CN101329953A - Method of preparing multilayer solid electrolytic capacitor - Google Patents
Method of preparing multilayer solid electrolytic capacitor Download PDFInfo
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- CN101329953A CN101329953A CNA2008100230811A CN200810023081A CN101329953A CN 101329953 A CN101329953 A CN 101329953A CN A2008100230811 A CNA2008100230811 A CN A2008100230811A CN 200810023081 A CN200810023081 A CN 200810023081A CN 101329953 A CN101329953 A CN 101329953A
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Abstract
The invention provides a manufacturing method of a multilayer solid electrolytic capacitor, which has the advantages of simple manufacturing process, low cost and high product yield rate. The method of the invention is characterized by comprising the following steps: (1) a cathode substrate unit 1 of the capacitor is produced; (2) an oxide film layer 11 serving as dielectric is coated or formed on the peripheral surface of the cathode substrate unit 1; (3) an insulation layer 9 is set, causing an anode 16 and a cathode 10 to be isolated from each other; (4) a conductive polymer layer 14 is formed on the peripheral surface of the cathode 10 and serves as a solid electrolyte; (5) a carbon rubber layer 15 is formed on the surface of the conductive polymer layer 14; (6) a silver rubber is coated on the peripheral surface of the carbon rubber layer 15 to form a silver rubber layer 13; the silver rubber layer 13 is the cathode 10; the anode 16 prominent outwards is formed on the uncovered part by the cathode substrate unit 1; (7) each solid electrolytic capacitor is cut down from a sheet metal so as to obtain a solid electrolytic capacitor 12; (8) the solid electrolytic capacitor 12 is stacked and overlapped.
Description
(1) technical field
The present invention relates to the capacitor processing technique field, be specially a kind of manufacture method of multilayer solid electrolytic capacitor.
(2) background technology
Because the evolution of semiconductor technology, make the product of semi-conductor packaging under the market demand improves, constantly develop and more accurate, more advanced electronic building brick.With present semiconductor technology,, all in semiconductor industry, occupy indispensable status such as the technology of crystal covered package, the design of laminated substrate and the design of passive component etc.To cover crystalline substance/ball lattice array packaging structure is example, chip system is disposed on the surface of base plate for packaging, and chip and base plate for packaging electrically connect, and being multi-layered patterned circuit layer and multilayer dielectric layer productive set, base plate for packaging forms, wherein patterned circuit layer can be defined via the mode of lithography and be formed, and insulating barrier is disposed between adjacent two patterned circuit layer.In addition, in order to obtain better electrical characteristic, also dispose passive components such as electric capacity, inductance and resistance on the surface of base plate for packaging, it can be by internal wiring and the chip and the electric connection of other electronic building brick of base plate for packaging.
In the design of passive component, because chip is under high-speed computation, can produce high heat, and the heat energy that chip produced can reach on the base plate for packaging, reach on the passive component again.Therefore even, also can not influence its electrical characteristic, must design passive component, and microminiature lamination capacitor promptly is an example wherein with high temperature resistant and high stability in order to make passive component under the environment of high temperature.
General microminiature lamination capacitor, main system is formed by multilayer dielectric layer and multiple layer metal layer stack, wherein, the dielectric series of strata are by the material of high-k, as: ba titanate is formed, and the metal series of strata by as: silver, the conductive material of silver palladium alloy is formed, and the multiple layer metal layer forms a plurality of sun, the interior electrode that negative electrode replaces (Internal electrode), and interior electrode and dielectric series of strata constitute a capacitance structure, and its both sides also dispose a pair of terminal electrode, electrically connect sun respectively, the interior electrode of negative electrode, form anode and negative electrode, and these anodes and cathode surface can form a surface metal-layer, as: nickel, in case oxidation.
Though but common microminiature lamination capacitor reason multilayer dielectric layer and multiple layer metal layer stack formation, but and the volume microminaturization increases the utilization scope.But, its processing procedure complexity, the cost height, short circuit ratio is a lot, manufacture process and assembling difficulty.Moreover, U.S. US6249424 patent has also disclosed single aluminium chip capacitor, this capacitor system is made of anode and negative electrode intermediate isolating one separator, wherein be coated with dielectric oxide film (Al2O3) on the anode, between negative electrode that conductive carbon glue-line and elargol layer are constituted and anode electroconductive polymer layer is arranged then, and separator completely cuts off negative electrode, anode constitutes the aluminium chip capacitor.Yet, the capacitor desire increases its capacitance system in the mode of being connected in parallel, make several capacitor stack and make the capacitance addition of these capacitors, obtain the bigger capacitance after several capacitance additions, and the aluminium chip capacitor behind the storehouse encapsulated, and draw two lead foots respectively from anode and cathode terminal, form complete capacitor, but, the stack capacitor device needs with tool extruded aluminium chip capacitor, so processing procedure complexity (increase with tool and pressing and going up the elargol supervisor), the cost height, short circuit ratio is a lot, and produces thermal stress in when encapsulation easily and cause capacitance damage, and and for example U.S. US6421227 patent also discloses the different storehouse mode of electric capacity, yet, no matter which kind of storehouse mode also as above-mentioned U.S. US6249424 patent, can't overcome capacitor and damage easily, the processing procedure complexity, the cost height, the shortcoming that short circuit ratio is a lot.
(3) summary of the invention
At the problems referred to above, the invention provides a kind of manufacture method of multilayer solid electrolytic capacitor, its manufacturing process is simple, cost is low, product yield height.
Manufacture method of the present invention, it comprises the following steps:
(1) bores a hole 2 in sheet metal 8 a punching presses majority U-shaped that can be used as solid electrolyte capacitor, form most unit metal plates that the maintenance of one side and sheet metal 8 bodies is connected, be the cathode substrate unit 1 of electric capacity;
(2) lining or form the oxidation film layer 11 of one deck on the side face of cathode substrate unit 1 as dielectric medium;
(3) lining one deck isolation layer 9 on the surface of the central authorities of each cathode substrate unit 1 makes anode 16, negative electrode 10 isolated mutually;
(4) coated with conductive Polymer Solution on negative electrode 10 perimeter surface makes to form one deck electroconductive polymer layer 14, as solid electrolyte;
(5) lining conduction carbon paste on the surface of the electroconductive polymer layer 14 of above-mentioned negative electrode 10, and form a carbon paste layer 15;
(6) coat elargol on the side face of above-mentioned carbon paste layer 15, form an elargol layer 13, elargol layer 13 is a negative electrode 10, and the part that cathode substrate unit 1 is not covered then forms outwards outstanding anode 16;
(7) each solid electrolyte capacitor is cut down from sheet metal 8, promptly obtain solid electrolytic capacitor 12;
(8) with solid electrolytic capacitor 12 storehouses stacks, the anode 16 and the negative electrode 10 of each capacitor 12 are individually fixed on the leg of a lead frame, drawing the terminal electrode of the positive and negative utmost point 16,10, and on storehouse stack solid electrolytic capacitor 7 the packaging insulating layer;
Another manufacture method of the present invention, it comprises the following steps:
(1) bores a hole 2 in sheet metal 8 a punching presses majority U-shaped facing each other that can be used as solid electrolyte capacitor, form most unit metal plates that the maintenance of one side and sheet metal 8 bodies is connected, be the cathode substrate unit 1 of electric capacity;
(2) lining or form the oxidation film layer 11 of one deck on the side face of most cathode substrates unit 1 as dielectric medium;
(3) lining one deck isolation layer 9 on the central perimeter surface of each cathode substrate unit 1;
(4) be coated with photoresistance 17 or stick adhesive tape on corresponding capacitive insulation layer 9, the zone that photoresistance 17 or adhesive tape cover is the anode region of Unit two; Dipping or coated with conductive Polymer Solution on negative electrode 10 perimeter surface make to form one deck electroconductive polymer layer 14, as solid electrolyte;
(5) lining conduction carbon paste on the side face of the electroconductive polymer layer 14 of above-mentioned negative electrode 10, and form a carbon paste layer 15;
(6) coat elargol on the side face of above-mentioned carbon paste layer 15, form an elargol layer 13, this is a negative electrode 10, and the part that cathode substrate unit 1 is not covered then forms outwards outstanding anode 16;
(7) on capacitive insulation layer 9, remove photoresistance 17 or tear adhesive tape, each solid electrolyte capacitor is cut down from sheet metal 8, promptly obtain solid electrolytic capacitor 12;
(8) with solid electrolytic capacitor 12 storehouses stacks, the anode 16 and the negative electrode 10 of each capacitor 12 are individually fixed on the leg of a lead frame, drawing the terminal electrode of the positive and negative utmost point 16,10, and on storehouse stack solid electrolytic capacitor 12 the packaging insulating layer.
It is further characterized in that: described multilayer solid electrolytic capacitor can be used on the circuit board, or can be welded on the circuit board in the SMT mode; In the above-mentioned making step, can replace carbon paste with carbon paste or carbon paste; In above-mentioned making step, can use imitate the accurate rubbing method that function is controlled, conductive-polymer solution is evenly coated on the side face of each cathode substrate unit 1, form electroconductive polymer layer 14; Conducting polymer is polyaniline, poly-arsenic noise made in coughing or vomiting, poly-match fen; Described polyaniline comprises aniline, oxidant and dopant.
Make multilayer solid electrolytic capacitor by said method, manufacturing process is simple, can batch machining, at the bottom of the cost, shortcoming that short circuit ratio is a lot of, and the stack of solid electrolytic capacitor 12 storehouses, the anode 16 and the negative electrode 10 of each capacitor 12 are individually fixed on the leg of a lead frame, to draw the terminal electrode of the positive and negative utmost point 16,10, and then encapsulation, the probability that leakage current occurs is less.
(4) description of drawings
Fig. 1 is a manufacturing flow chart of the present invention.
Fig. 2 is a manufacturing schematic diagram of the present invention.
Fig. 3 figure is a finished product profile of the present invention.
Fig. 4 a, 4b, 4c are the manufacturing schematic diagram of another embodiment of the present invention.
(5) embodiment
Below in conjunction with embodiment the course of processing of the present invention is described:
Embodiment 1
(1) bores a hole 2 in sheet metal 8 a punching presses majority U-shaped that can be used as solid electrolyte capacitor, form most unit metal plates that the maintenance of one side and sheet metal 8 bodies is connected, be the cathode substrate unit 1 of electric capacity;
(2) lining or form the oxidation film layer 11 of one deck on the side face of cathode substrate unit 1 as dielectric medium;
(3) lining one deck isolation layer 9 on the surface of the central authorities of each cathode substrate unit 1 makes anode 16, negative electrode 10 isolated mutually;
(4) coated with conductive Polymer Solution on negative electrode 10 perimeter surface makes to form one deck electroconductive polymer layer 14, as solid electrolyte;
(5) lining conduction carbon paste on the surface of the electroconductive polymer layer 14 of above-mentioned negative electrode 10, and form a carbon paste layer 15;
(6) coat elargol on the side face of above-mentioned carbon paste layer 15, form an elargol layer 13, elargol layer 13 is a negative electrode 10, and the part that cathode substrate unit 1 is not covered then forms outwards outstanding anode 16;
(7) each solid electrolyte capacitor is cut down from sheet metal 8, promptly obtain solid electrolytic capacitor 12;
(8) solid electrolytic capacitor 12 storehouses are superposeed, the anode 16 and the negative electrode 10 of each capacitor 12 are individually fixed on the leg of a lead frame, to draw the terminal electrode of the positive and negative utmost point 16,10, and on storehouse stack solid electrolytic capacitor 7 the packaging insulating layer, this multilayer solid electrolytic capacitor can be used on the circuit board, or can be welded on the circuit board in the SMT mode.
(1) bores a hole 2 in sheet metal 8 a punching presses majority U-shaped facing each other that can be used as solid electrolyte capacitor, form most unit metal plates that the maintenance of one side and sheet metal 8 bodies is connected, be the cathode substrate unit 1 of electric capacity;
(2) lining or form the oxidation film layer 11 of one deck on the side face of most cathode substrates unit 1 as dielectric medium;
(3) lining one deck isolation layer 9 on the central perimeter surface of each cathode substrate unit 1;
(4) be coated with photoresistance 17 or stick adhesive tape on corresponding capacitive insulation layer 9, the zone that photoresistance 17 or adhesive tape cover is the anode region of Unit two; Dipping or coated with conductive Polymer Solution on negative electrode 10 perimeter surface make to form one deck electroconductive polymer layer 14, as solid electrolyte;
(5) lining conduction carbon paste on the side face of the electroconductive polymer layer 14 of above-mentioned negative electrode 10, and form a carbon paste layer 15;
(6) coat elargol on the side face of above-mentioned carbon paste layer 15, form an elargol layer 13, this is a negative electrode 10, and the part that cathode substrate unit 1 is not covered then forms outwards outstanding anode 16;
(7) on capacitive insulation layer 9, remove photoresistance 17 or tear adhesive tape, each solid electrolyte capacitor is cut down from sheet metal 8, promptly obtain solid electrolytic capacitor 12;
(8) with solid electrolytic capacitor 12 storehouses stacks, the anode 16 and the negative electrode 10 of each capacitor 12 are individually fixed on the leg of a lead frame, drawing the terminal electrode of the positive and negative utmost point 16,10, and on storehouse stack solid electrolytic capacitor 12 the packaging insulating layer.This multilayer solid electrolytic capacitor can be used on the circuit board, or can be welded on the circuit board in the SMT mode.
Claims (6)
1, a kind of manufacture method of multilayer solid electrolytic capacitor, it is characterized in that: it comprises the following steps:
(1) bores a hole 2 in sheet metal 8 a punching presses majority U-shaped that can be used as solid electrolyte capacitor, form most unit metal plates that the maintenance of one side and sheet metal 8 bodies is connected, be the cathode substrate unit 1 of electric capacity;
(2) lining or form the oxidation film layer 11 of one deck on the side face of cathode substrate unit 1 as dielectric medium;
(3) lining one deck isolation layer 9 on the surface of the central authorities of each cathode substrate unit 1 makes anode 16, negative electrode 10 isolated mutually;
(4) coated with conductive Polymer Solution on negative electrode 10 perimeter surface makes to form one deck electroconductive polymer layer 14, as solid electrolyte;
(5) lining conduction carbon paste on the surface of the electroconductive polymer layer 14 of above-mentioned negative electrode 10, and form a carbon paste layer 15;
(6) coat elargol on the side face of above-mentioned carbon paste layer 15, form an elargol layer 13, elargol layer 13 is a negative electrode 10, and the part that cathode substrate unit 1 is not covered then forms outwards outstanding anode 16;
(7) each solid electrolyte capacitor is cut down from sheet metal 8, promptly obtain solid electrolytic capacitor 12;
(8) with solid electrolytic capacitor 12 storehouses stacks, the anode 16 and the negative electrode 10 of each capacitor 12 are individually fixed on the leg of a lead frame, drawing the terminal electrode of the positive and negative utmost point 16,10, and on storehouse stack solid electrolytic capacitor 7 the packaging insulating layer.
2, a kind of manufacture method of multilayer solid electrolytic capacitor, it is characterized in that: it comprises the following steps:
(1) bores a hole 2 in sheet metal 8 a punching presses majority U-shaped facing each other that can be used as solid electrolyte capacitor, form most unit metal plates that the maintenance of one side and sheet metal 8 bodies is connected, be the cathode substrate unit 1 of electric capacity;
(2) lining or form the oxidation film layer 11 of one deck on the side face of most cathode substrates unit 1 as dielectric medium;
(3) lining one deck isolation layer 9 on the central perimeter surface of each cathode substrate unit 1;
(4) be coated with photoresistance 17 or stick adhesive tape on corresponding capacitive insulation layer 9, the zone that photoresistance 17 or adhesive tape cover is the anode region of Unit two; Dipping or coated with conductive Polymer Solution on negative electrode 10 perimeter surface make to form one deck electroconductive polymer layer 14, as solid electrolyte;
(5) lining conduction carbon paste on the side face of the electroconductive polymer layer 14 of above-mentioned negative electrode 10, and form a carbon paste layer 15;
(6) coat elargol on the side face of above-mentioned carbon paste layer 15, form an elargol layer 13, this is a negative electrode 10, and the part that cathode substrate unit 1 is not covered then forms outwards outstanding anode 16;
(7) on capacitive insulation layer 9, remove photoresistance 17 or tear adhesive tape, each solid electrolyte capacitor is cut down from sheet metal 8, promptly obtain solid electrolytic capacitor 12;
(8) with solid electrolytic capacitor 12 storehouses stacks, the anode 16 and the negative electrode 10 of each capacitor 12 are individually fixed on the leg of a lead frame, drawing the terminal electrode of the positive and negative utmost point 16,10, and on storehouse stack solid electrolytic capacitor 12 the packaging insulating layer.
3, according to the manufacture method of claim 1 or 2 described a kind of multilayer solid electrolytic capacitors, it is characterized in that: described multilayer solid electrolytic capacitor can be used on the circuit board, or can be welded on the circuit board in the SMT mode.
4, according to the manufacture method of the described a kind of multilayer solid electrolytic capacitor of claim 3, it is characterized in that: in the described above-mentioned making step, can replace carbon paste with carbon paste or carbon paste.
5, according to the manufacture method of the described a kind of multilayer solid electrolytic capacitor of claim 3, it is characterized in that: in above-mentioned making step, can use imitate the accurate rubbing method that function is controlled, conductive-polymer solution is evenly coated on the side face of each cathode substrate unit 1, formed electroconductive polymer layer 14
6, according to the manufacture method of the described a kind of multilayer solid electrolytic capacitor of claim 5, it is characterized in that: conducting polymer is polyaniline, poly-arsenic noise made in coughing or vomiting, poly-match fen; Described polyaniline comprises aniline, oxidant and dopant.
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| Application Number | Priority Date | Filing Date | Title |
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| CNA2008100230811A CN101329953A (en) | 2008-07-14 | 2008-07-14 | Method of preparing multilayer solid electrolytic capacitor |
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| CNA2008100230811A CN101329953A (en) | 2008-07-14 | 2008-07-14 | Method of preparing multilayer solid electrolytic capacitor |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103632846A (en) * | 2012-08-22 | 2014-03-12 | 株式会社村田制作所 | Solid electrolytic capacitor and manufacturing method therefor |
| CN104053689A (en) * | 2011-12-09 | 2014-09-17 | 南洋理工大学 | Graft copolymers of a poly(vinylidene fluoride)-based polymer and at least one type of electrically conductive polymer, and methods for forming the graft copolymers |
| CN107221440A (en) * | 2017-06-15 | 2017-09-29 | 苏州圣咏电子科技有限公司 | A kind of solid capacitor |
| TWI690958B (en) * | 2018-09-19 | 2020-04-11 | 鈺冠科技股份有限公司 | Pre-treatment equipment for capacitor element and rapid manufacturing method for capacitor element |
| CN114694974A (en) * | 2020-12-30 | 2022-07-01 | 禾达材料科技股份有限公司 | Winding type electrolytic capacitor packaging structure and winding type corrosion-resistant negative electrode foil thereof |
-
2008
- 2008-07-14 CN CNA2008100230811A patent/CN101329953A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104053689A (en) * | 2011-12-09 | 2014-09-17 | 南洋理工大学 | Graft copolymers of a poly(vinylidene fluoride)-based polymer and at least one type of electrically conductive polymer, and methods for forming the graft copolymers |
| CN104053689B (en) * | 2011-12-09 | 2017-01-18 | 南洋理工大学 | Graft copolymers of a poly(vinylidene fluoride)-based polymer and at least one type of electrically conductive polymer, and methods for forming the graft copolymers |
| CN103632846A (en) * | 2012-08-22 | 2014-03-12 | 株式会社村田制作所 | Solid electrolytic capacitor and manufacturing method therefor |
| US9318268B2 (en) | 2012-08-22 | 2016-04-19 | Murata Manufacturing Co., Ltd. | Solid electrolytic capacitor and manufacturing method therefor |
| CN103632846B (en) * | 2012-08-22 | 2016-08-31 | 株式会社村田制作所 | Solid electrolytic capacitor And Manufacturing approach |
| CN107221440A (en) * | 2017-06-15 | 2017-09-29 | 苏州圣咏电子科技有限公司 | A kind of solid capacitor |
| TWI690958B (en) * | 2018-09-19 | 2020-04-11 | 鈺冠科技股份有限公司 | Pre-treatment equipment for capacitor element and rapid manufacturing method for capacitor element |
| CN114694974A (en) * | 2020-12-30 | 2022-07-01 | 禾达材料科技股份有限公司 | Winding type electrolytic capacitor packaging structure and winding type corrosion-resistant negative electrode foil thereof |
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Open date: 20081224 |