%,.Device work
Reliability is very sensitive to temperature change, and electronic component temperature every increase 10oC, reliability in limiting temperature level can decline
Half, service life also will be greatly reduced.The high heat that electronic component generates removes not in time, to device reliability and can make
Great threat is caused with the service life.Thus it is necessary to study dissipate with exploitation efficient radiating apparatus to meet high heat flux density electronic component
Heat demand.
Micro-cooler studied both at home and abroad at present has: micro-channel heat sink, micro- refrigerator, the equal backing of micro heat pipe and integrated declining
Cooler etc..Microchannel heat dissipation technology is as a kind of high coefficient of heat transfer device level heat dissipating method, processing technology comparative maturity, and can
It is directly integrated on microelectronic element, thus can be widely applied to various high power density small electronic equipment arrays coolings, from
Thermal control and heat management angle effectively solve the problems such as high-power electronic device cooling difference and difficult temperature control, improve microelectronic device and use
Life and reliability.Research on Thermal Performance of Micro Channels is broadly divided into single-phase convection heat-transfer and evaporation heat transfer both direction at present.With it is single-phase
Convective heat transfer is compared, and microchannel boiling heat transfer is high with heat transfer coefficient, refrigerant flow rate is low, working medium dosage is small, heat sink temperature distribution
The advantages that uniform.But in design aspect, there are following limitations currently used for the micro-channel heat exchanger of boiling heat transfer: first, small scale
Larger pressure drop caused by flow boiling；Second, micro-processing technology causes channel wall smooth, roughness is even in nanometer
Grade, less suitable dimension coring cave lead to that onset of boiling is higher, critical heat flux density is low；Third, being easier to generate boiling
Unstability.
The reduction onset of boiling mentioned in document at present, intensified heat transfer method, most of researchs are concentrated on to microchannel
Bottom surface and rib wall improve, bottom surface such as etch depression, covering nano wire carbon nanotube, hydrophilic coating, rib wall such as etches recessed
Cave, flaring microchannel, sine curve microchannel, interruption microchannel.Above method can also inhibit boiling unstable to a certain extent
It is fixed.Unstable aspect of boiling is controlled, most of research selections are in microchannel entrance installation throttling set in document, to improve disengaging
It is that cost inhibits flow boiling unstable that mouth pressure drop, which consumes more pump works,.
The utility model uses micropin rib cluster array micro-channel heat exchanger, by unit micropin rib clustering architecture arrangement and ruler
Very little optimization design, and micropin rib cluster array structural dimension optimization is designed, it can be under the conditions of meeting reduces flow resistance, simultaneously
Reduce onset of boiling, high critical heat flux density, augmentation of heat transfer, unstable thorough elimination of boiling.It is applied to high-power chip
The device of heat dissipation has the performances such as superior thermal matching, High Efficiency Thermal remove, temperature is uniform.
Utility model content
It is changed in view of this, the first technical problems to be solved of the utility model are to provide a kind of micropin rib cluster array microchannel
Hot device, can realize simultaneously reduces flow resistance, reduces onset of boiling, augmentation of heat transfer, eliminates unstable, the solution microelectronics that boils
Device surface High Efficiency Thermal removes, chip temperature distributing homogeneity and micro-channel evaporator and chip it is thermally matched the problems such as, be
The efficient stable operation of chip provides reliable heat management.
The utility model devises a kind of micropin rib cluster array microchannel micro heat exchanger of fluid boiling heat transfer, feature
It is, as shown in Figure 1, including by stacking gradually the case chip being packaged together (1), substrate (2)；Be provided on case chip (1) with
The fluid inlet (3) and fluid outlet (4) of exterior line connection；Substrate front side processes micropin rib cluster array microchannel (5), entrance
It is micro- logical that liquid storage tank (6) and outlet liquid storage tank (7), entrance liquid storage tank (6) and outlet liquid storage tank (7) are located at micropin rib cluster array
The two sides in road (5), fluid inlet (3) and entrance liquid storage tank (6) are opposite up and down, and fluid outlet (4) and outlet liquid storage tank (7) are up and down
Relatively；
As shown in Fig. 2, being bonded together case chip (1) and substrate (2) to form closed micropin rib cluster array microchannel
Heat exchanger (8).Fluid flow circuit is formed in micro heat exchanger.In micro heat exchanger, working medium is followed by fluid inlet
(3), entrance liquid storage tank (6), micropin rib cluster array microchannel (5), outlet liquid storage tank (7), fluid outlet (4).Heat-exchange working medium stream
After entrance liquid storage tank (6), enter micropin rib cluster array microchannel (5) for evenly dispersed, by boiling heat transfer from microchannel bottom
Heat is taken away on face and micropin rib surface, is then pooled in outlet liquid storage tank (7).
The utility model proposes the machining area of micropin rib cluster array microchannel (5) can be according to cooled electronic device ruler
Very little determination.For the structure of definitely substrate (2), Fig. 1 (b), Fig. 1 (c), Fig. 1 (d), substrate is set forth in Fig. 1 (e)
(2) top view, main view, A-A sectional view and B-B sectional view.
The micropin rib cluster array microchannel (5) using multiple (being not less than 3) micropin rib cluster unit (10) in-lines or
Stagger arrangement forms；Each micropin rib cluster unit (10) is arranged by multiple (at least three) independent micropin rib column, arranges shape
Shape is selected from circle, diamond shape, triangle, rectangle, water-drop-shaped, aerofoil profile, ellipse, cone；Micropin rib cluster unit (10) interior micropin
The density that rib column arranges is that uniform or internal relatively close, external opposite hinge is dilute, close outer dilute in abbreviation；It is close outer dilute in it is preferred that,
The distance between internal closeer two neighboring micropin rib column is lc, external diluter the distance between two neighboring micropin rib column
For ls, lc is less than ls, and ls is consistent with the direction of lc；Inside compared between the micropin rib column of compact part point arrangement mode and it is external compared with
Arrangement mode between the micropin rib column of dilute part is identical or different, and such as internal is that positive direction arranges, and outside is rounded projections arranged.
Two neighboring micropin rib column spacing l is 3 μm -50 μm.Single micropin rib column axial cross section shape is selected from circle, diamond shape, triangle,
Rectangle, water-drop-shaped, aerofoil profile, ellipse, cone, hydraulic diameter d are 3 μm -50 μm.
Remember in the direction that is most recently connected in micropin rib cluster array microchannel (5) along entrance liquid storage tank (6) and outlet liquid storage tank (7)
For the orientation of a row, the distance between two neighboring micropin rib cluster unit (10) L is equal in a row, any two rows
Between distance Lb be also equal；Size of the micropin rib cluster unit (10) along row direction is La, and the size in vertical row direction is H, L,
H, the area ratio relationship of La, Lb, the internal area compared with compact part point and the diluter part of external den, can be adjusted as needed
Section.
Substrate front side middle position is equipped with groove, micropin rib cluster array microchannel (5), entrance liquid storage tank (6) and outlet storage
Liquid pool (7) is respectively positioned in groove.Cross-sectional shape of the groove in vertical row direction is cross-section rectangle, cross-section is trapezoidal, becomes and cuts
Face rectangle, variable cross-section.
The utility model adopts the following technical solution:
The utility model is based on following three kinds of mechanism: micro- rib column increases heat exchange area and convection current body forms the convection current disturbed and changes
Theory of heat, adjacent micro- rib column gap can provide the nucleate theory in a large amount of additional suitable dimension coring caves, flow between micropin rib cluster unit
Body interconnects and micropin rib cluster unit internal capillary forces transport liquid needed for providing coring and avoid the fluid force being locally evaporated
Theory couples two phase flow theory.Micropin rib cluster array microchannel (5) is used in heat exchanger major part.Such as Fig. 4 (a) and Fig. 4
(b) shown in, micropin rib cluster array microchannel (5) is formed by N number of identical micropin rib cluster in-line or stagger arrangement, adjacent micropin rib cluster unit
Outer most edge point flow direction size LaWith perpendicular to flow direction size LbSpacing distance is impartial respectively.LaAnd LbSize, micropin rib
Cluster unit planform, structure size flow direction size L and perpendicular to flow direction size H, micro- rib in micropin rib cluster unit
Column density arrangement (minimum spacing lcWith maximum spacing lsSize) and micro- rib column cross-sectional shape and hydraulic diameter d,
It can be according to the actual demands optimization design such as practical heat radiation power and device size.Micropin rib cluster increases heat exchange area and to fluid
Disturbance is formed, heat exchange efficiency is improved, the additional coring cave that micro- rib column gap provides greatly reduces onset of boiling, avoids
The growth of vapour phase explosivity caused by wall surface temperature is excessively high is led to that boiling is unstable, and the presence of micropin rib cluster unit spacing may make micro-
The entirety to interconnect is formed in channel, greatly improves vehicle repair major boiling uniformity in microchannel, to improve micro- logical
Temperature distribution evenness in road, micropin rib cluster unit internal clearance enhances capillary force and transports to liquid, to effectively prevent
Local evaporated phenomenon simultaneously improves critical heat flux density.To sum up, the micropin rib cluster array under three big mechanism coupling effect triggerings is micro- logical
Road micro heat exchanger is the very effective method of high heat flux density chip High Efficiency Thermal management.
Deionized water, acetone, methanol, refrigerant (such as FC-72) dielectric fluid can be selected in heat-exchange working medium.According to institute's recruitment
The optimum working temperature range of matter and electronic device, the evaporation heat transfer that micropin rib cluster array microchannel is formed on heat exchange surface come
Realize cooling technology requirement.
Tungsten copper and oxygen-free copper, silicon etc. can be selected in micro heat exchanger material.Global geometric shape, size can be according to electronic devices
Size and overall package require to determine.It is primarily adapted for use in the cooling of the heating surfaces such as bar shaped, rectangular.
Utility model has the advantages that
1, micropin rib cluster array microchannel increases effectively heat exchange area and enhances flow disturbance, effectively improves and changes
The thermal efficiency；
2, the additional coring cave that micro- rib column gap can be used as avoids high hot-fluid close to greatly reduce onset of boiling
It spends the excessively high coring steam bubble of lower wall surface temperature and explosive growth occurs, so that it is unstable to be inherently eliminated flow boiling；
3, compared to the micro-channel heat exchanger at general rib wall interval, the presence of micropin rib cluster unit spacing may make microchannel
Interior to form the entirety to interconnect, under identical heat exchange amount, pressure drop is significantly reduced, and vehicle repair major boiling uniformity is significant in microchannel
It improves, to improve temperature distribution evenness in microchannel；
4, compared to the micro-channel heat exchanger at general rib wall interval, micropin rib cluster unit internal clearance enhances capillary force to liquid
Body transports, to effectively prevent local evaporated phenomenon and improve critical heat flux density.
Detailed description of the invention
Fig. 1 (a): the top view of the utility model case chip；
Fig. 1 (b): the substrate top view with micro- class cluster array microchannel of the utility model；
Fig. 1 (c): the substrate main view with micropin rib cluster array microchannel of the utility model.
Fig. 1 (d): the substrate A-A sectional view with micropin rib cluster array microchannel of the utility model.
Fig. 1 (e): the substrate B-B sectional view with micropin rib cluster array microchannel of the utility model.
Fig. 2: the utility model outside schematic diagram with structure shown in Fig. 1.
Fig. 3: the utility model has the whole of the cooling high-power chip micro heat exchanger of micropin rib cluster array microchannel fluid
Body structural schematic diagram；
Fig. 4 (a): the micropin rib cluster array schematic diagram of the utility model embodiment 1；
Fig. 4 (b): the micropin rib cluster unit structural schematic diagram of the utility model embodiment 1.
Fig. 5 (a): 2 micropin rib cluster array schematic diagram of the utility model embodiment；
Fig. 5 (b): 2 micropin rib cluster unit structural schematic diagram of the utility model embodiment.
In figure: 1, case chip, 2, substrate, 3, fluid inlet, 4, fluid outlet, 5, micropin rib cluster array microchannel, 6, enter
Mouth liquid storage tank, 7, outlet liquid storage tank, 8, micro heat exchanger, 9, simulation heat source, 10, micropin rib cluster unit.
Specific embodiment
There is provided herein a kind of micropin rib cluster array microchannel micro heat exchangers for evaporation and heat-exchange, below with reference to attached
Figure and specific embodiment the preferred embodiment of the utility model is further described: it should be appreciated that preferred embodiment only for
Illustrate the utility model, rather than in order to limit the protection scope of the utility model.
Embodiment 1
Micropin rib cluster array microchannel micro heat exchanger is made of case chip 1 and microchannel substrate 2.Case chip uses 7740
Heat resistant glass, substrate use silicon, and working medium uses acetone.Since the cost of high-power chip is very expensive, the present embodiment is used
Simulation heat source replaces chip to be tested for the property experimental study.It simulates heat source and uses the snakelike heating film of Pt platinum.By design
Optimization, the heating film can equably heat production, simulate the heat production of high-power chip.The input voltage of platinum heating film can be according to chip
Quantity of heat production determine.
As shown in figure 3, plating the uniform snakelike Pt platinum with a thickness of 100 nanometers at the silicon substrate back side by coating technique
Film, the heat production of heat production analog chip after energization, with the cooling heating film 9 of micropin rib cluster array micro-channel heat exchanger.Pass through MEMS skill
Art etches deep 80 microns of microchannel on the silicon substrate with a thickness of 400 microns, then imports and exports with diameter 1mm circular flow
Glass bonding, formed micro heat exchanger.Contain micropin rib cluster array microchannel structure area size and heating film region in silicon substrate
Domain sizes are consistent.The outer dimension of entire micro heat exchanger is 24 × 8.4 × 0.8mm3.Micropin rib cluster array partial structurtes are as schemed
(inside is square arrangement i.e. in-line, external for rounded projections arranged, that is, stagger arrangement) shown in 4 (b), microchannel is by equidistantly arranging
Micro- cylinder cluster unit staggered arrangement forms (see Fig. 4 (a)), defines flow direction and is respectively that X (is arranged perpendicular to flow direction
Direction) and Y-direction.X-direction spacing L and Y-direction spacing LbIt is 250 μm, micropin rib cluster unit X-direction size LaAnd Y-direction
Size H is 250 μm.Micropin rib cluster unit is that 10 μm of micro- cylinders form the close outer side lengths such as thin in 6 layers by 125 diameter d
Diamond shaped profile is parallel to the adjacent micro- circle in diamond shaped profile side at dense arrangement by outside 4 layers of dense arrangement, the 2 layers of sparse arrangement in center
Intercolumniation lcIt is 4.1 μm, the adjacent micro- cylinder spacing l of diamond shaped profile is parallel at sparse arrangementsIt is 18.3 μm.Cooling working medium is through flowing
Body entrance 3 enters in entrance liquid storage tank 6, evenly dispersed to enter micro- cylinder diamond array microchannel 5, is led to by boiling heat transfer from micro-
After road bottom surface and micro- periphery take away heat, it is pooled in outlet liquid storage tank 7, is finally flowed out from fluid outlet 4.Realize height
The uniformity of heat flow density electronic device radiates, and guarantees that the temperature of electronic device is able to maintain that within the scope of optimum working temperature,
Extend electronic device service life.
Embodiment 2
Micropin rib cluster array microchannel micro heat exchanger is made of case chip 1 and microchannel substrate 2.Case chip uses 7740
Heat resistant glass, substrate use silicon, and working medium uses acetone.Since the cost of high-power chip is very expensive, the present embodiment is used
Simulation heat source replaces chip to be tested for the property experimental study.It simulates heat source and uses the snakelike heating film of Pt platinum.By design
Optimization, the heating film can equably heat production, simulate the heat production of high-power chip.The input voltage of platinum heating film can be according to chip
Quantity of heat production determine.
As shown in figure 3, plating the uniform snakelike Pt platinum with a thickness of 100 nanometers at the silicon substrate back side by coating technique
Film, the heat production of heat production analog chip after energization, with the cooling heating film 9 of micropin rib cluster array micro-channel heat exchanger.Pass through MEMS skill
Art etches deep 80 μm of microchannel on the silicon substrate with a thickness of 400 μm, then with the glass with diameter 1mm circular flow inlet and outlet
Glass bonding, forms micro heat exchanger.Contain micropin rib cluster array microchannel structure area size and heating film region ruler in silicon substrate
It is very little consistent.The outer dimension of entire micro heat exchanger is 24 × 8.4 × 0.8mm3.Micropin rib cluster array partial structurtes such as Fig. 5 (a)
With shown in 5 (b), microchannel is made of the micro- cylinder cluster unit staggered arrangement equidistantly arranged, between X-direction (direction arranged)
Away from L and Y-direction spacing LbIt is 170 μm, micropin rib cluster unit X-direction size LaIt is 170 μm with Y-direction size H.Micropin rib
Cluster unit is that 10 μm of micro- cylinders form close outer thin equilateral rhomboid profile in 4 layers by 53 diameter d, and outside 2 layers by center
2 layers of sparse arrangement of dense arrangement are parallel to the adjacent micro- cylinder spacing l in diamond shaped profile side at dense arrangementcIt is 4.1 μm, sparse row
The adjacent micro- cylinder spacing l of diamond shaped profile is parallel at columnsIt is 18.3 μm.Cooling working medium enters entrance liquid storage tank 6 through fluid inlet 3
In, it is evenly dispersed to enter micro- cylinder diamond array microchannel 5, it is taken away by boiling heat transfer from microchannel bottom surface and micro- periphery
After heat, it is pooled in outlet liquid storage tank 7, is finally flowed out from fluid outlet 4.Realize the uniform of high heat flux density electronic device
Property heat dissipation, guarantee that the temperature of electronic device is able to maintain that within the scope of optimum working temperature, extend electronic device service life.
The present embodiment is only that the structure of micropin rib cluster array microchannel is different from the difference of embodiment 1.Firstly, embodiment
Micropin rib cluster unit arrangement mode is in-line in 1, and arrangement mode is stagger arrangement, micropin rib cluster unit X-direction spacing in embodiment 1
L and Y-direction spacing LbRespectively less than corresponding size in embodiment 1；Secondly, micro- cylinder number in micropin rib cluster unit in embodiment 2
Less than number in embodiment 1, to be less than the number of plies in embodiment 1, micropin rib cluster unit X-direction size by the outside number of plies in center
LaCorresponding size in embodiment 1 is respectively less than with Y-direction size H.
Claims (9)
1. micropin rib cluster array microchannel micro heat exchanger, which is characterized in that including by stacking gradually the encapsulation being packaged together
Piece (1), substrate (2)；The fluid inlet (3) and fluid outlet (4) connecting with exterior line are provided on case chip (1)；Substrate is just
Face processes micropin rib cluster array microchannel (5), entrance liquid storage tank (6) and outlet liquid storage tank (7), entrance liquid storage tank (6) and outlet
Liquid storage tank (7) is located at the two sides of micropin rib cluster array microchannel (5), fluid inlet (3) and entrance liquid storage tank (6) phase up and down
Right, fluid outlet (4) and outlet liquid storage tank (7) are opposite up and down；
The micropin rib cluster array microchannel (5) is formed using multiple micropin rib cluster unit (10) in-lines or stagger arrangement；Each
Micropin rib cluster unit (10) is arranged by multiple independent micropin rib columns.
2. micropin rib cluster array microchannel described in accordance with the claim 1 micro heat exchanger, which is characterized in that the micropin rib
Cluster array microchannel (5) is formed using not less than 3 micropin rib cluster unit (10) in-lines or stagger arrangement；Each micropin rib cluster unit
(10) it is arranged by least three independent micropin rib columns, spread geometry is selected from circle, diamond shape, triangle, rectangle, water droplet
Shape, aerofoil profile, ellipse or cone.
3. micropin rib cluster array microchannel described in accordance with the claim 1 micro heat exchanger, which is characterized in that micropin rib cluster unit
(10) density that interior micropin rib column arranges is that uniform or internal relatively close, external opposite hinge is dilute, close outer dilute in abbreviation.
4. micropin rib cluster array microchannel described in accordance with the claim 3 micro heat exchanger, which is characterized in that it is interior close outer dilute, it is interior
The distance between closeer two neighboring micropin rib column in portion is lc, and external diluter the distance between two neighboring micropin rib column is
Ls, lc are less than ls, and ls is consistent with the direction of lc；Inside compared between the micropin rib column of compact part point arrangement mode and outside it is diluter
Arrangement mode between partial micropin rib column is identical or different.
5. micropin rib cluster array microchannel described in accordance with the claim 3 micro heat exchanger, which is characterized in that two neighboring micropin
Rib column spacing l is 3 μm -50 μm.
6. micropin rib cluster array microchannel described in accordance with the claim 1 micro heat exchanger, which is characterized in that single micropin rib column
Axial cross section shape is selected from circle, diamond shape, triangle, rectangle, water-drop-shaped, aerofoil profile, ellipse or cone, and hydraulic diameter d is 3
μm-50μm。
7. micropin rib cluster array microchannel described in accordance with the claim 1 micro heat exchanger, which is characterized in that micropin rib cluster array
In microchannel (5) along entrance liquid storage tank (6) and outlet liquid storage tank (7) the orientation for being most recently connected direction and being denoted as a row,
The distance between two neighboring micropin rib cluster unit (10) L is equal in one row, and the distance between any two rows Lb is also equal；
Size of the micropin rib cluster unit (10) along row direction is La, and the size in vertical row direction is H, and L, H, La, Lb, inside are compared with compact part point
Area and the diluter part of external den area ratio relationship, can be adjusted as needed.
8. micropin rib cluster array microchannel described in accordance with the claim 1 micro heat exchanger, which is characterized in that among substrate front side
Position is equipped with groove, and micropin rib cluster array microchannel (5), entrance liquid storage tank (6) and outlet liquid storage tank (7) are respectively positioned in groove；
Cross-sectional shape of the groove in vertical row direction is trapezoidal cross-section rectangle, cross-section, variable cross-section rectangle or variable cross-section.
9. micropin rib cluster array microchannel according to claim 1 micro heat exchanger, it is characterised in that the substrate and
Case chip material are as follows: tungsten copper, oxygen-free copper, silicon；Micropin rib cluster array microchannel (5) is highly greater than substrate thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821350485.7U CN209045535U (en) | 2018-08-21 | 2018-08-21 | Micropin rib cluster array microchannel micro heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821350485.7U CN209045535U (en) | 2018-08-21 | 2018-08-21 | Micropin rib cluster array microchannel micro heat exchanger |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209045535U true CN209045535U (en) | 2019-06-28 |
Family
ID=67031250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821350485.7U Active CN209045535U (en) | 2018-08-21 | 2018-08-21 | Micropin rib cluster array microchannel micro heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209045535U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378303A (en) * | 2018-08-21 | 2019-02-22 | 华北电力大学（保定） | Micropin rib cluster array microchannel micro heat exchanger |
| CN110631386A (en) * | 2019-09-09 | 2019-12-31 | 贵州永红航空机械有限责任公司 | Micro-channel plate-fin heat exchanger and forming and assembling method |
| CN113873842A (en) * | 2021-09-28 | 2021-12-31 | 北京大学 | Heat dissipation device and heat dissipation regulation and control method |
| CN114783967A (en) * | 2022-03-31 | 2022-07-22 | 江苏大学 | Silicon substrate cavity groove for chip liquid cooling heat dissipation |
-
2018
- 2018-08-21 CN CN201821350485.7U patent/CN209045535U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378303A (en) * | 2018-08-21 | 2019-02-22 | 华北电力大学（保定） | Micropin rib cluster array microchannel micro heat exchanger |
| CN109378303B (en) * | 2018-08-21 | 2024-03-22 | 华北电力大学（保定） | Micro-needle rib cluster array micro-channel micro-heat exchanger |
| CN110631386A (en) * | 2019-09-09 | 2019-12-31 | 贵州永红航空机械有限责任公司 | Micro-channel plate-fin heat exchanger and forming and assembling method |
| CN113873842A (en) * | 2021-09-28 | 2021-12-31 | 北京大学 | Heat dissipation device and heat dissipation regulation and control method |
| CN113873842B (en) * | 2021-09-28 | 2022-06-07 | 北京大学 | Heat dissipation device and heat dissipation regulation and control method |
| CN114783967A (en) * | 2022-03-31 | 2022-07-22 | 江苏大学 | Silicon substrate cavity groove for chip liquid cooling heat dissipation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109378303A (en) | Micropin rib cluster array microchannel micro heat exchanger | |
| CN209045535U (en) | Micropin rib cluster array microchannel micro heat exchanger | |
| Gilmore et al. | Microchannel cooling of concentrator photovoltaics: A review | |
| Karami et al. | Heat transfer enhancement in a PV cell using Boehmite nanofluid | |
| CN1639532A (en) | Capillary evaporator | |
| CN103167780A (en) | Combined type radiator for power module and combined type radiator assembly | |
| CN106332529B (en) | A kind of corrugated tube type microcirculation radiator and microcirculation heat-exchange system | |
| CN104167399A (en) | Staggered complex micro-channel miniature heat exchanger | |
| CN110610911A (en) | Novel three-dimensional uniform distribution manifold type microchannel | |
| CN101854027A (en) | Liquid refrigerator for semiconductor laser | |
| CN1968596A (en) | Array jetting micro heat exchanger | |
| CN111415915A (en) | Heat radiation structure of micro-channel radiator | |
| CN113251837A (en) | Pulsating heat pipe temperature equalizing plate | |
| WO2021253813A1 (en) | Thermal superconducting heat dissipation plate, heat dissipation device and 5g base station device | |
| CN203633055U (en) | Heat sink heat radiation device with novel heat exchange structure and self-adaptive characteristic | |
| CN106255396B (en) | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system | |
| CN216818326U (en) | High-power chip efficient heat dissipation cooling device | |
| CN206251533U (en) | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system | |
| CN209822624U (en) | Microchannel-nano porous composite structure evaporator | |
| Deng et al. | Thermal study of the natural air cooling using roll bond flat heat pipe as plate fin under multi-heat source condition | |
| CN206389664U (en) | A kind of corrugated tube type microcirculation radiator and microcirculation heat-exchange system | |
| CN203983257U (en) | Complicated microchannel micro heat exchanger misplaces | |
| CN111750713B (en) | Vapor-liquid phase separation type loop heat pipe heat dissipation device with inserted porous membrane and working method thereof | |
| CN101635432B (en) | Liquid refrigerating chip for semiconductor laser and preparation method thereof | |
| CN112736046A (en) | Integrated chip heat dissipation device and heat dissipation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |