CN104979307B - Microchannel heat sink cools down multichip system device - Google Patents
Microchannel heat sink cools down multichip system device Download PDFInfo
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- CN104979307B CN104979307B CN201510409552.2A CN201510409552A CN104979307B CN 104979307 B CN104979307 B CN 104979307B CN 201510409552 A CN201510409552 A CN 201510409552A CN 104979307 B CN104979307 B CN 104979307B
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Abstract
Microchannel heat sink cools down multichip system device, and the invention belongs to microelectronics cooling technology field.The present apparatus includes the case chip (1) and substrate (2) being packaged together successively；Be provided with the groove (3) for being put into radiator on case chip (1), and with channel attached fluid intake (4) and fluid issuing (5)；The front of substrate (2) is machined with split channel groove (6) and confluence passage groove (7), and reverse side is provided with the fluid main entrance (8) being connected with exterior line and fluid general export (9).The present apparatus is integrated multiple microchannel heat sinks, while multi-chip is radiated.
Description
Technical field
The invention belongs to microelectronics technology, is related to a kind of device for cooling down multichip system.
Background technology
With developing rapidly for the technologies such as MEMS and super large-scale integration, electronic equipment towards volume more
It is small, integrated level is higher, with better function, the more sensitive direction of reaction is developed.The heat flow density of electronic chip increased dramatically, and heat is negative
Lotus increasingly strengthens, if these heats can not be taken away rapidly, electronic device will due to high temperature cisco unity malfunction, or even burn
Ruin.The own warp of traditional heat-dissipating mode can not meet the cooling requirements of high load capacity electronic device.For this reason, it may be necessary to some new radiating knots
Structure or material solve the heat dissipation problem in the electronic equipment of high heat flux.
The micro-cooler actively set about research both at home and abroad at present and applied includes：Micro-heat exchanger, chilly jelly
The equal backing of machine, micro-channel heat sink, micro heat pipe and integrated micro-cooler etc..Wherein micro-channel heat sink is because of its processing and fabricating technology ratio
It is more ripe, the more concern of people is obtained, and have proved to be one of most potential radiating mode.Micro-channel heat sink
Have the advantages that simple in construction, small volume, radiating efficiency are high.
Under the application background of MEMS, heat dissipation element (chip) is not individualism, but with multi-chip collection
Form into system is present.At present, in terms of the research for micro-system is concentrated mainly on micro- radiator of one single chip, and for
The Research of Integrated System of multiple chips is less.In the presence of having multiple chips, to ensure that what integrated chip system can be well dissipates
Heat, the microchannel heat sink system with excellent heat dispersion performance is integrated, while multi-chip is radiated.
The content of the invention
It is an object of the invention to provide a kind of device of microchannel heat sink cooling multichip system, when there is multiple chips
In the presence of, can microchannel heat sink system effectively, equably radiate, and will be determined by the uniformity of its fluid distribution.The present apparatus
Provide a kind of optimal runner layout type, make fluid flow to radiator corresponding to each chip flow-rate ratio it is more uniform,
Reliable temperature environment is provided for the operation of chip.
The present invention devises a kind of device of microchannel heat sink cooling multichip system, as shown in Figure 1.In order to brighter
The really structure of explanation system, Fig. 2, Fig. 3, Fig. 4, Fig. 5, Fig. 6 sets forth the front view of system, top view, A-A profiles,
B-B profiles, C-C profiles.
The present invention adopts the following technical scheme that：
The present invention devises a kind of device of microchannel heat sink cooling multichip system, it is characterised in that：Including encapsulation
Piece (1) and substrate (2), the multiple grooves (3) for being put into radiator, the bottom of each groove (3) are provided with the front of case chip (1)
Have fluid intake (4) and fluid issuing (5)；Fluid intake (4) and fluid issuing (5) are through holes, fluid intake (4)
The another side for leading directly to case chip (1) respectively with fluid issuing (5) is the back side；The front of substrate (2) is machined with split channel groove (6)
With confluence passage groove (7)；Split channel groove (6) be connected by a total split channel and with total split channel it is multiple
Split channel branch is formed；What confluence passage groove (7) was equally connected by a total confluence passage and with total confluence passage
Multiple confluence passage branches are formed；Substrate (2) another side is that the back side is provided with fluid main entrance (8) and fluid general export (9), fluid
Main entrance (8) is connected with total split channel, and fluid general export (9) is connected with total confluence passage.
The back side of case chip (1) is relative with the front of substrate (2), each fluid intake (4) respectively with split channel groove (6)
A split channel branches end be connected, each fluid issuing (5) confluence passage branch with confluence passage groove (7) respectively
End is connected；Case chip (1) and substrate (2) are welded together to form complete system, micro- logical in groove (3) with being embedded in
Road radiator forms the fluid flow circuit system of closing.
Channel cross-sectional shape is rectangle in split channel groove (6) and confluence passage groove (7).
Fluid stream is through route：Fluid enters split channel groove (6) from the fluid main entrance (8) on substrate (2), and is dividing
Shunted in circulation road groove (6), the radiator entered respectively by the fluid intake (4) on case chip (1) in groove (3),
Fluid flows through the confluence passage groove (7) flowed into after radiator by the fluid issuing (5) on case chip (1) on substrate (2), finally
From fluid general export (9) outflow on substrate (2).
A kind of device for microchannel heat sink cooling multichip system that the present invention designs, meeting each chip cooling effect
Under the conditions of fruit is preferable, it is also necessary to make the radiating effect of each chip suitable, the Temperature Distribution of chip is similar, if each chip
Temperature Distribution difference is larger, then can influence the normal work of chip.Therefore, fluid flows into the assignment of traffic situation of each radiator
The radiating effect of chip is affected, assignment of traffic is more uniform, and radiating effect is better.
In the device for the system that the present invention designs, split channel branch and T junction of the split channel groove (6) by H type structures
Total split channel of structure is combined, i.e.,Type, after fluid enters split channel groove (6) from main entrance (8), first flow through
T-shaped passage, and the two identical branch roads in T-shaped left and right are flowed to, two fluids again flows through the branch of H type passages respectively afterwards, i.e.,
Each divide equally again and flow to two branch roads, it is identical and symmetrical to shunt all flow direction structures successively by shunting twice every time for fluid
Two branch roads.
The size dimension of groove (3) on case chip (1) determines that microchannel is radiated according to the size of microchannel heat sink
Device optimization design, overall geometry size can require according to situations such as the size and heating power of actual chips according to chip size
To determine.
Fluid working substance can be respectively from empty gas and water, refrigerant etc.；Copper, aluminium alloy etc. can be selected in the material of system and device.
The present invention has following advantages and effect：
1st, under the conditions of multiple chips (thermal source) are existing, multiple microchannel heat sinks are integrated, can be simultaneously right
Multi-chip is radiated；
2nd, fluid flow into each radiator distribution ratio of liquid flow it is more uniform, radiating effect is suitable, the Temperature Distribution phase of chip
Seemingly.
Brief description of the drawings
Fig. 1：The schematic diagram of the device of the microchannel heat sink cooling multichip system of the embodiment of the present invention 1；
In figure：1st, case chip, 2, substrate, 3, groove, 4, fluid intake, 5, fluid issuing, 6, split channel groove, 7, interflow
Channel slot, 8, fluid main entrance, 9, fluid general export.
The structural representation of the device of the microchannel heat sink cooling multichip system of Fig. 2-6 embodiment of the present invention 1；
Fig. 2：The front view of the device of the embodiment of the present invention 1；
Fig. 3：The top view of Fig. 2 devices；
Fig. 4：The A-A profiles of Fig. 2 devices；
Fig. 5：The B-B profiles of Fig. 2 devices；
Fig. 6：The C-C profiles of Fig. 2 devices.
Specific implementation method
Below in conjunction with the accompanying drawings and microchannel heat sink cools down application of the device of multichip system in heat dissipation of electronic chip
The invention will be further described：But the present invention is not limited to following examples.
With the rapid development of information technology and electronic technology, the power of electronic chip increased dramatically, effective radiating into
For chip development it is most important the problem of.
Including case chip 1 and substrate 2, the multiple grooves 3 for being put into radiator, each groove 3 are provided with the front of case chip 1
Bottom have fluid intake 4 and fluid issuing 5；Fluid intake 4 and fluid issuing 5 are through hole, fluid intake 4 and stream
The another side that body outlet 5 leads directly to case chip 1 respectively is the back side；The front of substrate 2 is machined with split channel groove 6 and confluence passage groove
7；Split channel groove 6 is by a total split channel and the multiple split channel branches structure being connected with total split channel
Into；Confluence passage groove 7 is equally by a total confluence passage and the multiple confluence passage branches being connected with total confluence passage
Form；The another side of substrate 2 is that the back side is provided with fluid main entrance 8 and fluid general export 9, fluid main entrance 8 and total split channel
It is connected, fluid general export 9 is connected with total confluence passage.
The back side of case chip 1 is relative with the front of substrate 2, each fluid intake 4 one point with split channel groove 6 respectively
Circulation road branches end is connected, and each fluid issuing 5 is connected with the confluence passage branches end of confluence passage groove 7 respectively；
Case chip 1 and substrate 2 are welded together to form complete system, are formed and closed with the microchannel heat sink being embedded in groove 3
Fluid flow circuit system.
Embodiment 1
Under the conditions of existing for multiple chips, a kind of device of microchannel heat sink cooling multichip system is designed.This dress
Put and case chip 1 and substrate 2 are linked together by welding procedure, concrete structure is shown in Fig. 1-6.Device material uses aluminium alloy,
Working medium is deionized water, and radiator is triangle depression microchannel heat sink.Because the cost of high-power chip is very expensive, this reality
Apply in scheme replaces chip to carry out performance test using film thermal source.Film thermal source uses platinum heating film, is set by optimization
Meter, platinum heating film can uniform heat production, its input voltage according to the quantity of heat production of chip determine.Platinum heating film passes through plated film skill
Art forms thick 100 nanometers uniform snakelike film, the groove 3 being then embedded into radiator on case chip 1 at the radiator back side
It is interior.
Split channel groove 6 is made up of the split channel branch of H type structures and total split channel of T-type structure, fluid from
After main entrance 8 enters split channel groove 6, two identical branch roads of T-shaped passage, flow direction or so are first flowed through, afterwards two fluids
H type passages are again flowed through respectively, and are each divided equally and flowed to two branch roads.Fluid successively by shunting twice, all flow by shunting every time
Two branch roads identical and symmetrical to structure.Finally, the flow of four branch roads is relatively uniform.
Deionized water enters split channel groove 6 from the fluid main entrance 8 on substrate 2, and is shunted in channel slot 6,
The radiator entered respectively by the fluid intake 4 on case chip 1 in groove 3, deionized water pass through encapsulation after flowing through radiator
The confluence passage groove 7 that fluid issuing 5 on piece 1 is flowed on substrate 2, finally flows out from the fluid general export 9 on substrate 2.Go from
Sub- water is uniformly divided into four branch roads in channel slot 6, flows to each radiator, heat is absorbed from radiator bottom surface, to heating
Film is radiated, because de-ionized water flow rate distribution ratio is more uniform, so the radiating effect of each heating film is suitable, so as to ensure
The uniformity of electronic device temperature, extend the life-span of electronic device.
Claims (3)
- A kind of 1. device of microchannel heat sink cooling multichip system, it is characterised in that：Including case chip (1) and substrate (2), The multiple grooves (3) for being put into radiator are provided with the front of case chip (1), the bottom of each groove (3) has fluid and entered Mouth (4) and fluid issuing (5)；Fluid intake (4) and fluid issuing (5) are through hole, fluid intake (4) and fluid issuing (5) The another side for leading directly to case chip (1) respectively is the back side；The front of substrate (2) is machined with split channel groove (6) and confluence passage groove (7)；Split channel groove (6) is by a total split channel and the multiple split channel branches being connected with total split channel Form；Confluence passage groove (7) is equally by a total confluence passage and the multiple confluence passages being connected with total confluence passage Branch is formed；Substrate (2) another side is that the back side is provided with fluid main entrance (8) and fluid general export (9), fluid main entrance (8) and Total split channel is connected, and fluid general export (9) is connected with total confluence passage；The back side of case chip (1) is relative with the front of substrate (2), each fluid intake (4) respectively with split channel groove (6) one Individual split channel branches end is connected, each fluid issuing (5) confluence passage branches end with confluence passage groove (7) respectively It is connected；Case chip (1) and substrate (2) are welded together to form complete system, and the microchannel with being embedded in groove (3) dissipates Hot device forms the fluid flow circuit system of closing；Split channel groove (6) is combined by the split channel branch of H type structures and total split channel of T-type structure, i.e.,Type, after fluid enters split channel groove (6) from main entrance (8), T-shaped passage is first flowed through, and flow to two phases in T-shaped left and right With branch road, afterwards two fluids again flow through the branch of H type passages respectively, i.e., again each respectively flow to two branch roads, fluid Successively by shunting twice, all two identical and symmetrical branch roads of flow direction structure are shunted every time；Confluence passage groove (7) generally three bread enclose type, and split channel groove (6) is surrounded in it.
- 2. cool down the device of multichip system according to a kind of microchannel heat sink of claim 1, it is characterised in that：Split channel Channel cross-sectional shape is rectangle in groove (6) and confluence passage groove (7).
- 3. cool down the device of multichip system according to a kind of microchannel heat sink of claim 1, it is characterised in that：Fluid flows through Route is：Fluid enters split channel groove (6) from the fluid main entrance (8) on substrate (2), and enters in split channel groove (6) Row shunting, the radiator entered respectively by the fluid intake (4) on case chip (1) in groove (3), after fluid flows through radiator The confluence passage groove (7) flowed into by the fluid issuing (5) on case chip (1) on substrate (2), finally from the stream on substrate (2) Body general export (9) flows out.
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| CN105540529B (en) * | 2015-12-04 | 2017-11-10 | 通富微电子股份有限公司 | Adaptive Temperature Controlling Chip micro-system |
| CN108666283B (en) * | 2018-05-03 | 2020-05-15 | 中国电子科技集团公司第二十九研究所 | Micro-channel radiator structure and preparation method thereof |
| CN110137146A (en) * | 2019-04-30 | 2019-08-16 | 东南大学 | A kind of fractal runner liquid cooling apparatus |
| CN110711546A (en) * | 2019-11-15 | 2020-01-21 | 南通好唯智能制造科技有限公司 | Flow dividing system for microchannel reactor, flow divider and manufacturing method of flow divider |
| CN111542203B (en) * | 2020-04-29 | 2023-02-03 | 南京工业大学 | T-shaped pipeline chip radiator based on impingement cooling and complete device |
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| CN103151319A (en) * | 2012-10-14 | 2013-06-12 | 中国计量学院 | Fractal fin radiator |
| CN203242614U (en) * | 2013-05-15 | 2013-10-16 | 中国电子科技集团公司第三十八研究所 | Microfluidic-channel heat dissipation device used for an electronic component and electronic device |
| CN103824826B (en) * | 2014-02-21 | 2017-01-04 | 电子科技大学 | A kind of fluid channel heat dissipating method |
| CN104201158A (en) * | 2014-08-28 | 2014-12-10 | 中国电子科技集团公司第二十九研究所 | Integrated cooling device of silicon-based micro-channel radiator |
| CN205081111U (en) * | 2015-07-13 | 2016-03-09 | 北京工业大学 | Many chip systems of microchannel radiator cooling device |
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