CN103249852A - Material for electrical/electronic use - Google Patents

Material for electrical/electronic use Download PDF

Info

Publication number
CN103249852A
CN103249852A CN2011800591716A CN201180059171A CN103249852A CN 103249852 A CN103249852 A CN 103249852A CN 2011800591716 A CN2011800591716 A CN 2011800591716A CN 201180059171 A CN201180059171 A CN 201180059171A CN 103249852 A CN103249852 A CN 103249852A
Authority
CN
China
Prior art keywords
quality
alloy
electrical
hardness
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800591716A
Other languages
Chinese (zh)
Inventor
宍野龙
宫本健一朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokuriki Honten Co Ltd
Original Assignee
Tokuriki Honten Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokuriki Honten Co Ltd filed Critical Tokuriki Honten Co Ltd
Publication of CN103249852A publication Critical patent/CN103249852A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C30/00—Alloys containing less than 50% by weight of each constituent
    • C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)

Abstract

The present invention provides an electrical/electronic material which has low contact resistance, excellent corrosion resistance, high hardness, high flexing strength and excellent processability. The electrical/electronic material is characterized by being composed of 20-40% by mass of Ag, 20-40% by mass of Pd, 10-30% by mass of Cu and 1.0-20% by mass of Pt and having a hardness of 340-420 HV at the time of precipitation hardening after metal forming and an adequate flexing strength.

Description

The electrical/electronic material
Technical field
The present invention relates to the Ag-Pd-Cu alloy that a kind of electric/electronic is used.
Background technology
The material that is used for electric/electronic, therefore various characteristicses such as general requirement low contact resistance and good corrosion resistance, are extensive use of precious metal alloys such as the high Pt alloy of price, Au alloy, Pd alloy, Ag alloy.
But, with probe pin etc., according to use, except low contact resistance and erosion resistance, also require hardness, wearability etc. as the inspection of semiconductor integrated circuit.
Under these circumstances, preferably use the Pt alloy that under the state of having implemented plastic working, presents high hardness, lr alloy etc. or carry out the Au alloy, Pd alloy etc. (for example, with reference to patent documentation 1) of precipitation hardening.
The prior art document
Patent documentation 1: No. 4176133 communique of Japan's special permission
Summary of the invention
Invent problem to be solved
Use the probe pin for checking, according to checking that object uses all kinds (shape) such as cantilevered, rectilinear (cobra), spring loaded, desired characteristic also has nothing in common with each other.
Paying attention under the situation of hardness, be recommended in the Pt alloy that shows high rigidity under the state of implementing plastic working, lr alloy etc. or under the state of implementing precipitation hardening, show the Au alloy of high rigidity and Pd alloy etc.
But these materials that generally have high rigidity have weak performance (brittleness) for bending.
Therefore, under the situation of the probe pin of the type of front end being implemented bending machining, because of the fatigue for bending part that produces when the bending machining or when being used as the probe pin, the bending part of probe pin is lost sometimes.
Therefore, under the situation of the probe pin of the type of front end being implemented bending machining, then require to also have on the basis of low contact resistance, erosion resistance, hardness the material of buckling strength.
Be used for solving the method for problem
Therefore, the present invention is by adding the Pt as element-specific of 1.0～20 quality % in the Cu of Pd, 10～30 quality % of Ag, 20～40 quality % of 20～40 quality %, form a kind of electrical/electronic material, its mechanical characteristics as alloy is improved, namely, hardness during precipitation hardening after the viscous deformation is 340～420HV, and buckling strength improves and erosion resistance improves.
Herein, the reason of the addition of Pt employing 1.0～20 quality % is in order to improve buckling strength, if less than 1.0 quality %, then can't to obtain to improve the effect of buckling strength, if surpass 20 quality %, the then hardness that can't obtain to stipulate.
In Ag-Pd-Cu, added in the alloy of Pt, as the interpolation element that improves characteristic, also added at least a among Re, Rh, Co, Ni, Si, Sn, Zn, B, the In of Au, 0.1～3.0 quality % of 0.1～10 quality % according to purposes.
In addition, it is in order to improve hardness and to obtain scale resistance that Au adopts the reason of 0.1～10 quality %, if less than 0.1 quality %, this effect not then is if surpass 10 quality %, then processibility variation.
In addition, add Re, Rh, Co, Ni, Si, Sn, Zn, the B of 0.1～3.0 quality %, at least a reason among the In is in order to improve hardness, if less than 0.1 quality %, this effect not then is if surpass 3.0 quality %, then processibility variation.Re, Rh and Ni also bring into play the effect of the effect material that makes the crystal grain granular.
The invention effect
According to electrical/electronic material of the present invention, can become the low and good corrosion resistance of contact resistance, hardness height, buckling strength is big and processibility is good material.
Description of drawings
Fig. 1 is the explanatory view of expression cripping test.
Embodiment
According to table 1 explanation embodiments of the invention.
In addition, in the present embodiment, make the alloy pig that in the Ag-Pd-Cu alloy, has added Pt by vacuum melting
After removing fusion such as shrinkage cavity defective part, repeat Wire Drawing and solution treatment (at 800 ℃ * 1hrH 2And N 2Mixed atmosphere in) extremely
Figure BDA00003319474900031
Become final section decrement to be about 75% alloy as test film Wire Drawing The condition of precipitation hardening is at H 2And N 2Mixed atmosphere in carry out with 300～500 ℃ * 1hr.In addition, the measurement of hardness of test film is the mensuration of carrying out surface hardness with Vickers pyramid hardness testing machine with HV0.2.
The investigation of buckling strength is used the anchor clamps restraint test sheet of R0.5 as shown in Figure 1, bends repeatedly till test film is lost, and investigation reaches the bending number of times of losing.In addition, with moment of crooked 90 degree as counting once, refer to not be bent to 90 and spend for 0 time.
The composition of each embodiment of table 1 expression, expression reach the hardness after bending number of times, processing back and the precipitation hardening of losing.
[table 1]
Figure BDA00003319474900041
According to the result of table 1, can confirm in Ag-Pd-Cu, not add the precipitation hardening material of the comparative example of Pt, a little less than its buckling strength, also do not bend above will losing twice, but the embodiment 1 that has added Pt can bend more than twice, buckling strength improves.
Equally, the precipitation hardening material that has added at least a alloy among Pt and Au, Re, Rh, Co, Ni, Si, Sn, Zn, B, the In in Ag-Pd-Cu of embodiment 2～6 also can bend more than twice.

Claims (2)

1. electrical/electronic material is characterized in that:
Contain the Cu of Pd, 10～30 quality % of Ag, 20～40 quality % of 20～40 quality % and the Pt of 1.0～20 quality %, the hardness during precipitation hardening after the plastic working is 340～420HV, and has buckling strength.
2. electrical/electronic material is characterized in that:
In the alloy of claim 1, according to purposes, as the interpolation element that improves characteristic, add at least a among Re, Rh, Co, Ni, Si, Sn, Zn, B, the In of Au, 0.1～3.0 quality % of 0.1～10 quality %.
CN2011800591716A 2010-12-09 2011-07-28 Material for electrical/electronic use Pending CN103249852A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010275103 2010-12-09
JP2010-275103 2010-12-09
PCT/JP2011/067375 WO2012077378A1 (en) 2010-12-09 2011-07-28 Material for electrical/electronic use

Publications (1)

Publication Number Publication Date
CN103249852A true CN103249852A (en) 2013-08-14

Family

ID=46206884

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800591716A Pending CN103249852A (en) 2010-12-09 2011-07-28 Material for electrical/electronic use

Country Status (6)

Country Link
US (1) US20130292008A1 (en)
JP (1) JPWO2012077378A1 (en)
KR (1) KR20140001931A (en)
CN (1) CN103249852A (en)
TW (1) TW201229248A (en)
WO (1) WO2012077378A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110983147A (en) * 2019-12-20 2020-04-10 有研亿金新材料有限公司 High-strength palladium-based weak electrical contact material and preparation method thereof
CN111511939A (en) * 2017-12-27 2020-08-07 株式会社德力本店 Precipitation hardening type Ag-Pd-Cu-In-B alloy

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5767484B2 (en) * 2011-02-01 2015-08-19 ササキジェム株式会社 Silver base alloy
US20140377129A1 (en) * 2011-12-27 2014-12-25 Tokuriki Honten Co., Ltd. Palladium Alloy for Electric and Electronic Appliances
US9804198B2 (en) 2012-08-03 2017-10-31 Yamamoto Precious Metal Co., Ltd. Alloy material, contact probe, and connection terminal
KR20150056556A (en) * 2012-09-28 2015-05-26 가부시키가이샤 토쿠리키 혼텐 Ag-Pd-Cu-Co ALLOY FOR USES IN ELECTRICAL/ELECTRONIC DEVICES
CN104646846B (en) * 2013-11-21 2017-09-26 北京有色金属与稀土应用研究所 Silver-bearing copper Polarium brazing wire and preparation method thereof
DE102014214683A1 (en) * 2014-07-25 2016-01-28 Heraeus Deutschland GmbH & Co. KG Sputtering target based on a silver alloy
JP6647075B2 (en) * 2016-02-19 2020-02-14 日本発條株式会社 Alloy materials, contact probes and connection terminals
EP3889280A4 (en) * 2018-11-30 2022-03-16 Tanaka Kikinzoku Kogyo K.K. Conductive material having excellent abrasion resistance and heat resistance
JP7072126B1 (en) 2022-02-10 2022-05-19 田中貴金属工業株式会社 Material for probe pins made of Ag-Pd-Cu alloy
JP2024037261A (en) * 2022-09-07 2024-03-19 株式会社ヨコオ probe
JP2024037196A (en) * 2022-09-07 2024-03-19 石福金属興業株式会社 Alloy material for probe pin

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5776706A (en) * 1980-10-30 1982-05-13 Shinko Electric Ind Co Method of producing electric contact piece
JP2000137042A (en) * 1998-08-24 2000-05-16 Japan Electronic Materials Corp Probe joined with different kinds of metals, and manufacture thereof
JP2007271472A (en) * 2006-03-31 2007-10-18 Kanai Hiroaki Dissimilar metal junction probe pin and its manufacturing method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967354A (en) * 1982-10-07 1984-04-17 Tanaka Kikinzoku Kogyo Kk Sliding contact material
JPS5967355A (en) * 1982-10-07 1984-04-17 Tanaka Kikinzoku Kogyo Kk Sliding contact material
JPS5970740A (en) * 1982-10-15 1984-04-21 Tanaka Kikinzoku Kogyo Kk Sliding contact material
JPS5970737A (en) * 1982-10-15 1984-04-21 Tanaka Kikinzoku Kogyo Kk Sliding contact material
US5484569A (en) * 1994-08-12 1996-01-16 The J. M. Ney Company Silver palladium alloy
US5833774A (en) * 1997-04-10 1998-11-10 The J. M. Ney Company High strength silver palladium alloy
JP4176133B1 (en) * 2007-06-06 2008-11-05 田中貴金属工業株式会社 Probe pin
JP5657881B2 (en) * 2009-12-09 2015-01-21 株式会社徳力本店 Probe pin material

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5776706A (en) * 1980-10-30 1982-05-13 Shinko Electric Ind Co Method of producing electric contact piece
JP2000137042A (en) * 1998-08-24 2000-05-16 Japan Electronic Materials Corp Probe joined with different kinds of metals, and manufacture thereof
JP2007271472A (en) * 2006-03-31 2007-10-18 Kanai Hiroaki Dissimilar metal junction probe pin and its manufacturing method

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
张书仁 等: "钯银铜金铂锌六元合金的研究", 《贵金属》, vol. 4, no. 3, 31 August 1983 (1983-08-31) *
李银娥 等: "钯银铜金铂合金的研究", 《稀有金属》, vol. 30, 31 December 2006 (2006-12-31) *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111511939A (en) * 2017-12-27 2020-08-07 株式会社德力本店 Precipitation hardening type Ag-Pd-Cu-In-B alloy
CN111511939B (en) * 2017-12-27 2021-09-14 株式会社德力本店 Precipitation hardening type Ag-Pd-Cu-In-B alloy
CN110983147A (en) * 2019-12-20 2020-04-10 有研亿金新材料有限公司 High-strength palladium-based weak electrical contact material and preparation method thereof
CN110983147B (en) * 2019-12-20 2021-05-11 有研亿金新材料有限公司 High-strength palladium-based weak electrical contact material and preparation method thereof

Also Published As

Publication number Publication date
TW201229248A (en) 2012-07-16
WO2012077378A1 (en) 2012-06-14
KR20140001931A (en) 2014-01-07
JPWO2012077378A1 (en) 2014-05-19
US20130292008A1 (en) 2013-11-07

Similar Documents

Publication Publication Date Title
CN103249852A (en) Material for electrical/electronic use
WO2013099682A1 (en) Pd ALLOY FOR ELECTRIC/ELECTRONIC DEVICES
JP6012638B2 (en) Press-fit terminal and electronic component using the same
US20150197834A1 (en) Ag-Pd-Cu-Co ALLOY FOR USES IN ELECTRICAL/ELECTRONIC DEVICES
JP5968668B2 (en) Metal materials for electronic parts
JP5284526B1 (en) Metal material for electronic parts and method for producing the same
JP6728057B2 (en) Alloy materials, contact probes and connection terminals
TWI488733B (en) Metal material for electronic parts and manufacturing method thereof
JP6550457B2 (en) Alloy material, contact probe and connection terminal
JP2023175747A (en) Palladium-copper-silver-ruthenium alloy
EP2436790B1 (en) Silver alloy that is appropriately usable in probe pins having excellent contact resistance and excellent anti-stain properties
JP6181392B2 (en) Cu-Ni-Si copper alloy
JP2015137372A (en) Cu-Fe BASED ALLOY WIRE FOR CONNECTOR PIN, AND CONNECTOR
JP5897083B1 (en) Conductive material for connecting parts with excellent resistance to fine sliding wear
KR100902201B1 (en) Copper alloy for electrical connecting device
CN109155208B (en) Coating material for electrical contacts and method for producing said coating material
KR20230160852A (en) Alloy material for probe pins
TW201348466A (en) Rhodium alloy for the production of a wire for test needles
JP5761400B1 (en) Wire for connector pin, method for manufacturing the same, and connector
JP2019026921A (en) Cu ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, AND PROBE PIN USING THE SAME
US20230250513A1 (en) PROBE PIN MATERIAL INCLUDING Ag-Pd-Cu-BASED ALLOY
WO2015093270A1 (en) Cu-fe alloy rolled plate for terminal fitting and terminal fitting
JP2017021935A (en) Press-fit terminal
JP2023145888A (en) Alloy material for probe pins

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20130814