CN103035831B - The manufacture method of LED aluminum base plate insulating barrier - Google Patents
The manufacture method of LED aluminum base plate insulating barrier Download PDFInfo
- Publication number
- CN103035831B CN103035831B CN201210322652.8A CN201210322652A CN103035831B CN 103035831 B CN103035831 B CN 103035831B CN 201210322652 A CN201210322652 A CN 201210322652A CN 103035831 B CN103035831 B CN 103035831B
- Authority
- CN
- China
- Prior art keywords
- insulating layer
- aluminium base
- alumina insulating
- aluminium
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of manufacture method processing LED insulating barrier on aluminium base, it is characterised in that including: (1) deoils, the surface wiping aluminium base that uses cloth to wipe with is to remove the greasy dirt on this aluminium base；(2) protecting film is covered the surface that need not process on aluminium base；(3) differential arc oxidation, puts into the aluminium base after covered with protective film in electrolyte and carries out differential arc oxidation, makes surface uncovered on aluminium base create the alumina insulating layer being integrated with this aluminium base；(4) polishing, uses burnishing device to be polished alumina insulating layer, makes any surface finish of alumina insulating layer, and controls this alumina insulating layer and become certain thickness；(5) clean, with the surface of the alumina insulating layer after water cleaning polishing；(6) it is dried, the alumina insulating layer natural drying after cleaning.
Description
Technical field
The invention belongs to the manufacture method of LED aluminum base plate insulating barrier, particularly one directly add on aluminium base
Work forms the processing method that alumina insulating layer improves LED thermal diffusivity.
Technical background
Compared with conventional light source, LED has that volume is little, lightweight, firm in structure and running voltage is low,
Service life length, the advantage such as energy-conserving and environment-protective.But, current LED as photoelectric device, its work process
In only have 10%～20% electric energy be converted into luminous energy, remaining electric energy is nearly all converted into heat energy, and chip face
Long-pending less, along with the increase of input power, on chip, the heat of accumulation will be more and more, and dispel the heat bad LED
Junction temperature raises, and reduces LED service life.Experimental data shows, junction temperature often reduces by 10 DEG C of LED life and can prolong
Long 2 times.Junction temperature is if controlling at 65 ° of C, then LED light decline to 70% life-span can be up to 100,000
Hour, but, heat radiation and this requirement of actual LED greatly differ from each other, so that LED lamp
It is to weigh LED package cooling performance that life-span becomes the junction temperature when subject matter affecting its performance uses
An important technology index, (generally 150 DEG C), big merit when junction temperature is increased beyond maximum allowable temperature
Rate LED can be damaged because of overheated.Therefore, heat dissipation problem be LED encapsulation key, be also in recent years compel
Be essential problem to be solved, and in high-power LED lamp designs, a main target is exactly heat dissipation design.
Main path that the heat that baseplate material produces as LED outwards dispels the heat and electricity can be designed on matrix
Road, baseplate material requires have high electrical insulating properties, high-termal conductivity, high planarization and higher intensity.Aluminum closes
Gold is as the most conventional a kind of baseplate material.
Fig. 3 is former aluminium base LED encapsulation structure schematic diagram.As it is shown on figure 3, in order to realize aluminium base
(7) surface insulated, containing insulating barrier (5) and adhesive linkage (6) between aluminium base and LED chip (4).
The most conventional insulant is elargol to be used between sapphire or carborundum, and Sapphire Substrate and substrate
Bonding, and the heat conduction of elargol is very poor, reduces LED chip transmission of heat between aluminium base.Carborundum
Shortcoming is that cost is somewhat expensive, and the most only Very few companies uses, and has patent protection.Therefore, close at aluminum
Prepare high electrical insulating properties on gold base, the film layer of high-termal conductivity has important function to exploitation great power LED.
The differential arc oxidization technique occurred in recent years, can rely on arc discharge to produce at aluminum, magnesium, titanium alloy surface
Raw TRANSIENT HIGH TEMPERATURE high pressure effect, grows ceramic film in the electrolytic solution.Differential arc oxidation film layer is tied with matrix
Close firmly, compact structure.It is simple that the differential arc oxidation of aluminium alloy has technique, and processing cost is low, the oxygen of formation
Change the feature that aluminum heat conductivity is good.The purpose of this invention is to provide a kind of high-power LED aluminum substrate by micro-
The method that the method for arc oxidation prepares alumina insulating layer, belongs to and newly designs new technology.
New through looking into, retrieve relevant patent altogether as follows:
The patent of Application No. CN200420007791.2 discloses a kind of LED method of band heat sinking function.Should
Method distributes removing as early as possible for heat LED chip produced, another in addition to two current potential feet on chip
Outward equipped with the pin of a special heat radiation, this pin be specifically used to heat radiation.The method can play certain reduction
The effect of junction temperature, but there is also complex process, the high deficiency of manufacturing cost.
The patent of Application No. CN201010540362.1 discloses a kind of LED-baseplate and manufacture method thereof, its
It is characterised by that this substrate includes double layer of metal matrix, and the insulator by two kinds of metallic matrix electric isolution.Should
The insulator that application uses not only achieves electric isolution, also by bonding for two metallic matrixes, LED chip is produced
Raw heat distributes.The insulant used in this application is epoxy resin, acrylate, gathers benzene
The materials such as dioctyl phthalate.Method in this application is compared with ceramic substrate, has some improvement in heat radiation, but
The problem that the insulant such as the epoxy resin used there is also poor heat conduction.
The patent of Application No. CN201110052991.4 discloses the paster LED of a kind of liquid radiating.The party
Method devises Control device of liquid cooling in LED base and dispels the heat to strengthen LED chip, reduces junction temperature.But the party
Method is required to be LED lamp and is individually equipped with fluid circulation system, is unfavorable for the miniaturization of LED, is not also suitable for one
A little special environments.
The patent of Application No. CN201110202039.8 discloses the LED of a kind of ceramic substrate integration packaging.
This application uses 0.5～1.0mm aluminium nitride or aluminium oxide to be substrate, and this substrate functions simultaneously as insulating barrier, at this
Substrate both sides utilize the method for magnetron sputtering to carry out metallization to prepare metal level.Wherein prepared by the metal level of side
LED circuit；The metal level of opposite side is connected with fin.This application uses aluminium nitride or aluminium oxide as absolutely
Edge layer, make use of aluminium nitride or the higher electrical insulating property of aluminium oxide and good heat conductivity, and at insulating barrier
And between metallic radiating layer, there is not the heat radiation of adhesive linkage, beneficially LED chip, thus, this design has
Higher thermal diffusivity, is beneficial to realize great power LED.But, the method uses the method for magnetron sputtering at substrate
Metal level is prepared in both sides, there is the problem that production efficiency is low, manufacturing cost is high.
Summary of the invention
It is an object of the invention to overcome the tradition problem that LED insulating barrier production efficiency is low, manufacturing cost is high,
Thering is provided a kind of technique simple, the processing method at the bottom of manufacturing cost improves LED heat-sinking capability.
In order to solve the problems referred to above, the invention provides a kind of manufacture processing LED insulating barrier on aluminium base
Method, it is characterised in that including:
(1) deoiling, the surface wiping aluminium base that uses cloth to wipe with is to remove the greasy dirt on this aluminium base；
(2) protecting film is covered the surface that need not process on aluminium base；
(3) differential arc oxidation, puts into the aluminium base after covered with protective film in electrolyte and carries out differential arc oxidation, make aluminum
Surface uncovered on substrate creates the alumina insulating layer being integrated with this aluminium base；
(4) polishing, uses burnishing device to be polished alumina insulating layer, makes the table of alumina insulating layer
Face is bright and clean, and controls this alumina insulating layer and become certain thickness；
(5) clean, with the surface of the alumina insulating layer after water cleaning polishing；
(6) it is dried, the alumina insulating layer natural drying after cleaning.
The manufacture method of the LED aluminum base plate insulating barrier that the present invention provides, is further characterized in that: wherein, aluminum base
Plate is AA1100 fine aluminium, and certain thickness is 6um.
The manufacture method of the LED aluminum base plate insulating barrier that the present invention provides, is further characterized in that: wherein, electrolysis
Liquid is formulated with deionized water by sodium silicate, uses 1.5A/dm2Electric current density, at 10 DEG C～20 DEG C
At a temperature of differential arc oxidation aluminium base 5 minutes.
The manufacture method of the LED aluminum base plate insulating barrier that the present invention provides, is further characterized in that: wherein, oxidation
The resistance of aluminum insulation layer is 10M Ω.
The manufacture method of the LED aluminum base plate insulating barrier that the present invention provides, is further characterized in that: wherein, oxidation
The heat conductivity of aluminum insulation layer is 10W/mK.
The manufacture method of the LED aluminum base plate insulating barrier that the present invention provides, is further characterized in that: wherein, aluminium base
Being 5052 aluminium alloys, certain thickness is 5um.
The manufacture method of the LED aluminum base plate insulating barrier that the present invention provides, is further characterized in that: wherein, electrolysis
Liquid is formulated by dilute sulfuric acid, uses 0.6A/dm2Electric current density, differential of the arc oxygen at a temperature of 5 DEG C～10 DEG C
Change aluminium base 10 minutes.
The manufacture method of the LED aluminum base plate insulating barrier that the present invention provides, is further characterized in that: wherein, oxidation
The resistance of aluminum insulation layer is 6M Ω.
The manufacture method of the LED aluminum base plate insulating barrier that the present invention provides, is further characterized in that: wherein, oxidation
The heat conductivity of aluminum insulation layer is 20W/mK.
The manufacture method of the LED aluminum base plate insulating barrier that the present invention provides, is further characterized in that: wherein, protection
Film is adhesive tape.
Invention effect and effect
The manufacture method of the LED aluminum base plate insulating barrier that the present invention provides overcomes classical production process complex process,
The problem that manufacturing cost is high, it is provided that a kind of technique is simple, the processing method at the bottom of manufacturing cost is workable,
By being put into by aluminium base, electrolyte carries out differential arc oxidation, make surface uncovered on aluminium base produce oxygen
Change aluminum insulation layer, so that aluminium base and alumina insulating layer are integrally formed aluminium-base plate insulating layer, thus increase
The heat conductivity of this aluminium-base plate insulating layer.
Accompanying drawing explanation
Fig. 1 is the process chart of present invention manufacture method in an embodiment.
Fig. 2 is the structural representation of present invention LED aluminum base plate insulating barrier in an embodiment.
Fig. 3 is the aluminium base LED encapsulation structure schematic diagram that technology manufactures in the past.
1-LED 2-alumina insulating layer 3-aluminium base
4LED chip 5-insulating barrier 6-tack coat
7-aluminium base
Detailed description of the invention
For the technological means making the present invention realize, creation characteristic, reach purpose and be easy to understand with effect,
Below in conjunction with diagram, the present invention is expanded on further.
Fig. 1 is the process chart of present invention manufacture method in an embodiment.According to Fig. 1, it is special
Levying and comprise the steps: that step (1) is deoiled, the surface wiping aluminium base that uses cloth to wipe with is to remove on this aluminium base 3
Greasy dirt；Protecting film is covered the surface that need not processing on aluminium base 3 by step (2)；Step (3) differential of the arc oxygen
Change, the aluminium base 3 after covered with protective film is put into electrolyte carries out differential arc oxidation, make on aluminium base 3 not
Capped surface creates the alumina insulating layer 2 being integrated with this aluminium base 3, thus increase LED 1 to
The transmission of aluminium base 3 heat；Step (4) polishes, and uses burnishing device to throw alumina insulating layer 2
Light, makes any surface finish of alumina insulating layer 2, and controls this alumina insulating layer 2 and become certain thickness；Step
Suddenly (5) are cleaned, with the surface of the alumina insulating layer 2 after water cleaning polishing；Step (6) is dried, will
Alumina insulating layer 2 natural drying after cleaning.
Embodiment one
Use manufacture method provided by the present invention to processing LED aluminum base plate insulation on AA1100 fine aluminium substrate
Layer, step is as follows:
Step 1. is deoiled, and the surface wiping AA1100 fine aluminium substrate that uses cloth to wipe with is to remove this AA1100 fine aluminium substrate
On oily thing.
Protecting film is covered the surface that need not processing on AA1100 fine aluminium substrate by step 2..
Step 3. differential arc oxidation, puts into the aluminium base after covered with protective film and is prepared with deionized water by sodium silicate
Electrolyte in, use 1.5A/dm2Electric current density, differential arc oxidation at a temperature of 10 DEG C～20 DEG C
AA1100 fine aluminium substrate aluminium base 5 minutes, make uncovered surface on AA1100 fine aluminium substrate create with
The alumina insulating layer that this AA1100 fine aluminium substrate aluminium base is integrated.
Step 4. uses buffing machine to be polished above-mentioned alumina layer, makes the surface light of alumina layer
Clean, polished after alumina layer thickness be about 6um.
Step 5. is cleaned, with the surface of the alumina insulating layer after water cleaning polishing.
Step 6. is dried, the alumina insulating layer natural drying after cleaning.
To above-mentioned aluminium-base plate insulating layer, inventor has carried out tests below respectively.
1, resistance test
Above-mentioned alumina insulating layer is placed in probe station and carries out resistance test three times, three test results are put down
All, the resistance on this alumina insulating layer surface reaches 10M Ω.
2, Determination of conductive coefficients
Above-mentioned alumina insulating layer is placed in thermal conductivity coefficient measurement instrument and carries out thermal conductivity measurement, through heat conduction system
Number measuring instrument test, the heat conductivity of this alumina insulating layer reaches 10W/mK.
Embodiment two
Use manufacture method provided by the present invention to processing LED aluminum base plate insulation on 5052 aluminium alloy base plates
Layer, step is as follows:
Step 1. is deoiled, and the surface wiping 5052 aluminium alloy base plates that uses cloth to wipe with is to remove on 5052 aluminium alloy base plates
Oily thing.
Protecting film is covered the surface that need not processing on 5052 aluminium alloy base plates by step 2..
Step 3. differential arc oxidation, puts into the electrolysis formulated by dilute sulfuric acid by the aluminium base after covered with protective film
In liquid, use 0.6A/dm2Electric current density, at a temperature of 5 DEG C～10 DEG C this 5052 aluminum of differential arc oxidation close
Gold aluminium base 10 minutes, makes uncovered surface on 5052 aluminium alloy aluminium bases create and this 5052 aluminum
The alumina insulating layer that alloy aluminum substrate is integrated.
Step 4. uses buffing machine to be polished above-mentioned alumina layer, makes any surface finish of alumina layer,
Alumina layer thickness after polished is about 5um.
Step 5. is cleaned, with the surface of the alumina insulating layer after water cleaning polishing.
Step 6. is dried, the alumina insulating layer natural drying after cleaning.
To above-mentioned aluminium-base plate insulating layer, inventor has carried out tests below respectively.
1, resistance test
Above-mentioned alumina insulating layer is placed in probe station and carries out resistance test three times, three test results are put down
All, the resistance on this alumina insulating layer surface reaches 6M Ω.
2, Determination of conductive coefficients
It is individually placed in thermal conductivity coefficient measurement instrument carry out thermal conductivity measurement by above-mentioned alumina insulating layer, through leading
Hot coefficient measuring instrument is tested, and the heat conductivity of this alumina insulating layer reaches 20W/mK.
Embodiment effect and effect
In sum, the manufacturing approach craft of the aluminium-base plate insulating layer that the present embodiment provides is simple, manufacturing cost
The end, workable, by being put into by aluminium base, electrolyte carries out differential arc oxidation, make on aluminium base not by
The surface covered produces alumina insulating layer, so that aluminium base and alumina insulating layer are integrally formed aluminium base
Insulating barrier, increases the LED transmission to aluminium base heat.The manufacturer of the aluminium-base plate insulating layer in the present embodiment
The aluminium-base plate insulating layer heat conductivity that method manufactures is strong, and resistance is big, at the bottom of cost.
Above-described embodiment is only used for the present invention is described, does not limit the scope of the invention.
Claims (1)
1. on aluminium base, process a manufacture method for LED insulating barrier, including:
(1) deoiling, the surface wiping described aluminium base that uses cloth to wipe with is to remove the greasy dirt on this aluminium base；
(2) protecting film is covered the surface that need not processing on described aluminium base；
(3) differential arc oxidation, the described aluminium base after covering described protecting film is put into and is carried out differential of the arc oxygen in electrolyte
Change, make surface uncovered on described aluminium base create the alumina insulating layer being integrated with this aluminium base；
(4) polishing, uses burnishing device to be polished described alumina insulating layer, makes described aluminium oxide exhausted
Any surface finish of edge layer, and control this alumina insulating layer and become certain thickness；
(5) clean, with the surface of the described alumina insulating layer after water cleaning polishing；
(6) it is dried, the described alumina insulating layer natural drying after cleaning；It is characterized in that:
Described aluminium base is 5052 aluminium alloys, and described certain thickness is 5um；
Described electrolyte is formulated by dilute sulfuric acid, uses 0.6A/dm2Electric current density, at 5 DEG C～10 DEG C
At a temperature of aluminium base described in differential arc oxidation 10 minutes；
The resistance of described alumina insulating layer is 6M Ω；
The heat conductivity of described alumina insulating layer is 20W/mK；
Described protecting film is adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210322652.8A CN103035831B (en) | 2012-09-03 | 2012-09-03 | The manufacture method of LED aluminum base plate insulating barrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210322652.8A CN103035831B (en) | 2012-09-03 | 2012-09-03 | The manufacture method of LED aluminum base plate insulating barrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103035831A CN103035831A (en) | 2013-04-10 |
| CN103035831B true CN103035831B (en) | 2016-09-14 |
Family
ID=48022514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210322652.8A Expired - Fee Related CN103035831B (en) | 2012-09-03 | 2012-09-03 | The manufacture method of LED aluminum base plate insulating barrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103035831B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104088003B (en) * | 2014-07-28 | 2016-06-29 | 哈尔滨工业大学 | A kind of preparation method of LED lamp aluminium alloy radiator surface radiating composite coating material |
| CN105552192A (en) * | 2015-12-08 | 2016-05-04 | *** | Polycrystal reflection insulating plate and preparation method thereof |
| CN107611245A (en) * | 2017-08-30 | 2018-01-19 | 苏州惠华电子科技有限公司 | A kind of method that insulating barrier is processed on aluminium base |
| CN114214696B (en) * | 2021-12-17 | 2023-06-06 | 中国船舶重工集团公司第十二研究所 | Micro-arc oxidation method of aluminum substrate for LED packaging |
| CN115289410A (en) * | 2022-08-11 | 2022-11-04 | 深圳市未林森科技有限公司 | Production process for improving uniformity of light spots and light colors of LED lamp |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101005108A (en) * | 2006-01-16 | 2007-07-25 | 深圳大学 | Power type light emitting diode heat sink and its method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7036219B2 (en) * | 2004-04-01 | 2006-05-02 | Feng Chia University | Method for manufacturing a high-efficiency thermal conductive base board |
-
2012
- 2012-09-03 CN CN201210322652.8A patent/CN103035831B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101005108A (en) * | 2006-01-16 | 2007-07-25 | 深圳大学 | Power type light emitting diode heat sink and its method |
Non-Patent Citations (1)
| Title |
|---|
| 国内铝和铝合金微弧氧化技术研究动态;徐勇;《腐蚀与防护》;20030430;第24卷(第4期);第154-157页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103035831A (en) | 2013-04-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103035831B (en) | The manufacture method of LED aluminum base plate insulating barrier | |
| CN103730480B (en) | A kind of manufacture method of high drive flip LED thin film chip | |
| TWI481086B (en) | Cooling device for electronic components | |
| CN102256441A (en) | Metal substrate of heat conducting aluminium-based core and preparation method thereof | |
| CN102683570A (en) | White light LED (Light Emitting Diode) packaged on composite ceramic substrate and preparation method thereof | |
| CN101005108B (en) | Power type light emitting diode heat sink and its method | |
| CN103042762B (en) | High thermal conductive metal substrate | |
| CN105163485A (en) | Heat conducting substrate for heating device and heating device and manufacturing method thereof | |
| CN103313509B (en) | A kind of Metal Substrate conducting wire plate and preparation method thereof | |
| WO2011124019A1 (en) | Led lampwick, led chip, and method for manufacturing led chip | |
| CN203521463U (en) | High-thermal conductivity LED-COB packaging substrate | |
| KR20150033829A (en) | IGBT module having circuit pattern fabricated using cold spray and its manufacturing method | |
| CN207947939U (en) | A kind of structure of the metal substrate of thermoelectricity separation | |
| CN102496670A (en) | Copper electrode alumina ceramic substrate used in large power LED | |
| CN102811554A (en) | Base plate for high-power electronic device module and preparation method thereof | |
| CN104451818A (en) | Insulating metal plate and preparation method thereof | |
| CN206849831U (en) | A kind of insulation system of power electronic devices | |
| CN108539001A (en) | A kind of thermoelectric components integrated with heat exchanger | |
| CN203734133U (en) | Serially-connected multi-tube semiconductor laser | |
| CN203586162U (en) | LED (Light-Emitting Diode) heat-dissipating substrate | |
| TW201237316A (en) | Led optical module and led chip for illumination | |
| CN102945921A (en) | Light-emitting diode (LED) substrate radiating device | |
| TWM502251U (en) | LED heat dissipation substrate | |
| CN206077833U (en) | A kind of high thermal conductivity aluminium base | |
| CN205793613U (en) | A kind of high-frequency resistance circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160914 Termination date: 20210903 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |