CN103052271B - While making soldering-resistant pattern, surface, weld zone is carried out to the method for solderability process - Google Patents
While making soldering-resistant pattern, surface, weld zone is carried out to the method for solderability process Download PDFInfo
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- CN103052271B CN103052271B CN201210550409.1A CN201210550409A CN103052271B CN 103052271 B CN103052271 B CN 103052271B CN 201210550409 A CN201210550409 A CN 201210550409A CN 103052271 B CN103052271 B CN 103052271B
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Abstract
The present invention relates to a kind of make soldering-resistant pattern while the method for solderability process is carried out to surface, weld zone, the steps include: circuit board bare board to carry out full plate coating solder resist, by full plate resistance solder flux solidification, welding resistance figure is made by laser photetching, surface treatment is carried out to circuit board bare board weld zone simultaneously, obtain the printed circuit board with excellent surface solderability.On laser equipment, successively the making of soldering-resistant pattern and the surface treatment of weld zone is completed in the present invention; simplify production procedure; eliminate solderability protective material coating procedure and relevant device, significantly saved material, reduced energy consumption; reduce investment cost and production cost; alleviate environmental pressure, avoid the suction of operator to nuisance, production procedure is short; the investment needed is low, and the place of needs is little.
Description
Technical field
The invention belongs to printed circuit board field, relate to printed circuit board surface solderability process, especially a kind of make soldering-resistant pattern while surface, weld zone carried out to the method for solderability process.
Background technology
The manufacturing process of circuit board generally includes the manufacture of circuit board bare board and two production phases assembled by circuit board.Wherein, bare board refers to the circuit board of not yet mounting related components, also claims printed circuit board, printed circuit board (PCB), printed substrate, wiring board.Above-mentioned bare board generally customizes at circuit board manufacturers, usually this bare board customizing at circuit board manufacturers is called in making sheet, for double-sided PCB, technological process is roughly: sawing sheet, and---------------after milling external form, shipment is to assembly plant for coating mark symbol---surperficial solderability coating processing---for coating solder resist and making soldering-resistant pattern to move back metal etchant resist or organic etchant resist to make conductive pattern for boring and hole metallization.Assembled plate refers to the circuit board being provided with components and parts, this circuit board or carry out in professional assembly plant, or completed voluntarily by electronic product developer, at present,---print soldering paste---paster---reflow soldering that the method for this mounting related components on circuit boards adopts SMT technology usually, and technological process is roughly: from the makers' circuit board of bare board.
In naked circuit board making process, the coating processing of coating solder resist and pad solderability assembles complexity to circuit board and quality has decisive influence.The object applying solder resist at printed board production board is on the surface that other positions all on plate face except pad and plated-through hole inwall are all covered solder resist, prevents the short circuit between wire or pad; In addition, solder resist insulate, heat-resisting, and chemical-resistant resistance can be scraped off, scratches by anti-wire, plays mechanical isolation effect, can also play moisture proof, salt fog, the anti-function of mould three.
Coating solder resist adopts method for printing screen and photochemistry imaging method usually, no matter adopt which kind of method, first light is all needed to draw negative, carry out Graphic transitions again, then directly silk screen printing formation solder resist pattern or full plate apply liquid photosensitive solder resist coating, through predrying, exposure, soldering-resistant pattern is formed after development, its deficiency is: two kinds of methods need longer process route, due to the restriction of graphics resolution, being difficult to the requirement that adaptation electronic devices and components encapsulating structure more becomes more meticulous, is cause finer pitch components and parts to weld one of reason of difficulty.
When soldering is carried out in component lead and printed board, coating to help weldering property diaphragm in the component hole of printed board after coating solder resist and on pad, also claim solderability coat.Solderability coat, by carrying out surface treatment formation to printed conductor, has metal and organic substance two class.Organic substance helps weldering diaphragm based on OSP technology, but OSP is shorter to its covering surfaces protection term of validity.Washing means are divided into hot dipping and chemical plating two kinds; two kinds of methods all need comparatively complicated processing technology; and cost is higher; for the hot air leveling method of classics, coating welding resistance and the flow process of solderability protective layer are: move back metal etchant resist or organic etchant resist-clean-full plate and apply liquid photosensitive solder resist ink-predrying-exposure-development-Post RDBMS-clean and microetch process-pre-coated soldering flux-hot air leveling tin coating lead alloy.
Hot air leveling action need first carries out clean and microetch to printed board, then the upper solder flux of leaching, and dip-coating subsequently, in the solder of melting, proposes after stopping a few second from the solder of melting, through air knife, blows away unnecessary solder with hot compressed air.This hot air leveling method has certain limitation, SMT technology requires higher to circuit board, except the problem such as plug-hole, bridge joint, circuit board immerse solder time be subject to thermal shock, circuit board may be caused to be out of shape, circuit board at hot air leveling from solder bath upwards lifting process, the gravity of solder itself and surface tension, making bond pad surface solder upper-thin-lower-thick, out-of-flatness, is all the source of weld defect.Use solder containing pb on the other hand, be not suitable for lead-free process, the burden caused to environment is large.Hot air flattening technology is not suitable for the SMT that spacing is less than 0.5mm.In addition, hot air leveling will at high temperature work, and equipment needs stainless steel, titanium or other alloy, and equipment investment is large, and complex process, severe operational environment, is not suitable for finer pitch circuit board.
Summary of the invention
The object of the invention is to the weak point overcoming prior art, provide that a kind of technique is simple, environmental protection, machining accuracy are high and while being easier to the making soldering-resistant pattern operated, surface, weld zone is carried out to the method for solderability process.
The present invention adopts following technical scheme for realizing the object of the invention:
While making soldering-resistant pattern, surface, weld zone is carried out to a method for solderability process, the steps include:
(1) solder resist coating: at plate coating solder resist complete in making sheet;
(2) solder resist solidification: the solder resist applied in making sheet is cured;
(3) data importing: by needing the graph data of processing to import data processing software, obtain machining path data afterwards as calculated;
(4) laser photetching: by solder resist solidify after be placed on laser equipment in making sheet, will at making sheet top layer and machining path exactitude position, carry out photetching according to machining path data at making sheet top layer, divest the solder resist on making sheet top layer weld zone figure, obtain weld zone pattern;
(5) surface cleaning process: reduce Laser output energy, removes solder resist residue, after exposing clean pad at making sheet top layer, stops Laser output, completes the solderability processing of end face in making sheet;
(6) overturn in making sheet, repeat step and (4) (5) process at making sheet bottom with step, while completing making soldering-resistant pattern, carry out solderability process on surface, making sheet backing weld district, after completing, obtain printed circuit board.
And, bite after tin cream to described printed circuit board, carry out the SMT assembling of printed circuit board.
And, before tin cream that printed circuit board is bitten, apply scaling powder on a printed circuit board.
And the step coating layer thickness that (1) described full plate applies is: 0.5 μm ~ 100 μm.
And step (1) described solder resist is heat curing-type solder mask, light curable type solder mask, dry film solder mask.
And, when solder resist is solder mask, full plate painting method employing silk screen method, rolling method or painting curtain method that step is (1) described; When solder resist is dry film solder mask, the full plate painting method employing laminator hot-press method that step is (1) described.
And the (3) described laser setup parameter of step is:
Optical maser wavelength: 100 ~ 10700nm;
Spot diameter: 5 ~ 300 μm;
Power: 0.5 ~ 200W.
And infrared laser parameter and the Ultra-Violet Laser parameter of described laser are respectively:
Infrared laser parameter:
Advantage of the present invention and effect are:
1, on laser equipment, the making of soldering-resistant pattern and the surface treatment of weld zone is completed in the present invention; simplify production procedure; eliminate solderability protective material coating procedure and relevant device, significantly saved material, reduced energy consumption; reduce investment cost and production cost; alleviate environmental pressure, avoid the suction of operator to nuisance, production procedure is short; the investment needed is low, and the place of needs is little.
2, the present invention adopts full plate apply solder resist and solder resist coating on plate face all solidified, do not need photoresistance film and masking film negative, eliminate light and paint egative film and corresponding flow process, exposure, development flow process are not needed for photochemical method, also eliminate equipment and the material such as equipment, exposure, development of optical plotter and flushing egative film, production procedure is short, and the investment of needs is low, and the place of needs is little.
3, the present invention's cad data Direct driver laser equipment shaping weld zone pattern, there is no the deviation accumulation of Graphic transitions, and due to laser facula meticulousr, compare with photochemical method with traditional silk screen process, there is better resolution, precision for product has raising by a relatively large margin, can make the circuit board of meticulousr pattern.
4, laser photetching of the present invention makes weld zone figure; to material upslide to be processed according to laser; direct photetching falls high polymer solder resist; and can clean and alligatoring finished surface, compared with prior art, do not need before the coating of solderability protective material, carry out other clean and microetch process; simultaneously can directly apply solderability protective material; production procedure is short, and the investment of needs is low, and the place of needs is little.
5, the present invention completes and carries out solderability process to surface, weld zone while making soldering-resistant pattern, can at assembling field conduct laser welding district pattern forming, to material upslide to be processed according to laser, direct photetching falls high polymer solder resist, and clean surface to be welded, expose end copper, make it have better solderability, without the need to applying solderability protective material specially again, such as metallic tin, leypewter, directly can apply solder(ing) paste on naked copper directly to weld, coating scaling powder or add scaling powder directly weld, overall simplified production procedure, eliminate solderability protective material coating procedure and relevant device, significantly save material, reduce energy consumption, reduce investment cost and production cost, alleviate environmental pressure, be conducive to operator's health.
6, the present invention adopts the direct photetching of laser to remove completely crued high polymer solder resist, material is no longer needed to have photosensitive property, operable solder resist comprises: liquid photosensitive solder mask, non-photo-sensing thermosetting, the solid ink of light and dry film solder mask, Material selec-tion is wide, and cost is lower.
7, the laser described in the present invention comprises laser that is infrared, the multi-wavelength such as green glow, ultraviolet, alternate material kind is many, improve manufacturing flexible, not only be applicable to the making of circuit board, small lot multi items high-precision circuit board, also be applicable to the batch production of printed circuit board, there is good promotional value.
Embodiment
Below with reference to embodiment, the present invention is described further.Following embodiment is illustrative, is not determinate, can not limit protection scope of the present invention with following embodiment.
Embodiment 1
While making soldering-resistant pattern, surface, weld zone is carried out to a method for solderability process, the steps include:
(1) solder resist coating: carry out full plate coating in making sheet by the method for silk screen printing, adopts 43T grenadine to be coated in making sheet by photosensitive-ink C-7, leaves standstill 10 ~ 20min after biting;
Solder resist solidification: by leave standstill after making sheet put into drying baker baking, in two stages photosensitive-ink C-7 is cured, after solidifying 30min under 75 ± 2 DEG C of conditions, under 150 DEG C of conditions, solidifies 70min;
(3) data importing: the data importing solder mask, uses data processing software process, obtains the path of laser processing, and machining path is imported laser equipment control software design;
(4) laser photetching: be placed on laser equipment in making sheet after photosensitive-ink C-7 is cured, will at making sheet top layer and machining path exactitude position, carry out photetching according to machining path data at making sheet top layer, divest the solder resist on making sheet top layer weld zone figure, obtain weld zone pattern;
(5) surface cleaning process: reduce Laser output energy, remove solder resist residue, Laser output is stopped after exposing clean pad, employing wavelength is 1064nm, the laser beam of power 20W carries out high speed deflection throwing through scanning galvanometer according to described machining path data and shines and process in region, making sheet top layer weld zone, completes and processes in the solderability of making sheet top layer;
(6) overturn in making sheet, repeat step and (4) (5) process at making sheet bottom with step, while completing making soldering-resistant pattern, carry out solderability process on surface, making sheet backing weld district, after completing, obtain printed circuit board;
(7) assembly welding: after tin cream of being bitten by printed circuit board, carries out the SMT assembling of printed circuit board.
Embodiment 2
While making soldering-resistant pattern, surface, weld zone is carried out to a method for solderability process, the steps include:
(1) solder resist coating: carry out full plate coating in making sheet by the method for silk screen printing, adopts 43T grenadine to be coated in making sheet by photosensitive-ink UPC-9000, leaves standstill 10 ~ 20min after biting;
Solder resist solidification: by leave standstill after making sheet put into drying baker baking, in two stages photosensitive-ink UPC-9000 is cured, after solidifying 50min under 67 ± 2 DEG C of conditions, under 150 DEG C of conditions, solidifies 60min;
(3) data importing: the data importing solder mask, uses data processing software process, obtains the path of laser processing, and machining path is imported laser equipment control software design;
(4) laser photetching: be placed on laser equipment in making sheet after photosensitive-ink UPC-9000 is cured, will at making sheet top layer and machining path exactitude position, photetching is carried out at making sheet top layer according to machining path data, divest the solder resist on making sheet top layer weld zone figure, obtain weld zone pattern;
(5) surface cleaning process: reduce Laser output energy, remove solder resist residue, Laser output is stopped after exposing clean pad, employing wavelength is 532nm, the laser beam of power 35W carries out high speed deflection throwing through scanning galvanometer according to described machining path data and shines and process in region, making sheet top layer weld zone, completes the solderability processing of end face in making sheet;
(6) overturn in making sheet, repeat step and (4) (5) process at making sheet bottom with step, while completing making soldering-resistant pattern, carry out solderability process on surface, making sheet backing weld district, after completing, obtain printed circuit board;
(7) assembly welding: the printed circuit board after two-sided processing is put into OSP treatment fluid and carries out OSP process, after tin cream of biting, carries out the SMT assembling of circuit board.
Embodiment 3
While making soldering-resistant pattern, surface, weld zone is carried out to a method for solderability process, the steps include:
(1) solder resist coating: carry out full plate coating in making sheet by the method for silk screen printing, adopts 43T grenadine to be coated in making sheet by photosensitive-ink VSR-ZG, leaves standstill 10 ~ 20min after biting;
(2) solder resist solidification: by putting into UV-curing equipment in making sheet photosensitive-ink VSR-ZG is carried out photocuring after leaving standstill, optical energy density 12 μ W/cm2, at making sheet transfer rate 1.5-2.0m/min;
(3) data importing: the data importing solder mask, uses data processing software process, obtains the path of laser processing, and machining path is imported laser equipment control software design;
(4) laser photetching: be placed on laser equipment in making sheet after photosensitive-ink VSR-ZG is cured, will at making sheet top layer and machining path exactitude position, photetching is carried out at making sheet top layer according to machining path data, divest the solder resist on making sheet top layer weld zone figure, obtain weld zone pattern;
(5) surface cleaning process: reduce Laser output energy, remove solder resist residue, Laser output is stopped after exposing clean pad, employing wavelength is 1064nm, the laser beam of power 50W carries out high speed deflection throwing through scanning galvanometer according to described machining path data and shines and process in region, making sheet top layer weld zone, completes and processes in the solderability of making sheet top layer;
(6) overturn in making sheet, repeat step and (4) (5) process at making sheet bottom with step, while completing making soldering-resistant pattern, carry out solderability process on surface, making sheet backing weld district, after completing, obtain printed circuit board;
(7) assembly welding: after tin cream of being bitten by printed circuit board, carries out the SMT assembling of printed circuit board.
Three kinds of ink involved in above three embodiments are commercial goods, and above-mentioned ink types, grenadine model and the related datas such as involved type of laser and wavelength of windowing may adjust to some extent according to different technological requirements and characteristic and process environments change in actual application.
Claims (7)
1. while making soldering-resistant pattern, surface, weld zone is carried out to a method for solderability process, it is characterized in that: the steps include:
(1) solder resist coating: at plate coating solder resist complete in making sheet, the coating layer thickness of described full plate coating is: 0.5 μm ~ 100 μm;
(2) solder resist solidification: the solder resist applied in making sheet is cured;
(3) data importing: by needing the graph data of processing to import data processing software, obtain machining path data afterwards as calculated;
(4) laser photetching: by solder resist solidify after be placed on laser equipment in making sheet, will at making sheet top layer and machining path exactitude position, carry out photetching according to machining path data at making sheet top layer, divest the solder resist on making sheet top layer weld zone figure, obtain weld zone pattern;
(5) surface cleaning process: reduce Laser output energy, removes solder resist residue, after exposing clean pad at making sheet top layer, stops Laser output, completes the solderability processing of end face in making sheet;
(6) overturn in making sheet, repeat step and (4) (5) process at making sheet bottom with step, while completing making soldering-resistant pattern, carry out solderability process on surface, making sheet backing weld district, after completing, obtain printed circuit board.
2. while making soldering-resistant pattern according to claim 1, the method for solderability process is carried out to surface, weld zone, it is characterized in that: bite after tin cream to described printed circuit board, carry out the SMT assembling of printed circuit board.
3. while making soldering-resistant pattern according to claim 2, surface, weld zone is carried out to the method for solderability process, it is characterized in that: before tin cream that printed circuit board is bitten, apply scaling powder on a printed circuit board.
4. while making soldering-resistant pattern according to claim 1, surface, weld zone is carried out to the method for solderability process, it is characterized in that: step (1) described solder resist is heat curing-type solder mask, light curable type solder mask and dry film solder mask.
5. while making soldering-resistant pattern according to claim 4, surface, weld zone is carried out to the method for solderability process, it is characterized in that: when solder resist is solder mask, full plate painting method employing silk screen method, rolling method or painting curtain method that step is (1) described; When solder resist is dry film solder mask, the full plate painting method employing laminator hot-press method that step is (1) described.
6. according to while making soldering-resistant pattern according to claim 1, the method for solderability process is carried out to surface, weld zone, it is characterized in that: the (3) described laser setup parameter of step is:
Optical maser wavelength: 100 ~ 10700nm;
Spot diameter: 5 ~ 300 μm;
Power: 0.5 ~ 200W.
7., according to the method for while making soldering-resistant pattern according to claim 6, surface, weld zone being carried out to solderability process, it is characterized in that: infrared laser parameter and the Ultra-Violet Laser parameter of described laser are respectively:
Infrared laser parameter:
Ultra-Violet Laser parameter:
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| CN113950197A (en) * | 2021-09-07 | 2022-01-18 | 德中（天津）技术发展股份有限公司 | Circuit board manufacturing method for conducting on-off inspection in bare board manufacturing stage |
| CN113939103A (en) * | 2021-09-07 | 2022-01-14 | 德中（天津）技术发展股份有限公司 | Circuit board manufacturing method for conducting on-off test and manufacturing solder resist pattern in assembly stage |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291943A (en) * | 2011-06-14 | 2011-12-21 | 深南电路有限公司 | Method for manufacturing printed circuit board |
| CN102548191A (en) * | 2010-12-14 | 2012-07-04 | 欣兴电子股份有限公司 | Circuit board and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012042846A1 (en) * | 2010-09-27 | 2012-04-05 | 太陽ホールディングス株式会社 | Method for forming solder resist |
-
2012
- 2012-12-17 CN CN201210550409.1A patent/CN103052271B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102548191A (en) * | 2010-12-14 | 2012-07-04 | 欣兴电子股份有限公司 | Circuit board and manufacturing method thereof |
| CN102291943A (en) * | 2011-06-14 | 2011-12-21 | 深南电路有限公司 | Method for manufacturing printed circuit board |
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