CN103037670B - A kind of for printed circuit board heat radiation process - Google Patents
A kind of for printed circuit board heat radiation process Download PDFInfo
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- CN103037670B CN103037670B CN201210521281.6A CN201210521281A CN103037670B CN 103037670 B CN103037670 B CN 103037670B CN 201210521281 A CN201210521281 A CN 201210521281A CN 103037670 B CN103037670 B CN 103037670B
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Abstract
The present invention's one is used for printed circuit board heat radiation process and belongs to electronic technology class, is applied to avionics field.The present invention is by a special bonding device bonding cold drawing on a printed circuit board, components and parts " are lain prone " on cold drawing, relies on printed circuit plate substrate, printed circuit intralamellar part and surface metal electric conducting material, adhesive film material between printed circuit board and cold drawing and cold drawing to dispel the heat.Cold drawing is by the welding position perforate of printed circuit board component on aluminum alloy plate materials, and forms through hard anodizing surface treatment; Between printed circuit board and cold drawing, adhesives is the two-sided glued membrane of polyimides; Adhering device is convex, the recessed thick steel form with certain bow degree, completes smoothing function while printed circuit board can be made bonding with cold drawing.The present invention realizes cold drawing, the bonding processing with smoothing of printed circuit board once completes, the heat distributed after solving components and parts energising can not be discharged in time and cause properties of product deterioration problem, increase printed circuit board machinery intensity, antiseptic property, insulation property, the aliquation suppressing printed circuit board to produce when high temperature wave soldering, distortion.
Description
Technical field
The invention belongs to printed circuit board technology field, be specifically related to the process of a kind of printed circuit board heat radiation.
Background technology
Along with the high speed development of electronic technology, on a large scale, the extensive use of very lagre scale integrated circuit (VLSIC) device, electronic equipment develops to compactization, corresponding printing electroplax loads the density of components and parts along with raising, after the printed circuit board energising of erecting and welding electronic devices and components, on printed circuit board, electronic devices and components just become the thermal source of heating, the heat distributed can make the temperature of electronic product rise, when exceeding the serviceability temperature that element allows, the characteristic of components and parts will change, and causes the reduction of the penalty of product, reliability, the lost of life.Components and parts high temperature failure problem is more and more outstanding on a printed circuit board, has a strong impact on product and uses.
At present, mainly contain 3 kinds of methods for printed circuit board heat radiation, 1. during printed circuit board line design, increase heat radiation lines and plated-through hole in non-wiring area; 2. at printed circuit board component locations, the heat radiation of radiator fan, radiator or casing is installed; 3. select Metal Substrate copper clad plate material, as aluminium base, copper base, iron substrate, this printed circuit board makes metal blank as base material at wiring board skin, namely heating panel.Employing mode 1 has certain radiating effect, but be difficult to realize on highly dense printed circuit board, there is certain limitation in employing mode 2 provided with fan or radiator on the printed circuit board to original limited space, an a lot of difficult problem is there is in employing mode 3 in production technology, as more difficult in profile milling, and in follow-up plating, in etching and processing, Metal Substrate surface is easily corroded, Metal Substrate orifice edge burr and pickup be difficult to remove clean and cause high pressure resistant test time on fire, electric leakage, puncture, special in wave soldering, during reflow soldering, Metal Substrate sheet material is different from the linear expansion coefficient of printed circuit plate substrate makes the buckling deformation of plate face, cause device rosin joint, sealing-off, have a strong impact on properties of product.Therefore, above there is defect in various degree and deficiency in several printed circuit board radiating mode.
Summary of the invention
Goal of the invention: the object of this invention is to provide a kind of process for printed circuit board heat radiation, when solving printed circuit board energising, the heat that electronic devices and components distribute can be discharged in time, do not affect the assembling of printed circuit board component, solve rosin joint, sealing-off problem that the buckling deformation of printed circuit board high-temperature soldering causes, solve printed circuit board intensity low, not resistance to problem of colliding with.
Technical scheme: a kind of for printed circuit board heat radiation process, the method takes following steps:
1) cold drawing parts avoiding structure figure is designed, through painting data processing to printed circuit board light, components and parts pin positions in export, relevant position sets the perforate of cold drawing structure to cold drawing parts avoiding structure figure, components and parts pin and printed circuit board can be welded by the perforate of cold drawing structure;
2) prepare 2A12 ?T4 blank, the two-sided glued membrane of polyimides, the backing plate of digital control processing, the cutter that thickness is 1.5mm, on Digit Control Machine Tool, process cold drawing constitutional detail, the two-sided glued membrane part of polyimides according to cold drawing parts avoiding structure figure;
3) hard anodizing surface treatment is carried out to cold drawing constitutional detail, make cold drawing constitutional detail increase on the surface a layer thickness be 40um ~ 60um oxide-film formed cold drawing;
4) cold drawing, the two-sided glued membrane part of polyimides, printed circuit board are carried out pre-glued at 120 DEG C ~ 130 DEG C temperature, check contraposition quality, adjustment contraposition size;
5) adhering device, torque spanner, disengaging film, screw is prepared, adhering device is made up of convex, the recessed thick steel form that bow degree is 0.3% ~ 0.4%, length is 200mm ~ 250mm, width is 130mm ~ 180mm, thickness is 20mm ~ 25mm, convex, recessed thick steel form length, width dimensions, bow degree are all identical, on recessed thick steel form, there are four screws at 10mm place, distance adjacent both sides, on convex thick steel form, there are four screwed holes at 10mm place, distance adjacent both sides, screw and screwed hole dimensional fits;
The cold drawing that pre-bonding is connected, the two-sided glued membrane part of polyimides, printed circuit board are positioned among adhering device, wherein cold drawing is towards notch board face, the square being applied 16NM ~ 18NM by torque spanner is turned round, screw is fixedly connected with convex, recessed thick steel form with screw by screwed hole, the time of carrying out is 40min ~ 60min, hot pressing temperature is after 150 DEG C ~ 160 DEG C bonding, naturally be down to room temperature, take out cold drawing printed circuit board.
Beneficial effect of the present invention: in the present invention, cold drawing is heat sink body, cold drawing be by aluminum alloy plate materials by the welding position perforate of printed circuit board component, and form through hard anodizing surface treatment, aluminum alloy plate materials has excellent specific heat load, the heat that components and parts distribute can be discharged in time, aluminium alloy plate through overall hard anodizing has high insulating properties, resistance to wear, corrosion resistance, significantly can increase the antiseptic property of printed circuit board, insulation property and mechanical strength.The present invention adopts special bonding device to realize bond processing, because this device has specific bow degree, can solve the buckling deformation problem that printed circuit board and cold drawing coefficient of linear expansion do not coexist when being hot bonding, achieve bonding while complete smoothing.Adhesives of the present invention is the two-sided glued membrane of polyimides, this film material has the characteristic of high heat-resisting, high tensile, high extensibility, can suppress when high-temperature soldering, the aliquation of cold drawing and the different generation of printed circuit board plate linear expansion coefficient, buckling deformation, prevent components and parts rosin joint, sealing-off phenomenon from occurring.
Embodiment
Principle of the present invention is by a special bonding device bonding cold drawing on a printed circuit board, components and parts " are lain prone " on cold drawing, relies on printed circuit plate substrate, printed circuit intralamellar part and surface metal electric conducting material, adhesive film material between printed circuit board and cold drawing and cold drawing to dispel the heat.Cold drawing is by the welding position perforate of printed circuit board component on aluminum alloy plate materials, and forms through hard anodizing surface treatment; Between printed circuit board and cold drawing, adhesives is the two-sided glued membrane of polyimides; Adhering device is convex, the recessed thick steel form with certain bow degree, completes smoothing function while printed circuit board can be made bonding with cold drawing.
Specific embodiment one
A kind of for printed circuit board heat radiation process, the method takes following steps:
1) cold drawing parts avoiding structure figure is designed, through CAM350 software, data processing is painted to printed circuit board light, components and parts pin positions in export, through application software ger ?pcb conversion process form the pcb file of PROTEL form, on cold drawing parts avoiding structure figure, relevant position sets the perforate of cold drawing structure with PROTEL software, components and parts pin and printed circuit board can be welded by the perforate of cold drawing structure, on cold drawing, bore size is depending on components and parts feature, circular hole is opened after the pin perforate of direct plugging member strengthens 1.8mm on pad size basis, relevant position, surface mounting component perforate carries out opening square hole for after the outside monolateral expansion 2.2mm of the maximum profile of this device, certain product F A20H ?0201 ?01 power supply printed circuit board overall dimension length be 120mm, width is 78mm, cold drawing parts avoiding structure figure overall dimension is identical with printed circuit board overall dimension, all like this holes of dodging form avoiding structure figure together with overall dimension.
2) prepare 2A12 ?T4 blank, the two-sided glued membrane of polyimides, the backing plate of digital control processing, the cutter that thickness is 1.5mm, on Digit Control Machine Tool, process cold drawing constitutional detail, the two-sided glued membrane part of polyimides according to cold drawing parts avoiding structure figure;
3) hard anodizing surface treatment is carried out to cold drawing constitutional detail, make cold drawing constitutional detail increase on the surface a layer thickness be 40um ~ 60um oxide-film formed cold drawing;
4) cold drawing, the two-sided glued membrane part of polyimides, printed circuit board are carried out pre-glued at 130 DEG C of temperature, check contraposition quality, adjustment contraposition size;
5) adhering device, torque spanner, disengaging film, screw is prepared, adhering device is made up of convex, the recessed thick steel form that bow degree is 0.4%, length is 220mm, width is 140mm, thickness is 22.5mm, convex, recessed thick steel form length, width dimensions, bow degree are all identical, on recessed thick steel form, there are four φ 6.1mm screws at 10mm place, distance adjacent both sides, on convex thick steel form, there are four M6mm screwed holes at 10mm place, distance adjacent both sides, screw and screwed hole dimensional fits;
The cold drawing that pre-bonding is connected, the two-sided glued membrane part of polyimides, printed circuit board are positioned among adhering device, wherein cold drawing is towards notch board face, the square being applied 17.5NM by torque spanner is turned round, screw is fixedly connected with convex, recessed thick steel form with screw by screwed hole, the time of carrying out is 50min, hot pressing temperature is after 158 DEG C bonding, naturally be down to room temperature, take out cold drawing printed circuit board.
Specific embodiment two
A kind of for printed circuit board heat radiation process, the method takes following steps:
1) cold drawing parts avoiding structure figure is designed, through CAM350 software, data processing is painted to printed circuit board light, components and parts pin positions in export, through application software ger ?pcb conversion process form the pcb file of PROTEL form, on cold drawing parts avoiding structure figure, relevant position sets the perforate of cold drawing structure with PROTEL software, components and parts pin and printed circuit board can be welded by the perforate of cold drawing structure, on cold drawing, bore size is depending on components and parts feature, circular hole is opened after the pin perforate of direct plugging member strengthens 1.5mm on pad size basis, relevant position, surface mounting component perforate carries out opening square hole for after the outside monolateral expansion 2mm of the maximum profile of this device, certain product F A30D ?0401 ?01 signal printed circuit board overall dimension length be 160mm, width is 93mm, cold drawing parts avoiding structure figure overall dimension length is 176mm, width is 97mm, all like this holes of dodging form avoiding structure figure together with overall dimension.
2) prepare 2A12 ?T4 blank, the two-sided glued membrane of polyimides, the backing plate of digital control processing, the cutter that thickness is 1.5mm, on Digit Control Machine Tool, process cold drawing constitutional detail, the two-sided glued membrane part of polyimides according to cold drawing parts avoiding structure figure;
3) hard anodizing surface treatment is carried out to cold drawing constitutional detail, make cold drawing constitutional detail increase on the surface a layer thickness be 40um ~ 60um oxide-film formed cold drawing;
4) cold drawing, the two-sided glued membrane part of polyimides, printed circuit board are carried out pre-glued at 130 DEG C of temperature, check contraposition quality, adjustment contraposition size;
5) adhering device, torque spanner, disengaging film, screw is prepared, adhering device is made up of convex, the recessed thick steel form that bow degree is 0.3%, length is 250mm, width is 180mm, thickness is 24.5mm, convex, recessed thick steel form length, width dimensions, bow degree are all identical, on recessed thick steel form, there are four φ 6.1mm screws at 10mm place, distance adjacent both sides, on convex thick steel form, there are four M6mm screwed holes at 10mm place, distance adjacent both sides, screw and screwed hole dimensional fits;
The cold drawing that pre-bonding is connected, the two-sided glued membrane part of polyimides, printed circuit board are positioned among adhering device, wherein cold drawing is towards notch board face, the square being applied 17NM by torque spanner is turned round, screw is fixedly connected with convex, recessed thick steel form with screw by screwed hole, the time of carrying out is 60min, hot pressing temperature is after 156 DEG C bonding, naturally be down to room temperature, take out cold drawing printed circuit board.
Claims (1)
1., for a printed circuit board heat radiation process, it is characterized in that, the method takes following steps:
1) cold drawing parts avoiding structure figure is designed, through painting data processing to printed circuit board light, components and parts pin positions in export, relevant position sets the perforate of cold drawing structure to cold drawing parts avoiding structure figure, components and parts pin and printed circuit board can be welded by the perforate of cold drawing structure;
2) prepare 2A12 ?T4 blank, the two-sided glued membrane of polyimides, the backing plate of digital control processing, the cutter that thickness is 1.5mm, on Digit Control Machine Tool, process cold drawing constitutional detail, the two-sided glued membrane part of polyimides according to cold drawing parts avoiding structure figure;
3) hard anodizing surface treatment is carried out to cold drawing constitutional detail, make cold drawing constitutional detail increase on the surface a layer thickness be 40um ~ 60um oxide-film formed cold drawing;
4) cold drawing, the two-sided glued membrane part of polyimides, printed circuit board are carried out pre-glued at 120 DEG C ~ 130 DEG C temperature, check contraposition quality, adjustment contraposition size;
5) adhering device, torque spanner, disengaging film, screw is prepared, adhering device is made up of convex, the recessed thick steel form that bow degree is 0.3% ~ 0.4%, length is 200mm ~ 250mm, width is 130mm ~ 180mm, thickness is 20mm ~ 25mm, convex, recessed thick steel form length, width dimensions, bow degree are all identical, on recessed thick steel form, there are four screws at 10mm place, distance adjacent both sides, on convex thick steel form, there are four screwed holes at 10mm place, distance adjacent both sides, screw and screwed hole dimensional fits;
The cold drawing that pre-bonding is connected, the two-sided glued membrane part of polyimides, printed circuit board are positioned among adhering device, wherein cold drawing is towards notch board face, the square being applied 16NM ~ 18NM by torque spanner is turned round, screw is fixedly connected with convex, recessed thick steel form with screw by screwed hole, the time of carrying out is 40min ~ 60min, hot pressing temperature is after 150 DEG C ~ 160 DEG C bonding, naturally be down to room temperature, take out cold drawing printed circuit board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210521281.6A CN103037670B (en) | 2012-12-07 | 2012-12-07 | A kind of for printed circuit board heat radiation process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210521281.6A CN103037670B (en) | 2012-12-07 | 2012-12-07 | A kind of for printed circuit board heat radiation process |
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| CN103037670A CN103037670A (en) | 2013-04-10 |
| CN103037670B true CN103037670B (en) | 2015-08-05 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103474357A (en) * | 2013-09-16 | 2013-12-25 | 无锡市同步电子科技有限公司 | Technology for manufacturing plane radiator |
| CN105228332B (en) * | 2014-06-09 | 2018-07-13 | 潮州市通恒科技有限公司 | A kind of integrated circuit of radiating insulating |
| CN105722337A (en) * | 2014-12-01 | 2016-06-29 | 中国航空工业集团公司第六三一研究所 | Method for installing and reinforcing high-density mixed printed circuit assembly containing BGA device |
| CN107546201A (en) * | 2017-06-08 | 2018-01-05 | 中国科学院理化技术研究所 | A kind of radiator of resistance to high-temperature corrosion of liquid metal |
| CN108170918B (en) * | 2017-12-20 | 2021-03-05 | 上海望友信息科技有限公司 | Cold plate audit methods, systems, computer readable storage media and apparatus |
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| JPH05175654A (en) * | 1991-12-26 | 1993-07-13 | Yokohama Rubber Co Ltd:The | Surface treating method for printed wiring board |
| TWI264259B (en) * | 2004-09-16 | 2006-10-11 | Gold Circuit Electronics Ltd | Multiple-layer flexible printed circuit board process and apparatus thereof |
| CN200994224Y (en) * | 2006-12-15 | 2007-12-19 | 连伸科技股份有限公司 | Printed circuit board medium structure |
| CN201479462U (en) * | 2009-05-11 | 2010-05-19 | 成都航天通信设备有限责任公司 | Cooling plate printing plate |
| CN102223767A (en) * | 2011-06-01 | 2011-10-19 | 何忠亮 | Production process for high heat-conduction circuit board |
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