CN103249525A - Composition for polishing glass substrate, and polishing slurry - Google Patents
Composition for polishing glass substrate, and polishing slurry Download PDFInfo
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- CN103249525A CN103249525A CN2011800584905A CN201180058490A CN103249525A CN 103249525 A CN103249525 A CN 103249525A CN 2011800584905 A CN2011800584905 A CN 2011800584905A CN 201180058490 A CN201180058490 A CN 201180058490A CN 103249525 A CN103249525 A CN 103249525A
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- China
- Prior art keywords
- polishing
- composition
- glass substrate
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Classifications
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
- G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
Abstract
This invention provides a polishing slurry that can mitigate roughness of the finished surface and surface unevenness in the fabrication of a glass substrate, and provides a polishing composition used to prepare the polishing slurry. This composition for polishing a glass substrate and the polishing slurry which contains abrasive grains and the polishing composition include components (A), (B), and as required, (C) and/or (D), where (A) is a tetrazole derivative having at least one group selected from a mercapto group, an alkylthio group, and an alkyl group, (B) is water, (C) is a polysaccharide, and (D) is an amine.
Description
Technical field
The present invention relates to hard disk with glass substrate, CD with glass substrate, plasma scope (PDP) with glass substrate, LCD (LCD) with glass substrate and photomask with various polished glass substrates such as glass substrates with composition (below, be called composition for use in polishing) and use its polishing slurries.In more detail, the composition for use in polishing and the polishing slurries that relate to the improvement excellence of polished surface roughness and concave-convex surface defective.
Background technology
In recent years, require the high record densityization of hard disk day by day.In order to improve the packing density of hard disk drive, and in order to improve the detection sensitivity of magnetic signal, be necessary further to dwindle the flying height between magnetic head and the disk.For this reason, in glass substrate, improve the polished surface roughness and the concave-convex surface defective becomes important topic.
The trend of this high record densityization is accelerated year by year, and the requirement of polished glass substrate slurry is increased day by day.Desired project is low with the polished surface roughness to be representative, for blemish such as little hole, microspike and microscratch being disappeared and improving the production capacity of glass substrate, is requiring to improve polishing velocity.
As above-mentioned composition for use in polishing, proposed various be used to the composition for use in polishing that obtains the high quality glass substrate.
For example in patent documentation 1, the polishing slurries that contains ammonia or have the aliphatic amine of primary amino radical has been proposed.In addition, in patent documentation 2, proposed to contain the polishing slurries of carbonate or sulfate.But, in using the composition for use in polishing of prior art, have problem aspect the polished surface roughness that can not obtain to be suitable for high record densityization.
The prior art document
Patent documentation
Patent documentation 1:WO2004/100242
Patent documentation 2: the spy opens 2006-315160
Summary of the invention
The problem that invention will solve
Problem of the present invention is to provide: in the processing of glass substrate, can improve the polishing slurries of polished surface roughness and concave-convex surface defective and for the preparation of the composition for use in polishing of this polishing slurries.
The inventor finds, specific composition for use in polishing and contain the polishing slurries that polishes abrasive particle and can solve above-mentioned problem has so far been finished the present invention.
Solve the means of problem
The present invention relates to following invention.
1. polished glass substrate composition contains (A) and (B) composition,
(A) has the terazole derivatives of at least a group in selected from mercapto, alkylthio group and the alkyl
(B) water.
2. polished glass substrate composition contains (A), (B) and (C) composition,
(A) has the terazole derivatives of at least a group in selected from mercapto, alkylthio group and the alkyl
(B) water
(C) high molecular polysaccharide.
3. polished glass substrate composition contains (A), (B), (C) and (D) composition,
(A) have the terazole derivatives of at least a group in selected from mercapto, alkylthio group and the alkyl,
(B) water
(C) high molecular polysaccharide
(D) amine.
4. above-mentioned 1～3 each described composition contains (A) 0.01～20 weight %, (C) 0.01～20 weight %, (D) 0.01～20 weight %, (B) surplus.
5. above-mentioned 1～4 each described composition, wherein, glass substrate is the hard disk glass substrate.
6. polishing slurries contains above-mentioned each described composition for use in polishing and polishing abrasive particle.
The invention effect
According to the present invention, in the processing of various glass substrates, can improve polished surface roughness and concave-convex surface defective.And then can improve polishing velocity.
The specific embodiment
Below describe each composition that polished glass substrate of the present invention is used composition in detail.
(A) in the terazole derivatives of at least a group with selected from mercapto, alkylthio group and alkyl, as alkylthio group, for example can enumerate the lower alkylthio of carbon number 1～4, as alkyl, for example can enumerate the low alkyl group of carbon number 1～4.Specifically can enumerate 5-sulfydryl-1-methyl tetrazolium, 1-[2-(dimethylamino) ethyl]-5-sulfydryl-1H-tetrazolium, 5-(methyl mercapto)-1H-tetrazolium, 5-(ethylmercapto group)-1H-tetrazolium, 5-methyl tetrazolium, 5-ethyl tetrazolium etc.
(B) as water, Purified Waters such as preferred ion exchanged water or pure water.
(C) as high molecular polysaccharide, for example can enumerate pulullan polysaccharide, amylose, amylopectin, glycogen, dextrin, hyaluronic acid etc.
(D) amine does not have particular determination, for example can enumerate isopropylamine, cyclohexylamine, diethylamine, the chain of carbon numbers such as triethylamine 1～10 or the alkylamine of ring-type, MEA, diethanol amine, triethanolamine, monoisopropanolamine, diisopropanolamine (DIPA), triisopropanolamine, N-methyl MEA, N methyldiethanol amine, the N-ethyldiethanolamine, N, the N-dimethylethanolamine, N, the N-diethyl ethylene diamine, diglycolamine, 2-amino-2-methyl-1-propanol, n-butanol amine, the isobutyl hydramine, the alkanolamine of carbon numbers 1～10 such as tert-butyl alcohol amine, morpholine, carbon numbers 4～10 such as N-(2-amino-ethyl) piperazine are preferably the cyclic amine of carbon number 4～6 etc.In these amine, preferred formula
(R
2)mN(-R
1-OH)n
(R
1The alkylidene of the straight or branched of expression carbon number 2～5, R
2The alkyl of expression hydrogen atom or carbon number 1～3.M be 0,1 or 2, n be 1～3 integer, m+n=3.) expression amine, morpholine, N-(2-amino-ethyl) piperazine.
And then except these compositions, polyalcohols can also suit to use.As polyalcohols, the alkyl ether of polyalcohol and polyalcohol be can enumerate, ethylene glycol, diethylene glycol (DEG), triethylene glycol, tetraethylene glycol, propane diols, dipropylene glycol, tripropylene glycol, BC, hexylene glycol, butanediol, butyldiglycol, glycerine, glycol monomethyl methyl ether, diethylene glycol dimethyl ether, glycol monomethyl isopropyl ether, ethylene glycol monobutyl ether, ethylene glycol dimethyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, propane diols single-butyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, D-sorbite, sucrose etc. for example can be enumerated.
The content of the composition in the composition for use in polishing (A)～(D) is not particularly limited, and as the content of composition (A), is preferably 0.01～20 weight %, 0.05～10 weight % more preferably, and more preferably 0.1～5 weight % most preferably is 1～5 weight %.As long as the content of composition (A) just can obtain the effect of improving of polished surface roughness and concave-convex surface defective in above-mentioned scope.And then can also improve polishing velocity.
As the content of high molecular polysaccharide (C), be preferably 0.01～20 weight %, 0.05～10 weight % more preferably, more preferably 0.1～5 weight % most preferably is 1～5 weight %.As long as in above-mentioned scope, particularly can obtaining the improvement of concave-convex surface defective, the content of composition (C) imitates.
As the content of amine (D), be preferably 0.01～20 weight %, 0.05～10 weight % more preferably, more preferably 0.1～5 weight % most preferably is 1～5 weight %.As long as the content of composition (D) can be adjusted to alkalescence with pH in above-mentioned scope, obtain the effect of improving of polished surface roughness and concave-convex surface defective.Preferred pH scope is 8～13.
The content of water (B) is surplus.
By in composition for use in polishing of the present invention, disperseing the polishing abrasive particle, can obtain polishing slurries of the present invention.As the polishing abrasive particle, for example can adopt various known polishing abrasive particles such as cataloid, vapor deposition silica, diamond, aluminium oxide, ceria, zirconia, titanium oxide.Wherein, as the polishing abrasive particle, preferred cataloid and zirconia.As the size of cataloid, general, average grain diameter can be 0.001～1 μ m, is preferably 0.001～0.5 μ m, more preferably about 0.001～0.2 μ m.The content of the cataloid in the polishing slurries is not particularly limited, and is generally below the 40 weight %, is preferably 0.1～20 weight %.As zirconic size, general, average grain diameter can be 0.1～15 μ m, is preferably 0.1～10 μ m, more preferably about 0.1～5 μ m.Zirconic content in the polishing slurries is not particularly limited, and below the common 20 weight %, is preferably 0.1～10 weight %.
Being not particularly limited with composition and the polished glass substrate of polishing slurries by polished glass substrate of the present invention, is principal component with silicic acid for example, can also contain metallic compounds such as aluminium oxide, sodium oxide molybdena, potassium oxide in glass.
Polishing slurries of the present invention is the polishing slurries for the processed glass substrate, with the polishing slurries that is used for processing hard disk NiP alloy substrate or common different for processing iron or the water-soluble machining of aluminum, water-soluble grinding or water-soluble polishing working fluid.In above-mentioned common processing, liquid generally recycles, and is big with polishing slurries of the present invention difference on anticorrosion, froth breaking, desired performances such as secondary performance such as antirust.
Embodiment
In embodiment and comparative example shown below, carry out polishing evaluation shown below.But the present invention is not limited to embodiment.
Embodiment 1～8 and comparative example 1～6
Mix the composition shown in following table 1～3 (numerical value is weight %), preparation polished glass substrate composition.Water uses pure water.The N-of comparative example 1 (2-amino-ethyl) piperazine (AEP) is at WO2004/100242(patent documentation 1) in the aliphatic amine with primary amino radical that uses.The potash of comparative example 2 is that the spy opens 2006-315160(patent documentation 2) the middle carbonate that uses.The 1H-tetrazolium of comparative example 4～6, imidazoles, BTA are the heterocyclic compounds that uses in the polishing slurries of metal material usually.
The glass substrate polishing slurries is by after using 2875g pure water dilution 250g composition for use in polishing, add 1875g cataloid slurry (Adelite AT-40: silica concentration 40%, primary particle size 10-20nm), the content for preparing cataloid thus is the polishing slurries of 15 weight %.Use this polishing slurries, carry out the polishing evaluation of hard disk glass substrate.The results are shown in table 1～3.The result of the surface roughness after the polishing of table 1～3 (polished surface roughness), maximum difference of height and polishing velocity be N-(2-amino-ethyl) piperazine (AEP) with comparative example 1 each performance as 1.00 o'clock relatively.
The characteristic of embodiment 1～8 and comparative example 1～6 is measured by the following method.
The polishing evaluating characteristics
To imitate chamois leather cloth (the Supreme RN-R processed of Nitta Haas Co., Ltd.) is arranged on the CMP burnishing device (Nano Factor corporate system NF-300), at 30 rev/mins of revolution 30 rev/min, rotation numbers, the polish pressure 90g/cm of spiraling
2Condition under, supply with polishing slurries with 150ml/ minute speed, the hard disk glass substrate to 2.5 inches of diameters under polishing time 5 minutes polishes evaluation.By estimating surface roughness (polished surface roughness), maximum difference of height and the polishing velocity after polishing, polish evaluation.Illustrated that the assay method of the surface roughness after the polishing, maximum difference of height and polishing velocity is measured by the following method.
Surface roughness
Surface roughness after the polishing (Ra) is used scanning probe microscopy (SPA-400 of SII Nano Technology corporate system), presses the AFM pattern and measures.
Maximum difference of height
Maximum difference of height refers to the highest mountain peak (Rp) of glass surface and the distance between minimum mountain valley (Rv), is the evaluation method of concave-convex surface defective.Maximum difference of height after the polishing uses scanning probe microscopy (SPA-400), presses the AFM pattern and measures.
Polishing velocity
The weight change of the glass substrate before and after the polishing is measured by electronics Libra (LE225D of SARTORIUS K.K. Corp. system), obtains polished amount and polishing velocity.
[table 1]
[table 2]
[table 3]
Can be confirmed that by table 1 composition for use in polishing of embodiment 1～3 improves than comparative example 1～3 aspect surface roughness (polished surface roughness) and maximum difference of height.
Can be confirmed that by table 2 embodiment 2 and 4～6 composition for use in polishing improve than 1H-tetrazolium, imidazoles, the BTA of comparative example 4～6 aspect surface roughness (polished surface roughness) and maximum difference of height.
Can be confirmed by table 3, by adding high molecular polysaccharide, can significantly improve maximum difference of height.And then confirm, by adding high molecular polysaccharide and amine, can take into account surface roughness (polished surface roughness) and maximum difference of height.
Embodiment 9～10 and comparative example 7
Mix the composition shown in the following table 4 (numerical value is weight %), preparation polished glass substrate composition.Water uses pure water.Comparative example 7 only is water.
The glass substrate polishing slurries is by with behind the 170g pure water dilution 10g composition for use in polishing, adds 20g zirconia (Kishida Chemical corporate system, the about 4 μ m of particle diameter), prepares the polishing slurries that zirconic content is 10 weight % thus.Use this polishing slurries, carry out the polishing evaluation of hard disk glass substrate.The result is as shown in table 4.The result of the surface roughness after the polishing of table 4 (polished surface roughness), maximum difference of height and polishing velocity is 1.00 o'clock relatively illustrating by each performance with comparative example 1.
The characteristic of embodiment 9～10 and comparative example 7 is measured by the following method.
The polishing evaluating characteristics
Urethane pad (IC1000 processed of Nitta Haas Co., Ltd.) is arranged on the CMP burnishing device (Nano Factor corporate system NF-300), at 50 rev/mins of revolution 50 rev/min, rotation numbers, the polish pressure 360g/cm of spiraling
2Condition under, supply with polishing slurries with 50ml/ minute speed, the hard disk glass substrate to 2.5 inches of diameters under polishing time 2 minutes polishes evaluation.By estimating surface roughness (polished surface roughness), maximum difference of height and the polishing velocity after polishing, polish evaluation.Illustrated that the assay method of the surface roughness after the polishing, maximum difference of height and polishing velocity is measured by the following method.
Surface roughness
Surface roughness after the polishing (Ra) is used scanning probe microscopy (SPM-9700 processed of Shimadzu Seisakusho Ltd.), presses the DFM pattern and measures.
Maximum difference of height
Maximum difference of height refers to the highest mountain peak (Rp) of glass surface and the distance between minimum mountain valley (Rv), is the evaluation method of concave-convex surface defective.Maximum difference of height after the polishing uses scanning probe microscopy (SPM-9700 processed of Shimadzu Seisakusho Ltd.), presses the DFM pattern and measures.
Polishing velocity
The weight change of the glass substrate before and after the polishing is measured by electronics Libra (LE225D of SARTORIUS K.K. Corp. system), obtains polished amount and polishing velocity.
[table 4]
Can be confirmed that by table 4 composition for use in polishing of embodiment 9～10 improves than comparative example 7 aspect surface roughness (polished surface roughness), maximum difference of height and polishing velocity.
Industrial applicability
According to the present invention, can be used for hard disk with glass substrate, CD with glass substrate, plasma scope (PDP) with glass substrate, LCD (LCD) with glass substrate and photomask with the grinding of various glass substrates such as glass substrate and cutting etc.
Claims (11)
1. polished glass substrate composition contains (A) and (B) composition,
(A) has the terazole derivatives of at least a group in selected from mercapto, alkylthio group and the alkyl
(B) water.
2. polished glass substrate composition contains (A), (B) and (C) composition,
(A) has the terazole derivatives of at least a group in selected from mercapto, alkylthio group and the alkyl
(B) water
(C) high molecular polysaccharide.
3. polished glass substrate composition contains (A), (B), (C) and (D) composition,
(A) has the terazole derivatives of at least a group in selected from mercapto, alkylthio group and the alkyl
(B) water
(C) high molecular polysaccharide
(D) amine.
4. each described composition of claim 1～3, wherein, terazole derivatives is the terazole derivatives with at least a group in the alkyl of the alkylthio group of selected from mercapto, carbon number 1～4 and carbon number 1～4.
5. the described composition of claim 3, wherein, amine is by general formula (R
2) mN (R
1-OH) n(R
1The alkylidene of the straight or branched of expression carbon number 2～5, R
2The alkyl of expression hydrogen atom or carbon number 1～3, m be 0,1 or 2, n be 1～3 integer, m+n=3) Biao Shi amine, morpholine, N-(2-amino-ethyl) piperazine.
6. each described composition of claim 1～5 contains (A) 0.01～20 weight %, (C) 0.01～20 weight %, (D) 0.01～20 weight %, (B) surplus.
7. the described composition of claim 1 contains (A) 0.1～5 weight %, (B) surplus.
8. the described composition of claim 2 contains (A) 0.1～5 weight %, (C) 0.1～5 weight %, (B) surplus.
9. the described composition of claim 3 contains (A) 0.1～5 weight %, (C) 0.1～5 weight %, (D) 0.05～10 weight %, (B) surplus.
10. each described composition of claim 1～9, wherein, glass substrate is the hard disk glass substrate.
11. polishing slurries contains each described composition for use in polishing of claim 1～10 and polishing abrasive particle.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-271434 | 2010-12-06 | ||
| JP2010271434 | 2010-12-06 | ||
| PCT/JP2011/078231 WO2012077693A1 (en) | 2010-12-06 | 2011-11-30 | Composition for polishing glass substrate, and polishing slurry |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103249525A true CN103249525A (en) | 2013-08-14 |
| CN103249525B CN103249525B (en) | 2016-01-06 |
Family
ID=46207180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180058490.5A Expired - Fee Related CN103249525B (en) | 2010-12-06 | 2011-11-30 | Polished glass substrate composition and polishing slurries |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5531236B2 (en) |
| CN (1) | CN103249525B (en) |
| MY (1) | MY160307A (en) |
| SG (1) | SG191038A1 (en) |
| WO (1) | WO2012077693A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6411759B2 (en) * | 2014-03-27 | 2018-10-24 | 株式会社フジミインコーポレーテッド | Polishing composition, method for using the same, and method for producing a substrate |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1288920A (en) * | 1999-09-21 | 2001-03-28 | 不二见株式会社 | Polishing composition |
| JP2001269859A (en) * | 2000-03-27 | 2001-10-02 | Jsr Corp | Aqueous dispersing element for polishing chemical machine |
| JP2004031446A (en) * | 2002-06-21 | 2004-01-29 | Hitachi Chem Co Ltd | Polishing solution and polishing method |
| CN1517389A (en) * | 2002-12-26 | 2004-08-04 | ������������ʽ���� | Grinding liquid composition |
| CN1742066A (en) * | 2003-02-03 | 2006-03-01 | 卡伯特微电子公司 | Method of polishing a silicon-containing dielectric |
| JP2007095841A (en) * | 2005-09-27 | 2007-04-12 | Fujifilm Corp | Chemical mechanical polishing method |
| JP2007311779A (en) * | 2006-04-21 | 2007-11-29 | Hitachi Chem Co Ltd | Cmp abrasive, and method of polishing substrate |
| JP2009094430A (en) * | 2007-10-12 | 2009-04-30 | Adeka Corp | Polishing composition for cmp |
| JP2009117789A (en) * | 2007-10-17 | 2009-05-28 | Hitachi Chem Co Ltd | Polishing solution for cmp and polishing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5080012B2 (en) * | 2006-02-24 | 2012-11-21 | 富士フイルム株式会社 | Polishing liquid for metal |
| JP5473587B2 (en) * | 2009-12-24 | 2014-04-16 | 花王株式会社 | Polishing liquid composition for magnetic disk substrate |
-
2011
- 2011-11-30 WO PCT/JP2011/078231 patent/WO2012077693A1/en active Application Filing
- 2011-11-30 JP JP2012547881A patent/JP5531236B2/en not_active Expired - Fee Related
- 2011-11-30 SG SG2013043716A patent/SG191038A1/en unknown
- 2011-11-30 CN CN201180058490.5A patent/CN103249525B/en not_active Expired - Fee Related
- 2011-11-30 MY MYPI2013001922A patent/MY160307A/en unknown
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1288920A (en) * | 1999-09-21 | 2001-03-28 | 不二见株式会社 | Polishing composition |
| JP2001269859A (en) * | 2000-03-27 | 2001-10-02 | Jsr Corp | Aqueous dispersing element for polishing chemical machine |
| JP2004031446A (en) * | 2002-06-21 | 2004-01-29 | Hitachi Chem Co Ltd | Polishing solution and polishing method |
| CN1517389A (en) * | 2002-12-26 | 2004-08-04 | ������������ʽ���� | Grinding liquid composition |
| CN1742066A (en) * | 2003-02-03 | 2006-03-01 | 卡伯特微电子公司 | Method of polishing a silicon-containing dielectric |
| JP2007095841A (en) * | 2005-09-27 | 2007-04-12 | Fujifilm Corp | Chemical mechanical polishing method |
| JP2007311779A (en) * | 2006-04-21 | 2007-11-29 | Hitachi Chem Co Ltd | Cmp abrasive, and method of polishing substrate |
| JP2009094430A (en) * | 2007-10-12 | 2009-04-30 | Adeka Corp | Polishing composition for cmp |
| JP2009117789A (en) * | 2007-10-17 | 2009-05-28 | Hitachi Chem Co Ltd | Polishing solution for cmp and polishing method |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012077693A1 (en) | 2012-06-14 |
| CN103249525B (en) | 2016-01-06 |
| MY160307A (en) | 2017-02-28 |
| JPWO2012077693A1 (en) | 2014-05-19 |
| JP5531236B2 (en) | 2014-06-25 |
| SG191038A1 (en) | 2013-07-31 |
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