CN104611736A - Succinimide silver plating solution and electroplating method - Google Patents
Succinimide silver plating solution and electroplating method Download PDFInfo
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- CN104611736A CN104611736A CN201310543119.9A CN201310543119A CN104611736A CN 104611736 A CN104611736 A CN 104611736A CN 201310543119 A CN201310543119 A CN 201310543119A CN 104611736 A CN104611736 A CN 104611736A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
Abstract
The invention discloses a succinimide silver plating solution and an electroplating method. The succinimide silver plating solution comprises the following components: 10-20g/L silver nitrate and 130-150g/L succinimide by referring silver content, 30-40g/L methylsulfonate by referring methanesulfonic acid radical, 20-30g/L carbonate and 1-2g/L polyethyleneimine by referring carbonate radical. According to the invention, succinimide is taken as a coordination agent, methylsulfonate is selected as an additive for increasing compactness and smoothness of a plating layer, polyethyleneimine is taken as a brightener, so that the plating liquid has good stability, and the plating layer has discolouration resistance and strong weldability.
Description
Technical field
The present invention relates to the technical field of silver plating process, particularly relate to a kind of succimide plate silver plating solution and electro-plating method.
Background technology
Argent, with its excellent performance and relatively low cost, becomes one of precious metal be most widely used.In all metals, the electroconductibility of silver is best, and the ductility shelter of silver has the second of metal.In addition, silver also have good thermal conductivity, reflective, corrosion resisting property and welding property, therefore, be in great demand at the industrial circle such as electronics, communication.In addition, silver, because of its distinctive silvery white metalluster, is used on the artworks such as family high-grade apparatus, tableware and jewellery as ornament layer always.But silver is a kind of precious metal after all, practical application cost is higher, and the content in the earth's crust is only 1 × l0
-5%, thus considers to reduce costs at other metallic surface Electrodeposited Silver, and surface has the premium properties of silver simultaneously.
From the first patent of G.R.Elkington and the H.Elkington brother application cyaniding plant of silver of Britain in 1839 and since being invested in industrial production, cyaniding plant of silver technique because its bath stability is reliable, current efficiency is high, the careful and advantages such as light of good covering power and higher dispersive ability, the crystallization of gained coating, occupy an leading position in electrosilvering technique always.But prussiate is the chemical of severe toxicity, in production, stores, transport and in use procedure, can work the mischief to human body, and serious environment pollution.Therefore, people are exploring a kind of environmental protection silver plating process of alternative traditional cyaniding plant of silver technique always.Non-cyanide silver coating also becomes the study hotspot that recent two decades carrys out silver plating process, has wide market outlook and huge using value.
The comparatively common person of existing non-cyanide silver coating has that persulphate is silver-plated, sulphite is silver-plated, sulphosalicylic acid is silver-plated.Although to some extent solve containing the silver-plated pollution problem of cyanogen, but these non-cyanide silver coating ubiquity plating solutions are stable not, the poor and dissatisfactory technological deficiency of weldability of coating anti-discoloration.
Summary of the invention
In view of this, one aspect of the present invention provides a kind of succimide plate silver plating solution, and the good stability of this succimide plate silver plating solution is high, coating anti-discoloration and weldability strong.
A kind of succimide plate silver plating solution, comprise in silver content be 10 ~ 20g/L Silver Nitrate, in methylsulphonic acid root content be 30 ~ 40g/L metilsulfate, take carbonate content as the carbonate of 20 ~ 30g/L and content be the polymine of 1 ~ 2g/L.
Wherein, comprise in the silver content Silver Nitrate that is 15g/L, in the methylsulphonic acid root content metilsulfate that is 35g/L, the polymine that is 1.8g/L in the carbonate content carbonate that is 25g/L, content.
Wherein, the molecular weight of described polymine is 400 ~ 600.
In the technical scheme of above succimide plate silver plating solution, select succimide as coordination agent.The normal potential of argent is+0.799V, belongs to the metal that electropositivity is stronger.By Ag
+the exchange current density being reduced into elemental silver is comparatively large, and that is, the concentration polarization that Ag is deposited is less.Therefore, from Ag
+in the plating solution that form exists, the silvering crystallization that deposits is thick, and thus adding coordination agent can effective head it off.Succimide and silver ions coordination form more stable complexing ion and are present in plating solution.
Select metilsulfate as additive.Metilsulfate can be novalgin and/or methylsulphonic acid potassium.Novalgin and/or methylsulphonic acid potassium source are easy to get.The metilsulfate added can promote the sedimentation rate of silver, improves compactness and the smoothness of coating.In addition, to a certain extent, metilsulfate can suppress the hydrolysis of succimide to reduce the concentration for silver ions coordination free in plating solution on the one hand, and metilsulfate can promote the coordination reaction of succimide and silver ions on the other hand.The method mainly added with the form of methylsulphonic acid silver compared to the methylsulphonic acid of prior art is compared, and methylsulphonic acid of the present invention adds with the salt of solubility, such as, add with novalgin or methylsulphonic acid potassium.The difficult water-soluble salt of the former methylsulphonic acid silver, only have the part methylsulphonic acid of dissolving silver to ionize, the methylsulphonic acid silver concentration of Gong silver ion complexation free in plating solution is lower, makes this coordination reaction speed slower.And after the latter adds plating solution with the metilsulfate of solubility, be all dissolved in the water and ionization can occur discharge a large amount of methylsulphonic acid silver ionss, this coordination reaction speed is improved greatly.
Select carbonate as conducting salt and acid-base buffer agent, carbonate is preferably alkali-metal carbonate.Carbonate is strong electrolyte soluble in water, can strengthen the electroconductibility of plating solution; The alkaline environment of plating solution is maintained again by hydrolysis.Relative to other buffer reagent, such as Sodium Tetraborate, sodium-acetate, carbonate must have more significant price advantage.Carbonate consumption too much can cause carbonate to be separated out with crystal from plating solution.
Select polymine brightening agent the most.Polymine is water soluble oligomer compound, and the polymerization degree is generally no more than 100.Relative to the brightening agent of monomer amine, its stability is comparatively strong, and hydrolysis discharges ammonia hardly.Importantly can strengthen the luminance brightness of coating largely.Polymine of the present invention select molecular weight be 400 ~ 600 polymine, be preferably molecular weight be the polymine of 500.
The present invention provides a kind of plating simple electro-plating method on the other hand, and the method can strengthen hardness and the erosion resistance of coating, can improve dispersive ability and the covering power of electroplate liquid.
Use an above-mentioned succimide plate silver plating solution electric plating method, comprise the following steps:
(1) electroplate liquid is prepared: dissolve in silver 10 ~ 20g Silver Nitrate, in methylsulphonic acid root 30 ~ 40g metilsulfate, in carbonate 20 ~ 30g carbonate and 1 ~ 2g polymine in every premium on currency;
(2) using copper coin as negative electrode, anticathode carries out pre-treatment;
(3) using silver plate as anode, by anode with insert through pretreated negative electrode and pass into electric current in described electroplate liquid and electroplate.
Wherein, described pre-treatment be specially by after negative electrode acid dipping with deionized water rinsing, then insert in nickel plating solution and carry out nickel plating, the negative electrode after nickel plating is immersed in Ag-containing solution.
Wherein, the sulphur urine that described Ag-containing solution comprises Silver Nitrate that content is 10 ~ 15g/L, content is 200 ~ 220g/L, the temperature of described Ag-containing solution is 20 ~ 30 DEG C, and pH is 4 ~ 6.
Wherein, the Trisodium Citrate that the nickelous chloride that described nickel plating solution comprises single nickel salt that content is 220 ~ 240g/L, content is 30 ~ 40g/L, content are 60 ~ 70g/L, content are the phosphorous acid of 30 ~ 35g/L, the temperature that described nickel plating solution carries out electroplating is 60 ~ 70 DEG C, pH is 2 ~ 3, and average current density is 0.1 ~ 0.3A/dm
2.
Wherein, described electric current is monopulse rectangular wave current, and pulsewidth is 1 ~ 3ms, and dutycycle is 5 ~ 20%, and average current density is 0.3 ~ 0.7A/dm
2.
Wherein, described in step (3), the pH of electroplate liquid is 8 ~ 10, and the temperature of described electroplate liquid is 15 ~ 30 DEG C.
Wherein, described in step (3), the area ratio of negative electrode and positive electrode is 1/2 ~ 2, and described silver plate quantity is 2 pieces.
In the technical scheme of above electro-plating method, monopulse rectangular wave current is defined as at t
1passing into current density in time is J
pelectric current, at t
2without passing into electric current in time, it is a kind of intermittent pulse current.Dutycycle is defined as t
1/ (t
1+ t
2), frequency is 1/(t
1+ t
2), mean current is defined as J
pt
1/ (t
1+ t
2).Compare with DC electrodeposition, thickness and the ion concentration distribution of electrostatic double layer all change; While adding electrochemical polarization, reduce concentration polarization, the direct effect of generation is, the coating that pulse plating obtains than DC electrodeposition coating evenly, crystallization is finer and closely woven.Moreover, pulse plating also has: hardness and the wear resistance of (1) coating are all high; (2) solution dispersibility and covering power good; (3) decrease the super plating of part edge, coating distributing homogeneity is good, can saving silver.When silver thickness is reduced by 20%, pulse plating silver layer still has the performance suitable with DC plating silver layer.The joint silver rate of general pulse silver-coating is about 15 ~ 20%.
Acid dipping in pre-treatment is to activate copper coin.Comprise with dust technology dipping and afterwards with dilute hydrochloric acid dipping, the time of two kinds of acid dippings is 20 ~ 40s, be preferably 30s.Rinse with water after each acid dipping, to rinse out residual hydrogen ion, avoid the hydrogen ion remained to cause the rough problems such as the appearance space of coating.Pre-treatment be also included in acid dipping before copper coin is polished, the step of chemical alkaline liquid oil removing.
The Trisodium Citrate that the nickelous chloride that nickel plating solution specifically can comprise single nickel salt that content is 220g/L, content is 30g/L, content are 65g/L, content are the phosphorous acid of 32g/L, the temperature that described nickel plating solution carries out electroplating is 60 DEG C, pH is 2.5, and average current density is 0.2A/dm
2.The time of plating can be 25min.
The screening formulation of Ag-containing solution is the sulphur urine that Ag-containing solution comprises Silver Nitrate that content is 15g/L, content is 215g/L.The temperature of described Ag-containing solution is preferably 25 DEG C, and pH is preferably 5.The time of leaching silver is 1 ~ 2min, is preferably 1.5min.Why pre-treatment comprises the step of leaching silver, because the Standard Electrode Potentials of nickel is much more negative than silver, when the Copper substrate of plated nickel enters silver plating liquid, namely replacement(metathesis)reaction is there is before not being energized, there is replacement(metathesis)reaction in plating piece surface, displacement silver layer and the basal body binding force of the formation of plating piece surface are poor, and the nickel impurity simultaneously also having part pollutes plating solution.
Succimide plate silver plating solution of the present invention, comprise in silver content be the Silver Nitrate of 10 ~ 20g/L, content be 130 ~ 150g/L succimide, in methylsulphonic acid root content be 30 ~ 40g/L metilsulfate, take carbonate content as the carbonate of 20 ~ 30g/L and content be the polymine of 1 ~ 2g/L.The present invention selects succimide to be coordination agent, select metilsulfate be additive to improve compactness and the smoothness of coating, select polymine as brightening agent, thus make the good stability of plating solution, coating anti-discoloration and weldability strong.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail.
According to formulated plate silver plating solution described in embodiment 1 ~ 6 and comparative example, be specially: the quality taking each feed composition according to formula electronic balance.Silver Nitrate, succimide, metilsulfate, polymine and carbonate is dissolved respectively by suitable quantity of water.Succimide solution is constantly stirred, slowly adds in silver nitrate solution.Then, methylsulphonic acid salts solution is added the solution being dissolved with succimide and Silver Nitrate to mix.Then, respectively polyethylenimine solution and carbonate are added after mixing in the solution dissolving above-mentioned three feed composition, add water move to pre-determined volume.
Use formulated plate silver plating solution electric plating method described in embodiment 1 ~ 6 and comparative example:
(1) negative electrode adopts area to be the thick copper sheet for 2mm of 4cm × 6cm.After copper sheet is first tentatively polished with 200 order waterproof abrasive papers again with 600 successively order liquid honing expose metalluster to surface.Successively through the thermochemistry alkali liquor oil removing of sodium hydroxide/sodium carbonate, dehydrated alcohol oil removing, distilled water cleaning, 10% dust technology dipping 30s, deionized water rinsing, 5% dilute hydrochloric acid soak the process of 30s.
(2) copper sheet after step (1) process immersed in nickel plating solution carry out electroless nickel layer, this electroplate liquid by content be the single nickel salt of 220 ~ 240g/L, the content nickelous chloride that is 30 ~ 40g/L, the content Trisodium Citrate that is 60 ~ 70g/L, content is that the phosphorous acid of 30 ~ 35g/L forms.Plating conditions is: temperature is 60 ~ 70 DEG C, and pH is 2 ~ 3, and average current density is 0.1 ~ 0.3A/dm
2.
(3) by after the copper sheet deionized water rinsing after nickel plating, immerse by content be the Silver Nitrate of 10 ~ 15g/L, content is that the sulphur of 200 ~ 220g/L urinates the silver-colored solution formed, the silver-colored solution temperature immersed is 20 ~ 30 DEG C, and pH is 4 ~ 6, and the time of immersion is 4 ~ 6min.
(4) two blocks of silver plates that take area as 4cm × 6cm, thickness is 2mm, purity is 99.9% are anode, silver plate is inserted two rear flank of copper sheet, the negative pole that parallel connection is connected with the mains, by in the electroplate liquid in anode and negative electrode immersion plating groove, regulate electroplate liquid bath temperature to be 15 ~ 30 DEG C, pH is 8 ~ 10.Mechanical stirring rotating speed is adjusted to 200 ~ 500rpm.Make pulse power supply, the pulsewidth of pulsed current is 1 ~ 3ms, and dutycycle is 5 ~ 20%, and average current density is 0.3 ~ 0.7A/dm
2.After 30 ~ 60min to be energised, cut off the power supply of electroplanting device.Take out copper sheet, use distilled water cleaning, drying.
Embodiment 1
The formula of succimide plate silver plating solution is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 1ms, and dutycycle is 20%, and average current density is 0.3A/dm
2; PH is 8, and temperature is 15 DEG C, and electroplating time is 60min.
Embodiment 2
The formula of succimide plate silver plating solution is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 1ms, and dutycycle is 15%, and average current density is 0.4A/dm
2; PH is 8.5, and temperature is 20 DEG C, and electroplating time is 50min.
Embodiment 3
The formula of succimide plate silver plating solution is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 2ms, and dutycycle is 10%, and average current density is 0.5A/dm
2; PH is 9, and temperature is 25 DEG C, and electroplating time is 40min.
Embodiment 4
The formula of succimide plate silver plating solution is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 2ms, and dutycycle is 5%, and average current density is 0.6A/dm
2; PH is 9.5, and temperature is 30 DEG C, and electroplating time is 30min.
Embodiment 5
The formula of succimide plate silver plating solution is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 3ms, and dutycycle is 10%, and average current density is 0.7A/dm
2; PH is 10, and temperature is 25 DEG C, and electroplating time is 40min.
Embodiment 6
The formula of succimide plate silver plating solution is as follows:
Plating technology condition: the pulsewidth of monopulse rectangular wave current is 3ms, and dutycycle is 15%, and average current density is 0.5A/dm
2; PH is 9, and temperature is 25 DEG C, and electroplating time is 40min.
Comparative example:
Reference literature " thiosulphate, without cyanogen pulse silver-coating technical study, is electroplated and finish the 27th volume the 2nd phase the 14th page to the 18th page ".This plating solution formula is: the sodium sulfate that the pyrosulphite that the Sulfothiorine that the Silver Nitrate that content is 40 ~ 60g/L, content are 200 ~ 300g/L, content are 60 ~ 84g/L, content are 10 ~ 20g/L, content are 22 ~ 35g/L boric acid, plating technology condition is: pH is 4.2 ~ 4.8, temperature is 10 ~ 40 DEG C, and the average current density of pulsed current is 0.6A/dm
2, pulsewidth is 1ms, and dutycycle is 10%, and electroplating time is 10min.
Dispersive ability test is carried out with reference to the plating solution of following methods to embodiment 1 ~ 6 and comparative example:
The dispersive ability of plating solution adopts far and near cathode method (Haring-Blue method) to measure.Measure groove and adopt Haring cell, interior dimensions is 150mm × 50mm × 70mm.Negative electrode selects thickness to be the copper sheet of 0.5mm, and working face is of a size of 50mm × 50mm; Anode is plating nickel plate with holes; Plating electric current 1A, electroplating time 30min.
The dispersive ability calculation formula of plating solution is:
Dispersive ability=[K-(the Δ M of plating solution
1/ Δ M
2)]/(K-1) (result represents with percentage);
In formula, K is negative electrode far away to the distance of anode and nearly negative electrode to the ratio of distances constant of anode, and in this test, K gets 2; Δ M
1for the increment (g) after plating on nearly negative electrode; Δ M
2for the increment (g) after plating on negative electrode far away.
Covering power test is carried out with reference to the plating solution of following methods to embodiment 1 ~ 6 and comparative example 1:
Endoporus method is adopted to measure.Negative electrode selects internal diameter l10mm, and pipe range is the copper pipe of 50mm, and one end is closed.During test, the distance of the mouth of pipe and anode is fixed on 80mm, test current 0.2A, electroplating time 30min.According to following formulae discovery:
Covering power=endoporus coating length/pipe range (result represents with percentage).
Current efficiency test is carried out with reference to the plating solution of following methods to embodiment 1 ~ 6 and comparative example:
Copper voltameter method is adopted to measure.Negative electrode to be tested and copper voltameter cleaned and dry up rear electronic scale weighing, then insert in electrodeposit groove by two negative electrodes simultaneously, be energized 10 ~ 30min, take out and clean dry up after use electronic scale weighing.According to following formulae discovery:
Current efficiency=(1.186 × cathode quality to be measured)/(electrochemical equivalent of copper voltameter quality × cathodic deposition metal to be measured) × 100%.
Speed test is plated with reference to the plating solution of following methods to embodiment 1 ~ 6 and comparative example:
Mass method is adopted to measure sedimentation rate.Be 10 with sensitivity
-4electronic balance weighing sample plating before and after quality.By the acquisition sedimentation rate of poor quality of unit time, unit surface, press formulae discovery below:
Plating speed=(after plating before sample mass-plating sample mass)/(specimen surface to be plated long-pending × plating time).Each Data duplication is measured three times and is got its mean value.
Stability test is carried out with reference to the plating solution of following methods to embodiment 1 ~ 6 and comparative example:
Method of direct observation is adopted to measure the stability of plating solution.Whether method of direct observation is statically placed in air by plating solution, observe plating solution change judge the stability of plating solution through different time.
Weldability test is carried out with reference to the coating of following methods to embodiment 1 ~ 6 and comparative example:
Planimetry test is spread in employing, is specially: drip several rosin at coating surface and put the scolding tin of 0.2g, puts into baking oven and be heated to 250 DEG C, keep 5 minutes, checks solder surface covered.Judge that weldability is good and bad with surface covered diameter.Specifically can refer to periodical literature " non-cyanide silver coating experimental study on production technology, Anhui Western learning report, 2006,22 (5): 78-80 ".
Anti-discoloration test is carried out with reference to the coating of following methods to embodiment 1 ~ 6 and comparative example:
3mg/LH is prepared with sulfuric acid and sodium sulphite in the moisture eliminator that volume is 15L
2s, keeps higher humidity in moisture eliminator simultaneously.Dip test is carried out in 0.1% ammonium sulfide solution.Variable color judgement criteria is divided into 5 grade: a, nondiscoloration; B, micro-yellow or micro-ash are dark-coloured or occur the 1st variable color stain (diameter is less than 1mm); C, slight flavescence or ash are dark-coloured, and have brown and other colour films or occur several variable color stain; D, yellow intensification or the dark-coloured intensification of meeting, and brown also deepens to increase the weight of or occur stain diffusion with other colour films seriously, area is larger; E, yellow or grey furvous are very dark, and brown becomes chocolate, and other colour films are very heavy or variable color diffusion is very serious, and area becomes black very greatly or all.
Bonding force test is carried out with reference to the coating of following methods to embodiment 1 ~ 6 and comparative example:
Whether adopt bending experiment test, be specially: by plating piece alternating bending to disconnected, observing coating with magnifying glass has be full of cracks, peeling; Quench method is placed in thermostat container by sample to be heated to 200 DEG C, insulation 1h, takes out rapidly and put into the quenching of room temperature cold water, observe coating whether peeling, come off.
Outward appearance test is carried out with reference to the coating of following methods to embodiment 1 ~ 6 and comparative example:
Evaluated coating macrostate by range estimation, its evaluation rank is divided into: blackout, grey, yellow, canescence, silvery white, half bright and bright.
The test result of the coating of embodiment 1 ~ 6 and comparative example and the performance of plating solution is as follows:
As can be seen from the above table, the weldability of the coating of embodiment 1 ~ 6, anti-discoloration and outward appearance are all higher than comparative example, and the stability of plating solution, dispersiveness, covering power, current efficiency and plating speed are all better than comparative example.In embodiment 1 ~ 6, consider from the integration test effect of plating solution and coating, the formula of embodiment 6 is screening formulation of the present invention.
It should be noted that and understand, when not departing from the spirit and scope of accompanying claim the present invention for required protection, various amendment and improvement can be made to the present invention of foregoing detailed description.Therefore, the scope of claimed technical scheme is not by the restriction of given any specific exemplary teachings.
Applicant states, the present invention illustrates detailed process equipment and process flow process of the present invention by above-described embodiment, but the present invention is not limited to above-mentioned detailed process equipment and process flow process, namely do not mean that the present invention must rely on above-mentioned detailed process equipment and process flow process and could implement.Person of ordinary skill in the field should understand, any improvement in the present invention, to equivalence replacement and the interpolation of ancillary component, the concrete way choice etc. of each raw material of product of the present invention, all drops within protection scope of the present invention and open scope.
Claims (10)
1. a succimide plate silver plating solution, it is characterized in that, comprise in silver content be the Silver Nitrate of 10 ~ 20g/L, content be 130 ~ 150g/L succimide, in methylsulphonic acid root content be 30 ~ 40g/L metilsulfate, take carbonate content as the carbonate of 20 ~ 30g/L and content be the polymine of 1 ~ 2g/L.
2. succimide plate silver plating solution according to claim 1, it is characterized in that, comprise in the silver content Silver Nitrate that is 15g/L, the content succimide that is 134g/L, in the methylsulphonic acid root content metilsulfate that is 35g/L, the polymine that is 1.8g/L in the carbonate content carbonate that is 25g/L, content.
3. succimide plate silver plating solution according to claim 1, is characterized in that, the molecular weight of described polymine is 400 ~ 600.
4. use the succimide plate silver plating solution electric plating method described in claim 1, it is characterized in that, comprise the following steps:
(1) prepare electroplate liquid: dissolve in every premium on currency in silver 10 ~ 20g Silver Nitrate, 130 ~ 150g succimide, in methylsulphonic acid root 30 ~ 40g metilsulfate, in carbonate 20 ~ 30g carbonate and 1 ~ 2g polymine;
(2) using copper coin as negative electrode, anticathode carries out pre-treatment;
(3) using silver plate as anode, by anode with insert through pretreated negative electrode and pass into electric current in described electroplate liquid and electroplate.
5. method according to claim 4, is characterized in that, described pre-treatment be specially by after negative electrode acid dipping with deionized water rinsing, then insert in nickel plating solution and carry out nickel plating, the negative electrode after nickel plating is immersed in Ag-containing solution.
6. method according to claim 5, is characterized in that, the sulphur urine that described Ag-containing solution comprises Silver Nitrate that content is 10 ~ 15g/L, content is 200 ~ 220g/L; Temperature when described Ag-containing solution is dipped into is 20 ~ 30 DEG C, and pH is 4 ~ 6.
7. method according to claim 5, it is characterized in that, the Trisodium Citrate that the nickelous chloride that described nickel plating solution comprises single nickel salt that content is 220 ~ 240g/L, content is 30 ~ 40g/L, content are 60 ~ 70g/L, content are the phosphorous acid of 30 ~ 35g/L, the temperature that described nickel plating solution carries out electroplating is 60 ~ 70 DEG C, pH is 2 ~ 3, and average current density is 0.1 ~ 0.3A/dm
2.
8. method according to claim 4, is characterized in that, it is characterized in that, described in step (3), electric current is monopulse rectangular wave current, and pulsewidth is 1 ~ 3ms, and dutycycle is 5 ~ 20%, and average current density is 0.3 ~ 0.7A/dm
2.
9. method according to claim 4, is characterized in that, described in step (3), the pH of electroplate liquid is 8 ~ 10, and the temperature of electroplate liquid is 15 ~ 30 DEG C.
10. method according to claim 4, is characterized in that, described in step (3), the area ratio of negative electrode and positive electrode is 1/2 ~ 2, and described silver plate quantity is 2 pieces.
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| CN114752973A (en) * | 2022-05-13 | 2022-07-15 | 重庆大学 | Cyanide-free bright silver plating solution and electroplating method |
| CN114752973B (en) * | 2022-05-13 | 2023-12-22 | 重庆大学 | Cyanide-free bright silver plating solution and electroplating method |
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