CN103153808A - 苯乙烯类树脂组合物及其成型体 - Google Patents
苯乙烯类树脂组合物及其成型体 Download PDFInfo
- Publication number
- CN103153808A CN103153808A CN2011800485774A CN201180048577A CN103153808A CN 103153808 A CN103153808 A CN 103153808A CN 2011800485774 A CN2011800485774 A CN 2011800485774A CN 201180048577 A CN201180048577 A CN 201180048577A CN 103153808 A CN103153808 A CN 103153808A
- Authority
- CN
- China
- Prior art keywords
- composition
- styrene
- sheet
- molecular weight
- mass parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 title claims abstract description 95
- 239000011342 resin composition Substances 0.000 title abstract 2
- 150000001993 dienes Chemical class 0.000 claims abstract description 28
- 229920005990 polystyrene resin Polymers 0.000 claims abstract description 14
- 229920001400 block copolymer Polymers 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims description 71
- 229920001971 elastomer Polymers 0.000 claims description 19
- 239000005060 rubber Substances 0.000 claims description 19
- 238000009826 distribution Methods 0.000 claims description 14
- 238000012856 packing Methods 0.000 claims description 13
- 239000002245 particle Substances 0.000 claims description 5
- 239000000470 constituent Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 238000012795 verification Methods 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 27
- 239000011347 resin Substances 0.000 description 27
- 238000000034 method Methods 0.000 description 21
- 238000005227 gel permeation chromatography Methods 0.000 description 12
- 238000000465 moulding Methods 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 10
- 239000000178 monomer Substances 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 239000004793 Polystyrene Substances 0.000 description 7
- 229920002223 polystyrene Polymers 0.000 description 7
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- SDJHPPZKZZWAKF-UHFFFAOYSA-N 2,3-dimethylbuta-1,3-diene Chemical compound CC(=C)C(C)=C SDJHPPZKZZWAKF-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920001169 thermoplastic Polymers 0.000 description 4
- 239000004416 thermosoftening plastic Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000004049 embossing Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- AHAREKHAZNPPMI-AATRIKPKSA-N (3e)-hexa-1,3-diene Chemical compound CC\C=C\C=C AHAREKHAZNPPMI-AATRIKPKSA-N 0.000 description 2
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 2
- NVZWEEGUWXZOKI-UHFFFAOYSA-N 1-ethenyl-2-methylbenzene Chemical compound CC1=CC=CC=C1C=C NVZWEEGUWXZOKI-UHFFFAOYSA-N 0.000 description 2
- UVHXEHGUEKARKZ-UHFFFAOYSA-N 1-ethenylanthracene Chemical compound C1=CC=C2C=C3C(C=C)=CC=CC3=CC2=C1 UVHXEHGUEKARKZ-UHFFFAOYSA-N 0.000 description 2
- QEDJMOONZLUIMC-UHFFFAOYSA-N 1-tert-butyl-4-ethenylbenzene Chemical compound CC(C)(C)C1=CC=C(C=C)C=C1 QEDJMOONZLUIMC-UHFFFAOYSA-N 0.000 description 2
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 2
- AIDLAEPHWROGFI-UHFFFAOYSA-N 2-methylbenzene-1,3-dicarboxylic acid Chemical compound CC1=C(C(O)=O)C=CC=C1C(O)=O AIDLAEPHWROGFI-UHFFFAOYSA-N 0.000 description 2
- RCJMVGJKROQDCB-UHFFFAOYSA-N 2-methylpenta-1,3-diene Chemical compound CC=CC(C)=C RCJMVGJKROQDCB-UHFFFAOYSA-N 0.000 description 2
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- -1 aromatic ethenyl compound Chemical class 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000805 composite resin Substances 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 229910000489 osmium tetroxide Inorganic materials 0.000 description 2
- 239000012285 osmium tetroxide Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- PMJHHCWVYXUKFD-UHFFFAOYSA-N piperylene Natural products CC=CC=C PMJHHCWVYXUKFD-UHFFFAOYSA-N 0.000 description 2
- 239000012488 sample solution Substances 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 238000011179 visual inspection Methods 0.000 description 2
- APMOEFCWQRJOPS-UHFFFAOYSA-N 5-ethenyl-1,5-dimethylcyclohexa-1,3-diene Chemical compound CC1=CC=CC(C)(C=C)C1 APMOEFCWQRJOPS-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- DKGAVHZHDRPRBM-UHFFFAOYSA-N tert-butyl alcohol Substances CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D65/02—Wrappers or flexible covers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2325/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
- C08J2325/02—Homopolymers or copolymers of hydrocarbons
- C08J2325/04—Homopolymers or copolymers of styrene
- C08J2325/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2353/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2353/02—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2425/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Derivatives of such polymers
- C08J2425/02—Homopolymers or copolymers of hydrocarbons
- C08J2425/04—Homopolymers or copolymers of styrene
- C08J2425/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2451/00—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2451/04—Characterised by the use of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers grafted on to rubbers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2453/00—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers
- C08J2453/02—Characterised by the use of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Derivatives of such polymers of vinyl aromatic monomers and conjugated dienes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/1372—Randomly noninterengaged or randomly contacting fibers, filaments, particles, or flakes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/13—Hollow or container type article [e.g., tube, vase, etc.]
- Y10T428/1352—Polymer or resin containing [i.e., natural or synthetic]
- Y10T428/1397—Single layer [continuous layer]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Wrappers (AREA)
Abstract
本发明提供一种用于诸如压纹载带等电子器件包装的苯乙烯类树脂片,这种片通过热成型能够形成具有较大的拉深比(袋深)、良好的透明性及强度的袋,还提供一种对上述片进行热成型处理所得到的、能够从袋的外部对所收纳的电子器件上记载的字符等进行确认的载带等。电子器件包装用片含有:29~65质量份的(A)苯乙烯-共轭二烯嵌段共聚物;51~15质量份的(B)聚苯乙烯树脂;以及20~9质量份的(C)耐冲击性聚苯乙烯树脂,(A)成分、(B)成分和(C)成分分别具有特定范围的重均分子量(Mw)。
Description
技术领域
本发明涉及一种含有苯乙烯类树脂组合物而成的、可适用于包装诸如连接器、电容器等电子器件的容器的电子器件包装用片。
背景技术
用于将IC、LSI等电子器件安装到电子设备的压纹载带采用通过将由热塑性树脂构成的片热成型为压纹形状而成的载带,所述热塑性树脂例如为氯乙烯树脂、苯乙烯类树脂、聚碳酸酯类树脂等。为了防止静电对所述电子器件造成损害,所述压纹载带例如采用了通过使热塑性树脂含有碳黑等导电性填充物而具有导电性所得到的不透明片。另外,由于便于从外部对内容物的电子器件进行肉眼观察、便于对该器件上记载的字符进行检查,用于收纳电子器件当中诸如电容器那样被静电损害的可能性小的器件的压纹载带采用了以所述透明性较好的热塑性树脂为基材制成的透明型的压纹载带。
作为透明型的压纹载带所使用的片,例如,有人提出了通过混合通用聚苯乙烯树脂和苯乙烯-共轭二烯嵌段共聚物所得到的片(参照专利文献1、2)、使用了MBS类树脂的片(专利文献3)。
采用上述片的载带由于具有透明性而能够从外部对所收纳的电子器件进行肉眼观察、对该电子器件上记载的字符等进行检查,因此,近年来,这种载带的用途得以扩大。
现有技术文献
专利文献1:日本特开2003-055526号公报
专利文献2:日本特开2002-332392号公报
专利文献3:日本特开2003-253069号公报
发明内容
但是,上述片的缺陷在于,在热成型为载带等时,如果要成型具备较大拉深比的袋,就会导致型腔厚度显著变小,或者,难以得到具有足够强度的型腔,另外,由于成型导致成型前的片的透明性降低。
本发明的课题在于,提供一种用于诸如压纹载带等电子器件包装的苯乙烯类树脂片,这种片通过热成型能够形成具有较大的拉深比(袋深)、良好的透明性及强度的袋。并且,本发明的课题还在于,提供一种由上述片热成型所得到的、能够从袋的外部对所收纳的电子器件上记载的字符等进行确认的载带等。
本发明的发明人等发现可通过对含有各自具有特定的重均分子量的、分子结构不同的三种苯乙烯类树脂的片进行热成型来解决上述课题,从而完成了本发明。
即,本发明是一种电子器件包装用片,含有:29~65质量份的(A)苯乙烯-共轭二烯嵌段共聚物;51~15质量份的(B)聚苯乙烯树脂;以及20~9质量份的(C)耐冲击性聚苯乙烯树脂,(A)成分、(B)成分和(C)成分的重均分子量(Mw)为下述范围:
(A)成分:Mw=80,000~220,000
(B)成分:Mw=200,000~400,000
(C)成分:Mw=150,000~210,000。
本发明的片所使用的树脂组合物优选的是,在220℃时的熔体张力为10~30mN。并且,优选的是,在100质量份的(A)成分中,共轭二烯嵌段的比率为10~25质量%。还优选的是,(A)成分的苯乙烯嵌段通过GPC测定的峰值分子量在3万~12万的范围内,所述苯乙烯嵌段的分子量分布曲线的半值宽度为0.8~1.25的范围。还优选的是,(C)成分中的接枝橡胶的粒径为2.2~3.0μm,基材片中的接枝橡胶的橡胶成分含量为0.75~1.90质量%。
另一方面,本发明还包括使用了上述片的压纹载带。
根据本发明,能够得到用于诸如压纹载带等电子器件包装的苯乙烯类树脂片,这种片通过热成型能够形成具有较大的拉深比(袋深)、良好的透明性及强度的袋,对上述片进行热成型,还能够得到能够从袋的外部对所收纳的电子器件上记载的字符等进行确认的载带。
附图说明
图1是示出对本发明的片进行热成型所得到的袋的赋形性的评价基准(1~5)的照片。
具体实施方式
以下,对本发明进行详细说明。
如上所述,本发明是含有各自具有特定的重均分子量的(A)苯乙烯-共轭二烯嵌段共聚物、(B)聚苯乙烯树脂、以及(C)耐冲击性聚苯乙烯树脂的树脂组合物而成的片。
(A)苯乙烯-共轭二烯嵌段共聚物是指在其结构中含有以苯乙烯类单体为主体的聚合物嵌段和以共轭二烯单体为主体的聚合物嵌段的聚合物。作为苯乙烯类单体,有苯乙烯、邻甲基苯乙烯、对甲基苯乙烯、对叔丁基苯乙烯、1,3-二甲基苯乙烯、α-甲基苯乙烯、乙烯基萘、乙烯基蒽、1,1-二苯基乙烯等。在本发明中,以苯乙烯为主体,但是,也可以含有1种以上的上述其他成分作为微量成分。
共轭二烯单体是指在其结构中具有共轭双键的化合物,例如有1,3-丁二烯(丁二烯)、2-甲基-1,3-丁二烯(异戊二烯)、2,3-二甲基-1,3-丁二烯、1,3-戊二烯、1,3-己二烯、2-甲基戊二烯等,其中,优选丁二烯、异戊二烯。共轭二烯单体可以使用一种或二种以上。以苯乙烯类单体为主体的聚合物嵌段是指,仅由源自苯乙烯类单体的结构构成的聚合物嵌段、以及含有50质量%以上的源自苯乙烯类单体的结构的聚合物嵌段中的任意一者。以共轭二烯单体为主体的聚合物嵌段是指,仅由源自共轭二烯单体的结构构成的聚合物嵌段、以及含有50质量%以上的源自共轭二烯单体的结构的聚合物嵌段中的任意一者。关于(A)苯乙烯-共轭二烯嵌段共聚物中的共轭二烯含量,从片的机械特性方面考虑,优选的是,设(A)成分为100质量份时,共轭二烯含量为10~25质量%、或20~24质量%、或20~22质量%、或22~24质量%。
共轭二烯含量是指,源自共轭二烯单体的结构在全部聚合物中所占的质量比率。苯乙烯-共轭二烯嵌段共聚物可以使用一种或二种以上。在本发明中,对于苯乙烯-共轭二烯嵌段共聚物,例如,当共轭二烯为丁二烯时,可以是苯乙烯-丁二烯(SB)的二元共聚物和苯乙烯-丁二烯-苯乙烯(SBS)的三元共聚物中的任意一者,也可以是由多个嵌段(苯乙烯嵌段为3个以上,丁二烯嵌段为2个以上)构成的树脂。并且,也可以是具有所谓锥型嵌段结构的共聚物,所谓锥型嵌段结构为各嵌段间苯乙烯和丁二烯的组成比连续变化的结构。另外,苯乙烯-共轭二烯嵌段共聚物也可以直接使用市售品。
本发明中使用的(A)苯乙烯-共轭二烯嵌段共聚物的如后所述的苯乙烯换算的重均分子量(Mw)为80,000~220,000的范围。所述(A)成分中的苯乙烯嵌段通过GPC测定的峰值分子量优选3万~12万的范围,进一步优选4万~11万或4万~9万或8万~11万的范围。另外,(A)成分的苯乙烯嵌段的分子量分布曲线的半值宽度优选0.8~1.25的范围,进一步优选1.05~1.25或0.9~1.15或1.05~1.20的范围。通过采用上述范围,能够获得良好的成型性。可通过下述方法求得(A)成分的苯乙烯嵌段的分子量分布曲线。首先,依据(I.M.KOLTHOFF,et al.,J.Polym.Sci.1,429(1946))所记载的方法,以四氧化锇为催化剂,用三氯甲烷对(A)成分进行氧化分解,将由此获得的苯乙烯嵌段溶解于四氢呋喃溶剂,并通过GPC法求得苯乙烯嵌段的分子量分布曲线。然后,可由上述分子量分布曲线求取苯乙烯换算的峰值分子量,所述苯乙烯换算使用标准聚苯乙烯(单分散)。此时的GPC法测定根据常用方法进行,其主要测定条件如下。
柱温:40℃
检测方法:示差折射法
流动相:四氢呋喃
试样浓度:2质量%
标准曲线:通过标准聚苯乙烯(单分散)制成
可利用上述苯乙烯嵌段的分子量分布曲线求出其半值宽度。具体而言,分子量以对数表示使横轴1000~1000000的范围为15cm,纵轴上以任意高度表示浓度(重量比),并将峰顶高度的50%的峰的横轴宽度作为半值宽度。在这种情况下,峰顶高度需要与横轴垂直,高度的50%的峰的宽度需要与横轴水平。苯乙烯嵌段的分子量分布曲线的半值宽度与嵌段共聚物的分子量分布相关。上述分子量分布的调节方法没有特别限定,例如,可以用在(A)成分的苯乙烯嵌段部分聚合时对添加引发剂的时间进行调节的方法等获得分子量不同的嵌段共聚物。
(B)聚苯乙烯树脂是指,是一般被称为GPPS的树脂,也可以采用市售的树脂,作为单体其以苯乙烯为主体,但也可以含有一种以上的芳香族乙烯基化合物作为微量成分,所述芳香族乙烯基化合物有邻甲基苯乙烯、对甲基苯乙烯、对叔丁基苯乙烯、1,3-二甲基苯乙烯、α-甲基苯乙烯、乙烯基萘、乙烯基蒽、1,1-二苯基乙烯等。
本发明中的(C)耐冲击性聚苯乙烯树脂是一般被称为HIPS的树脂,是含有接枝了苯乙烯类单体的微粒状接枝橡胶的聚苯乙烯树脂。作为接枝橡胶中的橡胶成分,采用以例如1,3-丁二烯(丁二烯)、2-甲基-1,3-丁二烯(异戊二烯)、2,3-二甲基-1,3-丁二烯、1,3-戊二烯、1,3-己二烯、2-甲基戊二烯等为单体的二烯类橡胶。另外,还可以采用共轭二烯成分占50质量%以上的苯乙烯-共轭二烯嵌段共聚物的热塑性弹性体。其中,优选聚丁二烯、苯乙烯-丁二烯嵌段共聚物。
(C)成分中的接枝橡胶在其粒径在2.0μm以上且3.0μm以下,优选2.0μm以上且2.5μm以下,或者,2.3μm以上且2.7μm以下的范围时,基材片具有优异的透明性和强度物性。其中,所述接枝橡胶的粒径是指,通过激光衍射方式颗粒分析仪测得的接枝橡胶成分的平均粒径。另外,在本发明片中,对于取得片的耐冲击性与片透明性之间的平衡而言,优选的是,设片为100质量%时,使片中源自(C)成分的接枝橡胶含量为0.75~1.90质量%或0.70~1.75质量%或0.71~1.72质量%或0.75~1.60质量%或0.77~1.58质量%,优选通过调整(C)成分中的接枝橡胶含量和片中的(C)成分的配比,从而将片中的接枝橡胶含量设定在上述范围内。(C)成分中的接枝橡胶含量可以通过下述方法算出,即:通过离心分离法回收将(C)成分溶于MEK与丙酮的质量比为50/50的混合溶剂时未溶解的成分,由其质量值求出。
本发明的片含有(A)成分、(B)成分与(C)成分的总和为100质量份的树脂组合物而成,其中,所述(A)成分为29~65质量份,优选为35~60质量份,或者35~58质量份,或者40~55质量份,(B)成分为51~15质量份,优选为45~20质量份,或者51~25质量份,(C)成分为20~9质量份。通过采用上述范围的组成,能够获得强度物性、耐冲击性和透明性均得以满足的片。
所述(A)成分、(B)成分与(C)成分的重均分子量(Mw)可由利用GPC并通过常用方法所求得的标准聚苯乙烯换算的分子量分布曲线来求出。并且,在本发明中,使用(A)成分、(B)成分与(C)成分的重均分子量分别为下述范围的树脂:
(A)成分:Mw=80,000~220,000,优选140,000~200,000,或者,150,000~200,000,或者,140,000~150,000
(B)成分:Mw=200,000~400,000,优选290,000~390,000,或者,290,000~330,000,或者,330,000~390,000
(C)成分:Mw=150,000~210,000,优选180,000~190,000。
通过采用上述重均分子量范围的树脂,不仅能够如后述那样将上述树脂组合物的熔体张力调整至恰当的范围,还可获得强度物性的平衡和透明性良好的片,并且,在将所获得的片热成型为载带等时,成型性极为良好,即使进行深拉深成型也能够成型良好的袋。本发明所称的良好的成型性是指,在进行袋成型后,可获得可实现充分的袋的压曲强度程度的袋的侧面厚度,同时,袋底面的角部的赋形性良好,忠实地再现了模具形状。
如果(A)成分和(B)成分的Mw大于上述范围,则熔体张力变大,压制成型后的袋的侧面厚度较薄而难以实现充分的袋的压曲强度。气压成型时,袋底面的角部的赋形性变差,在装入诸如IC等电子器件等时稳定性变差。另一方面,如果(A)成分和(B)成分的Mw小于上述范围,则在进行浅拉深的压制成型时,虽然可得到良好的成型性,但是,侧面的厚度变大而导致透明性不够,并且,在一定级别以上的深拉深成型中,由于熔体张力不够而产生开孔,无法获得制品。
本发明中的熔体张力是利用熔体张力测定装置并在孔径孔长10mm、卷取速度10m/分、30m/分、50m/分的条件下测定熔体张力而得到的值。本发明的含有(A)成分、(B)成分和(C)成分而成的树脂组合物在220℃时的熔体张力优选10~30mN或13~32mN或14~31mN或15~29mN或16~28mN或17~27mN或18~26mN或19~25mN或20~24mN或21~23mN或22~23mN。在上述范围内,能够获得在将片热成型为容器时成型加工性特别良好的片。如果熔体张力不足10mN,则在对片进行热成型时可能会产生开孔。如果熔体张力超过30mN,则成型品袋的赋形性(尖锐度)可能会变差。可通过调整(A)成分、(B)成分和(C)成分的重均分子量以及各成分的配比,将上述熔体张力调整在10mN~30mN的范围内。
使用含有上述(A)成分、(B)成分和(C)成分而成的树脂组合物来制备本发明的片的方法并没有特别限定,可通过一般的方法进行制备。例如,按照预定比例配合上述(A)成分、(B)成分和(C)成分,使用一般所用的诸如滚筒之类的混合机进行混合,并通过挤出机将其混炼成粒料状的混合物。可使用挤出机和T型模头对上述粒料状的混合物进行挤出成型来制备片。另外,可将片挤出工序中发生的所谓“耳料”的部分等粉碎并在不会对片强度、成型加工后的成型品带来较大影响的范围内将粉碎物回用于基材层。
可通过利用真空成型、气压成型、压制成型等公知的片成型方法(热成型)来由本发明的片制得载带(压纹载带)、托盘等形状自由的电子器件包装容器。通过使用本发明的片,能够进行包装容器的容器深度较深的成型,能够获得强度优异的包装容器。
本发明的片特别是在载带的压纹成型方面极其有利。压纹载带作为通过上述成型方法形成的收纳部中收纳电子器件之后以盖带进行覆盖,然后将它们卷绕成卷盘状而成的载带体,用于电子器件的保管和搬运。
载带体是指收纳有电子器件的载带。作为所要包装的电子器件并没有特别限定,例如有IC、LED(发光二极管)、电阻、电容器等。另外,还可以用于对使用了上述电子器件的中间产品和最终产品进行包装。
实施例
<片和成型品的评价方法>
对于各实施例/比较例的组合物实施片制膜后进行压纹成型处理而得到的成型品,通过下述评价方法进行评价。
(1)原料树脂的特性评价
(1-1)分子量测定
关于本发明使用的各树脂原料(A)、(B)、(C)的分子量,利用GPC(凝胶渗透色谱)并通过常用方法求得标准聚苯乙烯换算的重均分子量(Mw)。在下述条件下进行GPC测定。
柱温:40℃
检测方法:示差折射法
流动相:四氢呋喃
试样浓度:2质量%
标准曲线:使用了标准聚苯乙烯(Polymer Laboratories公司制)。
(1-2)(A)苯乙烯-共轭二烯嵌段共聚物的苯乙烯嵌段的峰值分子量和分子量分布峰宽度的评价
通过以四氧化锇为催化剂,用过氧化叔丁醇对各实施例和比较例所用的(A)成分树脂及片进行氧化分解的方法(I.M.KOLTHOFF,et al.,J.Polym.Scl.1,429(1946)所记载的方法),测定了嵌段苯乙烯含量。
将所获得的(A)成分的苯乙烯嵌段部分溶解于四氢呋喃溶剂,并通过利用了凝胶渗透色谱(GPC)的常用方法求得分子量分布的色谱曲线。对GPC用标准聚苯乙烯(单分散)进行GPC测定,根据其峰值计数和标准聚苯乙烯的数均分子量的标准曲线,由所测定的色谱曲线读取峰值分子量,从而求得峰值分子量。
求得了上述峰值分子量的分子量分布曲线的分子量以对数表示于横轴并使1000~1000000的范围为15cm,求出峰顶高度的50%的峰在横轴上的宽度(单位:cm)。
(2)片的成型性评价
通过压制成型机和气压成型机,用各实施例和比较例的片成型了深度为9mm和18mm的袋,并以成型品的“尖锐度”对此时的赋形性进行了评价。另外,关于压制成型,对于成型时袋是否发生开孔进行了评价,并且对于没有开孔的袋还对袋的侧面的厚度进行了评价。
(成型条件)
压制成型:加热器温度:190℃
气压成型:加热器温度:220℃
(赋形性的评价标准)
观察各成型品的袋角,根据图1所示的样本1~5,以肉眼观察的方式对“尖锐度”进行了5级评价。
(3)成型品的透明性评价
(4)成型品的压曲强度评价
使用Strograph(拉伸压缩试验仪,东洋精机制作所制造),使在压制成型机中成型而得的成型品的袋的开口部朝下,将袋的底面部压缩为4mm(袋深:9mm)、8mm(袋深:18mm),对此时的强度进行测定并将其作为压曲强度。需要说明的是,如果袋深9mm的成型品的压曲强度在35N以上,袋深18mm的成型品的压曲强度在30N以上,则其具有作为容器的实用性。
<各实施例和比较例中使用的树脂>
本发明的实施例和比较例中使用的各树脂(A)、(B)、(C)成分的特性示于表1。
(实施例1)
将58质量份的苯乙烯-丁二烯嵌段共聚物(Mw:150,000,共轭二烯含量:20质量%)(A-1)、33质量份的聚苯乙烯树脂(Mw:330,000)(B-1)和9质量份的耐冲击性聚苯乙烯树脂(Mw:180,000,接枝橡胶粒径:2.5μm)(C-1)干混,并通过挤出机(L/D=26)和600mm宽的T型模头进行制膜,得到厚度500μm的片。
相对于100质量%的树脂组合物,所得到的片中的接枝橡胶的橡胶成分含量为0.77质量%(计算值)。对该片进行上述评价试验的结果示于表2、表3、表4。
(实施例2~14、比较例1~12)
作为树脂成分(A)、(B)、(C),分别采用选自表1所示的A-1~A-5、B-1~B-5以及C-1~C-3的树脂,并按照表2所示的质量比进行混合。除此之外,通过与实施例1同样的操作制得片。
将各实施例的袋深9mm和18mm的成型品的相关评价结果分别总结示于表3和表4中。
[表1]
[表3]
[表4]
*表中的标记“-”表示,因产生了开孔而未进行评价。
Claims (6)
1.一种电子器件包装用片,含有:29~65质量份的(A)苯乙烯-共轭二烯嵌段共聚物;51~15质量份的(B)聚苯乙烯树脂;以及20~9质量份的(C)耐冲击性聚苯乙烯树脂,所述(A)成分、(B)成分和(C)成分的重均分子量Mw分别为下述范围:
(A)成分:Mw=80,000~220,000
(B)成分:Mw=200,000~400,000
(C)成分:Mw=150,000~210,000。
2.根据权利要求1所述的电子器件包装用片,其中,其在220℃时的熔体张力为10~30mN。
3.根据权利要求1或2所述的电子器件包装用片,其中,在100质量%的(A)成分中,共轭二烯嵌段的比率为10~25质量%。
4.根据权利要求1至3中的任意一项所述的电子器件包装用片,其中,(A)成分的苯乙烯嵌段通过GPC测定的峰值分子量在3万~12万的范围内,所述苯乙烯嵌段的分子量分布曲线的半值宽度为0.8~1.25的范围。
5.根据权利要求1至4中的任意一项所述的电子器件包装用片,其中,(C)成分中的接枝橡胶的粒径为2.0~3.0μm,基底片中的接枝橡胶的橡胶成分含量为0.75~1.90质量%。
6.一种压纹载带,其使用了权利要求1至5中的任意一项所述的片。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-227462 | 2010-10-07 | ||
JP2010227462 | 2010-10-07 | ||
JP2010-286980 | 2010-12-24 | ||
JP2010286980 | 2010-12-24 | ||
PCT/JP2011/073112 WO2012046809A1 (ja) | 2010-10-07 | 2011-10-06 | スチレン系樹脂組成物及びその成形体 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103153808A true CN103153808A (zh) | 2013-06-12 |
CN103153808B CN103153808B (zh) | 2015-08-19 |
Family
ID=45927803
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180048577.4A Active CN103153808B (zh) | 2010-10-07 | 2011-10-06 | 苯乙烯类树脂组合物及其成型体 |
Country Status (7)
Country | Link |
---|---|
US (1) | US9028938B2 (zh) |
JP (1) | JP5889195B2 (zh) |
KR (1) | KR101866593B1 (zh) |
CN (1) | CN103153808B (zh) |
MY (1) | MY160899A (zh) |
SG (1) | SG189852A1 (zh) |
WO (1) | WO2012046809A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY168734A (en) | 2010-10-07 | 2018-11-29 | Denka Company Ltd | Electronic component packaging sheet, and formed article thereof |
US9028938B2 (en) | 2010-10-07 | 2015-05-12 | Denki Kagaku Kogyo Kabushiki Kaisha | Styrene resin composition, and molded article thereof |
KR20220005474A (ko) | 2019-04-26 | 2022-01-13 | 덴카 주식회사 | 적층 시트 및 전자 부품 포장 용기 그리고 전자 부품 포장체 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4446278A (en) * | 1981-05-18 | 1984-05-01 | General Electric Company | Polyphenylene oxide blends |
JP2002047387A (ja) * | 2000-08-01 | 2002-02-12 | Asahi Kasei Corp | スチレン系樹脂組成物 |
JP2003055526A (ja) * | 2001-08-22 | 2003-02-26 | Denki Kagaku Kogyo Kk | 樹脂組成物ならびにシート |
CN1533402A (zh) * | 2002-05-10 | 2004-09-29 | Ps日本株式会社 | 苯乙烯-基聚合物树脂及其组合物 |
JP2006232914A (ja) * | 2005-02-23 | 2006-09-07 | Shin Etsu Polymer Co Ltd | スチレン系樹脂シート及びエンボスキャリアテープ |
CN1839075A (zh) * | 2003-08-22 | 2006-09-27 | 旭化成化学株式会社 | 用于承载带的片材 |
CN101186741A (zh) * | 2006-11-14 | 2008-05-28 | 旭化成化学株式会社 | 苯乙烯系树脂片 |
CN101331179A (zh) * | 2006-03-30 | 2008-12-24 | Jsr株式会社 | 聚烯烃类树脂发泡体及其制备方法 |
WO2009081963A1 (ja) * | 2007-12-26 | 2009-07-02 | Denki Kagaku Kogyo Kabushiki Kaisha | 電子部品包装用シート |
JP2010174166A (ja) * | 2009-01-30 | 2010-08-12 | Asahi Kasei Chemicals Corp | スチレン系樹脂組成物、それからなるシート及びエンボスキャリアテープ |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3209393B2 (ja) | 1995-09-19 | 2001-09-17 | 電気化学工業株式会社 | 導電性複合プラスチックシート及び容器 |
AU6734000A (en) * | 1999-08-31 | 2001-03-26 | Denki Kagaku Kogyo Kabushiki Kaisha | Transparent heat-sealing film |
JP2002332392A (ja) | 2001-05-10 | 2002-11-22 | Denki Kagaku Kogyo Kk | 樹脂組成物ならびにシート |
DE60219197T2 (de) | 2001-12-04 | 2008-01-03 | Agfa-Gevaert | Verfahren zur herstellung von lösungen oder dispersionen von polythiophenepolymeren |
EP1481025A4 (en) | 2002-03-01 | 2011-04-06 | Denki Kagaku Kogyo Kk | SURFACE AND FORM BODY THEREOF |
JP4028258B2 (ja) | 2002-03-01 | 2007-12-26 | 電気化学工業株式会社 | シート |
JP2003308733A (ja) | 2002-04-17 | 2003-10-31 | Mitsubishi Rayon Co Ltd | 耐水性導電体、及びその形成方法 |
JP4145560B2 (ja) | 2002-05-01 | 2008-09-03 | 電気化学工業株式会社 | 帯電防止性に優れた透明シート及びその成形品、及びその製造方法 |
JP4781618B2 (ja) | 2003-07-02 | 2011-09-28 | 電気化学工業株式会社 | 樹脂組成物ならびにシート |
JP4582453B2 (ja) | 2004-06-17 | 2010-11-17 | ナガセケムテックス株式会社 | 帯電防止性樹脂シート及び電子部品包装用成形体 |
JP4852526B2 (ja) | 2005-02-07 | 2012-01-11 | 帝人デュポンフィルム株式会社 | 導電性積層フィルム |
JP4947962B2 (ja) | 2005-12-02 | 2012-06-06 | 大同塗料株式会社 | 導電性クリヤー用水性組成物およびその製造方法 |
US7582403B2 (en) | 2006-07-17 | 2009-09-01 | E. I. Du Pont De Nemours And Company | Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom |
JP2010502770A (ja) * | 2006-07-27 | 2010-01-28 | ダウ グローバル テクノロジーズ インコーポレイティド | 小ゴム粒子及び低ゴム粒子ゲル含量を有し且つブロックコポリマーを含む配向ポリスチレンフィルムのシュリンクラベル |
US7855001B2 (en) | 2008-07-28 | 2010-12-21 | Ovation Polymer Technology And Engineered Materials, Inc. | Thermoplastic polymer for electrically conductive thermoforming applications |
JP2010077294A (ja) | 2008-09-26 | 2010-04-08 | Toyo Ink Mfg Co Ltd | 帯電防止コーティング用組成物 |
MY152320A (en) | 2009-03-13 | 2014-09-15 | Denki Kagaku Kogyo Kk | Cover film |
US9028938B2 (en) | 2010-10-07 | 2015-05-12 | Denki Kagaku Kogyo Kabushiki Kaisha | Styrene resin composition, and molded article thereof |
MY168734A (en) | 2010-10-07 | 2018-11-29 | Denka Company Ltd | Electronic component packaging sheet, and formed article thereof |
-
2011
- 2011-10-06 US US13/877,707 patent/US9028938B2/en active Active
- 2011-10-06 SG SG2013026125A patent/SG189852A1/en unknown
- 2011-10-06 MY MYPI2013001244A patent/MY160899A/en unknown
- 2011-10-06 JP JP2012537760A patent/JP5889195B2/ja active Active
- 2011-10-06 KR KR1020137011475A patent/KR101866593B1/ko active IP Right Grant
- 2011-10-06 WO PCT/JP2011/073112 patent/WO2012046809A1/ja active Application Filing
- 2011-10-06 CN CN201180048577.4A patent/CN103153808B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4446278A (en) * | 1981-05-18 | 1984-05-01 | General Electric Company | Polyphenylene oxide blends |
JP2002047387A (ja) * | 2000-08-01 | 2002-02-12 | Asahi Kasei Corp | スチレン系樹脂組成物 |
JP2003055526A (ja) * | 2001-08-22 | 2003-02-26 | Denki Kagaku Kogyo Kk | 樹脂組成物ならびにシート |
CN1533402A (zh) * | 2002-05-10 | 2004-09-29 | Ps日本株式会社 | 苯乙烯-基聚合物树脂及其组合物 |
CN1839075A (zh) * | 2003-08-22 | 2006-09-27 | 旭化成化学株式会社 | 用于承载带的片材 |
JP2006232914A (ja) * | 2005-02-23 | 2006-09-07 | Shin Etsu Polymer Co Ltd | スチレン系樹脂シート及びエンボスキャリアテープ |
CN101331179A (zh) * | 2006-03-30 | 2008-12-24 | Jsr株式会社 | 聚烯烃类树脂发泡体及其制备方法 |
CN101186741A (zh) * | 2006-11-14 | 2008-05-28 | 旭化成化学株式会社 | 苯乙烯系树脂片 |
WO2009081963A1 (ja) * | 2007-12-26 | 2009-07-02 | Denki Kagaku Kogyo Kabushiki Kaisha | 電子部品包装用シート |
JP2010174166A (ja) * | 2009-01-30 | 2010-08-12 | Asahi Kasei Chemicals Corp | スチレン系樹脂組成物、それからなるシート及びエンボスキャリアテープ |
Also Published As
Publication number | Publication date |
---|---|
JP5889195B2 (ja) | 2016-03-22 |
CN103153808B (zh) | 2015-08-19 |
SG189852A1 (en) | 2013-06-28 |
KR20130130712A (ko) | 2013-12-02 |
US9028938B2 (en) | 2015-05-12 |
KR101866593B1 (ko) | 2018-06-11 |
US20130209742A1 (en) | 2013-08-15 |
MY160899A (en) | 2017-03-31 |
JPWO2012046809A1 (ja) | 2014-02-24 |
WO2012046809A1 (ja) | 2012-04-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6022938B2 (ja) | 電子部品包装用シート及び成形体の製造方法 | |
CN103338931B (zh) | 苯乙烯类树脂多层片材 | |
US9732215B2 (en) | Block copolymer composition, and sheet | |
CN102821951B (zh) | 表面导电性叠层片材以及电子部件包装容器 | |
CN103153808A (zh) | 苯乙烯类树脂组合物及其成型体 | |
CN101918478B (zh) | 电子部件包装用片材 | |
CN105658723A (zh) | 热塑性树脂片材及其容器 | |
JP7441320B2 (ja) | 樹脂シート、容器、キャリアテープ、及び電子部品包装体 | |
CN111491797B (zh) | 层叠片材以及利用该层叠片材成型的电子元件包装容器 | |
JPS5930182B2 (ja) | 樹脂組成物 | |
CN107109026A (zh) | 嵌段共聚物树脂组合物、热收缩性多层膜、热收缩性标签及饮料容器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |