CN103286408B - A kind of heat source system - Google Patents
A kind of heat source system Download PDFInfo
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- CN103286408B CN103286408B CN201210043919.XA CN201210043919A CN103286408B CN 103286408 B CN103286408 B CN 103286408B CN 201210043919 A CN201210043919 A CN 201210043919A CN 103286408 B CN103286408 B CN 103286408B
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Abstract
The present invention provides a kind of heat source system, and described heat source system includes heating system and hot distribution system, and described heating system includes gas provides unit and temperature control unit, and wherein gas provides unit to be used for providing flowing gas；Temperature control unit comprises substrate, multiple through holes are formed with substrate, to allow described flowing gas to pass through, at least a portion for the plurality of through hole is provided with temperature-adjusting device, and described temperature-adjusting device is independently adjusted the temperature of the flowing gas by corresponding through hole；Described hot distribution system includes separating device, and described hot distribution system being divided into multiple regions so that reaching in the plurality of region respectively by the flowing gas of the plurality of through hole has object to be heated.The thermal source that the embodiment of the present invention is provided can provide non-uniform heating as needed.
Description
Technical field
The present invention relates to the welding of electronic device and manufacture field, more specifically, it is related to can be used for device welding
Heat source system.
Background technology
It is often necessary to various elements are welded on the circuit board arranged in advance in the manufacture process of electronic device,
Thus forming the board with specific calculation logic.The pcb board (printed circuit board (PCB)) being adopted with electronic device constantly little
Type, to realize element at present to the welding of circuit board generally by the way of Reflow Soldering.In reflow process, using brazier
There is provided a heating environment so that allocating the solder refuse on printed panel pad in advance, thus realize element welding end or
Being mechanically and electrically between pin and printed panel pad.At present frequently with solder reflow techniques include far infrared Reflow Soldering,
Infrared Heating wind Reflow Soldering and the weldering of full hot air reflux etc..
In complicated printed circuit board (PCB) processing procedure (PCBA), the unit of number of different types be there may be on same circuit board
Part.In these elements, (such as, high-quality high-density connector, the mixing of a part of element, such as some sockets and adapter
Type socket etc.), there is larger quality and relatively low heat sensitivity, and another part element, such as electric capacity, LED etc., have relatively
Little quality and larger heat sensitivity.Usually latter element is referred to as responsive to temperature type element (TSC, temperature
sensitive component).Typically, TSC element is mainly manifested in following two aspects to the sensitivity of temperature.First,
The temperature that TSC element is resistant to is relatively low, therefore has relatively low peak temperature and limits；Secondly, TSC element is in solder fusing shape
State can duration shorter, show on liquidus line it is simply that more than the liquidus line that can stand time (TAL,
Time above liquidus) comparatively short, therefore there is shorter TAL time restriction.However, due to big quality element and
TSC element is located on same circuit board, jointly stands the heating process of Reflow Soldering, therefore usually has situations below and occurs, i.e.
The heat that big mass elements obtain and temperature are not enough, and TSC element has the risk of fail temperature and time restriction simultaneously.?
At present frequently with leadless process technique in, solder and element coating all not leaded, the fusing point required for welding is higher, TSC unit
The risk that the destruction TSC that part faces limits is higher.For example, in a specific example, heat high in reflow process simultaneously
Quality high-density connector and aluminum capacitor (TSC element).The specification temperature of high-quality high-density connector and aluminum capacitor is 230
DEG C between 250 DEG C.However, through common heating process, the true peak temperature of adapter is 232 DEG C, close to specification temperature
The lower limit of degree, and the true peak temperature of aluminum capacitor is 248 DEG C, close to the upper limit of specification temperature.Additionally, high-quality high density is even
The specification TAL time connecing device is 60 to 150s, and the specification TAL time of aluminum capacitor is 30 to 60s.However, heating through Reflow Soldering,
The actual TAL time recording for adapter is 70s, close to the lower limit of its specification time, and is directed to the reality that aluminum capacitor records
The TAL time is 140s, far beyond upper limit 60s of its TAL time.It is appreciated that being likely to result in the destruction of TSC thermal limit
The deterioration of TSC element function.
In order to solve this problem, industrial solder reflow device is optimized, there is provided heat shielding instrument thus
Separate different elements to a certain extent.However, these equipment are unsatisfactory to the hot segregation of element.In some extreme feelings
Under condition, prior art can only be respectively welded element and the TSC element of big quality with separate operation, or even in standard circumfluence weldering
TSC element is welded manually after operation.Thus, it is desirable to present new scheme, effectively can weld in a welding sequence simultaneously
Connect different types of element, thus improving welding efficiency and ensureing the welding quality of different elements.
Content of the invention
In view of posed problems above, propose the present invention, it is desirable to provide a kind of non-homogeneous heat source system, solved with this existing
Present in technology, at least one is not enough.
According to embodiments of the invention, there is provided a kind of heat source system, including heating system and hot distribution system, described plus
Hot systems include gas provides unit and temperature control unit, and described gas provides unit to be used for providing flowing gas；Described temperature
Degree control unit comprises substrate, described substrate is formed with multiple through holes, to allow described flowing gas to pass through, for described many
At least a portion in individual through hole is provided with multiple temperature-adjusting devices, at least one of the plurality of temperature-adjusting device phase
Other temperature-adjusting devices are independently adjusted to the temperature of the flowing gas by corresponding through hole；Described hot distribution system includes
Separating device, described hot distribution system is divided into multiple regions so that passing through the stream of the plurality of through hole by described separating device
Body of taking offence reaches respectively in the plurality of region object to be heated.
The heat source system that the embodiment of the present invention is provided can provide non-uniform heating as needed.By such thermal source system
The welding united for electronic component, so that the zones of different of board obtains different degrees of heating such that it is able to once
Effectively weld different types of element in welding sequence simultaneously, improve welding efficiency.
Brief description
Fig. 1 illustrates the schematic structure of heat source system according to embodiments of the present invention；
Fig. 2 illustrates the schematic structure of heating system 11 according to an embodiment of the invention；
Fig. 3 illustrates the structural representation of temperature control unit 112 according to an embodiment of the invention；
Fig. 4 illustrates the structural representation of temperature control unit 112 according to another embodiment of the present invention；And
Fig. 5 illustrates the schematic diagram of hot distribution system 12 according to an embodiment of the invention.
Specific embodiment
The specific embodiment of the present invention is described below in conjunction with accompanying drawing and example.However, it should be understood that below to concrete reality
The description applying example is just for the sake of explaining the execution example of the present invention, and does not carry out any restriction to the scope of the present invention.
Fig. 1 illustrates the schematic structure of heat source system according to embodiments of the present invention.As shown in figure 1, according to embodiment
Heat source system 10 includes heating system 11 and hot distribution system 12.Heating system 11 is used for providing hot gas heterogeneous, such as
In Fig. 1 shown in arrow.Specifically, the thicker arrow in right side illustrates the gas that degree of heat is higher, temperature is higher, and left side is thinner
Arrow illustrates the gas that degree of heat is relatively low, temperature is relatively low.Correspondingly, hot distribution system 12 is used for making the heating of different temperatures
Gas reaches respectively in zones of different 131-133 object 13 to be heated.In the example in fig 1, there is object to be heated
It is that the PCB group having pending Reflow Soldering is installed.As Fig. 1 is exemplarily illustrated, PCB group is installed on 131 regions and has less unit
Part, such as TSC element, and in 133 regions, there is the larger element of quality, for example various adapters.By heating system 11 He
Hot distribution system 12, the element of larger quality is subject to the heating of the higher gas (shown in block arrow) of temperature in region 133,
TSC element obtains the heating of lower degree in region 131.Therefore, the different types of element on PCB card can pass through thermal source
System 10 obtains each required heating heterogeneous, thus realizing efficient reflow soldering.
Heat source system 10 is described below in detail provides the concrete structure of non-uniform heating.
Fig. 2 illustrates the schematic structure of heating system 11 according to an embodiment of the invention.As shown in Fig. 2 heating system
System 11 includes gas provides unit 111 and temperature control unit 112, and wherein gas provides unit 111 to be used for providing flowing gas,
Temperature control unit 112 is used for controlling the temperature of flowing gas, thus providing heating heterogeneous.
In one embodiment, gas provides unit 111 to include the blast apparatus of gas source and fan etc.There is provided
Flowing gas can include compressed air, nitrogen etc..In certain embodiments, in order to avoid the oxidation in welding process, flowing
Gas is the noble gases of stable in properties.In one embodiment, gas provides unit 111 to include heater, such as metal
Heater strip, radiation source etc., to provide the uniform flowing gas with uniform temperature.In one embodiment, gas provides
Blast apparatus in unit 111 and/or heater connect to computer system, by this computer system carry out air blast/plus
The control of heat operation.
The main body of temperature control unit 112 is made up of substrate 113.The direction that substrate 113 provides towards flowing gas.In material
In the selection of material, substrate 113 should have certain intensity, and can resist the deformation that thermal stress may lead to.In a reality
Apply in example, substrate 113 is mainly made up of alloy steel products.In other embodiments it is also possible to adopt other materials as needed,
Such as other alloys.
On aforesaid substrate 113, it is formed with multiple through holes 114, to allow flowing gas to pass through.For these through holes extremely
A few part, is provided with temperature-adjusting device 115.At least one of multiple temperature-adjusting devices 115 are with respect to other temperature
Adjusting means is independently adjusted the temperature of the flowing gas by corresponding through hole, so that flowing gas are by different piece
Through hole after obtain different temperature.
In one embodiment, multiple through holes 114 are arranged as the form of array on substrate.In other embodiments, lead to
Can also arrange as other forms, such as multiple donuts in hole.In some embodiments, arrangement on substrate for the through hole is
Non-homogeneous arrangement, that is, in zones of different, there are different densities.For example, in one embodiment, needing higher heating strong
The region of degree, the through hole of setting higher density, in the region needing relatively low heating intensity, more low-density through hole is set.Another
In one embodiment, hole size heterogeneous can also be arranged as required to.For example, in the area needing higher heating intensity
Domain, the larger through hole of setting opening size, in the region needing relatively low heating intensity, the less through hole of opening size is set.
As described above, being provided with multiple temperature-adjusting devices 115 for multiple through holes 114.In one embodiment, each
Through hole 114 is both provided with a temperature-adjusting device 115, to adjust the temperature of the flowing gas by corresponding through hole.Another
In embodiment, in partial through holes, only it is provided with temperature-adjusting device 115.For example, in the region needing higher heating intensity,
Heating device is set as temperature-adjusting device 115 so that further heating is obtained by the gas of these through holes for through hole
And intensification；And in the region needing relatively low heating intensity, so that the flowing gas with uniform temperature directly pass through to lead to
Hole.Or, in the embodiment of flowing gas that gas provides unit 111 to provide higher temperature, needing higher heating
So that flowing gas directly pass through through hole in the region of intensity, and in the region needing relatively low heating intensity, it is through hole setting
Cooling system is as temperature-adjusting device 115, so that being reduced by the gas temperature of these through holes.
Therefore, it can temperature adjustment in arrangement and the size, and through hole by through hole in change temperature control unit 112
The setting of device come to obtain different Temperature Distribution so that heating system provide heating heterogeneous.
So that heating system 11 can provide different heat distributions need not change its physique, in a reality simultaneously
Apply in example, multiple through holes 114 are uniformly arranged (for example arranging as array) on substrate, one temperature is set for each through hole and adjusts
Regulating device 115；Each temperature-adjusting device is respectively connecting to computer system, obtains corresponding control from computer system and believes
Number, and enter the regulation of trip temperature under the control of said control signal independently of one another.Thus, it is possible to be changed using computer system
Become the setting of control signal, so that each temperature-adjusting device carries out different temperature under the control of different control signals
Adjust.So it is not necessary to change the physique of temperature control unit 112 it is possible to make heating system 11 provide different heat
Distribution, thus be applied to different heated material.
Except making each temperature-adjusting device obtain signal independently of one another and then independently carry out temperature controlled reality
Apply outside example, in another embodiment, can also be according to the heating granularity having needed for heated material, optionally by a part
Thermostatic control circuit is in parallel so that this portion temperature adjusting means is common obtains unified control signal, system
One ground carries out temperature control.However, this portion temperature adjusting means, with respect to other temperature-adjusting devices, remains and passes through
Respective control signal independently carries out temperature controlled.For example, in one example, can be according to desired heating distribution, will
Substrate is divided into multiple regions, and correspondingly, temperature-adjusting device also can be divided some.Expect to pass through in the same area
The gas temperature of through hole is equal.So just so that the temperature-adjusting device corresponding to a region is connected in parallel, jointly
As one man carry out temperature control.However, obtaining control signal independently of one another between the temperature-adjusting device of zones of different, thus
The gas temperature by through hole for the independent regulation.
Further, since the flexible control to temperature-adjusting device 115 for the computer system, can make to succeed in one's scheme in heating process
The control signal of calculation machine system changes over, so, it is possible to use the different heating periods realized by same firing equipment 11,
Such as low-temperature prewarming, high-temperature heating, cooling etc. after heating.
Describe the set-up mode of temperature control unit 112 under different embodiments below in conjunction with accompanying drawing in detail.
Fig. 3 illustrates the structural representation of temperature control unit 112 according to an embodiment of the invention.Example in Fig. 3
In, multiple through holes 114 (being illustrated with decussation) are uniformly arranged on substrate in array fashion.It is provided with one in each through hole
Individual METAL HEATING PROCESS silk is as temperature-adjusting device 115.Each METAL HEATING PROCESS silk is connected to computer system and (includes partly simultaneously
Connection), obtain corresponding control signal from computer system.Control signal can define the voltage V at METAL HEATING PROCESS silk two ends.Depend on
In obtain voltage V, each METAL HEATING PROCESS silk correspondingly to heated by the flowing gas of through hole so that from through hole flow out
Gas there is required temperature.METAL HEATING PROCESS silk can be arranged according to the required efficiency of heating surface, for example, select METAL HEATING PROCESS silk
Material, setting heater strip parameter, such as thickness, length, coiling etc..
In order to determine the temperature of hot gas, temperature sensor 116 can be set in each through hole, pass through for sensing
The temperature of the flowing gas of corresponding through hole.In one embodiment, the temperature of sensing can be sent to by temperature sensor 116
State computer system, provide the feedback about heats for it.In a specific example, temperature is constituted by thermocouple and passes
Sensor 116.It will be understood by those skilled in the art that using the temperature sensor of other forms come sensing temperature, and can also incite somebody to action
Sensing result sends computer system in the form of a signal to.
As described above, the METAL HEATING PROCESS silk in different through holes can heat to moving air, therefore independently of one another
The through hole closing on is likely to be of different temperatures.In order to avoid or reduce different temperatures through hole between interference, one implement
In example, arrange thermal insulation layer 117 in the inwall of through hole 114.In one example, thermal insulation layer is made of porous materials, for example foam
Material, fibrous material etc..In another example, thermal insulation layer is made up of heat-reflecting material, for example gold, silver, nickel, aluminium foil or gold-plated genus
Polymer etc..In another example, thermal insulation layer is made up of vacuum heat insulation materials, and it is right to be intercepted using the inner vacuum of material
Stream, thus realize heat-insulated.Those skilled in the art can adopt one or more of heat-barrier material listed above as needed
To make thermal insulation layer, or to adopt other heat-insulated modes, to prevent the heat interference between through hole.
In one embodiment, through hole 114 inwall there also is provided back-up coat 118, so that the shape of through hole is firmer.
In one example, back-up coat is mainly made up of metal level.In the case of there is back-up coat 118, thermal insulation layer 117 can be arranged
Outside in back-up coat 118.
It is appreciated that in the embodiment of Fig. 3 example, by the use of METAL HEATING PROCESS silk as temperature-adjusting device to by through hole
Flowing gas heated.It will be understood, however, that thermostatic example is not limited to heater strip；Art technology
Personnel can also arrange, for through hole, the temperature that other firing equipments to raise flowing gas.For example, in one embodiment,
Can radiation source be set in each through hole, heats the flowing gas by through hole by heat radiation.Such radiation source can
To include the source of infrared radiation or far-infrared radiation source etc..In this case, each radiation source may be coupled to department of computer science
System, therefrom obtains control signal.Control signal can define the radiant power of radiation source.Thus, under control of the control signal,
Each radiation source can work under different capacity, will be heated to different temperatures by the flowing gas of through hole.Reading this
In the case of bright book, those skilled in the art are also possible to using other firing equipments as temperature-adjusting device, and these variants are equal
Should be included within scope of the invention.
In the above embodiment, temperature control unit 112 includes multiple firing equipments, in these firing equipments
Part at least independently provides the flowing gas that unit 111 is provided to carry out different degrees of adding with respect to other parts to gas
Heat, thus provide hot gas heterogeneous.In another embodiment, so that gas provides unit 111 to provide height
Wet body, carries out different degrees of cooling using temperature control unit 112 to high-temperature gas, thus providing the heating of different temperatures
Gas.
Fig. 4 illustrates the structural representation of temperature control unit 112 according to another embodiment of the present invention.In this embodiment
In, gas provides unit 111 to utilize the heater including in it to provide temperature flowing gas.Correspondingly, temperature control unit
The 112 multiple through holes comprising array way arrangement, are provided with a cooling device for each through hole.In the example in fig. 4, cold
But equipment includes cooling fluid, fluid line and circulating pump, wherein cooling fluid under the driving of circulating pump in fluid line
Circulate.Each circulating pump is connected to computer system, obtains corresponding control signal from computer system.Control signal
The power of circulating pump can be defined.Therefore, each circulating pump can independently be operated with different capacity, drives cooling fluid
Circulated in fluid line with different speed, thus cold to being carried out by the flowing gas of through hole with different efficiency
But so that there is required temperature from through hole effluent air.
According to required cooling effectiveness, cooling fluid and fluid line can be selected and be arranged.The cooling being adopted
Fluid can include mixture of water, oil, water and gas etc..Those skilled in the art can also adopt other cold as needed
But fluid.Cooling fluid is flowed in fluid line with different rates under the driving of circulating pump.According to the needs of cooling effectiveness,
Fluid line may be arranged to various shapes, such as linear, spiral type, snakelike, fold-line-shaped, and the combination of these shapes.
It is (as Fig. 4 is exemplarily illustrated) in the case of rectilinear in fluid line, the main body of fluid line could be arranged to close on logical
Hole is arranged in parallel.In the case of fluid line is generally spiral, pipe main body is disposed about through hole.In other shapes
In the case of the fluid line of shape, in other ways fluid line can be arranged on the vicinity of corresponding through hole so that in pipeline
Cooling fluid cool down to by the high-temperature gas of through hole.
Although the foregoing describing the cooling device being made up of cooling fluid, fluid line and circulating pump, cooling device
Example be not limited thereto.Those skilled in the art can select other or more kinds of cooling device as needed, for example respectively
The forced air cooler of the form of kind, water cooler etc..
With the embodiment of Fig. 3 analogously, the temperature control unit 112 of Fig. 4 embodiment can also be optionally in through hole
In middle setting temperature sensor 116, thermal insulation layer 117 and back-up coat 118 one or more.Here is no longer entered to these parts
Row repeated description.
As the description above in association with embodiment, due to for each through hole be provided with the firing equipment that can work independently or
As temperature-adjusting device, heating system 11 can provide the hot gas heterogeneous with different temperatures to cooling device.So
And, due to the mobility of gas, after by through hole, there is the risk interfering in the gas of different temperatures.Therefore, at this
In inventive embodiment, using hot distribution system 12, the gas of different temperatures is individually directed heated material.
Fig. 5 illustrates the schematic diagram of hot distribution system 12 according to an embodiment of the invention, and wherein Fig. 5 A illustrates
The top view of hot distribution system, Fig. 5 B illustrates the axonometric chart of hot distribution system.As illustrated, hot distribution system 12 comprises upper surface
121 lower surfaces 122, are provided with separating device 123 between the upper and lower surfaces.During work, upper surface 121 presses close to heating system 11
The lower surface (surface that hot gas are flowed out by through hole) of substrate, lower surface 122 is pressed close to have object to be heated.Separating device
Space between the upper and lower surface of hot distribution system is divided into multiple region 131-135 so that passing through in heating system 11 by 123
The flowing gas of multiple through holes reach respectively in the plurality of region object to be heated.
In one embodiment, the setting of separating device 123 is corresponding to the temperature of the hot gas flowing out from heating system 11
Degree distribution.That is, separating device 123 same or like for temperature through hole outlet is separated in the same area so that not
Synthermal flowing gas arrive separately at object to be heated in the zones of different being separated.For example, region 133 comprises
The higher flowing gas of temperature, corresponding to the region needing height to heat in heated material；It is relatively low that region 131 comprises temperature
Flowing gas, corresponding to the region needing lower degree heating in heated material.
In order to prevent the heat interference between flowing gas in zones of different, in one embodiment, separating device further
123 include thermal insulation board, and thermal insulation board is made up of heat-barrier material, for example porous material, heat-reflecting material, vacuum heat insulation materials etc..
It is appreciated that the setting of separating device 123 shown in Fig. 5 and the region 131-135 being separated out are only that one kind is shown
Example.For different heated material and required heat distribution, those skilled in the art can change the setting of separating device 123
Mode, to be applied to different heated material.
Embodiment as described above, heating system 11 provides hot gas heterogeneous, and hot distribution system 12 will not
Synthermal gas guides the zones of different of heated material, thus the thermal source 10 of Fig. 1 be capable of non-to heated material
Uniformly heat.
Return to the overall structure figure of Fig. 1.In the example in fig 1, it is each provided with the both sides having PCB group to be heated to be installed
One heat source system 10, is heated inequality and buckling deformation to prevent described PCB group to be installed due to both sides.It is arranged on both sides
Each of two heat source systems 10 all can embodiment as described above and its variant constructing.Two heat source systems 10
Make can be identical or different.Additionally, in some cases it is also possible to only arrange a heat for heated material
Source 10 system.
In one embodiment, heat source system 10 also includes transmission system 14, has thing to be heated for fixing and transmission
Body.In one example, transmission system is driven by electro-motor, and this electro-motor is connected to above-mentioned calculating
Machine system.So, can by the operation of computer system control electro-motor so that transmission system 14 machine will have in due course
Object to be heated is sent to the appropriate location (for example, being directed at hot distribution system) of heating system 11, and the pre- timing that is fixed
Between fully heated with obtaining.
Although Fig. 1 is installed as an example shown with object to be heated with PCB group, it will be appreciated that the present invention is implemented
The thermal source of example is not only applicable to PCB group and is installed and reflow soldering process.As long as there being object to be heated to need not in zones of different
Heating it is possible to provide hot gas heterogeneous using the thermal source 10 of the embodiment of the present invention with intensity, thus once
Heating intensity in heating process, required for making the regional of object to be heated obtain.
It should be understood that term used herein, it is only for description specific embodiment, and be not intended to limit this
Bright." one " and " being somebody's turn to do " of singulative used herein it is intended to also include plural form, unless in context clearly separately
Point out.It should also be clear that when "comprising" and " inclusion " use in this manual, illustrating there is pointed feature, entirety, step
Suddenly, operation, unit and/or assembly, but it is not excluded that existing or increasing other features one or more, entirety, step, behaviour
Work, unit and/or assembly, and/or combinations thereof.The description of this invention going out given in description its object is to
Illustrate and describe, and non-exclusive, also it is not intended to the present invention to be limited to stated form.For art
Those of ordinary skill for, in the case of without departing from scope and spirit of the present invention, many modifications and modification can be made.Right
The selection of embodiment and explanation, are to best explain the principle of the present invention and practical application, making the skill of art
Art personnel can understand, the present invention can have suitable desired special-purpose and the various embodiments of application.Above-mentioned is various
Modification, modification and embodiment all should fall within the scope of this invention.
Claims (14)
1. a kind of heat source system, including
Heating system, described heating system includes：Gas provides unit and temperature control unit, and described gas provides unit to be used for
Flowing gas are provided；Described temperature control unit comprises substrate, described substrate is formed with multiple through holes, to allow described flowing
Gas passes through, and at least a portion in the plurality of through hole is provided with multiple temperature-adjusting devices, and the plurality of temperature is adjusted
At least one of regulating device is independently adjusted the temperature of the flowing gas by corresponding through hole with respect to other temperature-adjusting devices
Degree；And
Hot distribution system, including separating device, described hot distribution system is divided into multiple regions so that leading to by described separating device
Crossing the flowing gas of the plurality of through hole and reaching in the plurality of region respectively has object to be heated；
Wherein each temperature-adjusting device is firing equipment, thus the different piece of substrate is heated in various degree, to provide
There is the heating heterogeneous of object to be heated.
2. heat source system according to claim 1, wherein said gas provides unit to include aerator.
3. heat source system according to claim 1, wherein said multiple through holes are formed as array on the substrate.
4. heat source system according to claim 1, wherein said multiple temperature-adjusting devices connect to computer system, from
Described computer system obtains corresponding control signal, and enters the regulation of trip temperature under the control of said control signal.
5. heat source system according to claim 4, is provided with temperature sensor in wherein said through hole, described temperature sensor
The temperature of sensing is sent to described computer system.
6. heat source system according to claim 5, wherein said firing equipment includes METAL HEATING PROCESS silk, described control signal
Define the voltage at described METAL HEATING PROCESS silk two ends.
7. heat source system according to claim 5, wherein said firing equipment includes radiation source, described control signal definition
The radiant power of described radiation source.
8. heat source system according to claim 4, wherein said gas provides unit to include gas-heating apparatus, and institute
State temperature-adjusting device and include cooling device.
9. heat source system according to claim 8, wherein said cooling device includes cooling fluid, fluid line and circulation
Pump, described cooling fluid circulates under the driving of circulating pump in fluid line, and described control signal defines described circulation
The power of pump.
10. heat source system according to claim 9, wherein said fluid line is arranged near described through hole, and arranges
Combination for one or more of following shape：Linear, spiral type, snakelike and fold-line-shaped.
11. heat source systems according to any one of claim 1-10, wherein said through-hole wall is disposed with thermal insulation layer.
12. heat source systems according to any one of claim 1-10, wherein said through-hole wall is disposed with back-up coat.
13. heat source systems according to claim 1, wherein said separating device includes thermal insulation board.
14. heat source systems according to claim 1, also include transmission system, have thing to be heated for fixing and transmission
Body.
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| CN106238846B (en) * | 2016-08-22 | 2019-12-27 | 京信通信技术(广州)有限公司 | Non-contact heating tin brazing method for metal structural part and coaxial cable |
| CN106238848B (en) * | 2016-08-22 | 2019-12-27 | 京信通信技术(广州)有限公司 | Non-contact type heating tin brazing method for metal structural part and PCB |
| CN106270864B (en) * | 2016-08-22 | 2019-12-27 | 京信通信技术(广州)有限公司 | Non-contact heating tin brazing method for metal structural part and hardware part |
| CN106843321B (en) * | 2016-12-30 | 2018-09-07 | 青岛卓思三维智造技术有限公司 | Temperature control system and method |
| CN108152124B (en) * | 2018-02-06 | 2023-06-27 | 沈阳航空航天大学 | Method and device for detecting tensile failure temperature of material |
| CN109324078B (en) * | 2018-12-07 | 2020-12-15 | 黑龙江省能源环境研究院 | Temperature control method for detecting volatility of building materials |
| CN111312624B (en) * | 2020-02-27 | 2023-03-10 | 合肥维信诺科技有限公司 | Annealing device |
| CN111451592B (en) * | 2020-03-19 | 2022-04-19 | 金升阳（怀化）科技有限公司 | Through hole reflow soldering equipment and through hole reflow soldering processing method |
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| JPH02263570A (en) * | 1989-04-03 | 1990-10-26 | Matsushita Electric Ind Co Ltd | Method for controlling temperature of reflow device |
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| CN102015184A (en) * | 2008-04-28 | 2011-04-13 | 尔萨有限公司 | Device and method for thermally treating workpieces in particular by convective heat transfer |
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|---|---|---|---|---|
| CN88100726A (en) * | 1987-02-20 | 1988-08-31 | 霍利斯自动化公司 | Focus on convection current reflow soldering method and equipment |
| JPH02263570A (en) * | 1989-04-03 | 1990-10-26 | Matsushita Electric Ind Co Ltd | Method for controlling temperature of reflow device |
| US6005224A (en) * | 1997-10-30 | 1999-12-21 | U.S. Philips Corporation | Method of soldering components to at least one carrier |
| CN1902991A (en) * | 2003-10-30 | 2007-01-24 | 雷姆设备制造有限责任公司 | Method and device for reflow soldering with volume flow control |
| CN1938838A (en) * | 2004-03-30 | 2007-03-28 | 株式会社田村制作所 | Heater, reflow apparatus, and solder bump forming method and apparatus |
| CN201201088Y (en) * | 2008-04-25 | 2009-03-04 | 东莞市健时自动化设备有限公司 | Multiple proportionality jet current device |
| CN102015184A (en) * | 2008-04-28 | 2011-04-13 | 尔萨有限公司 | Device and method for thermally treating workpieces in particular by convective heat transfer |
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| CN103286408A (en) | 2013-09-11 |
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