CN103188876A - Method for reducing signal transmission loss of printed circuit board (PCB) rear panel - Google Patents
Method for reducing signal transmission loss of printed circuit board (PCB) rear panel Download PDFInfo
- Publication number
- CN103188876A CN103188876A CN2011104598222A CN201110459822A CN103188876A CN 103188876 A CN103188876 A CN 103188876A CN 2011104598222 A CN2011104598222 A CN 2011104598222A CN 201110459822 A CN201110459822 A CN 201110459822A CN 103188876 A CN103188876 A CN 103188876A
- Authority
- CN
- China
- Prior art keywords
- copper foil
- pcb
- signal transmission
- rear panel
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The invention provides a method for reducing signal transmission loss of a printed circuit board (PCB) rear panel. A layer of metal with a low resistance attribute is electroplated on the surface of a copper foil after manufacturing copper foil graphs in the inner layer of the PCB rear panel is completed, and then lamination of core material is conducted. On the basis of existing manufacturing process of the PCB rear panel, the method of inner layer copper foil multibond is replaced by plating the low resistance metal ( for example, gold) on the surface of the copper foil, and therefore transmission loss of high-speed signals is reduced, and transmission quality of the signals is improved.
Description
Technical field
The present invention relates to a kind of method of the PCB of reducing backboard signal transmission differential loss.
Background technology
High speed development along with modern electronic technology, the message transmission rate of PCB backboard is more and more higher, reached more than the 10Gbit/s, the transmission of the signal of two-forty is more and more higher to the requirement of PCB backboard, and particularly the reliability of PCB backboard directly affects the transmission rate of signal.The signal of telecommunication transmission performance of PCB backboard is relevant with the loss of dielectric and Copper Foil, and loss is more little, and the signal of telecommunication transmission performance of backboard is more strong.
Fig. 1 is the part manufacturing process flow diagram of existing PCB backboard.As shown in the figure, traditional PCB backboard is before the core material lamination, the internal layer Copper Foil of finishing graphic making is carried out surperficial brown to be handled, namely improve bonding force between Copper Foil and the prepreg by the roughness that increases copper foil surface, but such processing method directly causes the increase of high-frequency signal transmission differential loss.
Another main cause that the high-frequency signal loss produces is the lead loss.Lead itself has certain resistance, and under the direct current situation, electric current is evenly distributed on conductor cross-section, and under the interchange situation, electric current is to be tending towards the lead outer surface, and this phenomenon is called skin effect.The microstrip line electric current is tending towards being distributed in the side near reference layer.
Fig. 2 is that the FR-4 dielectric material is in different roughness RMS (unit: μ m), the variation relation schematic diagram of attenuation factor and frequency variation, as shown in the figure, the RMS value hour, following signal attenuation is inappreciable for 1GHz, and when RMS was big, decaying began in the low frequency of hundreds of MHz, and for high-frequency signal, micron-sized roughness value all can cause the decay of high-frequency signal.When Fig. 3 is 0.8 μ m for roughness RMS value, the differential loss graph of a relation of Copper Foil, as seen, the differential loss that is brought by roughness is still bigger.
Summary of the invention
In view of the foregoing, the object of the present invention is to provide a kind of method of the PCB of reducing backboard signal transmission differential loss.
For achieving the above object, the present invention is by the following technical solutions: a kind of method of the PCB of reducing backboard signal transmission differential loss: after PCB backboard internal layer copper clad patterns completes, copper foil surface is electroplated one deck have the metal of low resistance attribute, and then carry out the core material lamination treatment.
The metal of described low resistance attribute is gold.
Described copper foil surface electroplated metal layer thickness is minimum 0.05 μ m.
The invention has the advantages that: because the present invention is after PCB backboard internal layer copper clad patterns completes, copper foil surface has been electroplated the metal that one deck has the low resistance attribute, and the brown of not carrying out Copper Foil is handled, avoided because internal layer Copper Foil brown is handled the back high speed transmission of signals apart from the drawback that increases, reduce signal transmission differential loss, improved signal transmission quality.
Description of drawings
Fig. 1 is the part manufacturing process flow diagram of existing PCB backboard;
Fig. 2 be the FR-4 dielectric material under different roughness, the variation relation schematic diagram of attenuation factor and frequency variation;
When Fig. 3 is 0.8 μ m for roughness, the differential loss graph of a relation of Copper Foil;
Fig. 4 is the flow chart of the part manufacturing process of PCB backboard of the present invention.
Embodiment
Below in conjunction with drawings and Examples the present invention is carried out further detailed description.
Fig. 1 is the part manufacturing process flow diagram of existing PCB backboard.As figure, after completing, the internal layer copper clad patterns just copper foil surface is carried out the roughness that brown handles to increase copper foil surface, carry out the core material lamination treatment afterwards again.By analysis, for high-frequency signal, transmission has caused extra loss to the roughness on copper foil layer surface to signal.In order to reduce the PCB backboard to the differential loss of signal transmission, as shown in Figure 4, the present invention is after PCB backboard internal layer copper clad patterns completes, copper foil surface is electroplated the metal that one deck has the low resistance attribute, and then carry out the core material lamination treatment, namely copper foil surface brown treatment step is replaced in order to electroplate one deck low resistive metal at copper foil surface, and it is same as the prior art to make other technological process of PCB backboard.Metal layer thickness is minimum 0.05 μ m.
PCB generally adopts Copper Foil as conductor material, and the conductance of Copper Foil is 5.8 * 10
7S/m, relative permeability are 1, and the skin depth at 5GHz (10Gbps) frequency place is 0.93 μ m; The conductance of gold is 6.0X10
7S/m, relative permeability are 1, and the skin depth at 5GHz (10Gbps) frequency place is 1.08 μ m.As seen, the PCB surface treatment adopts gold-plated processing can reduce the skin effect of high-frequency signal to a certain extent.
Because the metallic character of gold can reduce the dielectric resistance of signal transmission, so, in specific embodiments of the invention, preferably have the gold of low resistance attribute.Certainly, also can select the metal of other low resistance attributes, such as: silver.
It should be noted that, the present invention only plates low resistive metal at backboard and handles, because carrying out brown, do not handle inner layer metal, thereby reduced degree of adhesion between metal and the prepreg, can cause backboard the problem of layering to occur under the situation of Reflow Soldering, still in most of the cases, the connector on the backboard has only crimping and seldom needs welding, therefore there is not the plate base to be heated to cause the pcb board lamination problem, thereby less demanding to degree of adhesion between prepreg and the metal copper foil.
In addition, from the angle of cost, though the cost of craft of gilding promotes to some extent, for some high value added products, can promote the meaning of product stability much larger than the consideration of cost factor, and compare also with other more expensive material and to hold advantage slightly.
The present invention is with in the prior art, the brown of the Copper Foil that constitutes the PCB backboard is handled to change at copper foil surface electroplate the metal that one deck has the low resistance attribute, has reduced the loss of signal transmission like this, has improved signal transmission quality.
The above is preferred embodiment of the present invention and the know-why used thereof; for a person skilled in the art; under the situation that does not deviate from the spirit and scope of the present invention; any based on apparent changes such as the equivalent transformation on the technical solution of the present invention basis, simple replacements, all belong within the protection range of the present invention.
Claims (3)
1. a method that reduces PCB backboard signal transmission differential loss is characterized in that: after PCB backboard internal layer copper clad patterns completes, copper foil surface is electroplated one deck have the metal of low resistance attribute, and then carry out the core material lamination treatment.
2. the method that reduces PCB backboard signal transmission differential loss according to claim 1, it is characterized in that: the metal of described low resistance attribute is gold.
3. the method that reduces PCB backboard signal transmission differential loss according to claim 2, it is characterized in that: described copper foil surface electroplated metal layer thickness is 0.05 μ m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104598222A CN103188876A (en) | 2011-12-31 | 2011-12-31 | Method for reducing signal transmission loss of printed circuit board (PCB) rear panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104598222A CN103188876A (en) | 2011-12-31 | 2011-12-31 | Method for reducing signal transmission loss of printed circuit board (PCB) rear panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103188876A true CN103188876A (en) | 2013-07-03 |
Family
ID=48679752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104598222A Pending CN103188876A (en) | 2011-12-31 | 2011-12-31 | Method for reducing signal transmission loss of printed circuit board (PCB) rear panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103188876A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101090817B (en) * | 2004-12-09 | 2011-09-07 | 旭硝子株式会社 | Laminate for printed wiring board |
| JP2011233836A (en) * | 2010-04-30 | 2011-11-17 | Nippon Mektron Ltd | Build-up type multilayer printed wiring board and method for manufacturing the same |
-
2011
- 2011-12-31 CN CN2011104598222A patent/CN103188876A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101090817B (en) * | 2004-12-09 | 2011-09-07 | 旭硝子株式会社 | Laminate for printed wiring board |
| JP2011233836A (en) * | 2010-04-30 | 2011-11-17 | Nippon Mektron Ltd | Build-up type multilayer printed wiring board and method for manufacturing the same |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105517374B (en) | A kind of production method of thin core plate HDI plate | |
| JP2015109449A (en) | Shield film, shield print circuit board, and shield film manufacturing method | |
| CN105472912A (en) | Press fit method for high-voltage-resistant PCB with thick copper plate | |
| CN105704945B (en) | A kind of method and device for realizing PCB via hole | |
| CN103648236B (en) | The method windowed in a kind of PCB of improvement metal hemming edge local | |
| US8198962B2 (en) | Carrier for high frequency signals having conducting wires with roughness portions and a carrier layout method | |
| CN104284520A (en) | PCB surface treatment method | |
| CN101877945A (en) | Method for removing via stub and PCB designed by using the method | |
| CN112654135A (en) | FPC flat coaxial line and manufacturing method thereof | |
| CN103188876A (en) | Method for reducing signal transmission loss of printed circuit board (PCB) rear panel | |
| CN101677486A (en) | Printed circuit board and manufacturing method thereof | |
| CN114222430A (en) | High-density PCB design method based on microstrip line far-end crosstalk | |
| CN108093557A (en) | A kind of circuit board and PCIE boards | |
| KR102502018B1 (en) | Surface treatment copper foil and copper clad laminate | |
| CN205082045U (en) | Take circuit plate structure of electromagnetic shield membrane | |
| CN206524233U (en) | A kind of inductor | |
| CN110996506A (en) | Embedded type magnetic material PCB and manufacturing process thereof | |
| CN201336197Y (en) | Composite substrate made of magnetic material | |
| CN101730398A (en) | Printed circuit board and method for producing same | |
| CN205071463U (en) | PCB circuit board anti -electromagnetic interference structure | |
| CN217470384U (en) | Asymmetric PCB core board of roughness and PCB are range upon range of | |
| CN102036472A (en) | Microwave high-frequency metal base circuit board | |
| CN108811337A (en) | A kind of production method of double-sided PCB board | |
| US11477890B2 (en) | Plated pads and leads for surface mount technology connections | |
| CN218939975U (en) | Transmission line and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130703 |