CN209435565U - A kind of BGA sealing-off heating device - Google Patents
A kind of BGA sealing-off heating device Download PDFInfo
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- CN209435565U CN209435565U CN201821691393.5U CN201821691393U CN209435565U CN 209435565 U CN209435565 U CN 209435565U CN 201821691393 U CN201821691393 U CN 201821691393U CN 209435565 U CN209435565 U CN 209435565U
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- sealing
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- heating device
- heating
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Abstract
The utility model discloses a kind of BGA sealing-off heating devices, it includes sealing-off heating module (3), it is provided with heater mounting hole (4) on the sealing-off heating module (3), heater (5) is installed in heater mounting hole (4)；The BGA sealing-off heating device can be realized contact heated at constant temperature, heat conduction efficiency height and homogeneous heating, heating module is compact-sized, it is contacted when operation with to sealing-off bga chip periphery component zero, the component of chip perimeter non-refractory will not be damaged, the integrality of monolith PCBA board is effectively ensured, effectively reduces maintenance risk, is particularly suitable for the sealing-off operation of high value PCBA board.
Description
Technical field
The utility model relates to a kind of sealing-off heating device, in particular to a kind of sealing-off heating device for bga chip.
Background technique
The BGA in IC package field (welded ball array encapsulation) technology has widely applied the mainboard in various electronic equipments at present
In, bga chip size is small, and the spacing very little between pin, solder joint has very big operation in welding or failure sealing-off
Difficulty.
Existing BGA sealing-off system is mostly Hot-blast Heating sealing-off Rework station, and bga chip own dimensions are small, tin ball is small, solder joint
Closely spaced feature makes Hot-blast Heating sealing-off Rework station operation difficulty in sealing-off bga chip very big, particularly with PCBA board
The situation of upper component high-density arrangement needs the bga chip periphery of sealing-off often to there is the component of non-refractory, BGA core
Sealing-off temperature is generally up to 230-280 DEG C when piece is dismantled, and the tolerable temperature of many plastics components is generally mostly at 110-180 DEG C
Between, the hot wind that the hot-air system of Hot-blast Heating sealing-off Rework station is produced by boasting will certainly damage the component of surrounding non-refractory,
Although can do enclosing processing in operation, strict encirclement measure is often difficult to accomplish, PCBA board tightens solid matter cloth sometimes
The distance between two devices are possibly even less than 1mm, and at this moment enclosure device would become hard to be set.
Because there are above-mentioned problems and defect in actual operation in the prior art, bga chip sealing-off at present, damage dimension
Repair the operations such as replacement and face huge difficult problem, with the universal of bga chip and widely apply, the sealing-off technology of bga chip need into
One step is promoted.
Summary of the invention
The purpose of this utility model is to provide a kind of BGA sealing-off heating devices, to overcome the defect of the above-mentioned prior art
And deficiency, especially solve the problems, such as that bga chip sealing-off is difficult under component high-density arrangement situation in PCBA board, is not influencing week
The smooth sealing-off of bga chip is realized under the premise of the component of side.
The utility model adopts the following technical scheme that realize:
A kind of BGA sealing-off heating device, the BGA sealing-off heating device include a sealing-off heating module, the sealing-off heated mould
Block has first end face, which is used for and is directly contacted to sealing-off bga chip to heat to sealing-off bga chip.
Further, above-mentioned first end face, which has, is enough reality with the consistent shape in surface to sealing-off bga chip, the shape
Existing first end face and to the direct face contact in consistent manner of shape between sealing-off bga chip.
Further, sealing-off heating module is integrally in cubic shaped, the cubic shaped be sufficient to make first end face with
To shape between sealing-off bga chip in consistent manner direct face contact while sealing-off heating module it is whole not and to sealing-off bga chip
Except other components directly contact.
Further, sealing-off heating module also has the second end face opposite disposed with first end face, at least one fever
Body mounting hole by through second end face and not through first end face in a manner of be arranged in sealing-off heating module.
Preferably, an at least heater is set at least one heater mounting hole to heat sealing-off heating module.
Preferably, an at least heater is that can be carried out thermostatically controlled welding stage heat generating core.
Preferably, at least the number of a heater can be less than the number of at least one heater mounting hole.
Preferably, sealing-off heating module is aluminum heat carrier, copper heat carrier or silver heat carrier.
Preferably, the whole longitudinal axis along sealing-off heating module of at least one of heater mounting hole extends and installs
There is heater.
Preferably, at least one heater mounting hole is drilling.
Compared to the prior art, the utility model has the following beneficial effects:
This kind of BGA sealing-off heating device of the utility model, using direct contact type heating method, heat quickly directly and
Uniformly, compared with traditional Hot-blast Heating, toward the phenomenon that surrounding diffusion after blowing down there is no hot wind, bga chip week will not be damaged
The integrality of monolith PCBA board is effectively ensured in the component of side non-refractory, will not damage because of one bga chip of sealing-off
Maintenance risk can be effectively reduced in other parts in PCBA board.
Detailed description of the invention
Fig. 1 is a kind of structural decomposition diagram for BGA sealing-off heating device that the utility model first embodiment provides；
Fig. 2 is a kind of structure combination diagram for BGA sealing-off heating device that the utility model first embodiment provides；
Fig. 3 is a kind of structural decomposition diagram for BGA sealing-off heating device that the utility model second embodiment provides；
Fig. 4 is a kind of structure combination diagram for BGA sealing-off heating device that the utility model second embodiment provides.
Appended drawing reference:
To sealing-off PCBA board 1, to sealing-off bga chip 2, sealing-off heating module 3, heater mounting hole 4, heater 5.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and specifically
Embodiment is described in further details the utility model.It should be appreciated that specific embodiment described herein is used only for solving
The utility model is released, and should not be understood as limiting the present invention.
A kind of BGA sealing-off heating device provided according to the utility model first embodiment is described referring to Fig. 1 and 2.
In Fig. 1, according to a kind of BGA sealing-off heating device of the utility model embodiment comprising sealing-off heating module 3, the sealing-off
At least one heater mounting hole 4 is provided on heating module 3, heater mounting hole 4 can be used for installing heater 5.In Fig. 2
In, heater 5 is installed in heater mounting hole 4, for providing heat in the work of BGA sealing-off heating device.
Well known, good heat dissipation, therefore inherently a excellent heat carrier of bga chip are needed when bga chip works.
It specifically, only need to be straight by the sealing-off heating module 3 of the BGA sealing-off heating device of the utility model when sealing-off operation
Connect with to being contacted to sealing-off bga chip 2 in sealing-off PCBA board 1, the heat of such sealing-off heating module 3 will be directly conducted to
Sealing-off bga chip 2 itself, and be subsequently conducted on each solder joint of sealing-off bga chip 2, make melts soldering tin, it can smooth sealing-off
Bga chip 2.
When the BGA sealing-off heating device work of the utility model, used between sealing-off heating module 3 and sealing-off bga chip 2
Direct contact type heating method can reduce sealing-off temperature relative to the air heat transfer working method of traditional hot wind sealing-off platform
At least 20 DEG C.
Further, the heater 5 of the BGA sealing-off heating device of the utility model is built in the hair of sealing-off heating module 3
In hot body mounting hole 4, the overall dimensions of sealing-off heating module 3 are desirably reduced, in sealing-off heating module 3 and to sealing-off BGA
Chip 2 can be accomplished to contact with the component zero to 2 periphery of sealing-off bga chip when directly contacting, being capable of effective protection periphery member
Device is not damaged.
Particularly, be realize cramped construction purpose, sealing-off heating module 3 can whole design cube form, installation
The depth in hole 4 can be designed to suitable with 5 length of heater.
Particularly, to realize uniformly heated purpose, at least one heater mounting hole 4 is whole along sealing-off heating module
3 longitudinal axis extends, and heater 5 is preferentially arranged in the heater mounting hole 4.
It will be appreciated by persons skilled in the art that the excellent material system of heating conduction can be used in sealing-off heating module 3
Make, especially thermal conductive metallic material, such as aluminium, copper, silver.
Advantageously, in order to improve sealing-off heating module 3 and to the heat conduction efficiency between sealing-off bga chip 2, this is practical new
The heating binding face of the sealing-off heating module 3 of the BGA sealing-off heating device of type, which can be processed into, can be realized and bga chip surface
The shape of complete face contact, especially possesses consistent geometric dimension with bga chip surface.
It will be appreciated by persons skilled in the art that above-mentioned sealing-off heating module 3 can be by various suitable in the prior art
Processing and forming technology manufacture, such as machine；Above-mentioned heater mounting hole 4 can be the brill for passing through drilling machine-shaping
Hole.
Particularly advantageously, the sealing-off operation of bga chip needs good thermostatic control, for this purpose, the utility model
The heater 5 of BGA sealing-off heating device selects welding stage heat generating core, by the temperature control system of welding stage, make BGA sealing-off heating device at
For a contact constant-temperature heating system.
It will be appreciated by persons skilled in the art that existing tradition welding stage and its welding stage heat generating core are able to satisfy operation and want
It asks, details are not described herein for their structure and working principle.
In addition, Fig. 3 and 4 describes a kind of BGA sealing-off heating device provided according to the utility model second embodiment.Its
In, identical appended drawing reference illustrates component as in the first embodiment, the difference is that, this kind of BGA sealing-off heating
The top setting of the sealing-off heating module 3 of device is mounted on heater 5 in each mounting hole 4 there are five mounting hole 4, more
The heater 5 of quantity, which is used, can be improved heating efficiency, 3 homogeneous heating of sealing-off heating module.
It will be appreciated by those skilled in the art that the specific number of mounting hole 4 and the specific number of heater 5 can be with
According to job requirements flexible choice, do not limited by specific embodiment.
The BGA sealing-off heating device of the utility model can be realized contact heated at constant temperature, and heat conduction efficiency is high and heats
Uniformly, heating module is compact-sized, and when operation contacts with to sealing-off bga chip periphery component zero, will not damage chip perimeter
The integrality of monolith PCBA board is effectively ensured in the component of non-refractory, effectively reduces maintenance risk, is particularly suitable for high price
It is worth the sealing-off operation of PCBA board.
Although the embodiments of the present invention have been shown and described above, it is to be understood that above-described embodiment is
Illustratively, it should not be understood as limiting the present invention, those skilled in the art are not departing from the utility model
Principle and objective in the case where above-described embodiment can be changed in the scope of the utility model, modify, replace and
Modification.
Claims (10)
1. a kind of BGA sealing-off heating device, which is characterized in that the BGA sealing-off heating device includes a sealing-off heating module (3),
The sealing-off heating module (3) has first end face, and the first end face with to sealing-off bga chip (2) for directly contacting to add
It is hot described to sealing-off bga chip (2).
2. BGA sealing-off heating device according to claim 1, which is characterized in that the first end face have with it is described to
The consistent shape in surface of sealing-off bga chip (2), the shape are enough to realize the first end face and described to sealing-off bga chip
(2) shape direct face contact in consistent manner between.
3. BGA sealing-off heating device according to claim 2, which is characterized in that the sealing-off heating module (3) is whole to be in
Cubic shaped, the cubic shaped are sufficient to make the first end face and described kiss to shape between sealing-off bga chip (2)
Close the sealing-off heating module (3) while direct face contact it is whole not with it is other except (2) to sealing-off bga chip
Component directly contacts.
4. BGA sealing-off heating device described in any one of -3 according to claim 1, which is characterized in that the sealing-off heating
Module (3) also has the second end face opposite disposed with the first end face, at least one heater mounting hole (4) is to run through institute
It states second end face and is arranged in the sealing-off heating module (3) not through the mode of the first end face.
5. BGA sealing-off heating device according to claim 4, which is characterized in that an at least heater (5) is set to described
To heat the sealing-off heating module (3) at least one heater mounting hole (4).
6. BGA sealing-off heating device according to claim 5, which is characterized in that an at least heater (5) is can be into
The thermostatically controlled welding stage heat generating core of row.
7. BGA sealing-off heating device according to claim 4, which is characterized in that the number of an at least heater (5)
It can be less than the number of at least one heater mounting hole (4).
8. BGA sealing-off heating device described in any one of -3 according to claim 1, which is characterized in that the sealing-off heating
Module (3) is aluminum heat carrier, copper heat carrier or silver heat carrier.
9. BGA sealing-off heating device according to claim 5, which is characterized in that in the heater mounting hole (4) extremely
Few entirety extends along the longitudinal axis of the sealing-off heating module (3) and is equipped with the heater (5).
10. BGA sealing-off heating device according to claim 4, which is characterized in that at least one described heater mounting hole
It (4) is drilling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821691393.5U CN209435565U (en) | 2018-10-18 | 2018-10-18 | A kind of BGA sealing-off heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821691393.5U CN209435565U (en) | 2018-10-18 | 2018-10-18 | A kind of BGA sealing-off heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209435565U true CN209435565U (en) | 2019-09-24 |
Family
ID=67966558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821691393.5U Active CN209435565U (en) | 2018-10-18 | 2018-10-18 | A kind of BGA sealing-off heating device |
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| CN (1) | CN209435565U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113770151A (en) * | 2021-07-20 | 2021-12-10 | 信利光电股份有限公司 | Integrated circuit recycling equipment and method |
| CN113873775A (en) * | 2021-12-01 | 2021-12-31 | 江苏金晓电子信息股份有限公司 | High-density display screen maintenance enclosure jig and maintenance method |
| CN117279228A (en) * | 2023-10-20 | 2023-12-22 | 东莞市华方电子技术有限公司 | Chip element welding seat |
-
2018
- 2018-10-18 CN CN201821691393.5U patent/CN209435565U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113770151A (en) * | 2021-07-20 | 2021-12-10 | 信利光电股份有限公司 | Integrated circuit recycling equipment and method |
| CN113873775A (en) * | 2021-12-01 | 2021-12-31 | 江苏金晓电子信息股份有限公司 | High-density display screen maintenance enclosure jig and maintenance method |
| CN113873775B (en) * | 2021-12-01 | 2022-04-01 | 江苏金晓电子信息股份有限公司 | High-density display screen PCB maintenance enclosure jig and maintenance method |
| CN117279228A (en) * | 2023-10-20 | 2023-12-22 | 东莞市华方电子技术有限公司 | Chip element welding seat |
| CN117279228B (en) * | 2023-10-20 | 2024-05-14 | 东莞市华方电子技术有限公司 | Chip element welding seat |
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