CN104451818A - Insulating metal plate and preparation method thereof - Google Patents
Insulating metal plate and preparation method thereof Download PDFInfo
- Publication number
- CN104451818A CN104451818A CN201410654338.9A CN201410654338A CN104451818A CN 104451818 A CN104451818 A CN 104451818A CN 201410654338 A CN201410654338 A CN 201410654338A CN 104451818 A CN104451818 A CN 104451818A
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- substrate
- insulator
- oxide film
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses an insulating metal plate and a preparation method thereof. The insulating metal plate is prepared by directly preparing an anodized layer (aluminum oxide film) on the surface of a metal substrate (an aluminum substrate/an aluminum alloy substrate), wherein the aluminum oxide film has good electric insulation property and can be used as an insulating layer. The insulating metal plate has the beneficial effects that since the aluminum oxide film can be directly used as the insulating layer of the insulating metal plate and the aluminum oxide film has very high electric insulation property, excellent heat dissipation property and relatively good thermal shock resistance, the insulating metal plate has strong heat-dissipation capacity and relatively high reliability and is one of ideal substrate materials; by the preparation method disclosed by the invention, the aluminum oxide film having very high electric insulation property, excellent heat-dissipation property and relatively good thermal shock resistance can be directly formed on the surface of the metal substrate, no a layer of epoxy resin needs to be laminated and thus the production cost is effectively reduced.
Description
Technical field
The present invention relates to a kind of insulator-metal board and preparation method thereof, belong to technical field of electronic materials.
Background technology
Within 1969, insulating metal substrate (IMS) has been invented by SANYO GS company, and it has good heat dissipation characteristics, can meet the cooling requirements of carrying device substrate, be successfully applied in many fields such as microelectronics Packaging.
Existing insulating metal substrate adopts following method to prepare usually: first adopt anodic oxidation treatment aluminium base, then one deck epoxy resin is laminated on the anodic oxide coating surface of aluminium base, laminate one deck Copper Foil as wiring layer at epoxy resin surface, epoxy resin layer is as insulation layer.
Because insulating metal substrate adopts epoxy resin layer as insulation layer, the thermal conductivity of epoxy resin layer is very low, so make the thermal conductivity of insulating metal substrate also very low, insulating metal substrate heat-conductive characteristic difference is then unfavorable for that heat diffusion and device operating temperature reduce, thus components and parts lifetime, power stage can be caused to reduce.
Summary of the invention
For solving the deficiencies in the prior art, the object of the present invention is to provide the insulator-metal board that a kind of good mechanical property, thermal conductivity are high, cost is low, and the making method of this insulator-metal board.
In order to realize above-mentioned target, the present invention adopts following technical scheme:
A kind of insulator-metal board, it is characterized in that, be made up of metal substrate and anodic oxide coating, aforementioned anodizing layer is directly prepared in the surface of aforementioned metal substrate, metal substrate is aluminium base or aluminium alloy base plate, and anodic oxide coating is the aluminum oxide film with good electrical insulativity.
Aforesaid insulator-metal board, is characterized in that, directly preparing anodic oxide coating on the surface of metal substrate and getting, specifically comprising the steps: by adopting anodizing process with sulfuric acid as major salt
(1) oil removing: the greasy dirt of removing metallic substrate surfaces, dry, aforementioned metal substrate is aluminium base or aluminium alloy base plate;
(2) alkaline etching: with the greasy dirt of the further clean metal substrate surface of Alkaline etchant, and remove natural oxide film and the cut of metallic substrate surfaces;
(3) wash: metal substrate distilled water carries out multiple cleaning, until surface cleaning;
(4) neutralization, bright dipping: the salpeter solution with 5% embathes metal substrate 10 ~ 30s, carries out acid-base neutralisation and bright dipping;
(5) secondary washing: embathe metal substrate with distilled water;
(6) anodic oxidation: adopt the sulphuric acid soln of 180-250g/L as anodizing solution, cathode material adopts red copper, and temperature controls at 22 ± 2 DEG C, and voltage control is at 16 ± 1V, and anodic current density controls at 0.8A/dm
2, anodizing time controls at 120-150min;
(7) close: sealing treatment is carried out to metal substrate.
Aforesaid insulator-metal board, is characterized in that, in step (2), containing 50g sodium hydroxide, 45g Sodium Nitrite, 50g Sunmorl N 60S in every 1L Alkaline etchant.
Aforesaid insulator-metal board, is characterized in that, in step (7), the process of sealing treatment metal substrate is:
Be heated to 98 DEG C with 5g/L nickel acetate solution and sealing treatment 5-10min is carried out to metal substrate.
Usefulness of the present invention is:
1, insulator-metal board of the present invention, due to aluminum oxide film (i.e. anodic oxide coating 2) is directly used as the insulation layer of insulator-metal board, and aluminum oxide film has very high electrical insulating properties, excellent heat dissipation characteristics and better thermal shock resistance, so insulator-metal board of the present invention has stronger heat-sinking capability and higher reliability, it is one of desirable substrate material;
2, method of the present invention is adopted can directly to form the aluminum oxide film with very high electrical insulating properties, excellent heat dissipation characteristics and better thermal shock resistance in metallic substrate surfaces, this aluminum oxide film (i.e. anodic oxide coating 2) directly uses as the insulation layer of insulator-metal board, without the need to laminating one deck epoxy resin again, effectively reduce production cost.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the insulator-metal board with copper wiring layer.
The implication of Reference numeral in figure: 1-metal substrate, 2-anodic oxide coating, 3-copper wiring layer.
Embodiment
Below in conjunction with specific embodiment, concrete introduction is done to the present invention.
With reference to Fig. 1, insulator-metal board of the present invention, it directly prepares anodic oxide coating 2 on the surface of metal substrate 1 by anodizing process with sulfuric acid as major salt, metal substrate 1 is aluminium base or aluminium alloy base plate, anodic oxide coating 2 is aluminum oxide film, aluminum oxide film has good electrical insulating property, can as the insulation layer between metal substrate 1 and copper wiring layer 3.
Due to aluminum oxide film (i.e. anodic oxide coating 2) is directly used as the insulation layer of insulator-metal board, and aluminum oxide film has very high electrical insulating properties, excellent heat dissipation characteristics and better thermal shock resistance, so insulator-metal board of the present invention has good mechanical property, stronger heat-sinking capability and higher thermal conductivity.
In addition, due on insulator-metal board of the present invention without the need to laminating one deck epoxy resin again, so the production cost of insulator-metal board of the present invention is lower.
Introduce the making method of above-mentioned insulator-metal board below.
What make insulator-metal board employing is anodizing process with sulfuric acid as major salt, and directly prepare anodic oxide coating 2 on the surface of metal substrate 1, concrete steps are as follows:
(1) oil removing
By 2A12-T4 aluminium alloy base plate successively through 400
#, 600
#, 800
#after sand paper grinding, first use the polishing of W2.5 diamond paste, then use carbon tetrachloride solvent ultrasonic cleaning, to remove the greasy dirt on aluminium alloy base plate surface, dry.
(2) alkaline etching
With the greasy dirt of the further cleaning aluminum alloy substrate surface of Alkaline etchant, and remove natural oxide film and the cut on aluminium alloy base plate surface.
Containing 50g sodium hydroxide, 45g Sodium Nitrite, 50g Sunmorl N 60S in every 1L Alkaline etchant.The time that aluminium alloy base plate embathes in Alkaline etchant is 5-10min.
(3) wash
Aluminium alloy base plate distilled water carries out multiple cleaning, observes surface cleanness degree, can repeat alkaline etching step if desired, until the surface cleaning of aluminium alloy base plate.
(4) neutralization, bright dipping
Salpeter solution with 5% embathes substrate 10 ~ 30s, carries out acid-base neutralisation and bright dipping.
(5) secondary washing
Aluminium alloy base plate is embathed, until raffinate all washes with distilled water.
(6) anodic oxidation
Adopt the sulphuric acid soln of 180g/L as anodizing solution, cathode material adopts red copper, and temperature controls at 22 ± 2 DEG C, and voltage control is at 16 ± 1V, and anodic current density controls at 0.8A/dm
2, anodizing time controls at 120-150min, specifically depending on being oxidized the degree of carrying out.
(7) close
Be heated to 98 DEG C with 5g/L nickel acetate solution and sealing treatment 5-10min is carried out to aluminium alloy base plate, finally obtain milky 2A12-T4 aluminium alloy insulator-metal board.
2A12-T4 aluminium alloy insulator-metal board is placed in the vacuum chamber deposited copper film 30min of ion film coating machine, thus obtains copper wiring layer 3 on 2A12-T4 aluminium alloy insulator-metal board, as shown in Figure 1.
Use the insulation effect of triumph VC9802A digital multimeter test 2A12-T4 aluminium alloy insulator-metal board, test result is as follows:
(1) thin copper film pin A, B 2 and conducting between C, D 2 (resistance is between tens ohm to 100 ohm), illustrate that thin copper film electroconductibility is good;
(2) do not connect up place's any two points, A, C 2 point, A, D 2 point, B, C 2 point, and B, D 2 point, all not conductings (M Ω class B insulation), thin copper film and matrix not conducting are described, namely the insulation effect of substrate surface is ideal.
As can be seen here, insulator-metal board of the present invention is under ensureing that thin copper film has the prerequisite of satisfactory electrical conductivity, and insulation effect is ideal.
It should be noted that, above-described embodiment does not limit the present invention in any form, the technical scheme that the mode that all employings are equal to replacement or equivalent transformation obtains, and all drops in protection scope of the present invention.
Claims (4)
1. an insulator-metal board, it is characterized in that, be made up of metal substrate (1) and anodic oxide coating (2), described anodic oxide coating (2) is directly prepared in the surface of described metal substrate (1), metal substrate (1) is aluminium base or aluminium alloy base plate, and anodic oxide coating (2) is for having the aluminum oxide film of good electrical insulativity.
2. insulator-metal board according to claim 1, is characterized in that, directly preparing anodic oxide coating on the surface of metal substrate and getting, specifically comprising the steps: by adopting anodizing process with sulfuric acid as major salt
(1) oil removing: the greasy dirt of removing metallic substrate surfaces, dry, described metal substrate is aluminium base or aluminium alloy base plate;
(2) alkaline etching: with the greasy dirt of the further clean metal substrate surface of Alkaline etchant, and remove natural oxide film and the cut of metallic substrate surfaces;
(3) wash: metal substrate distilled water carries out multiple cleaning, until surface cleaning;
(4) neutralization, bright dipping: the salpeter solution with 5% embathes metal substrate 10 ~ 30s, carries out acid-base neutralisation and bright dipping;
(5) secondary washing: embathe metal substrate with distilled water;
(6) anodic oxidation: adopt the sulphuric acid soln of 180-250g/L as anodizing solution, cathode material adopts red copper, and temperature controls at 22 ± 2 DEG C, and voltage control is at 16 ± 1V, and anodic current density controls at 0.8A/dm
2, anodizing time controls at 120-150min;
(7) close: sealing treatment is carried out to metal substrate.
3. insulator-metal board according to claim 2, is characterized in that, in step (2), containing 50g sodium hydroxide, 45g Sodium Nitrite, 50g Sunmorl N 60S in every 1L Alkaline etchant.
4. the making method of insulator-metal board according to claim 2, is characterized in that, in step (7), the process of sealing treatment metal substrate is:
Be heated to 98 DEG C with 5g/L nickel acetate solution and sealing treatment 5-10min is carried out to metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410654338.9A CN104451818A (en) | 2014-11-17 | 2014-11-17 | Insulating metal plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410654338.9A CN104451818A (en) | 2014-11-17 | 2014-11-17 | Insulating metal plate and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104451818A true CN104451818A (en) | 2015-03-25 |
Family
ID=52898545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410654338.9A Pending CN104451818A (en) | 2014-11-17 | 2014-11-17 | Insulating metal plate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104451818A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017161580A1 (en) * | 2016-03-25 | 2017-09-28 | 深圳市恒兆智科技有限公司 | Alkali etching agent for aluminum material and alkali etching preprocessing method for aluminum material |
| CN110983412A (en) * | 2019-03-26 | 2020-04-10 | 丹东思诚科技有限公司 | Application of hard aluminum oxide film prepared based on in-situ generation method in aluminum-shell lithium battery insulation sealing |
| CN113366141A (en) * | 2018-12-21 | 2021-09-07 | 旭硝子欧洲玻璃公司 | Method for metal coating |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101665970A (en) * | 2008-09-03 | 2010-03-10 | 中国科学院宁波材料技术与工程研究所 | Normal-temperature sealer for anodic oxide film of aluminum and aluminum alloy and sealing method thereof |
| CN102666940A (en) * | 2009-12-25 | 2012-09-12 | 富士胶片株式会社 | Insulated substrate, process for production of insulated substrate, process for formation of wiring line, wiring substrate, and light-emitting element |
| CN102888644A (en) * | 2011-07-18 | 2013-01-23 | 汉达精密电子(昆山)有限公司 | Anode treatment method of aluminium alloy |
-
2014
- 2014-11-17 CN CN201410654338.9A patent/CN104451818A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101665970A (en) * | 2008-09-03 | 2010-03-10 | 中国科学院宁波材料技术与工程研究所 | Normal-temperature sealer for anodic oxide film of aluminum and aluminum alloy and sealing method thereof |
| CN102666940A (en) * | 2009-12-25 | 2012-09-12 | 富士胶片株式会社 | Insulated substrate, process for production of insulated substrate, process for formation of wiring line, wiring substrate, and light-emitting element |
| CN102888644A (en) * | 2011-07-18 | 2013-01-23 | 汉达精密电子(昆山)有限公司 | Anode treatment method of aluminium alloy |
Non-Patent Citations (3)
| Title |
|---|
| 余祖孝等: "铝阳极氧化膜不同封孔方法的耐腐蚀性能研究", 《轻合金加工技术》 * |
| 卫晏华: "铝型材阳极氧化生产工艺探讨", 《有色金属加工》 * |
| 李启征等: "复合封孔对铸铝阳极氧化膜耐蚀性的影响", 《材料保护》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017161580A1 (en) * | 2016-03-25 | 2017-09-28 | 深圳市恒兆智科技有限公司 | Alkali etching agent for aluminum material and alkali etching preprocessing method for aluminum material |
| CN113366141A (en) * | 2018-12-21 | 2021-09-07 | 旭硝子欧洲玻璃公司 | Method for metal coating |
| CN110983412A (en) * | 2019-03-26 | 2020-04-10 | 丹东思诚科技有限公司 | Application of hard aluminum oxide film prepared based on in-situ generation method in aluminum-shell lithium battery insulation sealing |
| CN110983412B (en) * | 2019-03-26 | 2022-03-29 | 国研新能(深圳)技术有限公司 | Application of hard aluminum oxide film prepared based on in-situ generation method in aluminum-shell lithium battery insulation sealing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Liu et al. | High-performance, ultra-flexible and transparent embedded metallic mesh electrodes by selective electrodeposition for all-solid-state supercapacitor applications | |
| CN102256441A (en) | Metal substrate of heat conducting aluminium-based core and preparation method thereof | |
| EP1991720A1 (en) | Anodised aluminium, dielectric, and method | |
| CN101728011A (en) | Copper wire with insulating layer and manufacture method thereof | |
| CN104451818A (en) | Insulating metal plate and preparation method thereof | |
| CN102262989A (en) | Method for manufacturing anodic aluminum oxide template and method for manufacturing field emission cathode array material by using template | |
| CN106531949B (en) | A kind of solid-State Thin Film Li-Ion Batteries tab outbound course of rising structure | |
| CN102655714A (en) | Manufacturing process of metal substrate high-conductivity metal base circuit board | |
| CN104562110A (en) | Aluminum-based nickel-zinc-plated graphene thin film material with high heat conduction performance and corrosion resistance and preparation method for graphene thin film material | |
| JP2017011049A (en) | Insulation circuit board, and power semiconductor device using the same | |
| CN103035831B (en) | The manufacture method of LED aluminum base plate insulating barrier | |
| Lee et al. | Heat dissipation performance of metal-core printed circuit board prepared by anodic oxidation and electroless deposition | |
| CN105472899A (en) | Manufacturing method for graphene printed circuit board | |
| JPWO2016098865A1 (en) | Multilayer wiring board | |
| CN105483781A (en) | Method for preparing super-hydrophobic copper surface by combining electro-deposition with CVD | |
| CN111455384A (en) | Copper-clad plate with heat dissipation function and manufacturing method thereof | |
| CN202018886U (en) | Composite film medium filter capacitor | |
| CN114449744B (en) | Manufacturing method of high-heat-dissipation circuit board and high-heat-dissipation circuit board | |
| CN106982514B (en) | Single-layer multi-material conductive circuit board and preparation method thereof | |
| JP6107195B2 (en) | Method for manufacturing aluminum conductive member | |
| CN105489900A (en) | Preparation method of current collector for lithium-ion battery | |
| KR101372429B1 (en) | Heat dissipation sheet and method for producing heat dissipation sheet | |
| CN102740593A (en) | Circuit board for dissipating heat of LED (light emitting diode) and manufacture method of circuit board | |
| CN109411429A (en) | Intelligent power module and preparation method, electric appliance | |
| CN102945921A (en) | Light-emitting diode (LED) substrate radiating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150325 |
|
| WD01 | Invention patent application deemed withdrawn after publication |