CN103096651A - 电子装置 - Google Patents
电子装置 Download PDFInfo
- Publication number
- CN103096651A CN103096651A CN2011103373255A CN201110337325A CN103096651A CN 103096651 A CN103096651 A CN 103096651A CN 2011103373255 A CN2011103373255 A CN 2011103373255A CN 201110337325 A CN201110337325 A CN 201110337325A CN 103096651 A CN103096651 A CN 103096651A
- Authority
- CN
- China
- Prior art keywords
- thermoelectricity
- sheet
- electronic installation
- drain pan
- link
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005619 thermoelectricity Effects 0.000 claims description 79
- 238000009434 installation Methods 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 17
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 11
- 230000006698 induction Effects 0.000 claims description 10
- 239000002784 hot electron Substances 0.000 claims 3
- MRPWWVMHWSDJEH-UHFFFAOYSA-N antimony telluride Chemical group [SbH3+3].[SbH3+3].[TeH2-2].[TeH2-2].[TeH2-2] MRPWWVMHWSDJEH-UHFFFAOYSA-N 0.000 claims 1
- 229910052797 bismuth Inorganic materials 0.000 claims 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical group [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000004549 pulsed laser deposition Methods 0.000 description 1
- DDJAGKOCVFYQOV-UHFFFAOYSA-N tellanylideneantimony Chemical group [Te]=[Sb] DDJAGKOCVFYQOV-UHFFFAOYSA-N 0.000 description 1
- PDYNJNLVKADULO-UHFFFAOYSA-N tellanylidenebismuth Chemical group [Bi]=[Te] PDYNJNLVKADULO-UHFFFAOYSA-N 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1635—Details related to the integration of battery packs and other power supplies such as fuel cells or integrated AC adapter
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Secondary Cells (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
电子装置 | 100 |
底壳 | 10 |
底壁 | 11 |
周壁 | 13 |
中央处理器 | 30 |
第一表面 | 31 |
第二表面 | 33 |
温差电池组件 | 50 |
第一热电片 | 51 |
第一连接端 | 511 |
主体 | 513 |
隔热片 | 53 |
第二热电片 | 55 |
第二连接端 | 551 |
本体 | 553 |
导电件 | 57 |
绝缘片 | 59 |
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110337325.5A CN103096651B (zh) | 2011-10-31 | 2011-10-31 | 电子装置 |
TW100140151A TWI561156B (en) | 2011-10-31 | 2011-11-03 | Electronic device |
US13/368,612 US20130108893A1 (en) | 2011-10-31 | 2012-02-08 | Electronic device with thermoelectric cell module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110337325.5A CN103096651B (zh) | 2011-10-31 | 2011-10-31 | 电子装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103096651A true CN103096651A (zh) | 2013-05-08 |
CN103096651B CN103096651B (zh) | 2016-06-08 |
Family
ID=48172751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110337325.5A Active CN103096651B (zh) | 2011-10-31 | 2011-10-31 | 电子装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20130108893A1 (zh) |
CN (1) | CN103096651B (zh) |
TW (1) | TWI561156B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105376971A (zh) * | 2015-10-08 | 2016-03-02 | 京东方科技集团股份有限公司 | 移动电子设备的外壳和移动电子设备 |
WO2017219537A1 (zh) * | 2016-06-20 | 2017-12-28 | 意力(广州)电子科技有限公司 | 一种基于温差发电的自发电显示面板及电子设备 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013211505A1 (de) * | 2013-06-19 | 2014-12-24 | Behr Gmbh & Co. Kg | Temperiervorrichtung |
US20150075186A1 (en) * | 2013-09-18 | 2015-03-19 | Qualcomm Incorporated | Method of and an apparatus for maintaining constant phone skin temperature with a thermoelectric cooler and increasing allowable power/performance limit for die in a mobile segment |
TWI672582B (zh) * | 2015-08-13 | 2019-09-21 | 大陸商東莞錢鋒特殊膠黏製品有限公司 | 行動電子裝置之散熱緩衝導電複合成型結構(三) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010023591A1 (en) * | 2000-03-24 | 2001-09-27 | Kazuhiko Maeda | Power generating mechanism for electronic apparatus |
CN101188318A (zh) * | 2006-11-15 | 2008-05-28 | 乐金电子(昆山)电脑有限公司 | 移动设备的充电装置 |
CN101483218A (zh) * | 2009-01-20 | 2009-07-15 | 深圳大学 | 一种温差电池及其制作方法 |
CN201682722U (zh) * | 2009-12-28 | 2010-12-22 | 深圳华为通信技术有限公司 | 一种数据卡 |
-
2011
- 2011-10-31 CN CN201110337325.5A patent/CN103096651B/zh active Active
- 2011-11-03 TW TW100140151A patent/TWI561156B/zh not_active IP Right Cessation
-
2012
- 2012-02-08 US US13/368,612 patent/US20130108893A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010023591A1 (en) * | 2000-03-24 | 2001-09-27 | Kazuhiko Maeda | Power generating mechanism for electronic apparatus |
CN101188318A (zh) * | 2006-11-15 | 2008-05-28 | 乐金电子(昆山)电脑有限公司 | 移动设备的充电装置 |
CN101483218A (zh) * | 2009-01-20 | 2009-07-15 | 深圳大学 | 一种温差电池及其制作方法 |
CN201682722U (zh) * | 2009-12-28 | 2010-12-22 | 深圳华为通信技术有限公司 | 一种数据卡 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105376971A (zh) * | 2015-10-08 | 2016-03-02 | 京东方科技集团股份有限公司 | 移动电子设备的外壳和移动电子设备 |
WO2017219537A1 (zh) * | 2016-06-20 | 2017-12-28 | 意力(广州)电子科技有限公司 | 一种基于温差发电的自发电显示面板及电子设备 |
Also Published As
Publication number | Publication date |
---|---|
TW201318547A (zh) | 2013-05-01 |
CN103096651B (zh) | 2016-06-08 |
TWI561156B (en) | 2016-12-01 |
US20130108893A1 (en) | 2013-05-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20151021 Address after: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant after: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. Address before: 518109 Guangdong city of Shenzhen province Baoan District Guanlan Street third community Guanlan Foxconn Technology Park B District, building 4, building 6, building 7, building 13, (I) Applicant before: Futaihua Industrial (Shenzhen) Co., Ltd. Applicant before: Hon Hai Precision Industry Co., Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160214 Address after: 201424 Shanghai city Fengxian District Tuo Village barracks Lin Zhen No. 598 building ninth room 111 Applicant after: Shanghai Lirui Network Technology Co., Ltd. Address before: 518109 Guangdong province Shenzhen city Longhua District Dragon Road No. 83 wing group building 11 floor Applicant before: SCIENBIZIP CONSULTING (SHEN ZHEN) CO., LTD. |
|
C41 | Transfer of patent application or patent right or utility model | ||
CB03 | Change of inventor or designer information |
Inventor after: Shi Faguang Inventor after: Zhao Jianzhou Inventor after: Liang Yan Inventor after: Hu Renjie Inventor before: Shi Faguang Inventor before: Zhao Jianzhou Inventor before: Liang Yan |
|
COR | Change of bibliographic data | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20160512 Address after: 1, building 401, building 1, science and Technology Town, Jurong Economic Development Zone, Zhenjiang, Zhenjiang, Jiangsu 212400, China Applicant after: ZHENJIANG FUKEXIN ELECTRONIC TECHNOLOGY CO., LTD. Address before: 201424 Shanghai city Fengxian District Tuo Village barracks Lin Zhen No. 598 building ninth room 111 Applicant before: Shanghai Lirui Network Technology Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190508 Address after: 211100 9 Jiangning Road, Jiangning economic and Technological Development Zone, Nanjing, China Patentee after: Nanjing Galibo Electronic Technology Co., Ltd. Address before: Room 401, No. 1 Science and Technology Avenue, Science and Technology New Town, Jurong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee before: ZHENJIANG FUKEXIN ELECTRONIC TECHNOLOGY CO., LTD. |
|
TR01 | Transfer of patent right |