CN103219165A - Super capacitor module and manufacture method thereof - Google Patents
Super capacitor module and manufacture method thereof Download PDFInfo
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- CN103219165A CN103219165A CN2012102872960A CN201210287296A CN103219165A CN 103219165 A CN103219165 A CN 103219165A CN 2012102872960 A CN2012102872960 A CN 2012102872960A CN 201210287296 A CN201210287296 A CN 201210287296A CN 103219165 A CN103219165 A CN 103219165A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02E60/13—Energy storage using capacitors
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Abstract
The invention provides a super capacitor module and a manufacture method thereof. The super capacitor module comprises two separate main substrates, an isolation film and an electrolyte. Each main substrate comprise an insulation plate body and a connection circuit close to a conductive area on a surface of the other main substrate, connected to the conductive area and in electric connection with the outside; the isolation film is arranged between the two main substrates and comprises a film body possessing liquid penetrating performance; the electrolyte is filled between the two main substrates; the conductive area of the main substrates are in cooperation with the isolation film and the electrolyte to form a super capacitor in electric connection with the outside by means of a connecting circuit. The super capacitor module can prevent short circuit caused by direction contact of the conductive area of the isolation film through the isolation film; a super capacitor module with a plurality of super capacitors can have high power density and high power density.
Description
Technical field
The present invention relates to a kind of capacitance module and preparation method thereof, particularly relate to a kind of super-capacitor module and preparation method thereof.
Background technology
Super-capacitor module is to utilize two electrodes and be folded between two electrodes electrolyte to form jointly that electric double layer is theoretical to be set up, and becomes the novel energy-storing device that is different from the traditional capacitance module.
Consult Fig. 1, basic capacitance module 1 is to obtain capacitance by the electrolyte polarization at present, mainly comprise two electrodes 11, and be folded in the electrolyte 12 of 11 at two electrodes, and further by one of them electrode 11 and electrolyte 12, the electric double layer that reaches 11 at electrolyte 12 and another electrode is wherein obtained capacitance.Therefore, this capacitance module 1 and traditional capacitance module compare that to have size speed little, in light weight, that discharge and recharge fast, and discharge and recharge the number of times advantages of higher, and become educational circles and industry in the energy storage device area research with develop one of main flow.
Consult U.S. Patent application US7050291 number, for improveing above-mentioned basic capacitance module, its technical characterictic mainly utilizes positive and negative electrode plate form interlaced with each other, formation has a plurality of formed capacitance modules of electric capacity of parallel form that are, purpose is significantly to promote reserve of electricity and improve energy density.
Yet, even if improved charge capacity, but because the electrolyte that is positioned between two adjacent battery lead plates is liquid state or colloidal state, so, easily cause two adjacent battery lead plates directly contact and short circuit if when oppressing outermost two battery lead plates toward direction in opposite directions.
In addition, the structure that battery lead plate is crisscross arranged is that the electric capacity electricity in parallel each other that forms is imitated circuit, only can increase reserve of electricity and improves energy density, but can't improve power density in same capacitance module, and can't take into account energy density and power density simultaneously.
Summary of the invention
The object of the present invention is to provide a kind of super-capacitor module that can avoid causing short circuit.
The super-capacitor module of one aspect of the present invention, comprise: two main substrates that are provided with at interval, a barrier film, and electrolyte, each main substrate comprises the plate body of an insulation, at least one is formed at the conductive area of this plate body near another main substrate surface, and connecting circuit that connects this conductive area and externally be electrically connected, this barrier film inserts and puts between these two main substrates, and comprise that one deck has the film body of liquid penetrability, this electrolyte filling is between these two main substrates, and the conductive area of these two main substrates cooperates this barrier film and this electrolyte to form the super capacitor that at least one is electrically connected with the external world by this connecting circuit.
Preferably, aforementioned super-capacitor module, wherein, this barrier film also comprises and a plurality ofly outwards protrudes and make the not contacted projection of these two main substrates from this film body respectively.
Preferably, aforementioned super-capacitor module, wherein, each main substrate comprises a plurality of conductive area arranged into an array, and each conductive area of corresponding another main substrate of each conductive area of one of them main substrate.
Preferably, aforementioned super-capacitor module, wherein, each conductive area has the metal level that one deck is formed at this main substrate surface, and one deck is arranged on this metal level and the electrode layer that constitutes with the porousness conductive materials.
The present invention's super-capacitor module on the other hand, comprise: two main substrates that are provided with at interval, at least one Intermediate substrate, a plurality of barrier films, and electrolyte, each main substrate comprises the plate body of an insulation, at least one is formed at the conductive area of this plate body near another main substrate surface, and connecting circuit that connects this conductive area and externally be electrically connected, this Intermediate substrate is folded between these two main substrates and comprises that connects a plate body, and two conductive area that are formed at two opposed surface of this connection plate body respectively and are electrically connected to each other, described barrier film is arranged at respectively between this any main substrate and Intermediate substrate, each barrier film comprises that one deck has the film body of liquid penetrability, this electrolyte filling is in this any main substrate and Intermediate substrate, and between wantonly two Intermediate substrates, the conductive area of these two main substrates cooperates described barrier film and this electrolyte to form by this connecting circuit and the extraneous a plurality of super capacitors that are electrically connected with this Intermediate substrate.
Preferably, aforementioned super-capacitor module, wherein, each barrier film also comprises and a plurality ofly outwards protrudes and make this any main substrate and the not contacted projection of Intermediate substrate from this film body respectively.
Preferably, aforementioned super-capacitor module also comprises a plurality of Intermediate substrates, and a plurality of barrier films, described barrier film is arranged at this any main substrate and this respectively between the Intermediate substrate of adjacent this main substrate, and between wantonly two Intermediate substrates, and the projection of each barrier film outwards protrudes and makes any main substrate and Intermediate substrate, and wantonly two Intermediate substrates do not contact.
Preferably, aforementioned super-capacitor module, wherein, each main substrate comprises a plurality of conductive area arranged into an array, and each conductive area of each conductive area correspondence another main substrate wherein of one of them main substrate, the connecting circuit of each main substrate connects described conductive area, and this Intermediate substrate has a plurality of arranged into an array and to the conductive area of conductive area that should main substrate.
Preferably, aforementioned super-capacitor module, wherein, each conductive area has the metal level that one deck is formed at this main substrate surface, and one deck is arranged on this metal level and the electrode layer that constitutes with the porousness conductive materials.
The manufacture method of the super-capacitor module of another aspect of the invention, comprise: (a) one of them surface with respect to another plate body respectively at the plate body of two insulation forms at least one conductive area with electric conducting material, and a connecting circuit that connects this conductive area and can be electrically connected with the external world, make a main substrate; And after (b) barrier film being folded between these two main substrates, jointly this barrier film is encapsulated with enclosed seat semi-finished product and this two main substrates with a perforation, this bores a hole into an enclosed seat by electrolyte rear enclosed of this perforation perfusion again, makes this super-capacitor module.
Preferably, the manufacture method of aforementioned super-capacitor module also comprises one in the preceding step (c) of this step (b), this step (c) forms a plurality of projections that outwards protrude from this film body surface in the film body surface of one deck insulation and tool liquid penetrability, make this barrier film.
Preferably, the manufacture method of aforementioned super-capacitor module, wherein, this step (a) forms a plurality of conductive area arranged into an array, and each conductive area of corresponding another main substrate of each conductive area of one of them main substrate of this step (b).
Preferably, the manufacture method of aforementioned super-capacitor module, wherein, this step (c) is the surface coated photoresist in this film body, again by gold-tinted and presumptive area of little shadow definition, then remove all the other regional photoresists, and form a plurality of projections that the photoresist with sclerosis constitutes through the process of photoresist sclerosis and in this film body surface.
Preferably, the manufacture method of aforementioned super-capacitor module, wherein, this step (a) prior to each plate body surface be provided with one deck for presumptive area exposed mask layer, again this plate body is soaked and place reactive metal solution, and form the metal level that one deck constitutes with reactive metal in this plate body exposed regions, then form one deck transition metal films in the mode of electroplating in the surface of this metal film, this transition metal films is selected from aluminium, copper, nickel, gold, silver, titanium, an and aforesaid combination, form the electrode film that one deck is constituted based on the porousness conductive materials in this transition metal films surface again, and make this connecting circuit and this conductive area.
The manufacture method of the super-capacitor module of further aspect of the present invention, comprise: (a) one of them surface with respect to another plate body respectively at the plate body of two insulation forms at least one conductive area with electric conducting material, and a connecting circuit that connects this conductive area and can be electrically connected with the external world, make a main substrate; (b) form the electrode film body of two electrical connections respectively at least one two opposing face surface that connect plate body, and make at least one Intermediate substrate; And (c) a plurality of barrier films are folded between these two main substrates, and after this Intermediate substrate is folded in two adjacent barrier films, jointly described barrier film and this Intermediate substrate are encapsulated with enclosed seat semi-finished product and this two main substrates with at least one perforation, this bores a hole into enclosed seat by electrolyte rear enclosed of this perforation perfusion again, makes this super-capacitor module.
Preferably, the manufacture method of aforementioned super-capacitor module also comprises one in the preceding step (d) of this step (c), this step (d) forms a plurality of projections that outwards protrude from described film body surface respectively at the film body surface of a plurality of insulation and tool liquid penetrability, makes described barrier film.
Preferably, the manufacture method of aforementioned super-capacitor module, wherein, the manufacture method of this super-capacitor module also comprises one in the preceding step (d) of this step (c), this step (d) forms a plurality of projections that outwards protrude from described film body surface respectively at the film body surface of a plurality of insulation and tool liquid penetrability, makes described barrier film.
Preferably, the manufacture method of aforementioned super-capacitor module, wherein, this step (b) forms at least one perforation prior to the body of an insulation, and the filled conductive material forms contiguous block in this perforation again, makes this connection plate body.
Preferably, the manufacture method of aforementioned super-capacitor module, wherein, this step (a) forms a plurality of conductive area arranged into an array, and each conductive area of corresponding another main substrate of each conductive area of one of them main substrate of this step (c).
Preferably, the manufacture method of aforementioned super-capacitor module, wherein, this step (d) is the surface coated photoresist in this film body, again by gold-tinted and presumptive area of little shadow definition, then remove all the other regional photoresists, and form a plurality of projections that the photoresist with sclerosis constitutes through the process of photoresist sclerosis and in this film body surface.
Preferably, the manufacture method of aforementioned super-capacitor module, wherein, this step (a) prior to each plate body surface be provided with one deck for presumptive area exposed mask layer, again this plate body is soaked and place reactive metal solution, and form the metal level that one deck constitutes with reactive metal in this plate body exposed regions, then form one deck transition metal films in the mode of electroplating in the surface of this metal film, this transition metal films is selected from aluminium, copper, nickel, gold, silver, titanium, an and aforesaid combination, form the electrode film that one deck is constituted based on the porousness conductive materials in this transition metal films surface again, and make this connecting circuit and this conductive area.
Beneficial effect of the present invention is: the present invention avoids the conductive area of one of them main substrate to contact and short circuit with the conductive area of another main substrate wherein or with the electrode die body of this Intermediate substrate by this barrier film.
Description of drawings
Fig. 1 is a cross-sectional schematic, shows capacitance module in the past;
Fig. 2 is a perspective exploded view, shows the super-capacitor module of one first preferred embodiment of the present invention;
Fig. 3 is a cross-sectional schematic, shows this first preferred embodiment;
Fig. 4 is a schematic diagram, shows the equivalent electric circuit of this first preferred embodiment;
Fig. 5 is a flow chart, shows the manufacture method of this first preferred embodiment;
Fig. 6 is a cross-sectional schematic, shows a step 61;
Fig. 7 is a cross-sectional schematic, shows a step 62;
Fig. 8 is a stereogram, shows that enclosed seat semi-finished product have at least one perforation;
Fig. 9 is a schematic diagram, shows that a step 63 is to utilize vacuum plant to vacuumize and utilize pressure differential perfusion electrolyte;
Figure 10 is a cross-sectional schematic, shows the super-capacitor module of one second preferred embodiment of the present invention;
Schematic diagram of Figure 11 shows the equivalent electric circuit of this second preferred embodiment;
Figure 12 is a flow chart, shows the manufacture method of this second preferred embodiment; And
Figure 13 is a cross-sectional schematic, shows a step 92.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, the specific embodiment of the present invention is elaborated below in conjunction with accompanying drawing.Need to prove that at first the present invention is not limited to following embodiment, those skilled in the art should understand the present invention from the spirit that following execution mode embodied, and each technical term can be done the most wide in range understanding based on spirit of the present invention.Same or analogous member uses the same reference numerals to represent among the figure.
Consult Fig. 2, Fig. 3, the super-capacitor module of the present invention's first preferred embodiment comprises two main substrates that are provided with at interval 2, barrier film 3, an electrolyte 4, and an enclosed seat 5.
Each main substrate 2 comprise an insulation plate body 21, at least one is formed at the conductive area 22 on these plate body 21 surfaces, and connecting circuit 23 that connects this conductive area 22 and externally be electrically connected.
In this first preferred embodiment, each main substrate 2 comprises 4 separately and conductive area 22 arranged into an array, wherein 22 of two adjacent conductive blocks are electrically connected by this connecting circuit 23 becomes predetermined electrical connection form, each conductive area 22 has the transition electrode layer 222 that metal level 221, one deck that one deck is formed at these main substrate 2 surfaces are formed at these metal level 221 surfaces, reach the electrode layer 223 that one deck is formed at these transition electrode layer 222 surfaces, this electrode layer 223 constitutes with the porousness conductive materials and can conduct electricity.These two main substrates 2 are provided with toward each other, just the conductive area 22 of conductive area 22 contiguous another main substrates 2 wherein of one of them main substrate 2.Preferably, also have adhesive in this electrode layer 223, and can supply this porousness conductive materials to be uniformly distributed in the surface of this transition electrode layer 222 and reduce the contact resistance of these conductive area 22 integral body by this adhesive.
This connecting circuit 23 is positioned at the same side with described conductive area 22, and has the metal level 221 that one deck is formed at this plate body 21, and one deck is formed at the transition metal layer 22 on these metal level 221 surfaces.And the metal level 221 of this connecting circuit 23 is one-body molded with the metal level 221 of this conductive area 22, and the transition metal layer 222 of this connecting circuit 23 is one-body molded with the transition metal layer 222 of this conductive area 22.
This barrier film 3 possesses the characteristic of insulation, and is folded in 2 of these two main substrates.This barrier film 3 comprises one deck film body 31, and a plurality of projection 32 that outwards protrudes from this film body 31 respectively.This film body 31 is to be selected from polyethylene, polypropylene, and the aforesaid material that is combined as constitutes, and utilization for example forms a plurality of small holes, and make this film body 31 have the liquid penetrability, described projection 32 is the material of hard and insulation, and protrudes out from 31 2 opposed surface of this film body respectively, directly contacts the film body 31 of barrier film 3 to avoid other elements, and it is damaged to avoid this film body 31 to produce, and then the short circuit of avoiding these film body 31 damaged backs to be caused.In this first preferred embodiment, described projection 32 is the main composition material with the photoresist 72 of sclerosis.
This enclosed seat 5 is put this barrier film 3 wherein with these electrolyte 4 envelopes jointly with these two main substrates 2, and this enclosed seat 5 constitutes with the insulation material.
These electrolyte 4 fillings are in 2 of these two main substrates, and make the conductive area 22 of these two main substrates 2 cooperate this barrier film 3 and this electrolyte 4 to form a plurality of super capacitors.Especially, when each main substrate 2 comprises a plurality of conductive area 22 arranged into an array, each conductive area 22 of each conductive area 22 corresponding another main substrate 2 of one of them main substrate 2, and form a plurality of super capacitors arranged into an array, and described super capacitor by the connecting circuit 23 on these two main substrates 2 each other in predetermined electrical connection form, for example series, parallel, and these combination.In this first preferred embodiment, 4 super capacitors are connected into earlier the electric capacity of two groups of series connection in twos, and the electric capacity of these two groups series connection in parallel externally is electrically connected again again, and become equivalent electric circuit as shown in Figure 4.
When this first preferred embodiment electric energy is granted in the external world, electric charge accumulation forms electric double layer in two conductive area 22 that form each super capacitor and 4 in electrolyte, and then accumulate a large amount of electric energy, and because super-capacitor module of the present invention is that a plurality of super capacitors are arranged into an array, and then reach high power density and high-energy-density simultaneously, but not only pass through high power density and fast charging and discharging, and also possess high reserve of electricity by high-energy-density; Moreover, because 2 folders of these two main substrates are in opposite directions established this barrier film 3, except effectively avoiding the conductive area 22 of two main substrates 2 directly to contact and conduct and the inefficacy of super-capacitor module that short circuit causes by this film body 31, it is damaged also to avoid this film body 31 to take place by the projection 32 that is formed at these film body 31 surfaces, and reduces the chance that short circuit takes place to cause after breakages this film body 31 further.
More preferably, this metal level 221 is that main material constitutes and possesses the good characteristic of conduction with the palladium, this transition electrode layer 222 is with aluminium, copper, nickel, gold, silver, titanium, and aforesaid one be combined as material and constitute, this electrode layer 223 is with carbon, activated carbon, graphite, ruthenium-oxide, manganese oxide, iron oxide, nickel oxide, and aforesaid one be combined as material and constitute porousness conductive materials in this electrode layer 223, cooperate adhesive to be linked to this transition electrode layer 222 surfaces again, wherein, this adhesive can be polytetrafluoroethylene, and this porousness conductive materials and adhesive do not exceed with above-mentioned.
What deserves to be mentioned is, the conductive area 22 of this main substrate 2 also this metal level 221 directly is connected with this electrode layer 223, circulate as long as power to flow.
It below is the manufacture method of this first preferred embodiment.
Consult Fig. 5, the manufacture method of this first preferred embodiment mainly comprises a step 61, a step 62, and a step 63.
This step 61 is that one of them surface with respect to another plate body respectively at the plate body of two insulation forms at least one conductive area with electric conducting material, and one connect this conductive area and can be electrically connected with the external world and draw connecting circuit, and makes a main substrate.This step is to form a plurality of projections that outwards protrude from this film body surface in the film body surface of one deck insulation and tool liquid penetrability, makes a barrier film.After this step 63 is folded in this barrier film between these two main substrates, jointly this barrier film is encapsulated with enclosed seat semi-finished product and this two main substrates with a perforation, this bores a hole into an enclosed seat by electrolyte rear enclosed of this perforation perfusion again, makes this super-capacitor module.
Consult Fig. 5, Fig. 6, in more detail, at first, carry out this step 61 earlier.Prior to each plate body 21 surface the mask layer 71 that one deck exposes for presumptive area 721 is set, this mask layer 71 has the predetermined pattern of this connecting circuit 23 of follow-up formation and this conductive area 22, and in the manufacture method of this first preferred embodiment, the predetermined graph region of described conductive area 22 is arranged into an array; Then, the plate body 21 that this mask layer 71 is set soaked place a kind of reactive metal solution, and do not covered in these plate body 21 surfaces and exposed regions deposits this metal level 221 by this mask layer 71; Come again, form this transition electrode layer 22 in these metal level 221 surfaces in the mode of electroplating, and this transition metal layer 22 is to be selected from aluminium, copper, nickel, gold, silver, and metal such as titanium is main, or the also metal film that forms of multilayer plating, the metal level 221 and this transition electrode layer 222 that then are formed at connecting circuit 23 presumptive areas 721 surfaces of this plate body 21 form these connecting circuits 23; Then, with carbon, activated carbon, graphite, ruthenium-oxide, manganese oxide, iron oxide, material such as nickel oxide is as a kind of precursor, again with polytetrafluoroethylene as a kind of adhesive, and this precursor and this adhesive be dissolved in a kind of organic solvent based on ethanol, utilize the screen painting or the mode of spray printing to form this electrode preparation layer (figure does not show) again in these transition metal layer 222 surfaces, heating makes this electrode preparation layer dry solidification again, and form the electrode layer 223 that this precursor adequate relief is formed in these transition metal layer 222 surfaces, then the transition electrode layer 222 of this electrode layer 223 and this electrode layer 223 belows forms described conductive area 22 with metal level 221, then remove this mask layer 71 again, make this main substrate 2.
Consult Fig. 5, Fig. 7, then, carry out this step 62, have a plurality of micro hole (being microscopic dimensions) and two opposed surface of the film body 31 of tool liquid penetrability are coated with photoresist 72 respectively in one deck, utilize presumptive area 721 of yellow light lithography sclerosis again so scheme not shown, in developing procedure, remove all the other zones again, and the projection 32 that forms a plurality of each intervals and protrude out from the surface of this film body 31, and described projection 32 makes this barrier film 3 with photoresist 72 formations of sclerosis.And it should be noted that because photoresist 72 itself promptly possesses the character of insulation, described projection 32 can form in the manufacturing process of the photoresist 72 of sclerosis presumptive area.
Consult Fig. 2, Fig. 5, Fig. 8, then, carry out this step 63, this barrier film 3 is folded in 2 of these two main substrates in opposite directions, and contiguous these barrier films 3 of the conductive area 22 of these two main substrates 2 have enclosed seat 5 semi-finished product, 73 these two main substrates 2 of cooperation of a perforation 731 with one again and jointly this barrier film 3 are packaged in wherein.In the manufacture method of this first preferred embodiment, be to smear packaging plastic (scheming not shown) prior to these two main substrate 2 edges, with the hot-press solidifying operation these two main substrates 2 are mutually combined with this barrier film 3 again, form this enclosed seat semi-finished product 73.Cooperate and consult Fig. 9, then, to soak the vacuum plant 74 that places to be equipped with this electrolyte 4 with barrier film 3 with two main substrates 2 that these enclosed seat semi-finished product 73 are connected, and certainly should perforation 731 extract the gas of 2 of these enclosed seat semi-finished product 73 and this two main substrates, up to the air pressure of inside air pressure less than the external world, naturally pour into electrolyte 4 by draught head from this perforation 731 again, at last, seal this perforation 731 and constitute this enclosed seat 5 with UV glue (ultraviolet cured adhesive) again, and make the sclerosis of this UV glue according to ultraviolet light, make this super-capacitor module.
The manufacture method of this first preferred embodiment utilizes draught head for these electrolyte 4 perfusions, and can reduce the bubble between described super capacitor, and then reduces airgap effect and cause the super capacitor reserve of electricity to reduce, even be the probability of not conducting of electricity; Moreover, because described projection 32 is directly to constitute with photoresist 72, and do not need also to be coated with another kind of dielectric film on this film body again, just can make by loaded down with trivial details production processes such as coating photoresist, little shadow and etchings again, also be easier to implement in manufacturing process.
Consult Figure 10, one second preferred embodiment for super-capacitor module of the present invention, this second preferred embodiment is similar to this first preferred embodiment, its difference is in this second preferred embodiment and also comprises an Intermediate substrate 8 that is folded in 2 of this two main substrates, and two barrier films 3 that are folded in 8 of arbitrary main substrate 2 and this Intermediate substrates respectively, and in this second preferred embodiment, be to comprise that with each main substrate 2 conductive area 22 has a talk about bright.
This Intermediate substrate 8 comprises that connects a plate body 81, and two conductive area 82 that are formed at 81 2 opposed surface of this connection plate body respectively and are electrically connected to each other.This connection plate body 81 has a body 811, and at least one contiguous block 812 that runs through this body 811 and form with electric conducting material, and the two ends of this contiguous block 812 are connected with these two conductive area 82 respectively and conduct.Each conductive area 82 has the transition metal layer 821 that one deck is formed at these connection plate body 81 surfaces, and one deck is formed at the electrode layer 822 on these transition metal layer 821 surfaces.And the transition metal layer 821 of the transition metal layer 821 of this Intermediate substrate 8 and the material of electrode layer 822 and this main substrate 2 and the material of electrode layer 822 are identical or similar.
This enclosed seat 5 and described main substrate 2 are placed in one with these electrolyte 4 envelopes jointly with described Intermediate substrate 8, described barrier film 3, and this enclosed seat 5 constitutes with the insulation material.
In this second preferred embodiment, one of them conductive area 82 of this Intermediate substrate 8, the barrier film 3 of contiguous this conductive area 82, and the conductive area 22 of this main substrate 2 cooperates super capacitor of these electrolyte 4 common formation, another conductive area wherein of this Intermediate substrate 8 cooperates this electrolyte 4 common another super capacitors of formation with the barrier film 3 of contiguous this conductive area with the conductive area of this main substrate 2, and these two super capacitors two super capacitors that equivalence becomes as shown in figure 11 by connection plate body 81 electrical connections of this Intermediate substrate 8 become the series connection form.
When this second preferred embodiment electric energy is granted in the external world, electric charge accumulation forms electric double layer in two conductive area 22,82 and 4 in the electrolyte that form each super capacitor, and then accumulate a large amount of electric energy, and because this second preferred embodiment super-capacitor module is the super capacitor of a plurality of series connection, and then reach power density height and energy density height simultaneously, but not only pass through high rate density and fast charging and discharging, and also possess high reserve of electricity by high-energy-density; Moreover, because 22,82 of the conductive area of each super capacitor are passed through this barrier film 3 at interval, and effectively avoid the conductive area 22 of this main substrate 2 directly to contact and short circuit, and then effectively reduce the probability that super-capacitor module lost efficacy with the conductive area 82 of this Intermediate substrate 8; In addition, the projection 32 that is formed at these barrier film 3 surfaces is also kept 22,82 each intervals of described conductive area further, avoiding this film body 31 breakages, and then reduces the chance of these film body 31 damaged back short circuits that cause.
What deserves to be mentioned is, this second preferred embodiment also can comprise a plurality of Intermediate substrates 8, and a plurality of barrier films 3, described barrier film 3 is stacked and placed on 2 of these two main substrates, and extend in the same way with described main substrate 2, described barrier film 3 is arranged at 8 of the Intermediate substrates of this any main substrate 3 and this this main substrate 3 the most adjacent respectively, reach 8 of wantonly two Intermediate substrates, then Zheng Ti stacked order is main substrate 2-barrier film 3-Intermediate substrate 8-barrier film 3-Intermediate substrate 8-barrier film 3-...-barrier film 3-main substrate 2, and utilize the conductive area 22 of this main substrate 2, the conductive area 82 of this Intermediate substrate 8, cooperate this electrolyte 4 with barrier film 3 between the two, and the conductive area 82 of two adjacent Intermediate substrates 8 cooperates this electrolyte 4 with the barrier film 3 that inserts and puts therebetween, become the super capacitor of a plurality of one-tenth series connection forms, and described super capacitor is by the projection 32 and the film body 31 of described barrier film 3, just the projection 32 of each barrier film 3 outwards protrudes and makes any main substrate 3 and Intermediate substrate 8, and wantonly two Intermediate substrates 8 do not contact and avoid being short-circuited.
Also it should be noted that, when the main substrate 2 of this second preferred embodiment has a plurality of conductive area 22 arranged into an array, this Intermediate substrate 8 also has a plurality of conductive area arranged into an array 82, and each conductive area 22 of each corresponding another main substrate 2 wherein of 22 while of conductive area of one of them main substrate 2 and each conductive area 82 of this Intermediate substrate 8, and form a plurality of one-tenth series connection forms, parallel form or the super capacitor of aforementioned combination.
Consult Figure 12, be the manufacture method of this second preferred embodiment, comprise a step 91, a step 92, a step 93, and a step 94.
This step 91 is that the wherein surface with respect to another plate body respectively at the plate body of two insulation forms at least one conductive area with electric conducting material, and a connecting circuit that connects this conductive area and can be electrically connected with the external world, makes a main substrate.This step 92 forms the conductive area of two electrical connections respectively at the two opposite surfaces that at least one connects plate body, and makes at least one Intermediate substrate.This step 93 is respectively at a plurality of projections that outwards protrude from described film body surface of the film body surface formation of a plurality of insulation and tool liquid penetrability, makes a plurality of barrier films.This step 94 is folded in described barrier film between these two main substrates, and after this Intermediate substrate 8 is folded in two adjacent barrier films, jointly described barrier film 3 and this Intermediate substrate are encapsulated with packaging semi-finished product and this two main substrates with at least one perforation, this bores a hole into an enclosed seat by electrolyte rear enclosed of this perforation perfusion again, makes this super-capacitor module.
Cooperate and consult Fig. 6, at first, carry out this step 91, this step 91 is similar with the step 61 of the manufacture method of this first preferred embodiment, makes this two main substrates 2.
Consult Figure 12, Figure 13, then, carry out this step 92, this step 92 is at least one perforation 813 of body 811 formation prior to an insulation, bore a hole 813 filled conductive materials and form contiguous block 812 in this again, then be somebody's turn to do the body 811 that insulate and be connected plate body 81 with these contiguous block 812 one of common formations, two opposite surperficial elder generations in this connection plate body 81 form one deck transition metal layer 821 in the mode of electroplating again, form this electrode layer 822 again in the surface of this transition metal layer 821.Cooperate and consult Fig. 4, wherein, the production method of the transition metal layer 222 of the production method of this transition metal layer 821 and the main substrate of this step 61 2 is similar, the production method of this electrode layer 822 and the main substrate of this step 61 2 the production method of electrode layer 223 similar, and form the conductive area 82 of this Intermediate substrate 8, and the conductive area 82 of two opposed surface is electrically connected by this contiguous block 812, makes this Intermediate substrate 8.
Consult Fig. 7, Figure 12, then, carry out step 93, this step 93 is similar with the step 62 of the manufacture method of this first preferred embodiment, makes described barrier film 3.
Consult Figure 10, Figure 12, at last, carry out this step 94, described barrier film 3 is folded in 2 of these two main substrates in opposite directions, and this Intermediate substrate 8 is folded in 3 of described barrier films, cooperate these two main substrates 2 with the enclosed seat semi-finished product (as Fig. 8) with at least one perforation again and jointly with as described in barrier film 3 be packaged in wherein with this Intermediate substrate 8.In the manufacture method of this second preferred embodiment, be to smear packaging plastic prior to these two main substrate 2 edges and this Intermediate substrate 8 edges, with the hot-press solidifying operation these two main substrates 2, described barrier film 3 are harmonious with this Intermediate substrate 8 again, form this enclosed seat semi-finished product 73.Cooperate and consult Fig. 9, then, two main substrates 2 that will be connected with these enclosed seat semi-finished product 73, and described barrier film 3 soaks the vacuum plant 74 that places to be equipped with this electrolyte 4 jointly with this Intermediate substrate 8, and certainly should perforation 731 extract the gas of 2 of these enclosed seat semi-finished product 73 and this two main substrates, up to the air pressure of inside air pressure less than the external world, naturally pour into electrolyte 4 by draught head from this perforation 731 again, at last, seal this perforation 731 and this UV glue is hardened with UV glue again according to ultraviolet light, constitute this enclosed seat 5, and make this super-capacitor module.
The manufacture method of this second preferred embodiment utilizes draught head for 4 perfusions of this electrolyte, causes the super capacitor reserve of electricity to improve and the problem of not conducting of electricity and can reduce the airgap effect that bubble produced between described super capacitor.
In sum, super-capacitor module of the present invention has a plurality of connection in series-parallel forms that form arranged into an array, or the super capacitor of one-tenth series connection form, and can possess high power density and high-energy-density simultaneously, and avoid the conductive area 22,82 of each super capacitor to contact and short circuit by this barrier film 3, in addition, also utilize this electrolyte 4 of draught head filling, and avoid taking place the chance of airgap effect, can reach purpose of the present invention really.
Should be understood that those skilled in the art can make various changes or modifications the present invention after having read above-mentioned instruction content of the present invention, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
Claims (20)
1. super-capacitor module, it is characterized in that, comprise: two main substrates that are provided with at interval, a barrier film, and electrolyte, each main substrate comprises the plate body of an insulation, at least one is formed at the conductive area of this plate body near another main substrate surface, and connecting circuit that connects this conductive area and externally be electrically connected, this barrier film inserts and puts between these two main substrates, and comprise that one deck has the film body of liquid penetrability, this electrolyte filling is between these two main substrates, and the conductive area of these two main substrates cooperates this barrier film and this electrolyte to form the super capacitor that at least one is electrically connected with the external world by this connecting circuit.
2. super-capacitor module as claimed in claim 1 is characterized in that: this barrier film also comprises and a plurality ofly outwards protrudes and make the not contacted projection of these two main substrates from this film body respectively.
3. super-capacitor module as claimed in claim 2 is characterized in that: each main substrate comprises a plurality of conductive area arranged into an array, and each conductive area of corresponding another main substrate of each conductive area of one of them main substrate.
4. super-capacitor module as claimed in claim 3 is characterized in that: each conductive area has the metal level that one deck is formed at this main substrate surface, and one deck is arranged on this metal level and the electrode layer that constitutes with the porousness conductive materials.
5. super-capacitor module, it is characterized in that, comprise: two main substrates that are provided with at interval, at least one Intermediate substrate, a plurality of barrier films, and electrolyte, each main substrate comprises the plate body of an insulation, at least one is formed at the conductive area of this plate body near another main substrate surface, and connecting circuit that connects this conductive area and externally be electrically connected, this Intermediate substrate is folded between these two main substrates and comprises that connects a plate body, and two conductive area that are formed at two opposed surface of this connection plate body respectively and are electrically connected to each other, described barrier film is arranged at respectively between this any main substrate and Intermediate substrate, each barrier film comprises that one deck has the film body of liquid penetrability, this electrolyte filling is in this any main substrate and Intermediate substrate, and between wantonly two Intermediate substrates, the conductive area of these two main substrates cooperates described barrier film and this electrolyte to form by this connecting circuit and the extraneous a plurality of super capacitors that are electrically connected with this Intermediate substrate.
6. super-capacitor module as claimed in claim 5 is characterized in that: each barrier film also comprises and a plurality ofly outwards protrudes and make this arbitrary main substrate and the not contacted projection of Intermediate substrate from this film body respectively.
7. super-capacitor module as claimed in claim 6, it is characterized in that: this super-capacitor module also comprises a plurality of Intermediate substrates, and a plurality of barrier films, described barrier film is arranged at this any main substrate and this respectively between the Intermediate substrate of adjacent this main substrate, and between wantonly two Intermediate substrates, and the projection of each barrier film outwards protrudes and makes any main substrate and Intermediate substrate, and wantonly two Intermediate substrates do not contact.
8. super-capacitor module as claimed in claim 7, it is characterized in that: each main substrate comprises a plurality of conductive area arranged into an array, and each conductive area of each conductive area correspondence another main substrate wherein of one of them main substrate, the connecting circuit of each main substrate connects described conductive area, and this Intermediate substrate has a plurality of arranged into an array and to the conductive area of conductive area that should main substrate.
9. super-capacitor module as claimed in claim 8 is characterized in that: each conductive area has the metal level that one deck is formed at this main substrate surface, and one deck is arranged on this metal level and the electrode layer that constitutes with the porousness conductive materials.
10. the manufacture method of a super-capacitor module is characterized in that, comprises:
(a) one of them surface with respect to another plate body respectively at the plate body of two insulation forms at least one conductive area with electric conducting material, and a connecting circuit that connects this conductive area and can be electrically connected with the external world, makes a main substrate; And
(b) after a barrier film being folded between these two main substrates, jointly this barrier film is encapsulated with enclosed seat semi-finished product and this two main substrates with a perforation, this bores a hole into an enclosed seat by electrolyte rear enclosed of this perforation perfusion again, makes this super-capacitor module.
11. the manufacture method of super-capacitor module as claimed in claim 10, it is characterized in that: the manufacture method of this super-capacitor module also comprises one in the preceding step (c) of this step (b), this step (c) makes this barrier film in a plurality of projections from this outside protrusion in film body surface of film body surface formation that one deck insulate and has the liquid penetrability.
12. the manufacture method of super-capacitor module as claimed in claim 11, it is characterized in that: this step (a) forms a plurality of conductive area arranged into an array, and each conductive area of corresponding another main substrate of each conductive area of one of them main substrate of this step (b).
13. the manufacture method of super-capacitor module as claimed in claim 12, it is characterized in that: this step (c) is the surface coated photoresist in this film body, again by gold-tinted and presumptive area of little shadow definition, then remove all the other regional photoresists, and form a plurality of projections that the photoresist with sclerosis constitutes through the process of photoresist sclerosis and in this film body surface.
14. the manufacture method of super-capacitor module as claimed in claim 13, it is characterized in that: this step (a) prior to each plate body surface be provided with one deck for presumptive area exposed mask layer, again this plate body is soaked and place reactive metal solution, and form the metal level that one deck constitutes with reactive metal in this plate body exposed regions, then form one deck transition metal films in the mode of electroplating in the surface of this metal film, this transition metal films is selected from aluminium, copper, nickel, gold, silver, titanium, an and aforesaid combination, form the electrode film that one deck is constituted based on the porousness conductive materials in this transition metal films surface again, and make this connecting circuit and this conductive area.
15. the manufacture method of a super-capacitor module is characterized in that, comprises:
(a) one of them surface with respect to another plate body respectively at the plate body of two insulation forms at least one conductive area with electric conducting material, and a connecting circuit that connects this conductive area and can be electrically connected with the external world, makes a main substrate;
(b) form the electrode film body of two layers of electrical connection respectively at least one two opposing face surface that connect plate body, and make at least one Intermediate substrate; And
(c) a plurality of barrier films are folded between these two main substrates, and after this Intermediate substrate is folded in two adjacent barrier films, jointly described barrier film and this Intermediate substrate are encapsulated with enclosed seat semi-finished product and this two main substrates with at least one perforation, this bores a hole into enclosed seat by electrolyte rear enclosed of this perforation perfusion again, makes this super-capacitor module.
16. the manufacture method of super-capacitor module as claimed in claim 15, it is characterized in that: the manufacture method of this super-capacitor module also comprises one in the preceding step (d) of this step (c), this step (d) forms a plurality of projections that outwards protrude from described film body surface respectively at the film body surface of a plurality of insulation and tool liquid penetrability, makes described barrier film.
17. the manufacture method of super-capacitor module as claimed in claim 16 is characterized in that: this step (b) forms at least one perforation prior to the body of an insulation, and the filled conductive material forms a contiguous block in this perforation again, makes this connection plate body.
18. the manufacture method of super-capacitor module as claimed in claim 17, it is characterized in that: this step (a) forms a plurality of conductive area arranged into an array, and this step (c) each conductive area of corresponding another main substrate of each conductive area of a main substrate wherein.
19. the manufacture method of super-capacitor module as claimed in claim 18, it is characterized in that: this step (d) is the surface coated photoresist in this film body, again by gold-tinted and presumptive area of little shadow definition, then remove all the other regional photoresists, and form a plurality of projections that the photoresist with sclerosis constitutes through the process of photoresist sclerosis and in this film body surface.
20. the manufacture method of super-capacitor module as claimed in claim 19, it is characterized in that: this step (a) prior to each plate body surface be provided with one deck for presumptive area exposed mask layer, again this plate body is soaked and place reactive metal solution, and form the metal level that one deck constitutes with reactive metal in this plate body exposed regions, then form one deck transition metal films in the mode of electroplating in the surface of this metal film, this transition metal films is selected from aluminium, copper, nickel, gold, silver, titanium, an and aforesaid combination, form the electrode film that one deck is constituted based on the porousness conductive materials in this transition metal films surface again, and make this connecting circuit and this conductive area.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261589937P | 2012-01-24 | 2012-01-24 | |
| US61/589,937 | 2012-01-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103219165A true CN103219165A (en) | 2013-07-24 |
| CN103219165B CN103219165B (en) | 2016-02-17 |
Family
ID=48816862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210287296.0A Expired - Fee Related CN103219165B (en) | 2012-01-24 | 2012-08-13 | Super-capacitor module and preparation method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5823420B2 (en) |
| CN (1) | CN103219165B (en) |
| TW (1) | TWI528391B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106571235A (en) * | 2015-10-08 | 2017-04-19 | 冠研（上海）专利技术有限公司 | Supercapacitor structure |
| CN106981617A (en) * | 2016-01-19 | 2017-07-25 | 邵波 | A kind of anti-battery hits quick-fried method and removes quick-fried battery |
| CN111742383A (en) * | 2018-02-22 | 2020-10-02 | 阿维科斯公司 | Circuit including a supercapacitor with reduced leakage |
| CN111863459A (en) * | 2020-06-28 | 2020-10-30 | 华中科技大学 | Preparation method and application of patch type micro filter capacitor |
| CN112038261A (en) * | 2019-06-04 | 2020-12-04 | 无尽电子有限公司 | Substrate drying device |
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| CN111863459A (en) * | 2020-06-28 | 2020-10-30 | 华中科技大学 | Preparation method and application of patch type micro filter capacitor |
| CN111863459B (en) * | 2020-06-28 | 2021-10-08 | 华中科技大学 | Preparation method and application of patch type micro filter capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5823420B2 (en) | 2015-11-25 |
| TW201337986A (en) | 2013-09-16 |
| CN103219165B (en) | 2016-02-17 |
| JP2013153166A (en) | 2013-08-08 |
| TWI528391B (en) | 2016-04-01 |
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