CN103075644A - Led照明装置 - Google Patents

Led照明装置 Download PDF

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CN103075644A
CN103075644A CN2011103285004A CN201110328500A CN103075644A CN 103075644 A CN103075644 A CN 103075644A CN 2011103285004 A CN2011103285004 A CN 2011103285004A CN 201110328500 A CN201110328500 A CN 201110328500A CN 103075644 A CN103075644 A CN 103075644A
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lighting device
led lighting
led
pcb
circuit board
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CN103075644B (zh
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曾军华
林晶
迪尔克·布赫豪斯尔
胡瑾
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Landes Vance
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Osram Co Ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
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    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/366Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238Arrangement or mounting of circuit elements integrated in the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0388Other aspects of conductors
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    • H05K2201/09Shape and layout
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09145Edge details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

本发明涉及一种LED照明装置,包括:散热器(1);光引擎(2);LED驱动器(3);以及用于容纳LED驱动器(3)的驱动器壳体(4),其中,在散热器(1)中形成有隔离壁(A),光引擎(2)和容纳有LED驱动器(3)的驱动器壳体(4)分别设置在隔离壁(A)的相对的第一侧面和第二侧面,其中,LED照明装置还具有连接件(5),该连接件(5)将光引擎(2)压靠在隔离壁(A)的第一侧面上,并在隔离壁(A)的第二侧面与驱动器壳体(4)锁定在一起。

Description

LED照明装置
技术领域
本发明涉及一种LED照明装置。 
背景技术
众所周知,LED照明具有不可替代的优点,其节省能源,超低功耗,电光功率转换接近100%,相同的照明效率比传统光源节能80%以上,并且其寿命较长。鉴于以上优点,人们越来越多地将LED作为光源来使用,例如市场上大量出现的LED改型灯。这种LED改型灯具有传统的光源例如白炽灯的外形轮廓,这样其能够作为光源更好地适应已有的照明***。 
在现有技术中公开了一种LED改型灯,该LED改型灯具有:用于容纳LED驱动器的驱动器壳体;散热器,该散热器以其一个端部固定在驱动器壳体上,并且散热器的另一个端部与承载有LED发光组件的印刷电路板热接触;以及半球形的泡壳,该泡壳设置在散热器的另一个端部上,将承载有LED发光组件的印刷电路板封闭起来。这种LED改型灯的散热器设计为中空的,其中布置有容纳LED驱动器的驱动器壳体。然而,在进行装配时,需要通过螺栓或通过表面装配技术,例如焊接的方法将大多数情况下由塑料制成的驱动器壳体或承载有LED发光组件的印刷电路板固定在散热器上。这就有可能在利用焊接或螺栓进行固定时导致塑料的驱动器壳体或者散热器的破裂,并且也可能导致对印刷电路板上的对温度敏感的电子器件的损坏。 
发明内容
因此,本发明提出了一种LED照明装置,该LED照明装置的各个部件不需要通过传统的螺栓或者表面装配技术,例如焊接来装配在一起,从而有效地避免了装配过程对LED照明装置的各个部件的不良影响,同时其装配更加简单。 
本发明的目的通过一种LED照明装置由此实现,即该LED照明装置,包括:散热器;光引擎;LED驱动器;以及用于容纳LED驱动器的驱动器壳体,其中,在散热器中形成有隔离壁,光引擎和容纳有LED驱动器的驱动器壳体分别设置在隔离壁的相对的第一侧面和第二侧面上,其中,LED照明装置还具有连接件,该连接件将光引擎压靠在隔离壁的第一侧面上,并在隔离壁的第二侧面与驱动器壳体锁定在一起。根据本发明的LED照明装置的各个部件不需要通过传统的螺栓或者表面装配技术,例如焊接来装配在一起,从而有效地避免了焊接或者螺栓连接对LED照明装置的各个部件的不良影响,同时其装配更加简单。 
根据本发明的一个优选的设计方案提出,连接件具有板状本体,该板状本体具有突出于其延伸的至少两个卡钩,并且在驱动器壳体上形成有与卡钩相对应的至少两个卡口,卡钩卡扣到卡口中。由于连接件与驱动器壳体分别设置在散热器的隔离壁的两个相对的侧面上,因此在将卡钩卡扣到卡口中后,连接件和驱动器壳体将散热器的隔离壁,进而将散热器本身牢固地夹持在其之间,从而形成了稳固的固定连接。这种简单的卡扣连接方式完全替代了传统的装配方式,避免使用螺栓或者焊接。 
优选的是,卡钩形成在板状本体的周向边缘的相对侧上。由此,在卡钩卡扣到卡口中之后,能够在连接件与驱动器壳体之间建立稳定的连接。 
根据本发明提出,隔离壁上形成有至少两个第一通孔,卡钩穿过第一通孔锁定到卡口中。由于卡钩穿过第一通孔,从而确保了散热器相对于连接件旋转,这进一步使散热器稳固地保持在连接件与驱动器壳体之间。 
在本发明的设计方案中,光引擎包括印刷电路板和设置在印刷电路板上的LED芯片。优选的是,隔离壁上形成有第二通孔,其中,并且在印刷电路板上形成有缺口,LED驱动器的导电连接插脚穿过第二通孔***到缺口中。进一步优选的是,板状本体上形成有用于暴露出LED芯片的出光口,以及用于使导电连接插脚穿过的插脚通孔,在插脚通孔的内壁上设置有导电连接轨,并且在印刷电路板的缺口旁形成有导电触点,导电连接轨分别与导电触点和导电连接插脚导电接触。通过这种设计方案,连接件一方面起到了固定光引擎和驱动器壳体的作用,另一方面起到了在光引擎和驱动器之间的电连接桥梁的作用,该电连接通过简单的直接接触实现,而无需进行焊接,这在很大程度上简化了制造工艺,降低了成本。 
优选的是,板状本体在远离印刷电路板的一侧形成有凸台,插脚通孔形成在凸台中。凸台可以完全包裹着穿过印刷电路板缺口的导电连接插脚,从而对其进行保护,防止异物接触导电连接插脚,从而避免了不希望的短路。 
有利的是,板状本体的周向边缘包围印刷电路板的周向边缘。根据本发明的连接件完全包围印刷电路板,从而进一步增强了对印刷电路板的保护,防止其受到外界的干扰。 
根据本发明提出,连接件由绝缘材料制成。当然,连接件也可以由其他材料制成,包括金属,例如具有较高的导热系数的铜制成,但是这需要对印刷电路板进行绝缘处理,从而确保由金属制成的连接件不会引起印刷电路板上的器件的短路。 
附图说明
附图构成本说明书的一部分,用于帮助进一步理解本发明。这些附图图解了本发明的实施例,并与说明书一起用来说明本发明的原理。在附图中相同的部件用相同的标号表示。图中示出: 
图1是根据本发明的LED照明装置的分解示意图; 
图2是装配完毕的根据本发明的LED照明装置示意图; 
图3a是根据本发明的LED照明装置的连接件的一个侧面的示意图; 
图3b是根据本发明的LED照明装置的连接件的另一个侧面的示意图; 
图3c是根据本发明的LED照明装置的光引擎的示意图; 
图3d是根据本发明的LED照明装置的驱动器的示意图; 
图3e是根据本发明的LED照明装置的散热器的示意图; 
图3f是根据本发明的LED照明装置的驱动器壳体的示意图。 
具体实施方式
图1示出了根据本发明的LED照明装置的分解示意图,从图中可见,根据本发明的LED照明装置包括:散热器1;光引擎2;LED驱动器3;以及用于容纳LED驱动器3的驱动器壳体4。在本实施例中,根据本发明的LED照明装置设计成具有传统的白炽灯的外形轮廓的LED改型灯。从图中可见,在散热器1中形成有隔离壁A,光引擎2和容纳有LED驱动器3的驱动器壳体4分别设置在隔离壁A的相对的第一侧面和第二侧面。此外,根据本发明的LED照明装置还具有连接件5,该连接件5将光引擎2压靠在隔离壁A的第一侧面上上,并在隔离壁A的第二侧面与驱动器壳体4锁定在一起。图2中示出了装配完毕的根据本发明的LED照明装置示意图。 
图3a至图3f分别示出了LED照明装置的各个部件的示意图。图3a示出了连接件5的一个侧面的示意图,其中,该连接件5具有板状本体5a,板状本体5a具有突出于其延伸的至少两个卡钩6,并且在图3f示出的驱动器壳体4上形成有与卡钩6相对应的至少两个卡口7。此外,在图3a中进一步可见,板状本体5a在远离印刷电路板2a的一侧形成有凸台5e,在凸台5e中形成有插脚通孔5c。此外,在本实施例中,板状本体5a的中央形成有用于暴露出图3c中示出的光引擎2的LED芯片2c的出光口5b。 
图3b示出了连接件5的另一个侧面的示意图。从图中可见,卡钩6形成在板状本体5a的周向边缘的相对侧上,并且板状本体5a具有与印刷电路板2a对应的轮廓,并且在板状本体5a的面向印刷电路板2a的一侧形成有朝向印刷电路板2a的方向延伸的周向边缘5f,周向边缘5f包围印刷电路板2a的周向边缘。此外,从图3a和图3b中可见,在插脚通孔5c的内壁上设置有导电连接轨5d,该导电连接轨5d与图3d中示出的LED驱动器3的导电连接插脚3a电接触。同时,从图3b中可见,该导电连接轨5d延伸到板状本体5a的表面上,从而在进行装配时,能够使该导电连接轨5d能够与图3c中示出的印刷电路板2a上的导电触点2d进行电接触。 
从图3c可见,光引擎2包括印刷电路板2a和设置在印刷电路板2a上的LED芯片2c,并且在印刷电路板2a上形成有缺口2b,导电触点2d形成在缺口2b旁。 
图3e中示出了根据本发明的LED照明装置的散热器的示意图。从图中可见,该散热器1中形成有隔离壁A,光引擎2和容纳有LED驱动器3的驱动器壳体4分别设置在隔离壁A的相对的第一侧面和第二侧面上。此外,在隔离壁A上形成有两个第一通孔1a,卡钩6穿过第一通孔1a卡扣到卡口7中。在隔离壁A上还形成有第二通孔1b,LED驱动器3的导电连接插脚3a穿过第二通孔1b***到缺口2b中。 
在图3f中可见,卡口7形成在驱动器壳体4的壳体壁上。在实际的装配过程中,驱动器壳体4***到散热器1的容纳部中,并抵靠在散热器1的隔离壁A的第二侧面上,同时使驱动器3的导电连接插脚3a穿过隔离壁A的第二通孔1b。同时,将光引擎2放置在隔离壁A上,使光引擎2的缺口2b与隔离壁A的第二通孔1b对准。然后将连接件5扣合在光引擎2上,使光引擎2的LED芯片2c从连接件5的出光口5b暴露出来,同时使连接件5的卡钩6穿过隔离壁A的第一通孔1a,并卡扣到卡口7中,同时使导电连接插脚3a穿过缺口2b并***到插脚通孔5c中,插脚通孔5c的内壁上设置有导电连接轨5d,导电连接轨5d分别与导电触点2d和导电连接插脚3a导电接触,从而在驱动器3和光引擎2之间建立可靠的电连接。 
以上仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。 
参考标号 
1         散热器 
1a        第一通孔 
1b        第二通孔 
2         光引擎 
2a        印刷电路板 
2b        缺口 
2c        LED芯片 
3         LED驱动器 
3a        导电连接插脚 
4         驱动器壳体 
5         连接件 
5a        板状本体 
5b        出光口 
5c        插脚通孔 
5d        导电连接轨 
5e        凸台 
5f        周向边缘 
6         卡钩 
7         卡口 
A         隔离壁。 

Claims (11)

1.一种LED照明装置,包括:散热器(1);光引擎(2);LED驱动器(3);以及用于容纳所述LED驱动器(3)的驱动器壳体(4),其中,在所述散热器(1)中形成有隔离壁(A),所述光引擎(2)和容纳有所述LED驱动器(3)的所述驱动器壳体(4)分别设置在所述隔离壁(A)的相对的第一侧面和第二侧面上,其特征在于,所述LED照明装置还具有连接件(5),所述连接件(5)将所述光引擎(2)压靠在所述隔离壁(A)的所述第一侧面上,并在所述隔离壁(A)的所述第二侧面与所述驱动器壳体(4)锁定在一起。
2.根据权利要求1所述的LED照明装置,其特征在于,所述连接件(5)具有板状本体(5a),所述板状本体(5a)具有突出于其延伸的至少两个卡钩(6),并且在所述驱动器壳体(4)上形成有与所述卡钩(6)相对应的至少两个卡口(7),所述卡钩(6)卡扣到所述卡口(7)中。
3.根据权利要求2所述的LED照明装置,其特征在于,所述卡钩(6)形成在所述板状本体(5a)的周向边缘(5f)的相对侧上。
4.根据权利要求3所述的LED照明装置,其特征在于,所述隔离壁(A)上形成有至少两个第一通孔(1a),所述卡钩(6)穿过所述第一通孔(1a)卡扣到卡口(7)中。
5.根据权利要求4所述的LED照明装置,其特征在于,所述光引擎(2)包括印刷电路板(2a)和设置在所述印刷电路板(2a)上的LED芯片(2c)。
6.根据权利要求5所述的LED照明装置,其特征在于,所述隔离壁(A)上形成有第二通孔(1b),其中,并且在所述印刷电路板(2a)上形成有缺口(2b),所述LED驱动器(3)的导电连接插脚(3a)穿过所述第二通孔(1b)***到所述缺口(2b)中。
7.根据权利要求6所述的LED照明装置,其特征在于,所述板状本体(5a)上形成有用于使所述导电连接插脚(3a)穿过的插脚通孔(5c),在所述插脚通孔(5c)的内壁上设置有导电连接轨(5d),并且在所述印刷电路板(2a)上形成有导电触点(2d),所述导电连接轨(5d)分别与所述导电触点(2d)和所述导电连接插脚(3a)导电接触。
8.根据权利要求7所述的LED照明装置,所述板状本体(5a)在远离所述印刷电路板(2a)的一侧形成有凸台(5e),所述插脚通孔(5c)形成在所述凸台(5e)中。
9.根据权利要求3至8中任一项所述的LED照明装置,其特征在于,所述板状本体(5a)上形成有用于暴露出所述LED芯片(2c)的出光口(5b)。
10.根据权利要求3至8中任一项所述的LED照明装置,其特征在于,所述板状本体(5a)的周向边缘(5f)包围所述印刷电路板(2a)的周向边缘。
11.根据权利要求1至8中任一项所述的LED照明装置,其特征在于,所述连接件(5)由绝缘材料制成。
CN201110328500.4A 2011-10-25 2011-10-25 Led照明装置 Expired - Fee Related CN103075644B (zh)

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