CN103179840A - 散热器 - Google Patents

散热器 Download PDF

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Publication number
CN103179840A
CN103179840A CN2011104403703A CN201110440370A CN103179840A CN 103179840 A CN103179840 A CN 103179840A CN 2011104403703 A CN2011104403703 A CN 2011104403703A CN 201110440370 A CN201110440370 A CN 201110440370A CN 103179840 A CN103179840 A CN 103179840A
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CN
China
Prior art keywords
radiator
fixed
hole
radiator body
fixed arm
Prior art date
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Pending
Application number
CN2011104403703A
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English (en)
Inventor
陈国义
刘磊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN2011104403703A priority Critical patent/CN103179840A/zh
Priority to US13/340,717 priority patent/US20130163207A1/en
Priority to TW100149749A priority patent/TW201326729A/zh
Publication of CN103179840A publication Critical patent/CN103179840A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热器，包括一散热器本体及若干分别转动安装于该散热器本体的固定臂，每一固定臂设有至少一固定孔。由于该散热器具有可转动调节的固定臂，从而使散热器的固定孔的位置可调，因而该散热器可适用于定位孔布局不同的电路板，从而方便操作并降低成本。

Description

散热器
技术领域
本发明涉及一种散热器。
背景技术
目前在电子装置内，业界通常在电路板上设置散热器用以对设于电路板上的发热电子元件进行散热。通常，散热器上设有固定孔，电路板上设有与散热器上的固定孔位置对应的定位孔，电路板下方设有一背板，该背板上设有若干对应穿过该电路板的定位孔的固定柱。螺丝穿过散热器的固定孔与背板的固定柱相螺合，从而将散热器固定于电路板上。
然而，不同规格的电路板，其用于安装散热器的定位孔的布局不同。而对于一特定的散热器，其固定孔的布局是不变的，这样，可安装于某一电路板的散热器不能相容其他规格的电路板，不同规格的电路板需要配备不同的散热器，造成操作不便，且成本升高。
发明内容
有鉴于此，有必要提供一种散热器，其可安装于定位孔布局不同的电路板。
一种散热器，包括一散热器本体及若干分别转动安装于该散热器本体的固定臂，每一固定臂设有至少一固定孔。
由于该散热器具有可转动调节的固定臂，从而使散热器的固定孔的位置可调，因而该散热器可适用于定位孔布局不同的电路板，从而方便操作并降低成本。
附图说明
图1为本发明散热器的较佳实施方式的立体分解图。
图2是图1中的散热器、一第一主板及一第一背板的立体组装图。
图3是图2中的俯视图。
图4是图1中的散热器安装于另一主板的俯视图。
主要元件符号说明
散热器本体 10
底座 12
凸台 121
枢接孔 1212
鳍片 14
固定臂 30
枢接部 31
通孔 312
连接部 33
固定部 35
固定孔 352
枢接件 50
背板 400
固定柱 401
电路板 500、600
定位孔 501
螺丝 800
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1，本发明散热器的较佳实施方式包括一散热器本体10、四固定臂30及四枢接件50。
该散热器本体10由导热材料，如铜、铝等制成，包括一大致呈矩形的底座12及凸设于该底座12的顶面的若干鳍片14。该底座12的四角处分别形成一凸台121，每一凸台121设有一垂直该底座12延伸并贯穿该凸台的顶面的枢接孔1212。
每一固定臂30包括一枢接部31、一自该枢接部31的一端垂直向下延伸的连接部33及一自该连接部33的底端向远离该枢接部31的方向垂直延伸的固定部35。该枢接部31的中部设有一通孔312。该固定部35设有若干排列成一列的固定孔352。
在本实施方式中，每一枢接件50为一螺丝。
请参阅图2及图3，组装时，将这些固定臂30的枢接部31对应贴靠于该散热器本体10的凸台121的顶面，使这些固定臂30的通孔312对准该散热器本体10对应的枢接孔1212，将这些枢接件50穿过这些固定臂30的通孔312并锁入该散热器本体10对应的枢接孔1212，从而将这些固定臂30安装于该散热器本体10，当略微松释这些枢接件50时，这些固定臂30可相对该散热器本体10转动，且转动方向的切线垂直于对应的固定臂30上的固定孔352的排列方向。
配合一背板400将该散热器固定于一电路板500。该电路板500设有四定位孔501，该背板400上设有若干固定柱401。该背板400位于该电路板500的下方，使这些固定柱401自下而上对应穿过该电路板500的定位孔501。将该散热器放置于该电路板500的顶面，并使每一固定臂30的其中一固定孔352对准对应的固定柱401。然后利用螺丝800穿过这些固定臂30的对应固定孔352而锁入这些固定柱401，从而将散热器固定于电路板500上。
请同时参阅图4，电路板600的固定孔及固定柱（图未示）的布局与电路板500不同。由于每一固定臂30上设有若干固定孔352，同时该固定臂30可相对该散热器本体10转动，因此可方便的使该固定臂30的其中一固定孔352对准电路板600对应的一固定柱，从而利用螺丝800将散热器固定于该电路板600。因此，该散热器可适用于固定孔布局不同的电路板。

Claims (4)

1.一种散热器，包括一散热器本体及若干分别转动安装于该散热器本体的固定臂，每一固定臂设有至少一固定孔。
2.如权利要求1所述的散热器，其特征在于：该散热器还包括若干枢接件，该散热器本体设有若干枢接孔，每一固定臂设有一对正该散热器本体的其中一枢接孔的通孔，这些枢接件分别转动穿设于这些固定臂的通孔并锁入该散热器本体对应的枢接孔。
3.如权利要求2所述的散热器，其特征在于：该散热器本体包括一底座，该底座于邻近其边缘处向上凸设若干凸台，该散热器本体的枢接孔分别设置于这些凸台并贯穿对应的凸台的顶面，每一固定臂包括一抵靠于对应的一凸台的顶面的枢接部、一自该枢接部的一端垂直向下延伸的连接部及自该连接部的底端向远离该枢接部的方向垂直延伸的一固定部，该每一固定臂的枢接孔及固定孔分别设置于该固定臂的枢接部及固定部。
4.如权利要求1或3所述的散热器，其特征在于：每一固定臂设有若干固定孔，这些固定孔沿垂直该固定臂的转动轨迹的切线方向排列成一列。
CN2011104403703A 2011-12-26 2011-12-26 散热器 Pending CN103179840A (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2011104403703A CN103179840A (zh) 2011-12-26 2011-12-26 散热器
US13/340,717 US20130163207A1 (en) 2011-12-26 2011-12-30 Heat sink
TW100149749A TW201326729A (zh) 2011-12-26 2011-12-30 散熱器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011104403703A CN103179840A (zh) 2011-12-26 2011-12-26 散热器

Publications (1)

Publication Number Publication Date
CN103179840A true CN103179840A (zh) 2013-06-26

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US (1) US20130163207A1 (zh)
CN (1) CN103179840A (zh)
TW (1) TW201326729A (zh)

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CN103167778A (zh) * 2011-12-16 2013-06-19 鸿富锦精密工业（深圳）有限公司 散热器固定装置
CN103517612B (zh) * 2012-06-25 2017-06-13 富瑞精密组件（昆山）有限公司 散热装置
JP5998890B2 (ja) * 2012-12-06 2016-09-28 富士通株式会社 バネ付座金及び固定具
JP6088405B2 (ja) * 2013-11-27 2017-03-01 Ｎｅｃパーソナルコンピュータ株式会社 ヒートシンクの取付構造および基板
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TW201326729A (zh) 2013-07-01
US20130163207A1 (en) 2013-06-27

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Application publication date: 20130626