CN103474357A - Technology for manufacturing plane radiator - Google Patents
Technology for manufacturing plane radiator Download PDFInfo
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- CN103474357A CN103474357A CN2013104212777A CN201310421277A CN103474357A CN 103474357 A CN103474357 A CN 103474357A CN 2013104212777 A CN2013104212777 A CN 2013104212777A CN 201310421277 A CN201310421277 A CN 201310421277A CN 103474357 A CN103474357 A CN 103474357A
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Abstract
The invention discloses a technology for manufacturing a plane radiator. The plane radiating design is performed according to the fully-developed technical specification of the plane radiator design, design parameters are supported by a theory, therefore, the designed plane radiator is more reasonable in structure, and the design efficiency is improved. The practical radiating performance of the plane radiator is verified through the thermal analysis simulation method, the anti-vibration performance of the plane radiator is verified in a simulation mode through structure finite elements, the design is guided reversely according to the verification result, optimization of the radiating performance and the anti-vibration performance is achieved, and reliability of electronic products is improved. Any manner of glue bonding or adhesive film bonding is selected to achieve full attachment of the plane radiator and a printed board, and the technology ensures the good heat transmission performance of the plane radiator and also ensures stability of mechanical strength.
Description
Technical field
The present invention relates to printed board heat dissipation technology field, relate in particular to a kind of planar heat spreader manufacturing process.
Background technology
Since silicon integrated circuit comes out, the integrated level of circuit has increased several magnitudes, and the heat that each chip produces accordingly also increases considerably, and planar heat spreader is that cold drawing just arises at the historic moment, and it is mainly used in being bonded in printed board and dispels the heat.Cold drawing is commonly called as heating panel or heat-conducting plate, according to structure, mainly is divided into thin board type, integral type, split type etc.Conventional planar radiator manufacturing process exists following not enough: one, the industry inner radiator is more numerous and diverse, before processing, does not have a set of complete design specification to guide the heat radiation of printed board.Two, the radiator in industry, after design completes, does not have the compliance test result in later stage substantially, some problems perhaps in design, occur, cause heat radiation or anti-seismic performance undesirable, and this situation is not found, so since, the reliability of electronic product will reduce greatly.Three, industry inner radiator great majority are used screw lock, but, in heat transfer process, because printed board and radiator can not be fitted fully, in the middle of causing, a lot of air are arranged, and the thermal conductivity of air are lower, cause product to dispel the heat undesirable.
Summary of the invention
The object of the invention is to, by a kind of planar heat spreader manufacturing process, solve the problem that above background technology is partly mentioned.
For reaching this purpose, the present invention by the following technical solutions:
A kind of planar heat spreader manufacturing process, it comprises the steps:
A, according to user's request, according to the predetermined design standard, complete planar heat spreader design;
B, by thermoanalytical emulation mode, verify the actual heat dispersion of described planar heat spreader, verify described planar heat spreader anti-seismic performance by structure finite element imitation, if meet design requirement, perform step C, otherwise the planar heat spreader relevant design is modified, until meet design requirement;
C, sawing sheet: choose the required aluminium sheet material of described planar heat spreader, by plate shearing machine, whole aluminium sheet is cut into to the size that needs processing;
D, execution planar heat spreader wire cutting technology; The concrete technology flow process is as follows: first plate smoothing, and location, some hole, the line cutting, clean, polishing, check;
E, according to customer requirements, select the respective anode mode to carry out the surface anodization processing to planar heat spreader;
F, select glue is bonding or glued membrane is bonding either type to carry out the laminating of planar heat spreader and printed board.
Especially, carry out the planar heat spreader wire cutting technology in described step D, specifically comprise:
First plate smoothing: one side the line cutting smoothing of carrying out of first block of plate is processed;
Location, some hole: holed with drill bit according to the design data of planar heat spreader structure;
Line cutting: according to the design data of planar heat spreader structure, utilize the cutting on line machine to be cut, be no more than 15 blocks of plates at every turn;
Clean: with gasoline, the half-finished product plate cut is cleaned;
Counterbore: if the planar heat spreader of design has the pore-forming processing request, carry out counterbore processing;
Polishing: with file and sand paper to the reprocessing of being polished of the planar heat spreader of well cutting;
Check: ready-made planar heat spreader and light are painted to egative film and compare.
Especially, described step e middle-jiao yang, function of the spleen and stomach polarization mode comprises hard anodized, black anodizing, true qualities electric conductive oxidation and golden yellow electric conductive oxidation.
Especially, described step e specifically comprises: select the hard anodized mode to carry out the surface anodization processing to planar heat spreader;
Especially, in described step F, the bonding technological process of glued membrane specifically comprises:
Carve film: at first, use scissors to cut the film of correspondingly-sized, long and wide size is than the large 2-3 centimetre of planar heat spreader size; Secondly, use carving machine that film is carved, and checked with corresponding egative film;
Cold bonding: with syringe, acetone is expelled to the surface of film and planar heat spreader, makes it bonding, bondingly again it is bonded in corresponding printed board after complete, the whole plank that forms;
Location: plank cold bonding completed with alignment pin positions;
Hot sticky: the plank completed with vulcanizer pressing cold bonding;
Reprocessing: cooling plank tool using is carried out to reprocessing;
Check: the plank of finishing dealing with is checked according to predetermined check.
Especially, described cold bonding specifically comprises: clean planar heat spreader with aviation gasoline, dry the rear surface of film and planar heat spreader that acetone is expelled to syringe, make it bonding, bondingly it is bonded in corresponding printed board after complete again.
Especially, described hot stickyly specifically comprise: plank is placed in the insulating box of 125 degrees centigrade to preheating 5 minutes, the plank completed with vulcanizer pressing cold bonding, push down and make it naturally cooling with iron block after pressing completes.
Planar heat spreader manufacturing process provided by the invention has following advantage: one, according to user's request, carry out the planar heat spreader design according to sound planar heat spreader designing technique standard, design parameter has theoretical the support, makes the planar heat spreader structure of design more reasonable, has improved design efficiency.Two, by thermoanalytical emulation mode, set up and comprise printed board model, heat-conducting glue model, planar heat spreader model, chip model etc. one by one, and the environmental condition of moving by artificial actual is carried out heat analysis, calculate the temperature of planar heat spreader before and after playing a role, the heat radiation energy of checking planar heat spreader reality, verify described planar heat spreader anti-seismic performance by structure finite element imitation, and according to the result, reverse design, accomplish heat radiation and anti-seismic performance optimization, improved the reliability of electronic product.Three, select glue either type bonding or that glued membrane is bonding to realize the abundant laminating of planar heat spreader and printed board, this technique can guarantee the heat transfer performance that planar heat spreader is good, has guaranteed again the stability of mechanical strength.The present invention is by the distribution design of planar heat spreader structure, and the relatively existing performance of the heat dispersion of planar heat spreader has improved more than 20%, the heat that makes planar heat spreader can leave fast in printed board and produce, thus guarantee the radiating effect of planar heat spreader.
The accompanying drawing explanation
The planar heat spreader manufacturing process flow diagram that Fig. 1 provides for the embodiment of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.Be understandable that, specific embodiment described herein is only for explaining the present invention, but not limitation of the invention.It also should be noted that, for convenience of description, only show part related to the present invention in accompanying drawing but not full content.
Please refer to shown in Fig. 1, the present embodiment midplane radiator manufacturing process specifically comprises the steps:
Step S101, according to user's request, according to the predetermined design standard, complete planar heat spreader design.
Step S102, by thermoanalytical emulation mode, verify the actual heat dispersion of described planar heat spreader, verify described planar heat spreader anti-seismic performance by structure finite element imitation, if meet design requirement, perform step S103, otherwise the planar heat spreader relevant design is modified, until meet design requirement;
By thermoanalytical emulation mode, set up and comprise printed board model, heat-conducting glue model, planar heat spreader model, chip model etc. one by one, and the environmental condition of moving by artificial actual, carry out heat analysis, calculate the temperature of planar heat spreader before and after playing a role, can verify the heat radiation energy of planar heat spreader reality.It should be noted that, because the printed board model is multilayer materials, the material that not only will consider substrate when setting up model forms, also to consider the copper rate of covering wherein, comprise the factors such as via hole, pad, simultaneously the planar heat spreader surface adopt hard anodized after material property can change, before emulation, need just can carry out emulation after the every actual hot property of method test material by experiment, can promote simulation nicety like this.By the described planar heat spreader anti-seismic performance of structure finite element imitation technical identification, if do not meet designing requirement, the structure of planar heat spreader is carried out to corresponding modify, until meet shockproof requirements.
Step S103, sawing sheet: choose the required aluminium sheet material of described planar heat spreader, by plate shearing machine, whole aluminium sheet is cut into to the size that needs processing, attention need be put surplus.After each sawing sheet, need provide the aluminium sheet batch number.
The selection of planar heat spreader will be determined according to the concrete application of planar heat spreader, and for example, while being supplied for several military project units of group of Air China, its material of selecting must meet " GJB_2053-1994 Aero-Space aluminium alloy sheet standard " standard.
Step S104, execution planar heat spreader wire cutting technology: this technique idiographic flow is as follows: first plate smoothing, location, some hole, line cutting, cleaning, polishing, check.
In the present embodiment, described execution planar heat spreader wire cutting technology specifically comprises:
First plate smoothing: one side the line cutting smoothing of carrying out of first block of plate is processed;
Location, some hole: holed with 1 millimeter drill bit according to the design data (coordinate data) of planar heat spreader structure.
Line cutting: according to the design data of planar heat spreader structure, utilize the cutting on line machine to be cut, be no more than 15 blocks of plates at every turn.
Clean: with gasoline, the half-finished product plate cut is cleaned.
Counterbore: if the planar heat spreader of design has the pore-forming processing request, carry out counterbore processing.
Polishing: with file and sand paper to the reprocessing of being polished of the planar heat spreader of well cutting.
Check: ready-made planar heat spreader and light are painted to egative film and compare.
Step S105, according to customer requirements, select corresponding anodization mode to carry out the surface anodization processing to planar heat spreader.The processing mode of surface anodization has many kinds, specifically selects which kind of mode to be specified by the user according to actual conditions.
The most frequently used anodization mode comprises hard anodized, black anodizing, true qualities electric conductive oxidation and golden yellow electric conductive oxidation.In the present embodiment, select the hard anodized mode to carry out the surface anodization processing to planar heat spreader.Wherein, the technological process of hard anodized is as follows: ungrease treatment, and processing is washed in erosion, pickling, polishing, oxidation, washing, sealing of hole is processed.
Step S106, select glue is bonding or glued membrane is bonding either type to carry out the laminating of planar heat spreader and printed board.
Glue is bonding: adopt special customization glue to carry out bonding, most of units are used this kind of bonding way.The present embodiment selects the bonding mode of glue to carry out the laminating of planar heat spreader and printed board.The bonding technological process idiographic flow of glue is as follows: neck material: by the requirement of planar heat spreader manufacture order, get heating panel, printed board and egative film or drawing.Check: 1, the planar heat spreader surface should be without obviously scratching, damage and be anodizing to the phenomenon come off; 2, printed board should be without obviously warpage, metaboly, and surface should be without scratching, welding resistance comes off and the defect such as pad damage; 3, on drawing, to the bonding plane sign, should know without doubt.Smoothing: the planar heat spreader that warpage is arranged is carried out to manual smoothing.Clean: use silk or cotton to be stained with the bonding plane of examination absolute ethyl alcohol wiping printed board and heating panel, guarantee that the bonding plane of printed board and heating panel is clean clean, and at room temperature place 10-15 minute, dry surface.Impregnation: carry out impregnation according to glue specification blend gravity, a general impregnation total amount is 5 grams.
Glued membrane is bonding: adopt special glued membrane to carry out the bonding of printed board and planar heat spreader by cold bonding and hot sticky operation, minority unit is used this kind of bonding way.The bonding technological process of glued membrane specifically comprises: carve film: at first, use scissors to cut the film of correspondingly-sized, long and wide size is than the large 2-3 centimetre of planar heat spreader size; Secondly, use carving machine that film is carved, and checked with corresponding egative film.Cold bonding: clean planar heat spreader with aviation gasoline, dry the rear surface of film and planar heat spreader that acetone is expelled to syringe, make it bonding, bondingly again it is bonded in corresponding printed board after complete, the whole plank that forms.Location: plank cold bonding completed with alignment pin positions.Hot sticky: plank is placed in the insulating box of 125 degrees centigrade to preheating 5 minutes, the plank completed with vulcanizer pressing cold bonding, push down and make it naturally cooling with iron block after pressing completes.Reprocessing: cooling plank is used the instruments such as cutter, toothpick carry out reprocessing.Check: the plank of finishing dealing with is checked according to predetermined check.
Below will the core item of predetermined design standard in step S101 be explained the main points briefly:
1, the design rule of planar heat spreader.
1.1, the client proposes that the planar heat spreader design requirement is arranged, and just should consider planar heat spreader factor (the device discharge neatly, has been stayed planar heat spreader bar passage) when PCB layout, avoids the planar heat spreader bar too narrow as far as possible, guarantees good connectedness.
1.2, wiring the time avoids in planar heat spreader bar lower surface cabling, punching.
1.3, the PGA device of specific (special) requirements is arranged, printed board pad top layer arranges φ 1.2mm, planar heat spreader punching φ 2.2mm, do Double-side rounding and process.
1.4, for special circumstances, while as two printed boards, sharing a planar heat spreader, need be first by two printed boards stacks, planar heat spreader is avoided both common districts (cabling, via hole, milling district, direct inserting device pad etc.).
2, planar heat spreader design principle.
2.11, confirm whether the client provides the planar heat spreader structure chart, and according to structure chart design plane radiator.
2.12, planar heat spreader is mainly for installing hole, direct inserting device, surface mounting component does not need to do planar heat spreader.
2.13, planar heat spreader adopts linear cutting apart as far as possible, increases the effective area of planar heat spreader as far as possible.All linear graphs of cutting apart must be closed figures, and can not be overlapping (do not report an error in closed figure district not during out-of-plane radiator data, but report an error in the closed figure district); Can not there is not closed figure (if any severed thread end).
2.14, design rectangle and the trapezoidal cutting zone combined more, strengthen the connectedness of planar heat spreader.
2.15, the planar heat spreader width can not be too narrow, 614 require width >=2mm, other unit >=1mm.
2.16, the printed board of power panel, can take local or whole plate punching design, follow the minimized principle of boring aperture.
2.17, as far as possible reduce punching quantity, except the printed board installing hole, other more approaching aperture is as far as possible unified.
2.18, while cutting apart, noting can not be by a device, a part of undercutting planar heat spreader, a part is not cut apart.Some power tube devices particularly, otherwise during the welding device, can cause device not firm.
2.19, the wiring of planar heat spreader and place aspect, via hole, Surface Mount dish, direct inserting device pad edge be to planar heat spreader bar edge minimum range >=0.8mm.
2.110, need amplify processing for the via hole in the planar heat spreader zone, device dish.Via hole: put and be twice; The dish of device dish :≤1.5mm is amplified to 3.5mm, and 1.5-2.0mm is amplified to 4mm, and 2.0-2.5mm is amplified to 5mm; 2.5-3mm be amplified to 6mm, the Mark point is amplified to 2mm.(having special circumstances uncertain or dully, quality group that inquiries are welcome)
2.111, do not appoint the great dish of diameter, do not adopt without exception circular cutting, and adopt the mode of punching.
2.112, the hole attribute unification in planar heat spreader be set to non-metallic so that engineering department's out-of-plane radiator data.
2.113, in the size of installing hole and printed board (PCB) data, size is installed in planar heat spreader and is consistent, if amplify without amplifying the 0.1mm. customer requirement, because amplifying in planar heat spreader.
2.114, planar heat spreader and printed board be while adopting film sticky, needing increases by four location holes (non-metallic hole), is arranged in four jiaos of planar heat spreaders (as far as possible accomplishing location hole centre-to-centre spacing planar heat spreader outer rim >=5mm).Location hole diameter 3mm, planar heat spreader and printed board same position are all wanted perforate.In printed board centered by location hole in diameter 5mm Wei Jinbu district (in the Jin Bu district, all floor have not allowed figure).Planar heat spreader location hole and planar heat spreader outward flange distance >=1mm.
2.2, the check of planar heat spreader design.
2.21, for guaranteeing the correctness of planar heat spreader design, after the design engineer completes the PCB layout, design planar heat spreader, first planar heat spreader is issued to quality inspection teacher and is checked.
2.22, quality inspection teacher is recorded in audit report " the synchronous printed board design verification in Wuxi specification sheet ", the design engineer modifies according to the problem recorded in list, needs again to issue quality inspection teacher after having revised and checks, until entirely true.
2.23, planar heat spreader errorless after, the PCB data can be connected up.The layout personnel, according to the bonding method of planar heat spreader and printed board, instruct the wiring personnel to note which problem in wiring process simultaneously.Specifically can be referring to above.
2.3, the confirmation of planar heat spreader design.
2.31, after planar heat spreader designed, the relevant design data must be issued to the client, through the client, confirm after errorless to be produced.As the client proofreads rear wrongly, need change according to customer requirement, then issue client's check and correction, until errorless.
2.32, as the client after having confirmed planar heat spreader, find that the PCB layout is unreasonable, need layout regulation.The motionless planar heat spreader of trying one's best during layout regulation, as need change planar heat spreader, first delete old planar heat spreader file, then the planar heat spreader file that again makes new advances, and new planar heat spreader file is issued to client's check and correction.
2.33, planar heat spreader design is conventional with the PCB design, carries out simultaneously, so PCB confirms to comprise the planar heat spreader design and confirms, specifically confirms that mode is referring to " PCB designs and develops control program ".
2.4, planar heat spreader docking.
2.41, newly design if, in file, except the related data of PCB and list, also should comprise: XXX-COL, XXX-DP, " planar heat spreader work sheet ".Draw the egative film file and can participate in " Protel98 and Cadence out-of-plane radiator data ".
2.42, change plate if, when the DP file is arranged in raw sheet, in file except related data and the needs list " planar heat spreader work sheet " of PCB; If there is no the DP file in raw sheet, the designer should go out DP again, then together with " planar heat spreader work sheet ", puts the file of PCB into.
2.5, check and correction and the audit of planar heat spreader.The inspection of planar heat spreader is carried out with reference to the requirement of " planar heat spreader inspection standard ".
Technical scheme of the present invention has following advantage: one, according to user's request, carry out the planar heat spreader design according to sound planar heat spreader designing technique standard, design parameter has theoretical the support, makes the planar heat spreader structure of design more reasonable, has improved design efficiency.Two, by thermoanalytical emulation mode, set up and comprise printed board model, heat-conducting glue model, planar heat spreader model, chip model etc. one by one, and the environmental condition of moving by artificial actual is carried out heat analysis, calculate the temperature of planar heat spreader before and after playing a role, the heat radiation energy of checking planar heat spreader reality, and according to the result, reverse design, accomplish the optimization of dispelling the heat, improved the reliability of electronic product.Three, select glue either type bonding or that glued membrane is bonding to realize the abundant laminating of planar heat spreader and printed board, this technique can guarantee the heat transfer performance that planar heat spreader is good, has guaranteed again the stability of mechanical strength.The present invention is by the distribution design of planar heat spreader structure, and the relatively existing performance of the heat dispersion of planar heat spreader has improved more than 20%, the heat that makes planar heat spreader can leave fast in printed board and produce, thus guarantee the radiating effect of planar heat spreader.
Note, above are only preferred embodiment of the present invention and institute's application technology principle.Skilled person in the art will appreciate that and the invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious variations, readjust and substitute and can not break away from protection scope of the present invention.Therefore, although by above embodiment, the present invention is described in further detail, the present invention is not limited only to above embodiment, in the situation that do not break away from the present invention's design, can also comprise more other equivalent embodiment, and scope of the present invention is determined by appended claim scope.
Claims (7)
1. a planar heat spreader manufacturing process, is characterized in that, comprises the steps:
A, according to user's request, according to the predetermined design standard, complete planar heat spreader design;
B, by thermoanalytical emulation mode, verify the actual heat dispersion of described planar heat spreader, verify described planar heat spreader anti-seismic performance by structure finite element imitation, if meet design requirement, perform step C, otherwise the planar heat spreader relevant design is modified, until meet design requirement;
C, sawing sheet: choose the required aluminium sheet material of described planar heat spreader, by plate shearing machine, whole aluminium sheet is cut into to the size that needs processing;
D, execution planar heat spreader wire cutting technology; The concrete technology flow process is as follows: first plate smoothing, and location, some hole, the line cutting, clean, polishing, check;
E, according to customer requirements, select the respective anode mode to carry out the surface anodization processing to planar heat spreader;
F, select glue is bonding or glued membrane is bonding either type to carry out the laminating of planar heat spreader and printed board.
2. planar heat spreader manufacturing process according to claim 1, is characterized in that, carries out the planar heat spreader wire cutting technology in described step D, specifically comprises:
First plate smoothing: one side the line cutting smoothing of carrying out of first block of plate is processed;
Location, some hole: holed with drill bit according to the design data of planar heat spreader structure;
Line cutting: according to the design data of planar heat spreader structure, utilize the cutting on line machine to be cut, be no more than 15 blocks of plates at every turn;
Clean: with gasoline, the half-finished product plate cut is cleaned;
Counterbore: if the planar heat spreader of design has the pore-forming processing request, carry out counterbore processing;
Polishing: with file and sand paper to the reprocessing of being polished of the planar heat spreader of well cutting;
Check: ready-made planar heat spreader and light are painted to egative film and compare.
3. planar heat spreader manufacturing process according to claim 1, is characterized in that, described step e middle-jiao yang, function of the spleen and stomach polarization mode specifically comprises hard anodized, black anodizing, true qualities electric conductive oxidation and golden yellow electric conductive oxidation.
4. planar heat spreader manufacturing process according to claim 1, is characterized in that, described step e specifically comprises: select the hard anodized mode to carry out the surface anodization processing to planar heat spreader.
5. according to the described planar heat spreader manufacturing process of one of claim 1 to 4, it is characterized in that, in described step F, the bonding technological process of glued membrane specifically comprises:
Carve film: at first, use scissors to cut the film of correspondingly-sized, long and wide size is than the large 2-3 centimetre of planar heat spreader size; Secondly, use carving machine that film is carved, and checked with corresponding egative film;
Cold bonding: with syringe, acetone is expelled to the surface of film and planar heat spreader, makes it bonding, bondingly again it is bonded in corresponding printed board after complete, the whole plank that forms;
Location: plank cold bonding completed with alignment pin positions;
Hot sticky: the plank completed with vulcanizer pressing cold bonding;
Reprocessing: cooling plank tool using is carried out to reprocessing;
Check: the plank of finishing dealing with is checked according to predetermined check.
6. planar heat spreader manufacturing process according to claim 5, it is characterized in that, described cold bonding specifically comprises: with aviation gasoline, clean planar heat spreader, dry the rear surface of film and planar heat spreader that acetone is expelled to syringe, make it bonding, bondingly again it is bonded in corresponding printed board after complete.
7. planar heat spreader manufacturing process according to claim 5, it is characterized in that, described hot stickyly specifically comprise: plank is placed in the insulating box of 125 degrees centigrade to preheating 5 minutes, the plank completed with vulcanizer pressing cold bonding, push down and make it naturally cooling with iron block after pressing completes.
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Application publication date: 20131225 |