CN103037670A - Heat radiating process method for printed-circuit board - Google Patents
Heat radiating process method for printed-circuit board Download PDFInfo
- Publication number
- CN103037670A CN103037670A CN2012105212816A CN201210521281A CN103037670A CN 103037670 A CN103037670 A CN 103037670A CN 2012105212816 A CN2012105212816 A CN 2012105212816A CN 201210521281 A CN201210521281 A CN 201210521281A CN 103037670 A CN103037670 A CN 103037670A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- cold drawing
- printed
- printed circuit
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The invention discloses a heat radiating process method for a printed-circuit board, belongs to electron technology, and applies to the technical field of avionics. The a cold plate is bonded on a printed-circuit board through a dedicated bonding device, a component is enabled to grovel on the cold plate, and heat radiating is carried out through the bonding membrane material and the cold plate, wherein the membrane material is arranged among the printed-circuit board base materials, the metal conducting materials on the inner portion and the surface of the printed-circuit board, the printed-circuit board and the cold plate. The cold plate is formed by arranging holes in an aluminium alloy plate according to the welding locating of the components of the printed-circuit board through hard anodic oxidation surface treatment. The bonding material between the printed-circuit board and the cold plate is a polyimide double-faced adhesive membrane. The bonding device is a convex thick steel mold plate and a concave thick steel mold plate with a certain curvature, and enables the printed-circuit board and the cold plate can be completed a flattening function simultaneously with bonding. The heat radiating process method for the printed-circuit board achieves the processing of the bonding and the flattening of the cold plate and the printed-circuit board at one time, solves the problem of product performance deterioration due to the fact that heat emitted by component after being powered on can not be released in time, increases the mechanical strength, the antiseptic property and the insulating property of the printed-circuit board, and restrains the layer splitting and the deformation of the printed-circuit board generated by high-temperature wave soldering.
Description
Technical field
The invention belongs to the electronic technology class, be applied to the avionics field.
Background technology
High speed development along with electronic technology, on a large scale, the extensive use of very lagre scale integrated circuit (VLSIC) device, electronic equipment is to compactization development, load the density of components and parts on the corresponding printing electroplax along with raising, after the printed circuit board energising that welding electronic component is installed, electronic devices and components just become the thermal source of heating on the printed circuit board, the heat that distributes can make the temperature of electronic product rise, when surpassing the serviceability temperature of element permission, the characteristic of components and parts will change, and causes mis-behave, reliability reduction, the lost of life of product.Components and parts high temperature failure problem is more and more outstanding on printed circuit board, has a strong impact on product and uses.
At present, mainly contain 3 kinds of methods for printed circuit board heat radiation, 1. during the printed circuit board line design, increase dispel the heat lines and plated-through hole in non-wiring zone; 2. radiator fan, radiator or casing heat radiation are installed in printed circuit board component position; 3. select Metal Substrate copper clad plate material, such as aluminium base, copper base, iron substrate, this printed circuit board is made metal blank as base material at the wiring board skin, namely heating panel.Employing mode 1 has certain radiating effect, but be difficult to realize at highly dense printed circuit board, there are certain limitation in employing mode 2 provided with fan or radiator on to the printed circuit board of original limited space, there are a lot of difficult problems in employing mode 3 in production technology, relatively more difficult such as the profile milling, and in follow-up plating, in the etching and processing, the Metal Substrate surface easily is corroded, Metal Substrate orifice edge burr and pickup are difficult to remove when totally causing high pressure resistant test on fire, electric leakage, puncture, especially in wave soldering, during reflow soldering, Metal Substrate sheet material is different from the linear expansion coefficient of printed circuit plate substrate so that the buckling deformation of plate face, cause the device rosin joint, sealing-off has a strong impact on properties of product.Therefore, several printed circuit board radiating modes exist in various degree defective and deficiency above.
Summary of the invention
Goal of the invention: the purpose of this invention is to provide a kind of process for the printed circuit board heat radiation, when solving the printed circuit board energising, the heat that electronic devices and components distribute can in time be discharged, do not affect the assembling of printed circuit board component, solve rosin joint, sealing-off problem that the buckling deformation of printed circuit board high-temperature soldering causes, it is low to solve printed circuit board intensity, not anti-problem of colliding with.
Technical scheme: a kind of for printed circuit board heat radiation process, the method is taked following steps:
1) design cold drawing parts avoiding structure figure, process through printed circuit board light being painted data, components and parts pin positions in the export, the perforate of cold drawing structure is set in the relevant position on cold drawing parts avoiding structure figure, can weld components and parts pin and printed circuit board by the perforate of cold drawing structure;
2) preparing thickness is the two-sided glued membrane of 2A12-T4 blank, polyimides, the backing plate of digital control processing, the cutter of 1.5mm, processes cold drawing constitutional detail, the two-sided glued membrane part of polyimides according to cold drawing parts avoiding structure figure at Digit Control Machine Tool;
3) the cold drawing constitutional detail is carried out the hard anodizing surface treatment, making increases the oxide-film formation cold drawing that a layer thickness is 40um～60um on the cold drawing constitutional detail surface;
4) cold drawing, the two-sided glued membrane of polyimides, printed circuit board are carried out bonding in advance under 120 ℃～130 ℃ temperature, check the contraposition quality, adjust the contraposition size;
5) prepare adhering device, torque spanner, disengaging film, screw, adhering device by the bow degree be 0.3%～0.4%, length is that 200mm～250mm, width are that 130mm～180mm, thickness are that protruding, the recessed thick steel form of 20mm～25mm forms, protruding, recessed thick steel form length, width dimensions, bow degree are all identical, there are four screws at distance 10mm place, adjacent both sides on the recessed thick steel form, there are four screwed holes at distance 10mm place, adjacent both sides, screw and screwed hole dimensional fits on the protruding thick steel form;
The pre-bonding two-sided glued membrane of cold drawing, polyimides, printed circuit board is positioned among the adhering device, wherein cold drawing is towards the notch board face, the square that applies 16NM～18NM by torque spanner is turned round, screw is fixedly connected with protruding, recessed thick steel form with screw by screwed hole, the time of carrying out is that 40min～60min, hot pressing temperature are after 150 ℃～160 ℃ bonding, naturally be down to room temperature, take out the cold drawing printed circuit board.
Beneficial effect of the present invention: cold drawing is the heat radiation main body among the present invention, cold drawing be by on the aluminum alloy plate materials by the welding position perforate of printed circuit board component, and the surface treatment of process hard anodizing forms, aluminum alloy plate materials has good specific heat load, can in time discharge the heat that components and parts distribute, aluminium alloy plate through whole hard anodizing has high insulating properties, resistance to wear, corrosion resistance, can significantly increase antiseptic property, insulation property and the mechanical strength of printed circuit board.The present invention adopts the special bonding device to realize bond processing, because this device has specific bow degree, can solve do not coexist buckling deformation problem when being hot bonding of printed circuit board and cold drawing coefficient of linear expansion, has realized finishing bonding the time smoothing.Adhesives of the present invention is the two-sided glued membrane of polyimides, this film material has the characteristic of high heat-resisting, high tensile, high extensibility, in the time of being suppressed at high-temperature soldering, aliquation, the buckling deformation of the swollen different generations of coefficient of cold drawing and printed circuit board printed line prevent that components and parts rosin joint, sealing-off phenomenon from occuring.
Embodiment
Principle of the present invention is by special bonding device bonding cold drawing on printed circuit board, so that components and parts " are lain prone " on cold drawing, rely on adhesive film material and cold drawing between printed circuit plate substrate, printed circuit intralamellar part and surface metal electric conducting material, printed circuit board and the cold drawing to dispel the heat.Cold drawing be on the aluminum alloy plate materials by the welding position perforate of printed circuit board component, and form through the hard anodizing surface treatment; Adhesives is the two-sided glued membrane of polyimides between printed circuit board and the cold drawing; Adhering device is protruding, the recessed thick steel form with certain bow degree, can be so that printed circuit board and cold drawing are finished the smoothing function bonding the time.
Specific embodiment one
A kind of for printed circuit board heat radiation process, the method is taked following steps:
1) design cold drawing parts avoiding structure figure, through CAM350 software printed circuit board light being painted data processes, components and parts pin positions in the export, form the pcb file of PROTEL form through application software ger-pcb conversion process, set the perforate of cold drawing structure with PROTEL software relevant position on cold drawing parts avoiding structure figure, can weld components and parts pin and printed circuit board by the perforate of cold drawing structure, bore size is decided on the components and parts characteristics on the cold drawing, the pin perforate of direct plugging member is opened circular hole after 1.8mm is strengthened on pad size basis, relevant position, the surface mounting component perforate is to carry out opening square hole behind the outside monolateral expansion 2.2mm of the maximum profile of this device, certain product F A20H-0201-01 power supply printed circuit board overall dimension length is 120mm, width is 78mm, cold drawing parts avoiding structure figure overall dimension is identical with printed circuit board overall dimension, and all are dodged the hole and consist of avoiding structure figure with overall dimension like this.
2) preparing thickness is the two-sided glued membrane of 2A12-T4 blank, polyimides, the backing plate of digital control processing, the cutter of 1.5mm, processes cold drawing constitutional detail, the two-sided glued membrane part of polyimides according to cold drawing parts avoiding structure figure at Digit Control Machine Tool;
3) the cold drawing constitutional detail is carried out the hard anodizing surface treatment, making increases the oxide-film formation cold drawing that a layer thickness is 40um～60um on the cold drawing constitutional detail surface;
4) cold drawing, the two-sided glued membrane of polyimides, printed circuit board are carried out bonding in advance under 130 ℃ of temperature, check the contraposition quality, adjust the contraposition size;
5) prepare adhering device, torque spanner, disengaging film, screw, adhering device by the bow degree be 0.4%, length is that 220mm, width are that 140mm, thickness are that protruding, the recessed thick steel form of 22.5mm forms, protruding, recessed thick steel form length, width dimensions, bow degree are all identical, there are four φ 6.1mm screws at distance 10mm place, adjacent both sides on the recessed thick steel form, there are four M6mm screwed holes at distance 10mm place, adjacent both sides, screw and screwed hole dimensional fits on the protruding thick steel form;
The pre-bonding two-sided glued membrane of cold drawing, polyimides, printed circuit board is positioned among the adhering device, wherein cold drawing is towards the notch board face, the square that applies 17.5NM by torque spanner is turned round, screw is fixedly connected with protruding, recessed thick steel form with screw by screwed hole, the time of carrying out is that 50min, hot pressing temperature are after 158 ℃ bonding, naturally be down to room temperature, take out the cold drawing printed circuit board.
Specific embodiment two
A kind of for printed circuit board heat radiation process, the method is taked following steps:
1) design cold drawing parts avoiding structure figure, through CAM350 software printed circuit board light being painted data processes, components and parts pin positions in the export, form the pcb file of PROTEL form through application software ger-pcb conversion process, set the perforate of cold drawing structure with PROTEL software relevant position on cold drawing parts avoiding structure figure, can weld components and parts pin and printed circuit board by the perforate of cold drawing structure, bore size is decided on the components and parts characteristics on the cold drawing, the pin perforate of direct plugging member is opened circular hole after 1.5mm is strengthened on pad size basis, relevant position, the surface mounting component perforate is to carry out opening square hole behind the outside monolateral expansion 2mm of the maximum profile of this device, certain product F A30D-0401-01 signal printed circuit board overall dimension length is 160mm, width is 93mm, cold drawing parts avoiding structure figure overall dimension length is 176mm, width is 97mm, and all are dodged the hole and consist of avoiding structure figure with overall dimension like this.
2) preparing thickness is the two-sided glued membrane of 2A12-T4 blank, polyimides, the backing plate of digital control processing, the cutter of 1.5mm, processes cold drawing constitutional detail, the two-sided glued membrane part of polyimides according to cold drawing parts avoiding structure figure at Digit Control Machine Tool;
3) the cold drawing constitutional detail is carried out the hard anodizing surface treatment, making increases the oxide-film formation cold drawing that a layer thickness is 40um～60um on the cold drawing constitutional detail surface;
4) cold drawing, the two-sided glued membrane of polyimides, printed circuit board are carried out bonding in advance under 130 ℃ of temperature, check the contraposition quality, adjust the contraposition size;
5) prepare adhering device, torque spanner, disengaging film, screw, adhering device by the bow degree be 0.3%, length is that 250mm, width are that 180mm, thickness are that protruding, the recessed thick steel form of 24.5mm forms, protruding, recessed thick steel form length, width dimensions, bow degree are all identical, there are four φ 6.1mm screws at distance 10mm place, adjacent both sides on the recessed thick steel form, there are four M6mm screwed holes at distance 10mm place, adjacent both sides, screw and screwed hole dimensional fits on the protruding thick steel form;
The pre-bonding two-sided glued membrane of cold drawing, polyimides, printed circuit board is positioned among the adhering device, wherein cold drawing is towards the notch board face, the square that applies 17NM by torque spanner is turned round, screw is fixedly connected with protruding, recessed thick steel form with screw by screwed hole, the time of carrying out is that 60min, hot pressing temperature are after 156 ℃ bonding, naturally be down to room temperature, take out the cold drawing printed circuit board.
Claims (1)
1. one kind is used for printed circuit board heat radiation process, it is characterized in that the method is taked following steps:
1) design cold drawing parts avoiding structure figure, process through printed circuit board light being painted data, components and parts pin positions in the export, the perforate of cold drawing structure is set in the relevant position on cold drawing parts avoiding structure figure, can weld components and parts pin and printed circuit board by the perforate of cold drawing structure;
2) preparing thickness is the two-sided glued membrane of 2A12-T4 blank, polyimides, the backing plate of digital control processing, the cutter of 1.5mm, processes cold drawing constitutional detail, the two-sided glued membrane part of polyimides according to cold drawing parts avoiding structure figure at Digit Control Machine Tool;
3) the cold drawing constitutional detail is carried out the hard anodizing surface treatment, making increases the oxide-film formation cold drawing that a layer thickness is 40um～60um on the cold drawing constitutional detail surface;
4) cold drawing, the two-sided glued membrane of polyimides, printed circuit board are carried out bonding in advance under 120 ℃～130 ℃ temperature, check the contraposition quality, adjust the contraposition size;
5) prepare adhering device, torque spanner, disengaging film, screw, adhering device by the bow degree be 0.3%～0.4%, length is that 200mm～250mm, width are that 130mm～180mm, thickness are that protruding, the recessed thick steel form of 20mm～25mm forms, protruding, recessed thick steel form length, width dimensions, bow degree are all identical, there are four screws at distance 10mm place, adjacent both sides on the recessed thick steel form, there are four screwed holes at distance 10mm place, adjacent both sides, screw and screwed hole dimensional fits on the protruding thick steel form;
The pre-bonding two-sided glued membrane of cold drawing, polyimides, printed circuit board is positioned among the adhering device, wherein cold drawing is towards the notch board face, the square that applies 16NM～18NM by torque spanner is turned round, screw is fixedly connected with protruding, recessed thick steel form with screw by screwed hole, the time of carrying out is that 40min～60min, hot pressing temperature are after 150 ℃～160 ℃ bonding, naturally be down to room temperature, take out the cold drawing printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210521281.6A CN103037670B (en) | 2012-12-07 | 2012-12-07 | A kind of for printed circuit board heat radiation process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210521281.6A CN103037670B (en) | 2012-12-07 | 2012-12-07 | A kind of for printed circuit board heat radiation process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103037670A true CN103037670A (en) | 2013-04-10 |
| CN103037670B CN103037670B (en) | 2015-08-05 |
Family
ID=48023988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210521281.6A Active CN103037670B (en) | 2012-12-07 | 2012-12-07 | A kind of for printed circuit board heat radiation process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103037670B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474357A (en) * | 2013-09-16 | 2013-12-25 | 无锡市同步电子科技有限公司 | Technology for manufacturing plane radiator |
| CN105228332A (en) * | 2014-06-09 | 2016-01-06 | 安徽省磊鑫科技有限公司 | A kind of integrated circuit of radiating insulating |
| CN105722337A (en) * | 2014-12-01 | 2016-06-29 | 中国航空工业集团公司第六三一研究所 | Method for installing and reinforcing high-density mixed printed circuit assembly containing BGA device |
| CN107546201A (en) * | 2017-06-08 | 2018-01-05 | 中国科学院理化技术研究所 | A kind of radiator of resistance to high-temperature corrosion of liquid metal |
| CN108170918A (en) * | 2017-12-20 | 2018-06-15 | 上海望友信息科技有限公司 | Checking method, system, computer readable storage medium and the equipment of cold plate |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05175654A (en) * | 1991-12-26 | 1993-07-13 | Yokohama Rubber Co Ltd:The | Surface treating method for printed wiring board |
| TWI264259B (en) * | 2004-09-16 | 2006-10-11 | Gold Circuit Electronics Ltd | Multiple-layer flexible printed circuit board process and apparatus thereof |
| CN200994224Y (en) * | 2006-12-15 | 2007-12-19 | 连伸科技股份有限公司 | Printed circuit board medium structure |
| CN201479462U (en) * | 2009-05-11 | 2010-05-19 | 成都航天通信设备有限责任公司 | Cooling plate printing plate |
| CN102223767A (en) * | 2011-06-01 | 2011-10-19 | 何忠亮 | Production process for high heat-conduction circuit board |
-
2012
- 2012-12-07 CN CN201210521281.6A patent/CN103037670B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05175654A (en) * | 1991-12-26 | 1993-07-13 | Yokohama Rubber Co Ltd:The | Surface treating method for printed wiring board |
| TWI264259B (en) * | 2004-09-16 | 2006-10-11 | Gold Circuit Electronics Ltd | Multiple-layer flexible printed circuit board process and apparatus thereof |
| CN200994224Y (en) * | 2006-12-15 | 2007-12-19 | 连伸科技股份有限公司 | Printed circuit board medium structure |
| CN201479462U (en) * | 2009-05-11 | 2010-05-19 | 成都航天通信设备有限责任公司 | Cooling plate printing plate |
| CN102223767A (en) * | 2011-06-01 | 2011-10-19 | 何忠亮 | Production process for high heat-conduction circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103474357A (en) * | 2013-09-16 | 2013-12-25 | 无锡市同步电子科技有限公司 | Technology for manufacturing plane radiator |
| CN105228332A (en) * | 2014-06-09 | 2016-01-06 | 安徽省磊鑫科技有限公司 | A kind of integrated circuit of radiating insulating |
| CN105722337A (en) * | 2014-12-01 | 2016-06-29 | 中国航空工业集团公司第六三一研究所 | Method for installing and reinforcing high-density mixed printed circuit assembly containing BGA device |
| CN107546201A (en) * | 2017-06-08 | 2018-01-05 | 中国科学院理化技术研究所 | A kind of radiator of resistance to high-temperature corrosion of liquid metal |
| CN108170918A (en) * | 2017-12-20 | 2018-06-15 | 上海望友信息科技有限公司 | Checking method, system, computer readable storage medium and the equipment of cold plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103037670B (en) | 2015-08-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103037670B (en) | A kind of for printed circuit board heat radiation process | |
| CN105813391A (en) | Fabrication method of light emitting diode (LED) aluminum-based circuit board | |
| CN106132098A (en) | A kind of manufacture method of LED metal base circuit board | |
| JP5611355B2 (en) | Metal-clad laminate | |
| CN106550538A (en) | Board structure of circuit and processing method that a kind of metal derby is turned on internal layer circuit | |
| CN104394653B (en) | A kind of preparation method of Multi-layer Al-based sandwich printed board | |
| CN201571254U (en) | Metal coating film covering film for printed circuit board | |
| CN202026521U (en) | Circuit board with heat dissipation metal | |
| CN205005345U (en) | Circuit board that epoxy and metal base combine | |
| KR101666441B1 (en) | Edge Coating Apparatus of Metal Copper Clad Laminate | |
| CN109413867A (en) | High thermal conductivity double-face aluminium substrate and preparation method thereof | |
| CN105764244B (en) | Wiring board and its manufacturing method | |
| TWI460076B (en) | A substrate manufacturing method and a structure for simplifying the process | |
| CN107046765A (en) | The manufacture craft of double-side aluminum printed board | |
| CN105899006A (en) | Processing method of multilayer heat dissipation printed board | |
| CN106211641A (en) | A kind of high reliability laminated plates | |
| KR101031230B1 (en) | Copper clad laminate manufacturing method | |
| CN207783277U (en) | Aluminium base heat dissipation high temperature resistance multilayer backboard | |
| CN113966079A (en) | LED flexible circuit board and preparation method thereof | |
| CN202135398U (en) | Led circuit board | |
| KR101827716B1 (en) | Method for manufacturing flexible printed circuit board, and flexible printed circuit board manufactured by the method | |
| CN109496060A (en) | A kind of production technology of high-thermal conductive metal wiring board | |
| JPH1013024A (en) | Method for manufacturing multilayer printed wiring board | |
| JP3071722B2 (en) | Method for manufacturing multilayer printed wiring board | |
| CN220985929U (en) | High heat dissipation flexible line way board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |