CN103163441A - Semiconductor test device - Google Patents
Semiconductor test device Download PDFInfo
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- CN103163441A CN103163441A CN2012104519935A CN201210451993A CN103163441A CN 103163441 A CN103163441 A CN 103163441A CN 2012104519935 A CN2012104519935 A CN 2012104519935A CN 201210451993 A CN201210451993 A CN 201210451993A CN 103163441 A CN103163441 A CN 103163441A
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Abstract
The invention provides a semiconductor test device, refers to a comprehensive semiconductor test device with a plurality of testers, and can prevent metal fatigue of wirings connected with the testers. The semiconductor test device combines DC characteristic tests carried out by a DC tester and AC characteristic tests carried out by an AC tester; and comprises the following structures: a lower movable structure (57) for fixing DUT (testing element); an upper movable structure (59) comprising a terminal group (62) connected with the DC tester and the AC tester and cylinders (53, 54) with a short circuit electrode (71); and a fixing tool for fixing a wiring group (61) is configured between the upper movable structure and the lower movable structure. An expansion cylinder (53) enables the wiring group (61) to be disconnected from the terminal group (62) when the DC test is carried out, and the expansion cylinder (53) enables the wiring group (61) to be disconnected from the terminal group (62).
Description
Technical field
The present invention relates to have the comprehensive semiconductor test instruments of many testing machines.
Background technology
Insulated Gate Bipolar Transistor), (mos field effect transistor: delivery test and the various tests in manufacturing process as the power semiconductor product of representative such as roughly are divided into DC attribute testing and AC attribute testing to power MOSFET Metal Oxide Semiconductor Field Effect Transistor) take the IGBT(igbt:.In these tests, the hookup that usually uses respectively is different, so use independently semiconductor test instruments.
In the DC attribute testing of power semiconductor product, the static characteristic tests such as the leakage current measuring test of semiconductor element, withstand voltage determination test, forward voltage determination test and heat resistance measuring test are arranged.
These DC attribute testings are used the DC testing machine usually when dispatching from the factory and in-process carries out.
On the other hand, in the AC attribute testing of power semiconductor product, the dynamic characteristic tests such as L load test, short-circuit test are arranged.
In addition, except above-mentioned DC attribute testing and AC attribute testing, the also Insulation Test of guaranteed dielectric strength.
In this AC attribute testing, use the AC testing machine to test.The test of the dielectric strength of using the Insulation Test machine is also arranged in addition.
Like this, generally when the power semiconductor product export, usually use DC testing machine, AC testing machine and Insulation Test machine etc. to carry out attribute testing.
Figure 12 is the structural drawing with existing comprehensive semiconductor test instruments of AC testing machine and DC testing machine.
This semiconductor test instruments 500 comprises: the bottom cylinder 23 that is fixed on the matrix cabinet; Be fixed on the top cylinder 25,27 of matrix cabinet; With keep DUT(Device Under Test: for the examination device, be semiconductor module etc. herein) and the bottom movable structure section 22 that links with the movable part of bottom cylinder.Also comprise: carry the AC hookup and with the upper movable structural portion 24 of the movable part interlock of top cylinder 25; Carry the DC hookup and with the upper movable structural portion 26 of the movable part interlock of top cylinder 27; And be fixed in matrix cabinet and the fixed jig 20 between bottom movable structure section 22 and upper movable structural portion 24,25.
In this semiconductor test instruments, AC testing machine 16 and DC testing machine 17 are connected the outside.In the situation that implement test with AC testing machine 16, by making bottom cylinder 23 increase with the electrode 1P～1W of bottom movable structure section 22 by on the spring electrode 20P～20W of fixed jig 20.
In addition, by top cylinder 25 is descended with the spring electrode 10P～10W of upper movable structural portion 24 by on the electrode of fixed jig 20.Thus, DUT1 is connected with AC testing machine 16 distributions, can implement the AC test.
In addition, in the situation that implement test with the DC testing machine, by making bottom cylinder 23 increase with the electrode 1P～1W of bottom movable structure section 22 by on the spring electrode 20P～20W of fixed jig 20.In addition, descend by making top cylinder 27, and the spring electrode of upper movable structural portion 26 is pressed on the electrode of fixed jig 20.Thus, DUT1 is connected with DC testing machine 17 distributions, can implement the DC test.Symbol 29 in figure is the parallel flats that connect from the distribution H1 of AC testing machine 16, connecting valve circuit 2 or contact site 10P～10W.In addition, symbol G1 is the distribution that connects upper movable structural portion 26 and DC testing machine 17.
In addition, put down in writing in patent documentation 1: power supply unit is to having connected the tested device of DUT(by load portion) DUT connecting portion supply power; In load portion, use the switching devices such as passive load, transistor such as inductive load, ohmic load, capacitive load or rectification part (initiatively load), respectively to the additional necessary function of DUT; On the DUT connecting portion, connect DUT control/drive division and DUT characteristic measurement section; DUT control/drive division is supplied with voltage signal, current signal or the frequency signal of regulation to DUT, it is driven, by DUT characteristic measurement section 7, measure its electrical characteristics and thermal characteristics by the current value or the magnitude of voltage that flow through in DUT3, like this, heat resistance test, surge (surge) test, switching characteristic test, continuous working test to power semiconductor carry out comprehensively carrying out these tests with same bench teat experiment device.
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2010-107432 communique
Summary of the invention
The problem that invention will solve
In Figure 12, in the situation that implement test with DC testing machine and AC testing machine, when switching, upper movable structural portion 24 and 26 is moved up and down.Like this, be connected to many distribution F1 of upper movable structural portion 24 and move up and down simultaneously from many distribution G1 and upper movable structural portion 24 or 26 that the DC testing machine is connected to upper movable structural portion 26 from the AC testing machine.
Each AC test and DC test this knee-action repeatedly, its frequency is for example in the situation that the total test period of AC test and DC test is 30 seconds, be about 1000 times/days (8 hours * 60 minutes * 60 seconds/30 seconds), reach in 1 year 360000 times (1000 times * 30 days * 1 two months).
So repeatedly during knee-action, in the moving part of distribution F1, G1, metal fatigue occurs, the worst situation can cause broken string, can not test.
In addition, because upper movable structural portion 24 is heavier, so moving up and down of top cylinder 25 is time-consuming, test period is elongated.And then the frequency of spring electrode 10P～10W and spring electrode 20P～20W and the other side's electrode contact is higher, so abrasion significantly.
In addition, in patent documentation 1, the distribution for connecting DUT connecting portion, DUT controls/drive division and DUT characteristic measurement section not have to put down in writing because of moving the metal fatigue that causes.
The object of the invention is to solve above-mentioned problem, a kind of comprehensive semiconductor test instruments with a plurality of testing machines is provided, it can prevent the metal fatigue of the distribution that is connected with testing machine.
Be used for solving the method for problem
In order to reach above-mentioned purpose, invention described according to technical scheme 1 has the comprehensive semiconductor test instruments of a plurality of testing machines, comprising: a plurality of testing machine links subgroups, and setting corresponding to each testing machine is used for connecting the device terminal group for the examination device; The main wiring group leaves (separating) configuration with above-mentioned testing machine link subgroup, is used for being electrically connected to above-mentioned device terminal group for the examination device and above-mentioned each testing machine link subgroup; A plurality of the first actuators arrange one accordingly at least with each above-mentioned testing machine; And short-circuiting electrode, being arranged at the front end of above-mentioned the first actuator, the terminal that carries out above-mentioned each testing machine link subgroup is connected or disconnection with above-mentioned main wiring group's terminal.
In addition, invention described according to technical scheme 2 in the described invention of technical scheme 1, comprising: be fixed on the first movable structure section on assigned position with above-mentioned for the examination device; The second actuator that above-mentioned the first movable structure section can be moved up and down; The second movable structure section of fixing above-mentioned each testing machine link subgroup; With the 3rd actuator that above-mentioned the second movable structure section can be moved up and down.
In addition, invention described according to technical scheme 3, in the described invention of technical scheme 2, above-mentioned the first actuator is fixed in above-mentioned the second movable structure section.
In addition, invention described according to technical scheme 4, in the described invention of technical scheme 1, above-mentioned testing machine is one of Insulation Test machine of the DC testing machine that carries out the DC attribute testing, the AC testing machine that carries out the AC attribute testing or test dielectric strength.
in addition, invention described according to technical scheme 5, in the comprehensive semiconductor test instruments with DC testing machine and AC testing machine, comprise: above-mentioned DC testing machine, above-mentioned AC testing machine, the first cylinder, the second cylinder, the 3rd cylinder, the 4th cylinder, the 5th cylinder, the 6th cylinder, be located at the first short-circuiting electrode of the front end of above-mentioned the first cylinder, be located at the second short-circuiting electrode of the front end of above-mentioned the second cylinder, be located at the 3rd short-circuiting electrode of the front end of above-mentioned the 3rd cylinder, be located at the 4th short-circuiting electrode of the front end of above-mentioned the 4th cylinder, be located at the 5th short-circuiting electrode of the front end of above-mentioned the 5th cylinder, be located at the 6th short-circuiting electrode of the front end of above-mentioned the 6th cylinder, by stretch that above-mentioned the first cylinder descends the upper movable structural portion, by stretching bottom movable structure section that above-mentioned the second cylinder rises, being configured in the fixed jig between above-mentioned upper movable structural portion and above-mentioned bottom movable structure section, consist of the part fixing structure body of above-mentioned upper movable structural portion, be fixed on above-mentioned the 3rd cylinder on this part fixing structure body, the 4th cylinder, the 5th cylinder, the 6th cylinder, the first end subgroup, the second terminal group, be fixed on the main wiring group on above-mentioned fixed jig and control the distribution group, above-mentioned bottom movable structure comprises that above-mentioned semiconductor test instruments also comprises for examination device supporting station: the DC distribution that connects above-mentioned DC testing machine and above-mentioned first end subgroup, with the AC distribution that is connected above-mentioned AC testing machine and above-mentioned the second terminal group, by stretching above-mentioned the first cylinder, stretch above-mentioned the second cylinder, stretch above-mentioned the 3rd cylinder, the DC testing machine is connected with subgroup, main side or control end subgroup for the examination device, can implement the DC attribute testing, by stretching above-mentioned the first cylinder, stretch above-mentioned the second cylinder, stretch above-mentioned the 4th cylinder, the AC testing machine is connected with the power supply terminal of being connected with the subgroup, main side for the control end subgroup of examination device, by stretching the 5th cylinder, be connected with inductor or resistance for the main terminal beyond the power supply terminal in the subgroup, main side of examination device, by stretching the 6th cylinder, by short circuit, can implement the AC attribute testing for the main terminal beyond the power supply terminal in the subgroup, main side of examination device.
in addition, invention described according to technical scheme 6, in the comprehensive semiconductor test instruments with DC testing machine and Insulation Test machine, comprising: above-mentioned DC testing machine, above-mentioned AC testing machine, the first cylinder, the second cylinder, the 3rd cylinder, the 4th cylinder, be located at the front end of above-mentioned the first cylinder the first short-circuiting electrode, be located at the front end of above-mentioned the second cylinder the second short-circuiting electrode, be located at the front end of above-mentioned the 3rd cylinder the 3rd short-circuiting electrode, be located at the 4th short-circuiting electrode of the front end of above-mentioned the 4th cylinder, by stretch upper movable structural portion that above-mentioned the first cylinder descends, by stretching bottom movable structure section that above-mentioned the second cylinder rises, being configured in the fixed jig between above-mentioned upper movable structural portion and above-mentioned bottom movable structure section, consist of the part fixing structure body of above-mentioned upper movable structural portion, be fixed on above-mentioned the 3rd cylinder on this part fixing structure body, the 4th cylinder, the first end subgroup, the second terminal group, be fixed on the main wiring group on above-mentioned fixed jig and control the distribution group, above-mentioned bottom movable structure comprises for examination device supporting station, above-mentioned semiconductor test instruments also comprises: the DC distribution that connects above-mentioned DC testing machine and above-mentioned first end subgroup, with the AC distribution that is connected above-mentioned AC testing machine and is connected with above-mentioned the second terminal group, by stretching above-mentioned the first cylinder, stretch above-mentioned the second cylinder, stretch above-mentioned the 3rd cylinder, the DC testing machine is connected with subgroup, main side and control end subgroup for the examination device, can implement the DC attribute testing, by stretching above-mentioned the first cylinder, stretch above-mentioned the second cylinder, stretch above-mentioned the 4th cylinder, the Insulation Test machine is connected with the control end subgroup that supplies the examination device and the power supply terminal in the subgroup, main side, for the main terminal beyond the power supply terminal in the subgroup, main side of examination device and control end subgroup by short circuit, can implement Insulation Test.
In addition, invention described according to technical scheme 7, in the described invention of technical scheme 5 or 6, above-mentioned the 3rd cylinder can be made of a plurality of cylinders.
In addition, invention described according to technical scheme 8, in the described invention of any one, above-mentioned the 4th cylinder can be made of a plurality of cylinders in technical scheme 5 to 7.
The invention effect
According to the present invention, in having the comprehensive semiconductor test instruments of a plurality of testing machines, by actuators such as use cylinders in the switching of various tests, can reduce the travel frequency of the distribution that connects each testing machine, can prevent the metal fatigue of distribution.
Description of drawings
Fig. 1 is the structural representation of the semiconductor test instruments of the first embodiment of the present invention.
Fig. 2 is the major part stereographic map of short-circuiting electrode 71, (a) be mounted in the DC test and use the stereographic map of the short-circuiting electrode 71 on cylinder 55 with cylinder 54 and inductor with cylinder 53, AC test, (b) be mounted in the stereographic map of the short-circuiting electrode 71 on main wiring group 61, (c) be mounted in the stereographic map that the short-circuiting electrode 71 on cylinder 56 is used in short circuit.
Fig. 3 is operation (flow process) figure that DUT shown in Figure 9 is tested with the semiconductor test instruments of Fig. 1.
Fig. 4 is operation (flow process) figure that the semiconductor test instruments with Fig. 1 of then Fig. 3 is tested DUT shown in Figure 9.
Fig. 5 is operation (flow process) figure that the semiconductor test instruments with Fig. 1 of then Fig. 4 is tested DUT shown in Figure 9.
Fig. 6 is operation (flow process) figure that the semiconductor test instruments with Fig. 1 of then Fig. 5 is tested DUT shown in Figure 9.
Fig. 7 means the figure of the flow process of the situation that exchanges DUT.
Fig. 8 means the figure of flow process of the situation of crossover fixation tool.
Fig. 9 represents that DUT(is for the examination device) be the structure of semiconductor module, be (a) circuit diagram that consists of the three-phase inverter of semiconductor module, (b) be the stereographic map of semiconductor module.
Figure 10 is that the arrangement plan of cylinder 54 and main wiring group 61 and short-circuiting electrode 71 is used in the terminal group 62, the DC test that are fixed on the part fixing structure body with cylinder 53, AC test.
Figure 11 is the structural representation of the semiconductor test instruments of the second embodiment of the present invention.
Figure 12 is the structural drawing with existing comprehensive semiconductor test instruments of AC testing machine and DC testing machine.
Symbol description
51 bottom cylinders
52 top cylinders
53DC test cylinder
54AC test cylinder
55 inductor cylinders
56 short circuit cylinders
57 bottom movable structure sections
58,58a fixed jig
59 upper movable structural portion
60 part fixing structure bodies
61,61b main wiring group
61a controls the distribution group
62,62a terminal group
The 63DC distribution
The 64AC distribution
65 inductors
The 66DC testing machine
The 67AC testing machine
71 short-circuiting electrodes
The 71a leaf spring
72 for examination device supporting station
73 fixed heads
74DC/AC controls distribution
74a control end subgroup
75 subgroup, main sides
77 Insulation Test cylinders
78 Insulation Test machines
79 insulation distributions
80 matrix cabinets
81 resin enclosures
100,200 semiconductor test instruments of the present invention
500 existing semiconductor test instruments
A, B, C1, D1, E, F, G, H, I, J, Q, Z arrow (the flexible direction of expression cylinder)
Embodiment
The＜the first embodiment＞
Fig. 1 is the structural representation of the semiconductor test instruments of the first embodiment of the present invention.The semiconductor test instruments 100 of Fig. 1 is the examples with comprehensive semiconductor test instruments of DC testing machine and AC testing machine.
Fig. 9 represents as DUT(for the examination device) the structure of semiconductor module, this figure (a) is the circuit diagram that consists of the three-phase inverter of semiconductor module, this figure (b) is the stereographic map of semiconductor module.Three-phase inverter is made of with six FWD that are connected with its reverse parallel connection six IGBT.In addition, dispose N terminal, P terminal, U terminal, V terminal, W terminal and control end subgroup 74a on the top of the resin enclosure 81 of this semiconductor module.
In addition, in Fig. 1, there is no circuit that diagram is made of electrolytic condenser, connector, diode and the transistor of the distribution of be used for measuring, Figure 12 etc.
In addition, the cylinder 53 that dots, 54 and terminal group 62 expression stretch top cylinder 52 and make upper movable structural portion 59 mobile situation downwards as shown in arrow Z.
This semiconductor test instruments 100 comprises: cylinder 51～56, bottom movable structure section 57, fixed jig 58, upper movable structural portion 59, part fixing structure body 60, main wiring group 61, terminal group 62, DC distribution 63, AC distribution 64, inductor 65, DC testing machine 66 and AC testing machine 67.Above-mentioned cylinder 51～56th, vapour-pressure type, electrodynamic type or hydraulic type.In addition, be not limited to cylinder 51～56, can be up and down or the actuator of the moving sheet that moves left and right so long as have, just can replace cylinder to use.
As cylinder 51～56, there are bottom cylinder 51, top cylinder 52, DC to test with cylinder 53, AC test cylinder 54, inductor cylinder 55 and short circuit cylinder 56.Herein, cylinder 51～56 uses vapour-pressure type.Certainly, can be also electrodynamic type or hydraulic type.
Bottom movable structure section 57 is the confession examination device supporting stations 72 that load as the semiconductor module of DUT, and this confession examination device supporting station 72 is fixed in bottom cylinder 51.Also can comprise bottom cylinder 51 as bottom movable structure section 57, be made as herein and do not comprise.
Upper movable structural portion 59 in dotted line K comprise part fixing structure body 60 and be fixed in this part fixing structure body 60 with lower component: terminal group 62(N terminal, P terminal, U terminal, V terminal, W terminal), the DC test with cylinder 53, AC test with cylinder 54, inductor with cylinder 55, inductor 65 and short circuit with cylinder 56.The thick insulating element of part fixing structure body 60 use forms, and being needs to make part fixing structure body 60 and above-mentioned each parts insulation in the situation of metal parts.In addition, this part fixing structure body 60 is fixed in top cylinder 52 along moving up and down.
Each leading section at cylinder 53～56 is equipped with the short-circuiting electrode 71(spring electrode that the leaf spring 71a that is made of multi-disc shown in Fig. 2 (a) consists of).The material of this short-circuiting electrode 71 is made of phosphor bronze etc.
In the example of Fig. 1, main wiring group 61 and terminal group 62 have the compartment of terrain configuration up and down, dispose the surface of contact of using the short-circuiting electrode 71 of cylinder 54 with surface of contact and the AC test of the short-circuiting electrode 71 of cylinder 53 with the DC test in the front of paper.Each terminal of main wiring group 61, a side connect for the examination device, opposite side be divided into the DC test with and AC test with two.In Fig. 1, because be the test unit that combines DC testing machine 66 and AC testing machine 67 these two testing machines, so main wiring group 61 opposite side is divided into two, but according to the quantity of comprehensive testing machine and the method for test, the quantity of main wiring group 61 opposite side also can suitably be divided into more than two.
In Fig. 1, DC test with cylinder 53 and AC test with cylinder 54, be recited as terminal group 62 laterally, but in fact be configured in the front of main wiring group 61 and terminal group 62.
in addition, in Fig. 1, put down in writing for main wiring group 61 and terminal group 62 short-circuiting electrode 71 that only has respectively a DC test to use cylinder 54 with short-circuiting electrode 71 and the AC test of cylinder 53, but short-circuiting electrode 71 comprises the quantity of terminal group 62 and is ten, DC test cylinder 53, test with cylinder 54 with cylinder 53 and AC for the DC test, can prepare one, it comprises five short-circuiting electrodes 71, perhaps prepare five, it comprises a short-circuiting electrode 71, perhaps prepare cylinder and three cylinders that comprise three short-circuiting electrodes 71 that comprise two short-circuiting electrodes 71, can suitably consist of according to the configuration mode of main wiring group 61 and terminal group 62.
In addition, in Fig. 1, make main wiring group 61 and terminal group 62 and surface of contact short-circuiting electrode 71 towards the front of accompanying drawing direction in configuration up and down, but also can configure in the left and right towards the front of accompanying drawing direction, perhaps towards the configuration of the top of accompanying drawing.
Test short-circuiting electrode 71 with cylinder 53, C group terminal (N terminal, P terminal, U terminal, V terminal, W terminal) and main wiring group 61(N distribution, P distribution, U distribution, V distribution, the W distribution of terminal group 62 by DC) short circuit is connected.
Test short-circuiting electrode 71 with cylinder 54, D group terminal (N terminal, P terminal) and main wiring group 61(N distribution, P distribution in terminal group 62 by AC) short circuit is connected.
Use the short-circuiting electrode 71 of cylinder 55 by inductor, the terminal group 62a that is connected to inductor 65 is connected with D group terminal (U terminal, V terminal, W terminal) short circuit in terminal group 62.This inductor 65 is not coil but resistance or simple distribution sometimes.Be in the situation of simple distribution with the stray inductance of distribution as inductor.
Use the short-circuiting electrode 71 of cylinder 56 by short circuit, D group terminal (U terminal, V terminal, the W terminal) short circuit in terminal group 62 is connected.By this short circuit, the U distribution in main wiring group 61, V distribution, W distribution are by short circuit.
Above-mentioned DC distribution 63 and AC distribution 64, fixing by not shown slot (socket) etc. with terminal group 62.In addition, these distributions 63,64 use retaining element to be fixed on part fixing structure body 60, matrix cabinet 80.
At matrix cabinet 80 fixedly bottom cylinder 51, top cylinder 52 and fixed head 73.In Fig. 1, above-mentioned upper movable structural portion 59 is configured in the top of part fixing structure body 60, and is interior movable up and down at matrix cabinet 80.But, sometimes also a part of parts of above-mentioned upper movable structural portion 59 (terminal group 62 and DC, AC test with cylinder 53,54) are fixed on the downside (back side one side) of part fixing structure body 60.
In addition, also can accordingly above-mentioned DC test be arranged on matrix cabinet 80 with cylinder 54 with cylinder 53 and above-mentioned AC test with the position of the terminal group 62 shown in dotted line.In this situation, together do not descend, rise with top cylinder 52.
In addition, DC/AC controls the signal wiring that distribution 74 is control signals of the transmission DUT that is connected with the AC testing machine with the DC testing machine.
Fig. 2 is the major part stereographic map of short-circuiting electrode 71, this figure (a) is installed on the DC test to use the stereographic map of the short-circuiting electrode 71 of cylinder 55 with cylinder 54 and inductor with cylinder 53, AC test, this figure (b) is that main wiring group 61 DUT(is for the examination device) stereographic map of short-circuiting electrode 71 of the front end of a side, this figure (c) is mounted in short circuit with the stereographic map of the short-circuiting electrode 71 of cylinder 56.
Short-circuiting electrode 71 is made of the overlapping leaf spring 71a that forms of multi-disc, becomes the U font in this figure (a), has represented a terminal in main wiring group 61 in this figure (b).Becoming front end in this figure (c) is the rake shape of three of L font, connects at root.The short-circuiting electrode 71 of Fig. 1 has represented the front end position of Fig. 2.As the DUT(that controls distribution group 61a for the examination device) short-circuiting electrode 71 of the front end of a side, only flow through faint electric current, so use common spring stylus or two scissors contacts that leaf spring forms.
Figure 10 means the structural drawing of other examples of the main wiring group 61 who is fixed on fixed head 73, this figure (a) is the major part front view (FV), this figure (b) is main wiring group 61 planimetric map, this figure (c) is the side cross-sectional view of watching from the arrow Y-direction when cutting off at the dotted line X-X place of this figure (b), this figure (d) is the major part outboard profile of terminal group 62, main wiring group 61 and cylinder 53, and this figure (e) is the planimetric map of watching from a side that cylinder 53 is arranged on part fixing structure body 60.
The C group of terminal group 62 and D group terminal alternate configurations in Fig. 1, but organize centralized configuration by each in Figure 10.With its accordingly, main wiring group 61 also concentrates by group.In addition, it is fixing that cylinder 53,54 is pressed the arrangement of row shape on the one side of part fixing structure body 60. Cylinder 55,56 also can with cylinder 53,54 identical faces on arrange fixingly, also cylinder 55,56 can be fixed on other not shown places of part fixing structure body 60.
DC test is organized terminal (N distribution, P distribution, U distribution, V distribution, W distribution) with cylinder 53 for main wiring group 61 C and is arranged one generally, comprises five short-circuiting electrodes 71.
The N distribution of main wiring group 61 D group, the N distribution of organizing with main wiring group 61 C is electrically connected to by metal connection parts 611.In addition, the U distribution of main wiring group 61 D group is electrically connected to by metal connection parts 612 with the U distribution of C group.In addition, the V distribution of the V distribution of main wiring group 61 D group and C group comprises respectively teat 614, and the V distribution of organizing by the D that makes main wiring group 61 with teat 614 connection metal links 613 is connected with the V wired electric of C group.P distribution and the W distribution of main wiring group 61 D group are electrically connected to by connecting portion 615 with P distribution and the W distribution that main wiring group 61 C organizes respectively.
AC test comprises for the N distribution of main wiring group 61 D group and part that the P distribution arranges and the part that arranges for U distribution, V distribution and W distribution that main wiring group 61 D organizes generally generally with cylinder 54.Two AC tests are configured in respectively with cylinder 54 both sides that cylinder 53 is used in the DC test.The part that arranges for N distribution and the P distribution of main wiring group 61 D group comprises two short-circuiting electrodes 71 generally, and the part that arranges for U distribution, V distribution and the W distribution of main wiring group 61 D group comprises three short-circuiting electrodes 71 generally.
As shown in Figure 10 (d), by five short-circuiting electrodes 71 installing with the front end of cylinder 53 in the DC test, the C group terminal (N terminal, P terminal, U terminal, V terminal, W terminal) of terminal group 62 is connected with main wiring group 61 terminal (N distribution, P distribution, U distribution, V distribution, W distribution) short circuit simultaneously with insulating.
Two short-circuiting electrodes 71 installing with the front end insulation ground of cylinder 54 with the AC test in the left side of cylinder 53 by be configured in the DC test in cylinder 54 in AC test, the D group terminal (N terminal, P terminal) of terminal group 62 is connected with main wiring group 61 terminal (N distribution, P distribution) while short circuit.
Three short-circuiting electrodes 71 installing with the front end insulation ground of cylinder 54 with the AC test on the right side of cylinder 53 by be configured in the DC test in cylinder 54 in AC test, the D group terminal (U distribution, V distribution, W distribution) of terminal group 62 is connected with main wiring group 61 terminal (U distribution, V distribution, W distribution) while short circuit.
By three short-circuiting electrodes 71 installing with the front end of cylinder 55 at inductor, the D group terminal (U terminal, V terminal, W terminal) of terminal group 62 is connected with terminal (U terminal, V terminal, the W terminal) short circuit simultaneously of terminal group 62a with insulating.
By three short-circuiting electrodes 71 that are electrically connected to respectively with the front end of cylinder 56 in short circuit, the short circuit of the D of terminal group 62 group terminal (U terminal, V terminal, W terminal) connects.
Wherein, loaded down with trivial details because figure can become in Figure 10, so omitted DC distribution 63 and AC distribution 64.
Fig. 3～Fig. 6 means the figure of method, the operation in order (flow process) that the semiconductor test instruments that uses Fig. 1 is tested DUT shown in Figure 9.
At first, in Fig. 3, make top cylinder 52 descend by arrow A and upper movable structural portion 59 is descended by arrow A.Thus, the terminal group 62, the DC test that are arranged on the part fixing structure body 60 of upper movable structural portion 59 descend with cylinder 56, inductor 65, DC distribution 63 and AC distribution 64 with cylinder 55, short circuit with cylinder 54, inductor simultaneously with cylinder 53, AC test.
Then, in Fig. 4, with new DUT be arranged on bottom movable structure section 57 on examination device supporting station 72 and after having carried out carrying (loading), make bottom cylinder 51 rise by arrow B and make bottom movable structure section 57 increase, subgroup, main side 75(N terminal, P terminal, U terminal, V terminal, W terminal with DUT shown in Figure 9) and control end subgroup 74a be pressed in main wiring group 61(N distribution, P distribution, U distribution, V distribution, W distribution on the fixed head 73 that is arranged at fixed jig 58) and control on the short-circuiting electrode 71 of distribution group 61a, be electrically connected to thus.
Then, in Fig. 5, implement DC attribute testing (static characteristic tests such as leakage current test and withstand voltage test) with DC testing machine 66.At this moment, AC distribution 64 is off-state (state that is not connected with circuit in AC testing machine 67) in AC testing machine 67.Make DC test stretch (being correctly to stretch the flexible movable rod that consists of cylinder) in the direction of arrow C 1 with cylinder 53, make C in the terminal group 62 of the DC distribution 63 that is connected to upper movable structural portion 59 organize main wiring group 61(N distribution, P distribution, U distribution, V distribution, the W distribution of terminal (N terminal, P terminal, U terminal, V terminal, W terminal) and fixed jig 58) be connected by being configured in short-circuiting electrode 71 short circuits that DC tests with the leading section of cylinder 53.Thus, can carry out the DC test by enough DC testing machines 66.
Particularly, for example, in the situation that carry out leakage current test, withstand voltage test, can apply voltage to P terminal and U terminal DC testing machine 66 is interior, can consist of thus the test of element (IGBT of Fig. 9) of the upper arm of U in mutually of the DUT of inverter.In the situation that the element of the underarm in is mutually tested to U, can apply voltage to U terminal and N terminal.The selection action that can execute alive terminal is to use relay etc. to carry out in DC testing machine 66.By such selection terminal, can consist of leakage current test and the withstand voltage test of six elements (IGBT) of inverter.But, correct, also comprise the FWD(fly-wheel diode) reverse leakage current and oppositely withstand voltage.In addition, this semiconductor test instruments 100 can also be installed the powered-on capacity of heat resistance measuring circuit increase DC distribution 63 and carry out the heat resistance measuring test in DC testing machine 66.
Then, in Fig. 6, implement the AC attribute testing with AC testing machine 67.the DC test is shortened with the direction of cylinder 53 at arrow D1, make C group terminal (the N terminal of the terminal group 62 that is connected with the DC distribution 63 of upper movable structural portion 59, the P terminal, the U terminal, the V terminal, the W terminal) and the main wiring group 61(N distribution of fixed jig 58, the P distribution, the U distribution, the V distribution, the W distribution) disconnect, and then the AC test is stretched with the direction of cylinder 54 in arrow E, (the N terminal is connected D assembly line in the main wiring group 61 of being connected with fixed jig, and (the N distribution is connected with the P distribution by being configured in the AC test with the short-circuiting electrode 71 short circuits connections of the leading section of cylinder 54 with the P terminal to make D group terminal in the terminal group 62 that is connected with the AC distribution 64 of upper movable structural portion 59.At this moment, the distribution that is connected with DC distribution 63 in DC testing machine 66 becomes off-state.
If the L load test in the AC attribute testing, inductor is stretched in the direction of arrow F with cylinder 55, make U distribution, V distribution, W distribution in the D group that U terminal, V terminal, W terminal and the main wiring group of the terminal group 62a that is connected with inductor 65 be connected be connecteds by being configured in inductor the short-circuiting electrode 71 short circuits connections of using cylinder 54 leading section separately with AC with cylinder 55.Can carry out the L load test thus.During the not shown mensuration distribution that in this L load test, use is stretched out from each element (IGBT and FWD) that consists of inverter (being same distribution IGBT and FWD), can measure the switching characteristic (on state characteristic, turn-off characteristic, reverse recovery characteristic etc.) of each element (IGBT and FWD).Can carry out the ohmic load test when replacing above-mentioned inductor 65 with resistance.After off-test, make inductor shorten and U distribution, V distribution, the W distribution of inductor 65 from the D group of terminal group 62 disconnected in the direction by arrow I with cylinder 55.
In addition, if short-circuit test makes short circuit stretch by arrow G with cylinder 56, make U terminal, V terminal, the W short-circuit of terminals of the D of terminal group 62 in organizing with being configured in short circuit with the short-circuiting electrode 71 of the leading section of cylinder 56 downwards.Can carry out thus the short circuit load test.After off-test, U terminal, V terminal, the W terminal from the D group of terminal group 62 disconnects with cylinder 56 shortenings to make short circuit.
Can carry out AC attribute testing (L load test and short circuit load test) by enough AC testing machines 67 like this.After the end of AC load test, N distribution, P distribution during the D that makes the AC test make the D of terminal group 62 organize terminal (N terminal, P terminal) and main wiring group 61 by the direction shortening of arrow H with cylinder 54 organizes disconnect.
then, in Fig. 7, usually constantly exchange DUT and implement continuously test on the volume production production line, in the situation that exchange DUT, make bottom cylinder 51 descend and bottom movable structure section 57 is descended by the direction of arrow J, make subgroup, the main side 75(N terminal of DUT, the P terminal, the U terminal, the V terminal, the W terminal) and be arranged on main wiring group 61(N distribution on fixed jig 58, the P distribution, the U distribution, the V distribution, the W distribution) short-circuiting electrode 71 disconnects, controlling distribution 74 also disconnects from the control end subgroup 74a of DUT, after unloading, DUT is positioned in on examination device supporting station 72, be transferred to the operation of Fig. 4.Then, the attribute testing of implementing to use the attribute testing of DC testing machine 66 and using AC testing machine 67 with new DUT according to the operation of Fig. 5 and Fig. 6.
In Fig. 8, in the situation of the model (shape) of change DUT, make top cylinder 52 increase by arrow Q and make upper movable structural portion 59 increase.Thus, the DC test that is arranged at upper movable structural portion 59 is tested with cylinder 53, AC and is risen to solid line position from dotted line position simultaneously with cylinder 54, DC distribution 63 and AC distribution 64.Afterwards, be exchanged for the fixed jig 58a with the main wiring group 61b that can test new DUT.Flow process after exchange is tested according to the operation of Fig. 3～Fig. 7.
In above-mentioned operation, DUT is in the situation of same model, and the upper movable structural portion 59 that is connected of being connected with the AC testing machine with DC testing machine 66 is in the not mobile state that is fixed.Under this state, the switching of DC attribute testing and AC attribute testing is carried out with cylinder 54 with cylinder 53 and AC test with the DC test.Therefore, in the situation that the DUT of same model is tested, the distribution 63,64 of DC testing machine 66 and AC testing machine 67 and link subgroup 62 can all not move when each exchange DUT, can not cause the metal fatigue in distribution 63,64.Consequently, distribution 63,64 can not break.
On the other hand, during model change, distribution 63,64 movement occur in crossover fixation tool 58.But exchange frequency is very low, and the probability that distribution 63,64 metal fatigue occur is low.Wherein, in the situation that distribution 63,64 is fixed on part fixing structure body 60, move to the distribution 63,64 matrix cabinet 80 is fixing from the place of fixing at this part fixing structure body 60, but mobile frequency is very low as mentioned above, so it is low that the probability of distribution 63,64 metal fatigue occurs.
In addition, the switching of DC attribute testing and AC attribute testing is carried out with the cylinder 53,54 of light weight, so do not need to make the larger upper movable structural portion 59 of weight to move, shorten switching time.
In addition, the short-circuiting electrode 71 that is located at cylinder 53,54 front end that makes that terminal group 62 is connected with main wiring group 61 short circuits is light weights, so can easily make short-circuiting electrode 71 locate accurately and move.Because short-circuiting electrode 71 is located accurately, so the contact site of short-circuiting electrode 71 is not applied excessively large power.Consequently, can reduce the abrasion of short-circuiting electrode 71.In addition because wear away less, so can significantly reduce the exchange frequency of short-circuiting electrode 71.
In addition, in the volume production production line, generally continuous stream cross same model hundreds of～tens thousand of products.In this situation, the exchange of fixed jig 58 is not carried out usually.Therefore, in this semiconductor test instruments 100, the exchange of fixed jig 58 is to carry out in main wiring group 61 the situations such as short-circuiting electrode 71 abrasion, can make exchange frequency compare very low with existing semiconductor test instruments 500.
Wherein, semiconductor test instruments 100 shown in the first embodiment, having enumerated the situation that the semiconductor module (6in1) that is built-in with three-phase inverter is tested is that example is illustrated, but semiconductor module also can be tested by the change distribution in the situation that be the tetrad (4in1) that is built-in with single-phase inverter or two one group (2in1) as DUT.In this situation, also can access the effect that illustrates in the first embodiment.Wherein, make one in two one group to be dummy elements, also can test.
The＜the second embodiment＞
Figure 11 is the structural representation of the semiconductor test instruments of the second embodiment of the present invention.This semiconductor test instruments 200 is the comprehensive semiconductor test instruments with DC testing machine and Insulation Test machine.
The semiconductor test instruments 200 of Figure 11 and the semiconductor test instruments 100 of Fig. 1 different are that the second test machine is that AC testing machine 67 is changed and is Insulation Test machine 78 this point.Along with this change, the AC distribution 64 that is arranged on upper movable structural portion 59 is changed the distribution 79 into Insulation Test machine 78 use.In addition, do not need inductor cylinder 55, short circuit cylinder 56, and need Insulation Test cylinder 77.Insulation Test can be made of one or more with cylinder 77.Front end connection layout 2(a at Insulation Test use cylinder 77) short-circuiting electrode 71 shown in.Insulation is with connecting between the symbol S of the connection of the part in distribution 79 for the switching SW(figure that makes control end subgroup 74a short circuit).
Carry out in the situation of Insulation Test, by making top cylinder 52 stretch, make bottom cylinder 51 to stretch, make Insulation Test to stretch with the direction of cylinder 77 by arrow E by the direction of arrow B by the direction of arrow A, and the subgroup, main side 75 that makes main wiring group 61 and DUT be connected distribution group 61a and be connected respectively with the control end subgroup 74a of DUT.Connect by this, the control end subgroup 74a of DUT is by short circuit.In addition, the U terminal of subgroup, main side 75, V terminal, W terminal are interior by short circuit at Insulation Test machine 78.After short circuit, the P terminal from the subgroup, main side 75 of 78 couples of DUT of Insulation Test machine and N terminal apply the high voltage of regulation.Can carry out the Insulation Test of DUT by applying this voltage.In this Insulation Test, all elements (IGBT and FWD) that consist of DUT are applied voltage.Also can access the effect identical with the effect of the first embodiment in present embodiment.
In above embodiment, the structure that makes the structure that framework 80 turns upside down or make framework 80 tilt 90 ° also can access same effect.
Claims (8)
1. a semiconductor test instruments, be the comprehensive semiconductor test instruments with a plurality of testing machines, it is characterized in that, comprising:
A plurality of testing machine links subgroup, setting corresponding to each testing machine is used for connecting the device terminal group for the examination device;
The main wiring group leaves configuration with described testing machine link subgroup, is used for being electrically connected to described device terminal group for the examination device and each described testing machine link subgroup;
A plurality of the first actuators arrange one accordingly at least with each described testing machine; With
Short-circuiting electrode is arranged at the front end of described the first actuator, and the terminal that carries out described each testing machine link subgroup is connected or disconnection with described main wiring group's terminal.
2. semiconductor test instruments as claimed in claim 1, is characterized in that, comprising:
Be fixed on the first movable structure section on assigned position with described for the examination device;
The second actuator that described the first movable structure section can be moved up and down;
The second movable structure section of fixing described each testing machine link subgroup;
The 3rd actuator that described the second movable structure section can be moved up and down.
3. semiconductor test instruments as claimed in claim 2 is characterized in that:
Described the first actuator is fixed in described the second movable structure section.
4. semiconductor test instruments as claimed in claim 1 is characterized in that:
Described testing machine is one of Insulation Test machine of the DC testing machine that carries out the DC attribute testing, the AC testing machine that carries out the AC attribute testing or test dielectric strength.
5. a semiconductor test instruments, be the comprehensive semiconductor test instruments with DC testing machine and AC testing machine, it is characterized in that:
Comprise: described DC testing machine, described AC testing machine, the first cylinder, the second cylinder, the 3rd cylinder, the 4th cylinder, the 5th cylinder, the 6th cylinder, be located at the front end of described the first cylinder the first short-circuiting electrode, be located at the front end of described the second cylinder the second short-circuiting electrode, be located at the front end of described the 3rd cylinder the 3rd short-circuiting electrode, be located at the front end of described the 4th cylinder the 4th short-circuiting electrode, be located at the front end of described the 5th cylinder the 5th short-circuiting electrode, be located at the 6th short-circuiting electrode of the front end of described the 6th cylinder
Comprise: by stretch upper movable structural portion that described the first cylinder descends, by stretching bottom movable structure section that described the second cylinder rises, be configured in the fixed jig between described upper movable structural portion and described bottom movable structure section,
Consist of the part fixing structure body of described upper movable structural portion; Be fixed on described the 3rd cylinder on this part fixing structure body, the 4th cylinder, the 5th cylinder, the 6th cylinder, first end subgroup, the second terminal group; With the main wiring group and the control distribution group that are fixed on described fixed jig,
Described bottom movable structure comprises confession examination device supporting station,
Described semiconductor test instruments also comprises: the DC distribution that connects described DC testing machine and described first end subgroup; With the AC distribution that is connected described AC testing machine and described the second terminal group,
by stretching described the first cylinder, stretch described the second cylinder, stretch described the 3rd cylinder, the DC testing machine is connected with subgroup, main side and control end subgroup for the examination device, can implement the DC attribute testing, by stretching described the first cylinder, stretch described the second cylinder, stretch described the 4th cylinder, the AC testing machine is connected with the control end subgroup that supplies the examination device and the power supply terminal in the subgroup, main side, by stretching the 5th cylinder, be connected with inductor or resistance for the main terminal beyond the power supply terminal in the subgroup, main side of examination device, by stretching the 6th cylinder, main terminal beyond power supply terminal in the subgroup, main side of confession examination device is by short circuit, can implement the AC attribute testing.
6. a semiconductor test instruments, be the comprehensive semiconductor test instruments with DC testing machine and Insulation Test machine, it is characterized in that:
Comprise: described DC testing machine, described AC testing machine, the first cylinder, the second cylinder, the 3rd cylinder, the 4th cylinder, be located at the front end of described the first cylinder the first short-circuiting electrode, be located at the front end of described the second cylinder the second short-circuiting electrode, be located at the front end of described the 3rd cylinder the 3rd short-circuiting electrode, be located at the 4th short-circuiting electrode of the front end of described the 4th cylinder
By stretch upper movable structural portion that described the first cylinder descends, by stretching bottom movable structure section that described the second cylinder rises, be configured in the fixed jig between described upper movable structural portion and described bottom movable structure section,
Consist of the part fixing structure body of described upper movable structural portion; Be fixed on described the 3rd cylinder on this part fixing structure body, the 4th cylinder, first end subgroup, the second terminal group; With the main wiring group and the control distribution group that are fixed on described fixed jig,
Described bottom movable structure comprises confession examination device supporting station,
Described semiconductor test instruments also comprises: the DC distribution that connects described DC testing machine and described first end subgroup; With the AC distribution that is connected described AC testing machine and described the second terminal group,
By stretching described the first cylinder, stretch described the second cylinder, stretching described the 3rd cylinder, the DC testing machine is connected with subgroup, main side and control end subgroup for the examination device, can implement the DC attribute testing, by stretching described the first cylinder, stretch described the second cylinder, stretching described the 4th cylinder, the Insulation Test machine is connected with the control end subgroup that supplies the examination device and the power supply terminal in the subgroup, main side, by short circuit, can implement Insulation Test for the main terminal beyond the power supply terminal in the subgroup, main side of examination device and control end subgroup.
7. semiconductor test instruments as described in claim 5 or 6 is characterized in that:
Described the 3rd cylinder is made of a plurality of cylinders.
8. semiconductor test instruments as described in any one in claim 5～7 is characterized in that:
Described the 4th cylinder is made of a plurality of cylinders.
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| JP2011275167A JP6069831B2 (en) | 2011-12-16 | 2011-12-16 | Semiconductor test equipment |
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| CN103675622B (en) * | 2013-12-04 | 2017-01-04 | 株洲南车时代电气股份有限公司 | For testing the apparatus and method of the shelf depreciation of IGBT module |
| JP6548255B2 (en) * | 2015-08-10 | 2019-07-24 | 新電元工業株式会社 | CONNECTION JIG AND ELECTRICITY TESTING METHOD FOR SEMICONDUCTOR DEVICE |
| JP7119399B2 (en) * | 2018-02-06 | 2022-08-17 | 株式会社デンソー | semiconductor equipment |
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| JP6069831B2 (en) | 2017-02-01 |
| CN103163441B (en) | 2015-09-09 |
| JP2013124996A (en) | 2013-06-24 |
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