CN103320823A - Super-brightness local electroplating liquid for LED (light emitting diode) lead framework and electroplating process thereof - Google Patents
Super-brightness local electroplating liquid for LED (light emitting diode) lead framework and electroplating process thereof Download PDFInfo
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- CN103320823A CN103320823A CN201310242021XA CN201310242021A CN103320823A CN 103320823 A CN103320823 A CN 103320823A CN 201310242021X A CN201310242021X A CN 201310242021XA CN 201310242021 A CN201310242021 A CN 201310242021A CN 103320823 A CN103320823 A CN 103320823A
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- silver
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- led lead
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Abstract
The invention discloses super-brightness local electroplating liquid for an LED (light emitting diode) lead framework and an electroplating process thereof. The electroplating liquid comprises the following components: 50 to 70g/l of silver ions, 10 to 20g/l of editpotassium cyanide, 10 to 12ml/l of a brightening agent 1, 10 to 12ml/l of a brightening agent 2, 1ml/l of a wetting agent and 55 to 65ml/l of a supplement. The local electroplating liquid which is prepared from the existing reagents is matched with the bright silver electroplating process, so that a super-brightness silver layer can be electroplated, the GAM of a silver plated layer in a function area can reach 1.5 to 2.0, and the GAM of the traditional bright silver plated layer is generally less than 1.2.
Description
[technical field]
The present invention relates to a kind of LED lead frame super brightness parcel plating liquid, also relate to a kind of electroplating technology of this electroplate liquid, belong to the electroplating technology field.
[background technology]
Silver is a kind of precious metal, the content in the earth's crust seldom, fine silver is a kind of argenteous metal of beauty, its jewellery and vessel have good reflectivity, can reach very high luminance brightness after the polishing, have many uses in jewellery and home decoration general.And plate one deck silver in some metallic surfaces, and also can reach the decorative effect of fine silver, the appearance light is careful, and is wear-resisting, anticorrosive, anti-tarnishing ability is strong, has widely to use.The non-Bright Silver Plating Process that in the past adopted exists outward appearance relatively poor, and slushing oil is lower, and particularly anti-sulphur anti-tarnishing ability is poor, for bright dipping, usually adopts chemical rightenning or copper brush scratch brushing to soak silver again, has so both wasted electricity and time, again contaminate environment.In order to address the above problem, two kinds of methods of domestic general employing, the one, adopt antimonypotassium tartrate to be combined with organic additive (majority is sulfocompound) and obtain bright silver plating layer, this method is because of the impact of antimony and sulphur, makes that coating is easy to change, fragility is large, weldability is undesirable.Another kind is to adopt cyanide bright silver plating, this method adopts a kind of organic brightening agent of not sulfur-bearing and an amount of antimonypotassium tartrate to be used in conjunction with, obtain complete bright silver layer, solved the problem that coating is easy to change, fragility is large, weldability is undesirable, reduced simultaneously raw-material consumption.But this method is because the organic coordination compound that needs is more, so that the factor that impact is electroplated increases, has increased again operation.
The plating silver layer brightness of emitting led light source is general only between GAM1.0～1.2 mostly at present, the relative luminous source, coating brightness is on the low side, directly affect the reflectance of light source, the light source of same power comes comparison, existing led light source consumes more electric energy, does not reach again the ideal effect of luminous transmission signal, and the above SMD/TODLED of brightness 1.5-2.0GAM can address this problem with the advantage of its high brightness, reflectance, low light attenuation, low thermal resistance.
[summary of the invention]
The technical problem to be solved in the present invention is to overcome the deficiencies in the prior art, and a kind of LED lead frame super brightness parcel plating liquid that can guarantee to electroplate out the super brightness silver layer is provided.
The present invention also provides a kind of electroplating technology of this super brightness parcel plating liquid.
The present invention is for solving the problems of the technologies described above, by the following technical solutions:
A kind of LED lead frame super brightness parcel plating liquid is characterized in that comprising following component:
Brightening agent 1 wherein is for containing the agent of selenium metal polish, and brightening agent 2 is the organism brightening agent.
Brightening agent 1 among the present invention is 1:1 with the volume ratio of brightening agent 2.Brightening agent 1 all is lower than 10ml/l with ratio mismatch or the content of brightening agent 2, does not just reach the good light effect that goes out, and both are higher than 1 at ratio, and silvering impurity is higher, and not only brightness does not reach requirement, and relevant high temperature test can not be passed through; Ratio is lower than 1, and the silvering outward appearance can occur bad, and brightness also is difficult to reach more than the GAM1.5.
Brightening agent 1 among the present invention is Arguna4500Brightener1, and brightening agent 2 is Arguna4500Brightener2, and wetting agent is Arguna Wetting Agent32, and supplement are Arguna4500Replenisher Solution, are commercially available.
The preferred pH value of electroplate liquid of the present invention is 8.0～10.0.
Brightening agent 1 content about 11ml/l, mainly be control coating go out light effect, content is crossed and lowly can be caused the silver layer luminance brightness not reach not more than the GAM1.5, the too high silver layer purity that then can cause is on the low side, the high temperature test blackout of turning white; Brightening agent 2 content are about 11ml/l, it mainly is to stablize light effect, the auxiliary luminance brightness that increases silver layer, content is crossed to hang down and can be caused the silver layer luminance brightness not high enough, and it is unstable that plating bath goes out light effect, and the too high silver layer surface that then can cause is dirty, knob occurs, even silver layer pit, the defectives such as surface irregularity can appear; Humectant content is 1ml/l, mainly is the surface tension that reduces plating bath, keeps solution stability.
A kind of electroplating technology of above-mentioned LED lead frame super brightness parcel plating liquid is characterized in that may further comprise the steps:
A, be 45～55g/l at the pre-silvered film silver content of LED lead frame, KCN content be the plating bath of 20～30g/l with 5～15 amperes/square decimeter current density at 50 ℃ of lower galvanic deposit 10～15s, full plated deposition a layer thickness is the thin silver of 0.5～1um, then cleans with pure water to dry up;
B, will plate thin silver the LED lead frame under 50～60 ℃, with super bright parcel plating liquid galvanic deposit 4～10s part plating is carried out in the functional zone of LED lead frame with 50～100 amperes/square decimeter current densities, then clean with pure water and dry up;
C, the LED lead frame that will finish the local plating in functional zone carried out the silver protection and got final product.
The silver lustre thickness of coating that local plating forms among the step b in the electroplating technology of the present invention is 2～3 μ m.
Cross the silver protection for being to soak 30s in the silver protection solution of 2ml/l at liquid medicine AR-1 content in the electroplating technology of the present invention among the step c, this liquid medicine AR-1 is commercially available.
The selection of complete silver-plated procedure position is also very important among the present invention.One fixes on parcel plating implements the thin silver of plating before, because thin silvering lattice is careful, evenly, plating silver lustre effect is just more satisfactory in the above again, can not select the position of thin silver after local silver-plating, does not reach so the bright effect of silver layer ultraphotic.
The control of current density is also particularly important during parcel plating, traditional silver-plated current density generally can be lower than 50 amperes/square decimeter (ASD), the luminance brightness of silver layer does not reach more than 1.5 yet, but current density has more satisfactory bright silvering when the 80ASD left and right sides, so be subjected to the long-pending measurement of surfacing accurately necessary and accurate to plating piece, the selection of rectifier is preferably rectangle square-wave pulse rectifier.
The present invention compared with prior art has following advantage:
The parcel plating liquid that the present invention utilizes existing reagent to make cooperates silver lustre electroplating technology of the present invention can guarantee to electroplate out the silver layer of super brightness, make the silvering GAM of functional zone reach 1.5～2.0, and the GAM of traditional silver lustre coating is generally below 1.2.
The present invention reforms on the basis of original technique, developed a kind of strike plating silver process, namely under higher current density, in short several seconds, finish silver-plated, the thin and even light of silver layer, electroplating bath components is simple, do not need other a variety of organic batchings, process is once finished, and the time is short, production efficiency is high, conservation.
The time saving and energy saving province of the present invention raw material has been saved cost greatly, has improved again product quality.
[embodiment]
Describe the present invention below in conjunction with specific embodiment:
A kind of LED lead frame super brightness parcel plating liquid, it includes following component:
Silver ions 50～70g/l, potassium cyanide 10～20g/l contains selenium metal polish agent 10～12ml/l, organism brightening agent 10～12ml/l, wetting agent 1ml/l, supplement 55～65ml/l;
The pH value of above-mentioned parcel plating liquid is controlled at 8.0～10.0.
The electroplating technology of above-mentioned parcel plating liquid is:
Pre-silvered film silver content at the LED lead frame is 45～55g/l, KCN content be the plating bath of 20～30g/l with 5～15 amperes/square decimeter current density at 50 ℃ of lower galvanic deposit 10～15s, full plated deposition a layer thickness is the thin silver of 0.5～1um, then cleans with pure water to dry up; To plate again the LED lead frame of thin silver under 50～60 ℃, with super bright parcel plating liquid galvanic deposit 4～10s part plating is carried out in the functional zone of LED lead frame with 50～100 amperes/square decimeter current densities after, clean with pure water and to dry up; LED lead frame immersion 30s in containing the silver protection solution of 2ml/l liquid medicine AR-1 that will finish at last the local plating in functional zone carried out the silver protection and got final product.
Embodiment 1:
Parcel plating liquid: silver ions 60g/l, potassium cyanide 15g/l contains selenium metal polish agent 10ml/l, organism brightening agent 10ml/l, wetting agent 1ml/l, supplement 60ml/l;
Electroplating technology: the pre-silvered film silver content at the LED lead frame is 45g/l, KCN content be the plating bath of 20g/l with 5 amperes/square decimeter current density at 50 ℃ of lower galvanic deposit 15s, full plated deposition a layer thickness is the thin silver of 0.5um, then cleans with pure water to dry up; To plate again the LED lead frame of thin silver under 50 ℃, with super bright parcel plating liquid galvanic deposit 10s part plating is carried out in the functional zone of LED lead frame with 50 amperes/square decimeter current densities after, clean to dry up with pure water and carried out again the silver protection and get final product.
The silver lustre layer thickness that embodiment 1 plates is 2～3 μ m, and its GAM is 1.5.
Embodiment 2:
Parcel plating liquid: silver ions 60g/l, potassium cyanide 15g/l contains selenium metal polish agent 10ml/l, organism brightening agent 10ml/l, wetting agent 1ml/l, supplement 60ml/l;
Electroplating technology: the pre-silvered film silver content at the LED lead frame is 50g/l, KCN content be the plating bath of 25g/l with 10 amperes/square decimeter current density at 50 ℃ of lower galvanic deposit 10s, full plated deposition a layer thickness is the thin silver of 0.8um, then cleans with pure water to dry up; To plate again the LED lead frame of thin silver under 55 ℃, with super bright parcel plating liquid galvanic deposit 7s part plating is carried out in the functional zone of LED lead frame with 80 amperes/square decimeter current densities after, clean to dry up with pure water and carried out again the silver protection and get final product.
The silver lustre layer thickness that embodiment 2 plates is 2～3 μ m, and its GAM is 1.8.
Embodiment 3:
Parcel plating liquid: silver ions 60g/l, potassium cyanide 15g/l contains selenium metal polish agent 10ml/l, organism brightening agent 10ml/l, wetting agent 1ml/l, supplement 60ml/l;
Electroplating technology: the pre-silvered film silver content at the LED lead frame is 55g/l, KCN content be the plating bath of 30g/l with 15 amperes/square decimeter current density at 50 ℃ of lower galvanic deposit 15s, full plated deposition a layer thickness is the thin silver of 1um, then cleans with pure water to dry up; To plate again the LED lead frame of thin silver under 60 ℃, with super bright parcel plating liquid galvanic deposit 4s part plating is carried out in the functional zone of LED lead frame with 100 amperes/square decimeter current densities after, clean to dry up with pure water and carried out again the silver protection and get final product.
The silver lustre layer thickness that embodiment 3 plates is 2～3 μ m, and its GAM is 1.9.
Embodiment 4:
Parcel plating liquid: silver ions 50g/l, potassium cyanide 10g/l contains selenium metal polish agent 11ml/l, organism brightening agent 11ml/l, wetting agent 1ml/l, supplement 55ml/l;
Electroplating technology: the pre-silvered film silver content at the LED lead frame is 50g/l, KCN content be the plating bath of 25g/l with 10 amperes/square decimeter current density at 50 ℃ of lower galvanic deposit 13s, full plated deposition a layer thickness is the thin silver of 0.8um, then cleans with pure water to dry up; To plate again the LED lead frame of thin silver under 55 ℃, with super bright parcel plating liquid galvanic deposit 7s part plating is carried out in the functional zone of LED lead frame with 80 amperes/square decimeter current densities after, clean to dry up with pure water and carried out again the silver protection and get final product.
The silver lustre layer thickness that embodiment 4 plates is 2～3 μ m, and its GAM is 1.7.
Embodiment 5:
Parcel plating liquid: silver ions 70g/l, potassium cyanide 20g/l contains selenium metal polish agent 12ml/l, organism brightening agent 12ml/l, wetting agent 1ml/l, supplement 65ml/l;
Electroplating technology: the pre-silvered film silver content at the LED lead frame is 50g/l, KCN content be the plating bath of 25g/l with 10 amperes/square decimeter current density at 50 ℃ of lower galvanic deposit 13s, full plated deposition a layer thickness is the thin silver of 0.8um, then cleans with pure water to dry up; To plate again the LED lead frame of thin silver under 55 ℃, with super bright parcel plating liquid galvanic deposit 7s part plating is carried out in the functional zone of LED lead frame with 80 amperes/square decimeter current densities after, clean to dry up with pure water and carried out again the silver protection and get final product.
The silver lustre layer thickness that embodiment 5 plates is 2～3 μ m, and its GAM is 2.0.
Claims (7)
1. LED lead frame super brightness parcel plating liquid is characterized in that comprising following component:
Brightening agent 1 wherein is for containing the agent of selenium metal polish, and brightening agent 2 is the organism brightening agent.
2. a kind of LED lead frame super brightness parcel plating liquid according to claim 1 is characterized in that described brightening agent 1 and the volume ratio of described brightening agent 2 are 1:1.
3. a kind of LED lead frame super brightness parcel plating liquid according to claim 2, it is characterized in that described brightening agent 1 is Arguna4500Brightener1, described brightening agent 2 is Arguna4500Brightener2, described wetting agent is Arguna Wetting Agent32, and described supplement are Arguna4500Replenisher Solution.
4. a kind of LED lead frame super brightness parcel plating liquid according to claim 3, the pH value that it is characterized in that described electroplate liquid is 8.0～10.0.
5. the electroplating technology of each described LED lead frame super brightness parcel plating liquid in the claim 1 to 4 is characterized in that may further comprise the steps:
A, be 45～55g/l at the pre-silvered film silver content of LED lead frame, KCN content be the plating bath of 20～30g/l with 5～15 amperes/square decimeter current density at 50 ℃ of lower galvanic deposit 10～15s, full plated deposition a layer thickness is the thin silver of 0.5～1um, then cleans with pure water to dry up;
B, will plate thin silver the LED lead frame under 50～60 ℃, with super bright parcel plating liquid galvanic deposit 4～10s part plating is carried out in the functional zone of LED lead frame with 50～100 amperes/square decimeter current densities, then clean with pure water and dry up;
C, the LED lead frame that will finish the local plating in functional zone carried out the silver protection and got final product.
6. the electroplating technology of a kind of LED lead frame super brightness parcel plating liquid according to claim 5 is characterized in that the silver lustre thickness of coating that local plating forms among the described step b is 2～3 μ m.
7. the electroplating technology of a kind of LED lead frame super brightness parcel plating liquid according to claim 5 is characterized in that crossing the silver protection for being to soak 30s in the silver protection solution of 2ml/l at liquid medicine AR-1 content among the described step c.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310242021.XA CN103320823B (en) | 2013-06-18 | 2013-06-18 | A kind of LED lead frame super brightness local electric plating solution and electroplating technology thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310242021.XA CN103320823B (en) | 2013-06-18 | 2013-06-18 | A kind of LED lead frame super brightness local electric plating solution and electroplating technology thereof |
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| CN103320823A true CN103320823A (en) | 2013-09-25 |
| CN103320823B CN103320823B (en) | 2016-04-20 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3580821A (en) * | 1968-06-27 | 1971-05-25 | Schering Ag | Bright silver electroplating |
| CN1692182A (en) * | 2002-11-28 | 2005-11-02 | 新光电气工业株式会社 | Electrolytic silver plating solution |
| CN201265836Y (en) * | 2008-08-08 | 2009-07-01 | 湖北匡通电子有限公司 | LED lead frame with novel coating |
| CN102031546A (en) * | 2010-12-22 | 2011-04-27 | 宁波康强电子股份有限公司 | Electroplating method for lead frame |
| CN102817056A (en) * | 2012-08-15 | 2012-12-12 | 中山品高电子材料有限公司 | Electroplating process for lead wire frame palladium-nickel alloy plating layer |
-
2013
- 2013-06-18 CN CN201310242021.XA patent/CN103320823B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3580821A (en) * | 1968-06-27 | 1971-05-25 | Schering Ag | Bright silver electroplating |
| CN1692182A (en) * | 2002-11-28 | 2005-11-02 | 新光电气工业株式会社 | Electrolytic silver plating solution |
| CN201265836Y (en) * | 2008-08-08 | 2009-07-01 | 湖北匡通电子有限公司 | LED lead frame with novel coating |
| CN102031546A (en) * | 2010-12-22 | 2011-04-27 | 宁波康强电子股份有限公司 | Electroplating method for lead frame |
| CN102817056A (en) * | 2012-08-15 | 2012-12-12 | 中山品高电子材料有限公司 | Electroplating process for lead wire frame palladium-nickel alloy plating layer |
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