CN113747673A

CN113747673A - Method for manufacturing circuit board by respectively processing electroplating hole, circuit mask and conductive pattern by laser

Info

Publication number: CN113747673A
Application number: CN202111001586.XA
Authority: CN
Inventors: 胡宏宇; 宋金月
Original assignee: Dct Tianjin Technology Development Co ltd
Current assignee: Dct Tianjin Technology Development Co ltd
Priority date: 2021-08-30
Filing date: 2021-08-30
Publication date: 2021-12-03

Abstract

The invention relates to a method for manufacturing a circuit board by respectively processing a plated hole, a circuit mask and a conductive pattern by laser, drilling a hole, depositing a thin metal layer on the hole and the board surface, pasting a non-photosensitive masking film, only electroplating a thickened conductive layer in the hole after removing a masking layer covering the hole wall by laser and exposing the hole wall, then manufacturing a circuit part anti-plating pattern and pattern electroplating by laser, and guiding the conductive pattern and the anti-welding pattern by laser; the invention can optimize and shorten the manufacturing process of the circuit board on the whole, improve the quality and the efficiency, reduce the cost and is environment-friendly. The non-photosensitive material is used as an anti-electroplating material, so that the cost is reduced; holes and lines are electroplated differently, and the thickness of the plating layer is easy to control; the plated hole pattern and the plated circuit pattern are manufactured step by using laser, and the conductive pattern is manufactured by using laser, so that the steps are few, and a finer conductive pattern can be manufactured. The invention is suitable for mass production of various circuit boards, and is also suitable for manufacturing circuit board samples and small-batch and various products.

Description

Method for manufacturing circuit board by respectively processing electroplating hole, circuit mask and conductive pattern by laser

Technical Field

The invention relates to a method for manufacturing a circuit board by respectively processing a plated hole, a circuit mask and a conductive pattern by laser, which is characterized in that the pattern of only the plated hole wall is manufactured by directly removing the mask material step by laser, the patterns of the hole wall and the circuit are plated at the same time, the hole wall and the circuit are plated differently, and then the conductive pattern and the solder resist pattern are manufactured by laser, and belongs to the technical field of circuit board manufacturing.

Background

The invention uses laser direct material removing technique to manufacture circuit board, which can electroplate hole wall and circuit, without pattern transfer process, to directly manufacture conductive pattern and resistance welding pattern.

The manufacturing process comprises the following steps: depositing an initial conductive layer on a manufactured product of a double-sided and multi-layer circuit board which is drilled, chemically plating or electroplating thin copper → pasting an anti-electroplating masking film → manufacturing a pattern of an electroplating hole wall, removing the anti-electroplating masking film layer on the hole area by laser, opening a hole for liquid medicine → electroplating, depositing a copper thickened hole wall on the hole wall → removing the anti-electroplating masking film layer on a circuit by laser, adding a circuit electroplating window on the hole electroplating window → electroplating, simultaneously depositing copper and other metals on the circuit and the hole wall → removing the anti-electroplating masking film of a non-circuit area and copper foil under the masking thereof by laser in one step or multiple steps, manufacturing a conductive pattern → whole board coating and curing a solder resist material in one step → removing an organic material on a welding area conductor by laser at an assembly site, manufacturing a solder resist pattern, and cleaning and solderability processing the surface of the welding area → adding solder to a connecting pad, and carrying out component mounting and inserting, and carrying out remelting welding and wave soldering.

The invention can be used for replacing various technologies of manufacturing hole metal printed circuit boards by a subtractive method, and the starting raw material is a material coated with a conductive metal foil, including various rigid copper clad laminates, flexible copper clad laminates or rigid-flex combined boards. The invention utilizes the laser processing technology and utilizes the same non-photosensitive material mask to respectively manufacture the pattern only plated on the hole wall and the pattern simultaneously plated on the hole wall and the circuit, can respectively control the copper thickness of the hole wall and the copper thickness of the circuit, can better meet the electrical requirements of electronic products on the circuit board, and is suitable for small-batch and multi-variety production of the circuit board and batch manufacturing of the circuit board.

Electronic products generally go through three stages of design, preparation and assembly from concept to finished product.

After the physical design is completed, material preparation is performed, including selection and customization of various components, connectors, display modules, and other functional modules. One of the most important materials is a bare circuit board, which is used to support components and play a role in electrical interconnection between pins of the components, and is a key factor affecting the quality and reliability of electronic products and the difficulty, cost, and speed of the whole manufacturing process, and must be customized according to design requirements and product attributes. A bare circuit board, referred to as a bare board for short, refers to a circuit board on which components have not been mounted, and is also referred to as a printed circuit board, a printed wiring board, a printed board, a circuit board, and a printed board. The bare board is typically custom-made as needed by a manufacturer who specializes in manufacturing printed circuit boards. Taking a multilayer circuit board as an example, the process flow of bare board manufacturing is roughly as follows: manufacturing an inner layer conductive pattern, blackening/browning and laminating, drilling holes on a multi-layer copper foil-coated insulating substrate, metallizing the holes, manufacturing an outer layer conductive pattern, removing a metal corrosion resistant film or an organic corrosion resistant film, coating a solder resist, manufacturing a solder resist pattern and generating a welding area, performing solderability coating treatment on the surface of the welding area, manufacturing a mark symbol, and delivering the product to a manufacturer in an assembly stage.

The electronic product is assembled, i.e. various materials are assembled, matched and combined together, and the fixation of the positions of the materials and the corresponding electrical connection and functional matching are realized by connecting means such as soldering, fastening, bonding and the like. In a narrow sense, the assembly process of mounting and soldering components to a circuit board is often referred to as assembly. The product after the components are assembled is generally called an assembly board. Where distinction is not required, the bare board and the assembled board are generally referred to as circuit boards.

The former assembly technique mainly uses through-hole insertion method, i.e. the pins of various components, connectors, functional modules, etc. are inserted into the mounting holes of bare board, then these pins, hole wall and soldering pad are soldered together by using soldering material so as to fix the components on the circuit board, and the electric interconnection between the pins of the components can be implemented by means of soldering pad, interconnection line and relay hole on the circuit board. At present, electronic products are more often assembled and connected by adopting a surface mounting technology, namely, a soldering paste is coated on a connecting disc, namely a bonding pad, of a circuit board, pins of various components, connectors, functional modules and the like are correspondingly placed on a soldering paste layer of the connecting disc, finally, the circuit board is heated, so that powdery or granular solid metal tin/tin alloy in the soldering paste is melted, the melted soldering flux infiltrates terminal electrodes/pins of the components and the bonding pad of the circuit board, the terminal electrodes of the components and the connecting disc are brazed together when the solid metal is cooled, the components are attached and fixed on the surface of the circuit board, and the electrical interconnection among the components is realized through a conductive channel formed by the bonding pad, a lead and a hole on the circuit board. The assembly of the circuit board is carried out by professional assembly factories or is completed by an electronic product development mechanism. Taking the SMT technology as an example, the assembly process flow of the circuit board is roughly: the method comprises the steps of printing solder paste on a soldering tray from a circuit board from a bare board manufacturing factory, picking up components and attaching the components to the surface of the circuit board, heating the components to enable the solder paste to reflow again to achieve soldering between pins and the soldering tray.

Considering the whole process of manufacturing bare board and assembling elements of circuit board, it can be seen that the key of manufacturing bare board is the processes of making conductive pattern, laminating, drilling and metallizing hole, making resistance welding pattern and coating weldability, and the processes of coating soldering paste, sticking and inserting elements and welding are the key processes of assembly production stage. Further analysis shows that the processes are essentially for the purposes of fixing the components and electrically interconnecting the components. Wherein the conductive pattern fabrication is concerned with the fineness and electrical performance of the circuit board circuitry; the manufacture of the solder resist pattern and the solderability coating are finished at a bare board stage but are the basis of production at an assembly stage; the drilling and hole metallization affects the connection density, mechanical performance, application environment, and matching degree of the plug-in components during installation and fixation of the circuit board, determines the electrical performance and reliability of the Z-direction interconnection between the horizontal conductive layers of the circuit board, and directly affects the difficulty of the manufacturing process of the horizontal electrical connection conductive patterns of the circuit board.

With the progress of social economy, the requirements on electronic products are higher and higher, elements are smaller and smaller, functions are stronger and stronger, the number of pins is more and more, the requirements on conductive patterns and solder resist patterns are finer and more accurate, the requirements on holes are smaller and deeper, and all process problems influence each other no matter in the manufacturing stage of a bare board or in the assembling stage of components, so that the technical difficulty of manufacturing the circuit board is higher and higher.

For example, in the current hole metallization process, in order to satisfy the requirement that the Z-direction electrical interconnection physical carrier reaches the lowest reliability and electrical requirements, that is, the hole wall conductive layer reaches the lowest thickness, metal copper must be deposited on the hole wall by using an electroplating technology, and the electroplating process needs a conductive channel. In the IPC-6012 standard, there are specific requirements on the wall thickness of the metallized hole, which is at least 20 μm. The current circuit board manufacturing process has limited deep plating capability, when the hole wall copper thickness reaches 20 microns, the copper thickness increased by the board surface exceeds the hole wall copper thickness, and after the added copper thickness is added with the original copper foil thickness of 18 microns, the total copper thickness exceeds 40 microns, even reaches 50 microns. However, the original copper foil technique of the board surface must be synchronously thickened by the electroplating thickening hole, the performance of the circuit board is not enhanced due to the consumption of copper resources, the difficulty of subsequent processing is not reduced, and on the contrary, the processing has negative effects on the performance and the processing of the circuit board in the following aspects:

first, the thickness of the conductive via is smaller than that of the conductive via on the board, which results in the electrical performance of the Z-direction conductive link being inconsistent with that of the X, Y planar conductive link. Secondly, the conductive layer produced in the hole wall electroplating process of the circuit board becomes the top layer of the conductive layer of the future conductive pattern, and is the main medium of electrical signal transmission with higher frequency under the action of skin effect, and the quality of the copper layer deposited by the electroplating technology in the production of the circuit board is slightly lower than that of the copper foil manufactured by the original electroforming or calendaring technology, the crystal is slightly rough, and the quality of the electrical and mechanical properties is slightly poor, so that the increase of the thickness of the conductive layer is not beneficial to high-speed and high-frequency signal transmission. Thirdly, the increase of the copper foil thickness and the resulting lateral etching are factors for the fineness of the conductive pattern, in the process of manufacturing the conductive pattern by using the chemical etching technology, the etching solution is contacted with the copper foil for etching, the etching is not only carried out towards the depth of the copper foil, but also carried out at two lateral sides of the lead due to the contact of the etching solution and two side surfaces of the lead, the thicker the copper layer to be etched is, the longer the time is, the more serious the lateral etching phenomenon is, the lateral etching not only reduces the width of the lead, but also can cause the disconnection in serious cases. Fourthly, the copper foil is thick and uneven, which is the bottleneck of wide application of the laser-induced electrical pattern technology, obviously, the thicker the copper foil is, the greater the required laser energy is, the more passes are required to be processed, and the slower the processing process is; the more uneven the thickness of the copper foil is, the more difficult the photoetching process is, or the phenomenon that the residual copper influences the insulation performance due to the fact that the laser power applied is too small in the area with larger thickness of the copper foil, the copper removal is not clean, or the phenomenon that the insulation material below the copper foil is ablated due to the fact that the laser power applied is too large in the area with smaller thickness of the copper foil, and the quality of a circuit board is influenced.

In the prior art, the manufacturing process of the conductive pattern has the problems that the traditional etching method has complex process, a corrosion-resistant mask needs to be manufactured by using a pattern transfer process, a photosensitive material needs to be used in the pattern transfer process, a mask plate for selective exposure needs to be manufactured firstly, the corrosion-resistant mask needs to be removed after the conductive pattern is manufactured by etching, and the phenomena of underetching, overetching, side etching and uneven etching which are caused by the etching often cause the quality control factors to be mutually lost, so that the problem is serious; the process of directly removing the anti-etching mask, the anti-electroplating mask and the solder mask which are made of the organic materials by the laser and the conductive pattern which is made of the conductive copper foil by the method of directly removing the conductive copper foil by the laser is simple, but the laser spot diameter is small, point-by-point line-by-line processing is needed, the speed is low, and the efficiency is low. In addition, in the processing of the conductive pattern by the method of directly removing the conductive copper foil by laser, the thickness of the copper foil layer on the substrate becomes thicker and more uneven after the hole is metalized, so that the laser energy is difficult to change correspondingly in real time, and the removal quality is difficult to ensure.

The problems of solder resist pattern making and solderability coating are that, as with the making of conductive patterns, the traditional technique for making solder resist patterns is a pattern transfer process, which requires the use of photosensitive materials, and also requires the first making of masking plates for selective exposure, with the baking and exposure effects interfering with each other, making quality control difficult, and frequent occurrence of defects such as pads on solder resists. However, the solderability coating by hot air leveling or electroless nickel gold technology has the defects of complex components and complex process, and brings the confusion that the reliability is influenced because the welding mechanism is unclear.

The inventor with the application number of CN201410190917.2 discloses a method for selectively plating conductive holes on a circuit board, which is suitable for a direct hole plating metallization process by a polymer conductive film method. The technical scheme is that the anti-electroplating material, the anti-polymer conductive film deposition material and the stripping material, namely the polyester film coated with the silicon rubber adhesive, are used for stripping the adhesive and masking all areas of the board surface, and the surface of the hole wall is exposed after drilling. Because the materials have the properties of resisting the pretreatment required by the deposition of the high-molecular conductive film and resisting the deposition of the high-molecular conductive film, in the subsequent direct electroplating process of the high-molecular conductive film, the high-molecular conductive film is only added on the hole wall, and during electroplating, an electroplating power supply provides current for the hole wall by using the copper foil on the board surface as a conductive linking channel, so that the electroplating processing of depositing copper on the hole wall is realized. The problem is that the hole metallization process of the direct electroplating by the polymer conductive film method needs to be carried out for 70 seconds by using a solution with the permanganate concentration of 100g/L or more at the temperature of 90 ℃, both strippable glue and an adhesive for adhering a polyester film can generate destructive oxidation, so that the bonding force between a masking material which has small adhesive force with a substrate and a copper-clad foil is reduced, the phenomena of bone separation, layering, seam formation and opening are generated, the masking plate surface effect is poor, and the problem of uneven thickness of the copper-clad plate surface can be aggravated by the actions of solution infiltration, overflow, soaking and the like after the hole wall is thickened by electroplating copper. In addition, the application range of the direct electroplating hole metallization process by the polymer conductive film method is limited, the process is not suitable for multilayer circuit boards, the factors such as quality and cost are comprehensively considered, and the difficult problems of metallization and hole wall electroplating only faced by the traditional chemical copper deposition hole metallization technology, the black hole direct electroplating hole metallization technology and the palladium film method direct electroplating hole metallization technology need to be solved. Because these techniques require acid, base or organic solvent treatment before hole metallization, it is clear that the above-mentioned solutions using peelable gel-like materials are not sufficiently robust and cannot be applied to the mainstream hole metallization techniques, and a more suitable material and method must be additionally sought.

In summary, it is understood that the current circuit board manufacturing technology includes a series of indirect processing, chemical treatment, and wet manufacturing processes. Each of these single-function processes has inherent technical limitations, and they are mutually constrained and result in each other, which is a fundamental reason for limiting higher quality, higher efficiency and more environmental friendliness, and not only needs to improve and update each single-function process, but also needs to be integrally optimized and upgraded.

Disclosure of Invention

Aiming at the defect that thickened holes and circuits cannot be electroplated respectively in the prior art, the invention develops a novel manufacturing method, and the technical scheme of the invention is as follows:

a method for manufacturing circuit board by respectively processing electroplating holes, circuit masks and conductive patterns by laser comprises drilling holes, depositing thin metal layers on the holes and the board surface, sticking a non-photosensitive masking film, removing the masking layer covering the hole walls by laser to expose the hole walls, electroplating thickened conductive layers in the holes, then making circuit part anti-plating patterns and pattern electroplating by laser, and making the anti-plating patterns and the solder-resisting patterns by laser; the method comprises the following steps:

(1) depositing an initial conductive layer on a manufactured product of the double-sided and multi-layer circuit board which is drilled, and electroplating copper to a thickness which can endure subsequent processes;

(2) pasting a non-photosensitive organic film on the board surface as an electroplating-resistant masking film;

(3) removing the masking material covering the hole wall area by using laser to prepare an anti-electroplating pattern, and removing the anti-electroplating masking film layer on the surface of the clamping point of the electroplating clamp by using laser to expose the copper surface of the area in contact with the electroplating clamp;

(4) electroplating, namely depositing copper on the hole wall to thicken the conductive layer to a required thickness;

(5) removing the anti-electroplating masking film layer on the pad area and the circuit area by using laser, and adding electroplating windows of the pad area and the circuit area on the hole electroplating window;

(6) electroplating while depositing copper on the via walls, pads and lines to the desired thickness for final inspection and adding other metals.

(7) Removing the electroplating-resistant masking film on the non-line area by using laser;

(8) removing the copper foil in the non-circuit area by laser to manufacture a conductive pattern;

(9) coating the whole board and curing the solder resist material at one time;

(10) removing the organic material on the electric conductor of the welding area by laser at an assembly site, manufacturing a solder resist pattern, and cleaning and performing weldability treatment on the surface of the welding area;

(11) adding solder to the connecting disc, carrying out component mounting and insertion, and carrying out remelting welding or wave soldering.

The non-photosensitive organic film in the step (2) is composed of a plurality of layers with different forms and components, wherein the layer in contact with the circuit board has viscosity and fluidity. The step (2) comprises depositing non-photosensitive organic film-forming substances on the plate surface and the hole wall by using the techniques of electrophoresis, vacuum coating, vapor deposition and the like; including the application of liquid photosensitive materials and dry photosensitive films using known techniques.

The step (9) comprises the step of attaching a dry photosensitive film and a dry non-photosensitive film under a certain pressure and temperature.

And the step (9) or (10) comprises removing the organic material on the electric conductor of the welding area by laser at the manufacturing site of the bare board, manufacturing a solder resist pattern, and cleaning the surface of the welding area.

The step (9) or (10) further comprises the step of continuing the circuit board manufacturing process at the bare board manufacturing site by applying the prior art and materials.

The invention relates to a method for manufacturing a circuit board by respectively processing a plating hole, a circuit mask and a conductive pattern by laser, which comprises the steps of sticking a non-photosensitive electroplating-resistant mask after electroless copper plating or thin copper plating, directly removing the pattern of the plating-only hole made of a mask material by laser and electroplating; then, directly removing the mask materials on the pad area and the circuit area by using laser, and simultaneously electroplating holes, pads and circuits; then, a conductive pattern and a solder resist pattern are manufactured by laser.

And (1) depositing an initial conducting layer on a manufactured product of the double-sided and multi-layer circuit board with the drilled holes, and electroplating copper until the thickness can endure the subsequent processes. The purpose of forming thin copper on the initial conductive layer is to increase the reliability of the process, and the thickness of the thin copper is as low as the reliability of the process, for example, 1 μm to 5 μm thin copper is electroplated after conventional electroless copper deposition or black hole formation by carbon film method.

And (2) pasting a non-photosensitive organic film on the board surface to be used as an anti-electroplating masking film. In the prior art, a photoinduced dry film is generally used as an electroplating-resistant mask, the photoinduced dry film is of a three-layer structure, a photosensitive adhesive coating is arranged between a carrier film and a protective film and consists of an adhesive, a photopolymerization monomer and the like, the pattern forming process is complex, and the steps of photoplotting, plate making, film pasting, exposure and development are required; moreover, the mask is expensive, has low strength and large thickness, generally more than 20 μm, limited resolution and poor masking effect. The masking film does not need to have light sensitivity, common pre-coated pressure-sensitive coating films and heat-sensitive coating films can meet the requirements, hot-press coating is carried out, patterns are directly removed by laser, and the process is simple; and the mask has high resolution, low price, high strength and good masking capability, can be removed step by step and can withstand a plurality of electroplating processes. For example, a thermo-sensitive PI, PVC, PC, PET, PP film with a thickness of 20 μm is hot-pressed as an anti-electroplating mask, and parylene can also be used as the anti-electroplating mask.

The electroplating-resistant masking film comprises a dry film made of a single-component, multi-component, composite thermosetting, photocurable, thermocompression-bondable, photosensitive and non-photosensitive material, and has a thickness greater than the total metal thickness thickened on the wiring and ranging from 2 μm to 1000 μm, and is preferably a thermocompression-bondable thermosetting dry film having solder-resisting properties, and preferably has a film thickness of 5 μm to 500 μm.

The non-photosensitive organic film in the step (2) is composed of a plurality of layers with different forms and components, wherein the layer in contact with the circuit board has viscosity and fluidity; the step (2) comprises depositing non-photosensitive organic film-forming substances on the plate surface and the hole wall by using the techniques of electrophoresis, vacuum coating, vapor deposition and the like; including the application of liquid photosensitive materials and dry photosensitive films using known techniques.

And (3) removing the masking material covering the hole wall area by using laser to prepare an anti-electroplating pattern, and removing the anti-electroplating masking film layer on the surface of the clamping point of the electroplating clamp by using laser to expose the copper surface of the area in contact with the electroplating clamp. And removing the anti-electroplating masking film layer on the hole area by laser to open a window for the liquid medicine to enter the hole. For example, using a pulsed IR laser with a wavelength of 1064nm, the inner diameter of the hole is used as an outer contour, and the masking film covered on the hole wall is removed by ring-cutting or photoetched point by point to expose the hole wall. In order to solve the problems that the total area is too small, the power lines are not uniform step by step, the current density is not easy to control and the like when the hole wall is electroplated, when a hole wall electroplating pattern is manufactured, a laser is used for removing a dead copper area without an electric function of a non-circuit part, or an area which is required to remove a conducting layer and does not have negative influence on a subsequent removing process, or an area which is not influenced by the copper thickness, or an anti-electroplating hole masking film on an area which is increased by the copper thickness and has positive influence on the function, the area of the conducting area is increased, the power lines are dispersed, and the pattern which is favorable for the balanced electroplating process of the plated hole wall is formed.

The laser-based hole wall plating pattern also includes a dead copper area without an electric function, which is removed from the non-wiring and spaced from the wiring by more than 30 μm, preferably by more than 50 μm, or an area where the conductive layer thereof needs to be removed and does not adversely affect the subsequent removal process, or an area where the copper thickness does not affect the function thereof, or an anti-plating mask film on an area where the copper thickness positively affects the function thereof is added, to form a balanced plating pattern favorable for plating the hole wall.

When the laser is used to remove the plating resist mask, the focused laser optical power density is set to a value greater than, e.g., greater than 1.2 times the minimum optical power density required to remove the material, but less than or close to the minimum optical power density required to remove the underlying metal copper layer.

And (4) electroplating, namely depositing copper on the hole wall to thicken the conductive layer to a required thickness. The control point in this step is the plating time. At the moment, the whole area except the hole wall and the electroplating balance block on the plate surface is covered by a mask which is an insulating material and is not coated with copper in deposition on the surface although contacting with the electroplating liquid, so that only the hole wall and the balance block can deposit copper in the electroplating process, the electroplating time is enough, a copper deposition layer with enough thickness can be obtained on the hole wall, and the purpose of selectively controlling the copper thickness of the hole wall is achieved.

And (5) removing the anti-electroplating masking film layer on the pad area and the circuit area by using laser, and adding electroplating windows of the pad area and the circuit area on the hole electroplating window

And (6) electroplating, and simultaneously depositing copper on the hole wall, the bonding pad and the circuit to the required thickness for final inspection and adding other metals. The method comprises electroplating copper, then electroplating solderability protection metal such as tin, nickel, gold, etc., wherein the control point of the process is electroplating time. In the existing circuit board manufacturing technology, a photo-induced dry film is generally adopted as an electroplating-resistant mask, the material is mostly ultraviolet-cured, and the thickness of a formed masking pattern is in a certain range and can not be too thin or too thick. Because the material is crosslinked and polymerized to form a mask after hot-pressing film pasting and ultraviolet exposure, and the mask can be decomposed relatively easily by a film removing chemical solution, the mask formed by the technology is only an imperfect sub-solid to some extent. The film is too thick, the resolution ratio is low, the required exposure amount is large, and the phenomenon of overexposure of a thin layer close to a light source and underexposure of a thin layer far away from the light source can occur; an inherently weak sub-solid material, if too thin, would not achieve the mechanical strength needed for masking, resulting in bleeding.

The invention uses laser to directly remove and manufacture the masking pattern, can use non-photosensitive materials, the materials are completely polymerized solids, and have enough masking capability no matter the materials are thin and thick, and the materials can not fall off or dissolve even if the electroplating time is longer. For circuit boards requiring a thick copper trace, a thicker material may be selected in step (2), for example, a mask having a thickness of 300 μm is selected, and after the mask material on the surface of the trace is removed by laser, the electroplating time is controlled until the plating thickness of the metal or metals approaches or reaches 300 μm.

And (5) and (6) are used for simultaneously electroplating metal copper on the circuit and the hole wall for thickening, and electroplating nickel, gold or tin and other metals as a solderability protective layer, and when the thickness of the copper foil on the copper-clad plate can meet the requirement of electrical design on the thickness of the circuit copper, the step (5) and the step (6) can be skipped, and the step (7) is directly carried out.

Step (7) removing the electroplating-resistant masking film on the non-circuit area by using laser; when the ratio of the perimeter of the area to be removed to the diameter of the focused laser beam is smaller, preferably smaller than 10, the focused laser beam is used for removing the anti-electroplating masking film on the surface of the substrate and the conductive metal copper below the masking film by adopting a point-by-point line-by-line photoetching method; when the ratio of the perimeter of the area to be removed to the diameter of the focused laser beam is larger, preferably larger than 15, the focused laser beam is used for removing the masking film on the surface of the substrate and the conductive metal copper below the masking film along the inner side of the envelope of the area to be removed in a point-by-point photoetching mode by taking the envelope as a boundary until a closed heat insulation channel is formed around the part, which is not removed, of the area, and then the laser beam which is lower than the minimum optical power density required for removing the metal copper and has a larger diameter is used for heating the area, which is not removed, so that the electroplating-resistant masking film on the area and the conductive metal copper below the area are separated from the surface of the substrate and removed at the same time.

When the anti-electroplating masking film on the non-circuit area is removed by laser, the optical power density of the used focused laser is kept to be more than the minimum power density required by removing the organic material, preferably more than 1.2 times of the minimum optical power density required by removing the organic material and lower than or close to the minimum optical power density required by removing the metal layer covered under the focused laser, and the diameter of the focused laser beam is changed according to the shape and the size of the removed area so as to reduce or remove the overlapping of the laser processing area and improve the processing efficiency. The laser can also be used for removing the electroplating-resistant masking film on the non-circuit area by using the laser with the same wavelength and pulse width and the laser with different wavelength and pulse width, and the laser can be completed under the parameters of different spot diameters, different focal depths, different optical power densities and the like.

And (8) removing the copper foil in the non-circuit area by using laser to manufacture the conductive pattern. Because the present invention is capable of selectively plating holes, the technique of removing the conductive material of the non-wiring region with a laser is easier to implement. In the current common circuit board manufacturing technology, after the hole metallization electroplating process, due to the limitation of the plating uniformity of the hole metallization system, the deposition speed of copper is different in different areas on the same substrate material, so that the thickness of the total conductive layer is greatly different. Thus, when the laser is used for removing the conductive layer of the non-circuit part, if the laser parameters do not change along with the copper thickness, the copper removal is not clean at the part with large total copper thickness, the residual copper affects the insulation performance, or the energy applied to the part with small total copper thickness is too large, and the insulation material is ablated.

By implementing the technical scheme of the selective electroplating holes and the conductive patterns, copper can not be deposited in a non-line area, particularly on a laser photoetching removal path, the conductive layer under the laser photoetching path is kept to be the original copper foil, the thickness is uniform, and the laser processing difficulty is reduced. The invention adopts Striping and Stripping method/Striping and Striping of German and Chinese technology, firstly uses laser light etching to vaporize conductive material point by point and layer by layer to form a closed separation line, subdivides a conductive layer area to be removed into small pieces with mutually heat-insulated areas in a certain range, which is called Striping/Striping; the die is then heated with a laser to reduce the bonding force between the die and the substrate and release the die from the substrate, known as lift-off/striping.

The laser striping and stripping technology is implemented, the electroplating-resistant masking film in the non-line area is not necessarily removed, for example, the masking film and the copper foil layer below the masking film can be vaporized by laser light etching when the ultraviolet band laser processing is used or picosecond laser is used for striping until the insulating substrate layer stops to form a heat insulation channel; in the peeling, the masking film and the copper foil layer thereunder are heated together, and the masking film and the copper foil layer are peeled off in bulk by thermal deformation and reduction of the bonding force with the insulating base material. To be suitable for laser processing, the anti-plating masking film may be selected to be colored to produce better absorption.

When the copper foil on the non-circuit area is removed by laser, the optical power density of the used focused laser is kept to be more than the minimum optical power density required by removing the conductive metal copper layer and less than 3 times of the minimum optical power density required by removing the conductive metal copper layer, and the diameter of the focused laser beam is changed according to the shape and the size of the removed area so as to reduce or remove the lap joint of the laser processing area and improve the processing efficiency. The laser can be used for removing the copper foil on the non-circuit area by using the laser with the same wavelength and pulse width and the laser with different wavelengths and pulse widths under the parameters of different spot diameters, different focal depths, different optical power densities and the like.

And (9) coating the whole board and curing the solder resist material at one time.

In the prior art, liquid photosensitive ink is generally adopted as a solder resist, the solder resist contains an adhesive and a photopolymerization monomer, the pattern forming process is very complicated, and multiple processes such as coating, pre-baking, exposure, development, curing and the like are required; moreover, the cost is high, the resolution ratio is not high, and the coating quality between the fine pitch connecting discs is difficult to guarantee. The solder resist of the invention does not need to have light sensitivity, can meet the requirements of common precoating pressure-sensitive coating films and heat-sensitive coating films, has low price and high resolution, and can be used for manufacturing fine pattern structures. In addition, the invention adopts hot-pressing coating, does not need an additional curing process, leaves the solder resist pattern to be manufactured by laser on site before the component is assembled, and has simple flow. For example, thermo-sensitive PI, PVC, PC, PET, PP films with the thickness of 20 μm-200 μm are hot-pressed to be used as solder resists, and parylene can be used as solder resists.

And the step (9) comprises the steps of removing the organic material on the electric conductor of the welding area by laser at the manufacturing site of the bare board, manufacturing a solder resist pattern, and cleaning the surface of the welding area. It also includes continuing the circuit board manufacturing process at the bare board manufacturing site using existing techniques and materials.

Step (10), removing the organic material on the electric conductor of the welding area by laser on an assembly site, manufacturing a solder resist pattern, and cleaning and performing weldability treatment on the surface of the welding area; this step can be completed in one step in the same equipment, or can be performed in two steps on different equipment, that is, the first step: making a solder resist pattern, and generating a welding area: removing the solder resist coating on the welding area by selective photoetching with laser to prepare a solder resist pattern and generate the welding area; and secondly, cleaning and performing solderability treatment on the surface of the welding area, removing residual solder resist on the surface of the welding area by using another laser, slightly photoetching the surface layer of the metal of the welding area, removing metal oxide, exposing a fresh metal surface, and generating solderability which is easily infiltrated by molten solder.

The step (10) comprises removing the organic material on the conductor of the welding area by laser at the manufacturing place of the bare board, manufacturing a solder resist pattern, and cleaning the surface of the welding area. It also includes continuing the circuit board manufacturing process at the bare board manufacturing site using existing techniques and materials.

And (11) adding solder to the connecting disc, carrying out component mounting and inserting, and carrying out remelting welding and wave soldering. In the method, because the weldable coating layer of the welding area is replaced by the fresh copper surface treated by laser, after the step (10) is finished, the step (11) is carried out in the shortest time possible to avoid the surface oxidation of the connecting disc, and under the condition of excellent weldability after laser treatment, the component assembly is finished, including component insertion, and the welding of the component is finished by directly applying the welding flux to the welding area treated by the laser; or directly printing solder paste on the laser-processed welding area in a missing mode, and then carrying out component mounting and reflow soldering; or component assembly according to other techniques.

The invention can optimize and shorten the manufacturing process of the circuit board on the whole, improve the quality and the efficiency, reduce the cost and is environment-friendly. The non-photosensitive material is used as an anti-electroplating material, so that the cost is reduced; holes and lines are electroplated differently, and the thickness of the plating layer is easy to control; the plated hole pattern and the plated circuit pattern are manufactured step by using laser, and the conductive pattern is manufactured by using laser, so that the steps are few, and a finer conductive pattern can be manufactured. The invention is suitable for mass production of various circuit boards, and is also suitable for manufacturing circuit board samples and small-batch and various products.

The invention has the advantages and effects that:

1. the invention can selectively electroplate holes and circuits, the thickness of the plating layer is easy to control, especially only thicker holes can be electroplated, the problem that the thickness of the plating layer on the hole wall is thinner can be solved, and the problem that the thickness of the plating layer on the hole wall is not consistent with the thickness of the copper plating on the circuits can be solved.

2. The invention uses the laser direct removal method to manufacture the electroplated hole wall and the electroplated circuit pattern, can use the non-photosensitive material as the anti-electroplating material, reduces the cost, has good electroplating resistance, and can manufacture thicker hole wall conductive layer and circuit conductive layer.

3. The invention realizes only electroplating holes and circuits, the thickness of the conductive layer of the non-circuit part is not increased, the invention is suitable for directly removing the copper foil of the non-circuit part by using laser to manufacture the conductive pattern, the anti-electroplating material does not need to be removed, the steps are less, and the finer conductive pattern can be manufactured.

4. In the laser pattern manufacturing process, the diameter of the focused laser beam is changed according to the shape and the size of the removed area, so that the diameter of the focused laser beam or the multiple of the diameter of the focused laser beam is exactly equal to the width of the area to be removed, the overlapping of laser processing areas can be reduced or removed, and the processing efficiency is improved.

5. When the conductive pattern is manufactured by laser, the anti-electroplating mask is removed at the same time, a special film removing process is not needed, and the steps are few.

6. The invention uses the film pre-coated with the heat-sensitive and pressure-sensitive solder-resisting materials as the solder resist, and uses the lasers with different wavelengths, pulse widths and power densities to manufacture the solder-resisting pattern and carry out welding area cleaning and solderability treatment, thereby having higher efficiency and better treatment effect.

Drawings

FIG. 1: example 1 process flow diagram;

FIG. 2: example 2 process flow diagram;

wherein: 1. insulating substrate 2, copper clad laminate layer 3, starting conductive layer 4, electroplated thin copper 5, electroplating-resistant masking film 6, hole electroplated layer 7, hole wall, electroplated copper layer on pad and line 8 hole wall, other metal layer on pad and line 9, solder-resisting material layer 10, cleaned and solderability treated surface 11, solder 11, component

In the attached drawings, each letter of A \ B \ C \ D \ E \ F \ G \ H corresponds to each step and is a partially enlarged schematic diagram.

Detailed Description

The invention will be further described with reference to the following examples. The following examples are illustrative and not intended to be limiting, and are not intended to limit the scope of the invention.

Example 1

The common copper clad laminate in the electronic industry is used as a base material for manufacturing a circuit board, and comprises an insulating substrate 1 and a copper clad laminate 2.

In this embodiment, a double-sided printed circuit board is taken as an example, and the specific processing steps are as follows:

(1) the circuit board substrate copper-clad plate comprises an insulating substrate 1 and a copper-clad plate layer 2, the copper-clad plate finishes drilling, an initial conducting layer 3 is deposited on a manufactured product of the double-sided circuit board which finishes drilling, and the electroplating copper can endure subsequent procedures to the thickness, so that the electroplating thin copper 4 is formed.

The purpose of forming thin copper on the initial conductive layer is to increase the reliability of the process, and the thickness of the copper is only required to reach the lower limit for ensuring the reliability of the process.

And depositing chemical copper on the double-sided board with the drilled holes and electroplating copper. Specifically, brushing the double-sided board after drilling the hole, removing burrs at the hole opening, and cleaning the board surface at the same time. Then, normally depositing copper and electroplating, wherein the electroplating parameters are as follows: 10ASF 30min, the plating thickness is about 5 um.

(2) A non-photosensitive organic film is applied to the plate surface as an anti-plating mask film 5. In the prior art, a photoinduced dry film is generally used as an electroplating-resistant mask, the photoinduced dry film is of a three-layer structure, a photosensitive adhesive coating is arranged between a carrier film and a protective film and consists of an adhesive, a photopolymerization monomer and the like, the pattern forming process is complex, and the steps of photoplotting, plate making, film pasting, exposure and development are required; moreover, the mask is expensive, has low strength and large thickness, generally more than 20 μm, limited resolution and poor masking effect. The masking film does not need to have light sensitivity, common pre-coated pressure-sensitive coating films and heat-sensitive coating films can meet the requirements, hot-press coating is carried out, patterns are directly removed by laser, and the process is simple; and the mask has high resolution, low price, high strength and good masking capability, can be removed step by step and can withstand a plurality of electroplating processes. For example, a thermo-sensitive PI, PVC, PC, PET, PP film with a thickness of 20 μm is hot-pressed as an anti-electroplating mask, and parylene can also be used as the anti-electroplating mask.

Specifically, the double sides plated with thin copper are brushed, and the surfaces of the double sides are roughened and cleaned, so that the bonding force between the copper surface and the high polymer film to be attached is enhanced. Then have the high polymer film BOPET of anti-electroplating performance through sticking film machine hot pressing laminating on two-sided copper-clad plate, film thickness 10um, laminating parameter: pressure 10kg/cm²The temperature is 90 ℃ and the speed is 0.1 m/min.

(3) And removing the masking material covering the hole wall area by using laser to prepare an anti-electroplating pattern, and removing the anti-electroplating masking film layer on the surface of the clamping point of the electroplating clamp by using laser to expose the copper surface of the area in contact with the electroplating clamp. And removing the anti-electroplating masking film layer on the hole area by using laser to open a window for the liquid medicine to enter the hole.

In order to solve the problems that the electroplating area is too small, the power lines are not uniform step by step, the current density is not easy to control and the like when the hole wall is electroplated, when a hole wall electroplating pattern is manufactured, a laser is used for removing a dead copper area without an electric function of a non-circuit part, the area of a conductive area is increased, and the power lines are dispersed.

Specifically, in this embodiment, a 20W ultraviolet nanosecond laser machine is used to remove the BOPET film on the hole wall area, the clamping point of the electroplating fixture, and the electroplating balance block, the circuit board is placed on the laser equipment adsorption table, engineering data of laser processing is imported, the circuit board is accurately aligned with the processing data, and the BOPET film is removed by laser photoetching. And after the top surface is processed, turning over the circuit board, and removing the film on the bottom surface of the copper-clad plate by the same method. The processing parameters are as follows:

power/W	frequency/kHz	Pulse width/ns	Processing speed/mm/s	Number of working operations
					5	150	20	800	1

(4) Electroplating, depositing copper on the hole wall to thicken the conductive layer to a required thickness, and forming a hole electroplating layer 6. The control point in this step is the plating time. At the moment, the whole area except the hole wall and the electroplating balance block on the plate surface is covered by a mask which is an insulating material and is not coated with copper in deposition on the surface although contacting with the electroplating liquid, so that only the hole wall and the balance block can deposit copper in the electroplating process, the electroplating time is enough, a copper deposition layer with enough thickness can be obtained on the hole wall, and the purpose of selectively controlling the copper thickness of the hole wall is achieved.

Specifically, because the electroplating area is smaller, the step adopts a small current density to carry out electroplating, and the electroplating parameters are as follows: 10ASF 50min, the plating thickness is about 15 um. .

(5) And removing the anti-electroplating masking film layer on the pad area and the circuit area by using laser, and adding electroplating windows of the pad area and the circuit area on the hole electroplating window.

Specifically, the processing method and the processing parameters are the same as those in the step (3).

(6) And electroplating, and simultaneously depositing copper on the hole wall, the bonding pad and the circuit to the thickness required by final inspection and adding other metals to form an electroplated copper layer 7 on the hole wall, the bonding pad and the circuit and other metal layers 8 on the hole wall, the bonding pad and the circuit.

The method comprises electroplating copper, then electroplating solderability protection metal such as tin, nickel, gold, etc., wherein the control point of the process is electroplating time. In the existing circuit board manufacturing technology, a photo-induced dry film is generally adopted as an electroplating-resistant mask, the material is mostly ultraviolet-cured, and the thickness of a formed masking pattern is in a certain range and can not be too thin or too thick. Because the material is crosslinked and polymerized to form a mask after hot-pressing film pasting and ultraviolet exposure, and the mask can be decomposed relatively easily by a film removing chemical solution, the mask formed by the technology is only an imperfect sub-solid to some extent. The film is too thick, the resolution ratio is low, the required exposure amount is large, and the phenomenon of overexposure of a thin layer close to a light source and underexposure of a thin layer far away from the light source can occur; an inherently weak sub-solid material, if too thin, would not achieve the mechanical strength needed for masking, resulting in bleeding.

Specifically, the method comprises electroplating copper metal and then electroplating nickel and gold. The parameters of the electro-coppering are as follows: 12ASF 60min, the coating thickness is about 20 um.

After further electroplating copper, soft gold is electroplated on the hole wall, the bonding pad and the circuit to serve as a weldable metal protection layer. Parameters of soft gold electroplating: 0.3ASD 10min, the plating thickness is about 2 um.

(7) And removing the BOPET electroplating-resistant masking film on the non-circuit area by using laser. Specifically, the processing method and the processing parameters are the same as those in the step (3).

(8) And removing the copper foil in the non-circuit area by using laser to manufacture the conductive pattern. Because the present invention is capable of selectively plating holes, the technique of removing the conductive material of the non-wiring region with a laser is easier to implement. In the current common circuit board manufacturing technology, after the hole metallization electroplating process, due to the limitation of the plating uniformity of the hole metallization system, the deposition speed of copper is different in different areas on the same substrate material, so that the thickness of the total conductive layer is greatly different. Thus, when the laser is used for removing the conductive layer of the non-circuit part, if the laser parameters do not change along with the copper thickness, the copper removal is not clean at the part with large total copper thickness, the residual copper affects the insulation performance, or the energy applied to the part with small total copper thickness is too large, and the insulation material is ablated.

Specifically, in this embodiment, a 20W infrared nanosecond laser is used to remove the copper foil on the non-wiring region to fabricate the conductive pattern. The conducting layer in the laser removing area is the original copper foil, the thickness is uniform, and the laser processing difficulty is greatly reduced. The processing parameters are as follows:

phases	power/W	frequency/kHz	Pulse width/ns	Processing speed/mm/s	Number of working operations	Remarks for note
							Enveloping insulation	15	200	100	800	1	Focusing
Slitting and slicing	15	200	100	800	1	Focusing
							Heat peeling off	30	200	100	900	1	Out of focus

(9) The solder resist material is coated and cured all at once to form a solder resist material layer 9. In the prior art, liquid photosensitive ink is generally adopted as a solder resist, the solder resist contains an adhesive and a photopolymerization monomer, the pattern forming process is very complicated, and multiple processes such as coating, pre-baking, exposure, development, curing and the like are required; moreover, the cost is high, the resolution ratio is not high, and the coating quality between the fine pitch connecting discs is difficult to guarantee. The solder resist of the invention does not need to have light sensitivity, can meet the requirements of common precoating pressure-sensitive coating films and heat-sensitive coating films, has low price and high resolution, and can be used for manufacturing fine pattern structures. In addition, the invention adopts hot-pressing coating, does not need an additional curing process, leaves the solder resist pattern to be manufactured by laser on site before the component is assembled, and has simple flow. For example, thermo-sensitive PI, PVC, PC, PET, PP films with the thickness of 20 μm-200 μm are hot-pressed to be used as solder resists, and parylene can be used as solder resists.

Specifically, a screen printing mode is used for printing KSM-386 thermosetting ink of Suzhou Guangxin photosensitive new material Co., Ltd on a double-sided board, and the printing is completely cured at one time under the curing conditions: 150 ℃ for 30min, and the thickness of the solder resist ink is about 20 um.

(10) Removing the organic material on the conductor of the welding area by laser at the assembling site to manufacture a solder resist pattern, and cleaning and performing solderability treatment on the surface of the welding area to form a cleaned and solderability-treated surface 10; this step can be completed in one step in the same equipment, or can be performed in two steps on different equipment, that is, the first step: making a solder resist pattern, and generating a welding area: removing the solder resist coating on the welding area by selective photoetching with laser to prepare a solder resist pattern and generate the welding area; and secondly, cleaning and performing solderability treatment on the surface of the welding area, removing residual solder resist on the surface of the welding area by using another laser, slightly photoetching the surface layer of the metal of the welding area, removing metal oxide, exposing a fresh metal surface, and generating solderability which is easily infiltrated by molten solder.

Specifically, in this embodiment, a 20W infrared nanosecond laser is first used to remove solder resist ink in a welding area, a circuit board is placed on a laser device adsorption table, engineering data of laser processing is imported, the circuit board is aligned with processing data accurately, and the solder resist ink is removed by laser light etching. And after the top surface is processed, turning over the circuit board, and removing the ink on the bottom surface of the copper-clad plate by the same method. The processing parameters are as follows:

power/W	frequency/kHz	Pulse width/ns	Processing speed/mm/s	Number of working operations
					6	200	100	1000	1

Then, cleaning and weldability treatment are carried out on a welding area by using an ultraviolet picosecond laser with smaller single pulse energy, and the processing parameters are as follows:

power/W	frequency/kHz	Pulse width/ps	Processing speed/mm/s	Number of working operations
					10	1000	12	2000	1

(11) Solder 11 is added to the lands, and components 12 are mounted and inserted, and reflow soldering and wave soldering are performed. In the method, because the weldable coating layer of the welding area is replaced by the fresh copper surface treated by laser, after the step (10) is finished, the step (11) is carried out in the shortest time possible to avoid the surface oxidation of the connecting disc, and under the condition of excellent weldability after laser treatment, the component assembly is finished, including component insertion, and the welding of the component is finished by directly applying the welding flux to the welding area treated by the laser; or directly printing solder paste on the laser-processed welding area in a missing mode, and then carrying out component mounting and reflow soldering; or component assembly according to other techniques.

Example 2

In this embodiment, taking a four-layer circuit board with completed inner-layer circuit as an example, the specific processing steps are as follows:

(1) the circuit board base material copper-clad plate comprises an insulating base plate 1 and a copper-clad plate layer 2, the copper-clad plate completes drilling, chemical copper is deposited on the four layers of circuit boards which complete drilling and complete inner layer circuit manufacturing, an initial conducting layer 3 is formed, and electroplating copper is carried out to form electroplating thin copper 4;

specifically, the circuit board after drilling is brushed to remove burrs in an orifice and clean the board surface. Then, carrying out copper deposition electroplating after removing the glue residues, wherein the electroplating parameters are as follows: 10ASF 35min, the plating thickness is about 5 um.

(2) A non-photosensitive polymer film is applied to the plate surface as an anti-plating mask film 5.

Specifically, the four-layer circuit board of the thin copper of electroplating is dried after being brushed, and then the high polymer film BOPP of the hot-pressing joint anti-electroplating, the film thickness is 10um, the joint parameters are as follows: pressure 15kg/cm²The temperature was 100 ℃ and the speed was 0.1 m/min.

(3) And removing the masking material covering the hole wall area by using laser to prepare an anti-electroplating pattern, and removing the anti-electroplating masking film layer on the surface of the clamping point of the electroplating clamp by using laser to expose the copper surface of the area in contact with the electroplating clamp.

Specifically, in this embodiment, a 20W ultraviolet nanosecond laser machine is used to remove the BOPP film on the hole wall area, the clamping point of the electroplating fixture, and the electroplating balance block, the circuit board is placed on the laser equipment adsorption table, engineering data of laser processing is imported, the circuit board is accurately aligned with the processing data, and the BOPP film is removed by laser photoetching. After the top surface is processed, the circuit board is turned over, and the bottom surface film is removed in the same way. The processing parameters are as follows:

power/W	frequency/kHz	Pulse width/ns	Processing speed/mm/s	Number of working operations
					6	200	20	600	1

(4) And (4) exposing and electroplating, depositing copper on the hole wall to thicken the conductive layer to the thickness required by final inspection, and forming a hole electroplating layer 6.

The control point in this step is the plating time. At the moment, the whole area except the hole wall and the electroplating balance block on the plate surface is covered by a mask which is an insulating material and is not coated with copper in deposition on the surface although contacting with the electroplating liquid, so that only the hole wall and the balance block can deposit copper in the electroplating process, the electroplating time is enough, a copper deposition layer with enough thickness can be obtained on the hole wall, and the purpose of selectively controlling the copper thickness of the hole wall is achieved.

Because the electroplating area is smaller, the step adopts small current density to carry out electroplating, and the electroplating parameters are as follows: 10ASF 55min, the plating thickness is about 15 um.

The method comprises electroplating copper and then electroplating nickel and gold. The parameters of the electro-coppering are as follows: 12ASF 70min, and the thickness of the plating layer is about 20 um.

After the copper electroplating is finished, soft gold is electroplated on the hole wall, the bonding pad and the circuit to serve as a weldable metal protection layer. Parameters of soft gold electroplating: 0.3ASD 15min, the plating thickness is about 2 um.

(7) And removing the electroplating-resistant masking film on the non-line area by using laser.

Specifically, the BOPP anti-electroplating masking film on the four-layer circuit board is completely removed by laser, and the removing method and parameters are the same as those in the step (3).

(8) The copper foil on the non-wiring area is removed by laser to produce a conductive pattern.

(9) The solder resist material is coated and cured all at once to form a solder resist material layer 9.

In the embodiment, a PI film is pressed on a four-layer circuit board as a solder resist. Specifically, before the PI film is laminated, all the residual electroplating-resistant masking films on the surface of the circuit board are removed by laser, the removing method and the removing parameters are the same as those in the step (3), then the laminated circuit board and the PI film are laminated by using a laminating machine, the PI film is a Kapton HN film produced by DuPont, the thickness of the PI film is 25 micrometers, and a silicone rubber pad is used as a hot-pressing gasket during lamination. The RPP masking film needs to be completely removed by a laser before lamination. The thermocompression bonding stage and parameters are as follows, depending on the material properties:

serial number	Pressing pressure (N/cm2)	Pressing temperature (. degree.C.)	Pressing time (minutes)
				Stage 1	24	80	15
Stage 2	94	140	25
				Stage 3	188	180	25
Stage 4	188	220	60
				Stage 5	188→0	220 → room temperature	45

(10) Removing the organic material on the conductor of the welding area by laser at the assembling site to manufacture a solder resist pattern, and cleaning and performing solderability treatment on the surface of the welding area to form a cleaned and solderability-treated surface 10;

this step can be completed in one step in the same equipment, or can be performed in two steps on different equipment, that is, the first step: making a solder resist pattern, and generating a welding area: removing the solder resist coating on the welding area by selective photoetching with laser to prepare a solder resist pattern and generate the welding area; and secondly, cleaning and performing solderability treatment on the surface of the welding area, removing residual solder resist on the surface of the welding area by using another laser, slightly photoetching the surface layer of the metal of the welding area, removing metal oxide, exposing a fresh metal surface, and generating solderability which is easily infiltrated by molten solder.

Specifically, in this embodiment, a 20W ultraviolet nanosecond laser machine is used to fabricate the solder resist pattern, the circuit board is placed on a laser device adsorption table, engineering data of laser processing is imported, the circuit board and the processing data are accurately aligned, and the laser photoetching PI forms the solder resist pattern. And after the top surface is processed, the circuit board is turned over, and the bottom surface solder resist pattern is manufactured by the same method. The processing parameters are as follows:

And cleaning and performing weldability treatment on the welding area by adopting ultraviolet picosecond laser, wherein the processing parameters are as follows:

(11) Adding solder 11 to the land, mounting and inserting the component 12, and performing reflow soldering or wave soldering

While the methods and techniques of the present invention have been described in terms of preferred embodiments, it will be apparent to those of ordinary skill in the art that variations and/or modifications of the methods and techniques described herein may be made without departing from the spirit and scope of the invention. It is expressly intended that all such similar substitutes and modifications apparent to those skilled in the art are deemed to be within the spirit, scope and content of the invention.

Claims

1. A method for manufacturing a circuit board by respectively processing a plating hole, a circuit mask and a conductive pattern by laser is characterized in that: drilling holes, depositing thin metal layers on the holes and the board surface, sticking a non-photosensitive masking film, only electroplating a thickened conductive layer in the holes after removing the masking layer covering the hole walls by laser and exposing the hole walls, then making a circuit part anti-plating pattern and pattern electroplating by laser, and conducting the pattern and the anti-welding pattern by laser; the method comprises the following steps:

(9) coating the whole board and curing the solder resist material at one time;

2. The method as claimed in claim 1, wherein the non-photosensitive organic film of step (2) is composed of a plurality of layers having different forms and compositions, wherein the layer contacting the circuit board has viscosity and fluidity.

3. The method of claim 1, wherein step (2) comprises depositing a non-photosensitive organic film-forming material on the surface and walls of the holes by electrophoresis, vacuum deposition, vapor deposition, or the like; including the application of liquid photosensitive materials and dry photosensitive films using known techniques.

4. The method as claimed in claim 1, wherein the step (9) comprises attaching the photosensitive film in a dry state and the non-photosensitive film in a dry state under a pressure and a temperature.

5. The method of claim 1, wherein step (9) or (10) comprises removing the organic material on the conductor of the pad by laser, forming a solder resist pattern, and cleaning the surface of the pad at the site of manufacturing the bare board.

6. A method according to claim 1 or 4, characterized in that step (9) or (10) comprises continuing the circuit-board manufacturing process at the bare-board manufacturing site, applying existing techniques and materials.