CN103014401B - Novel aurum alloy and preparation method for same - Google Patents
Novel aurum alloy and preparation method for same Download PDFInfo
- Publication number
- CN103014401B CN103014401B CN201210513938.4A CN201210513938A CN103014401B CN 103014401 B CN103014401 B CN 103014401B CN 201210513938 A CN201210513938 A CN 201210513938A CN 103014401 B CN103014401 B CN 103014401B
- Authority
- CN
- China
- Prior art keywords
- alloy
- preparation
- shaped
- aurum
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The invention discloses a novel aurum-bismuth-germanium-tin alloy of precious metals and a preparation method for the same, and belongs to the field of electronic packaging materials. The aurum alloy comprises the following chemical ingredients in percentage by weight (wt%): 1.0-10.0% wt% of Bi, 1.0-10.0% wt% of Ge, 1.0-10.0% wt% of Sn, 1.0-5.0 wt% of Sb, 1.0-5.0 wt% of Se, 0.1-1.0 wt% of Pd, 0.1-1.0 wt% of La, 0.1-1.0 wt% of In and the balance of Au. The preparation method comprises the following steps of: proportioning the alloy elements of aurum (Au), bismuth (Bi), germanium (Ge), tin (Sn), stibonium (Sb), selenium (Se), palladium (Pd), lanthanum (La), indium (In) and the like in a chemical ingredient design prescription ratio of the alloy; preparing an Au-Bi-Ge-Sn-Sb-Se-Pd-La-In multi-element alloy in a vacuum high-frequency smelting furnace or a vacuum intermediate-frequency smelting furnace; machining the alloy via the processes of casting forming, rolling, drawing, heat treatment and the like, thereby obtaining the finished products which are sheet-shaped, plate-shaped, bar-shaped, wire-shaped and the like. The alloy has the characteristics of being good in wettability, low in melting point, corrosion-resistant, non-toxic, non-irritant to human body and the like, is mainly applied to packaging for semiconductor devices, integrated circuits, module circuits and the like and to welding for the devices, and is wide in application prospect.
Description
Technical field
The present invention relates to precious metal new type alloy and preparation method thereof, belong to electronic package material field.
Background technology
Development along with microelectronics, photoelectron, computer and semicon industry, super large-scale integration and high speed integrated circuit, mainly, towards high-density, small volume, complete, the intelligent high future development of function, this has higher requirement to the highly reliable packaged material of au-alloy.Because au-alloy has high chemical stability, good welding property, high reliability, is therefore widely used in the welding of the encapsulation such as semiconducter device, unicircuit, modular circuit and corresponding device.
For used for packing material au-alloy, must meet following basic demand: (1) is good to the wettability of mother metal, fillibility is good, fusing point is low; (2) chemical stability is high; (3) there is high erosion resistance and nontoxicity, non-stimulated to tissue, environmentally safe and broken ring; (4) there is high Physical and mechanical properties, as high-density, high rigidity, high strength, wear resistance etc.; (5) processing characteristics having had, as easy casting, good plasticity and processability; (6) by adding multicomponent alloy element when improving alloy property, the precious metal element of alternative costliness, reduces material cost, saves Precious Metals Resources, realizes the efficient and rational utilization of precious metal material.
Gold utensil has good erosion resistance, as anti-oxidant, anti-sulfuration and salt water resistance corrosion etc.; In the temperature range of 500 ℃～1000 ℃, all there is high stability, fusing point high (1063 ℃), saturated vapo(u)r forces down, and wear resistance is good; Au-alloy scolder, in welding process, in order to improve welding quality, and has added other alloying element, and soldered component relies on the solder of fusing to couple together, and the quality and performance at soldering position depends primarily on solder quality.For Electronic Packaging alloy material, meeting that resistance to air loss is good, resistance to sudden heating is strong, sealing strength high in, also should possess the requirement of spatter property and splatter.For the polynary system eutectic alloy forming, there is the features such as fusing point is low, good fluidity, rapid solidification homogeneous microstructure, compared with traditional electrical sedimentation, ordinary casting method, the cold rolling composite algorithm of lamination, electroplating deposition method etc., alloy structure homogeneity improves, over-all properties is obviously improved, manufacturing process reduces, tooling cost reduces, and yield rate improves, and is more adapted to the needs of mass production.
Summary of the invention
New type alloy of the present invention, is characterized in that its Chemical Composition (% by weight) is: 1.0～10.0Bi, and 1.0～10.0Ge, 1.0～10.0Sn, 1.0～5.0Sb, 1.0～5.0Se, 0.1～1.0Pd, 0.1～1.0La, 0.1～1.0In, surplus is Au.
Alloy material of the present invention, its Chemical Composition weight percent is: 1.0～10.0%Bi, 1.0～10.0%Ge, 1.0～10.0Sn, 1.0～5.0%Sb, 1.0～5.0%Se, 0.1～1.0Pd, 0.1～1.0La, 0.1～1.0%In, surplus is Au.
The preparation method of alloy material of the present invention, sequentially comprises following step of preparation process:
(1) select the alloy raw material of purity >99.99%, according to the weight percent of alloy Composition Design: 1.0～10.0%Bi, 1.0～10.0%Ge, 1.0～10.0Sn, 1.0～5.0%Sb, 1.0～5.0%Se, 0.1～1.0Pd, 0.1～1.0La, 0.1～1.0%In, surplus is Au, after batching, frequently alloying or in high-frequency melting furnace in a vacuum, vacuum tightness: >1 * 10
-3pa;
(2) until melt temperature of superheat, reach after 100 ℃～200 ℃, keep 5～10 minutes, carrying out vacuum pouring is sheet material, bar or ingot casting, and the rapid solidification rate of cooling of melt is >1 * 10
4k/s;
(3) finally prepare AuBiGeSnSbSePdLaIn polynary system precious metal alloys material;
Alloy ingot blank weight is 100g～1000g, oxygen level <0.01%;
Alloy is processed by casting forming, rolling, drawing, thermal treatment process, and net shape is sheet, tabular, bar-shaped or thread finished product.
Described board dimension is: thickness 6～10mm, width 40～80mm; Bar size is: diameter Ф 8～Ф 16mm; Ingot casting is of a size of: diameter Ф 20～Ф 40mm.
Because the fusing point of palladium is 1552 ℃, there is good anti-cure, wear resistance and processing characteristics.Find after deliberation, other alloy adds element can put forward heavy alloyed wettability, oxidation-resistance etc., such as dosing the alloying elements such as Bi, Ge, Sn, Sb, Se, La, In, can reduce alloy melting point, be conducive to put forward the performances such as heavy alloyed physics, chemistry, mechanics, and the organizing crystal grain, improve liquidity and wetting property of refinement alloy, formed multicomponent alloy material is the material of high welding performance, highly corrosion resistant, is the electronic package material of a class character excellence.
For the corrosion resistance nature of au-alloy, when gold content is greater than 50%, alloy demonstrates good solidity to corrosion in various corrosive mediums, while adding palladium in au-alloy, can further carry heavy alloyed corrosion resistance nature.Many experimental results show, golden palladium is associated gold and by nitric acid, is not corroded.
Therefore, the Nomenclature Composition and Structure of Complexes of design AuBiGeSnSbSePdLaIn polynary system precious metal alloys material, adopt vacuum high-frequency or mid-frequency melting furnace to prepare alloy, again by processes such as rapid solidification cast molding, rolling, drawing, thermal treatments, prepare new type alloy, there is important theory and application value.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail.
The preparation method of au-alloy of the present invention, sequentially comprises following step of preparation process:
(1) select the alloy raw material of purity >99.99%, according to the weight percent of alloy Composition Design: 1.0～10.0%Bi, 1.0～10.0%Ge, 1.0～10.0Sn, 1.0～5.0%Sb, 1.0～5.0%Se, 0.1～1.0Pd, 0.1～1.0La, 0.1～1.0%In, surplus is Au, and batching is frequency or the interior alloying of high-frequency melting furnace in a vacuum, vacuum tightness: >1 * 10
-3pa.
(2) until melt temperature of superheat, reach after 100 ℃～200 ℃, keep 5～10 minutes, carrying out vacuum pouring is sheet material, bar and ingot casting etc.Board dimension is: thickness 6～10mm, width 40～80mm; Bar size is: diameter Ф 8～Ф 16mm; Ingot casting is of a size of: diameter Ф 20～Ф 40mm; The rapid solidification rate of cooling of melt is >1 * 10
4k/s.
(3) finally prepare AuBiGeSnSbSePdLaIn polynary system precious metal alloys material.
(4) alloy ingot blank weight is 100g～1000g, oxygen level <0.01%;
(5) alloy is by processes such as casting formings, rolling, drawing, thermal treatment, and net shape is sheet, the finished product such as tabular, bar-shaped, thread.
The concrete enforcement of new type alloy material of the present invention is classified as: the fusing point of material, density, tensile strength, unit elongation, hardness and resistivity etc., and specifically as shown in table 1.
The physics of table 1. au-alloy, mechanics and electric property
Claims (3)
1. an alloy material, is characterized in that its Chemical Composition weight percent is: 1.0～10.0%Bi, and 1.0～10.0%Ge, 1.0～10.0Sn, 1.0～5.0%Sb, 1.0～5.0%Se, 0.1～1.0Pd, 0.1～1.0La, 0.1～1.0%In, surplus is Au.
2. a preparation method for alloy material, is characterized in that comprising following step of preparation process:
(1) select the alloy raw material of purity >99.99%, according to the weight percent of alloy Composition Design: 1.0～10.0%Bi, 1.0～10.0%Ge, 1.0～10.0Sn, 1.0～5.0%Sb, 1.0～5.0%Se, 0.1～1.0Pd, 0.1～1.0La, 0.1～1.0%In, surplus is Au, after batching, frequently alloying or in high-frequency melting furnace in a vacuum, vacuum tightness: >1 * 10
-3pa;
(2) until melt temperature of superheat, reach after 100 ℃～200 ℃, keep 5～10 minutes, carrying out vacuum pouring is sheet material, bar or ingot casting, and the rapid solidification rate of cooling of melt is >1 * 10
4k/s;
(3) finally prepare AuBiGeSnSbSePdLaIn polynary system precious metal alloys material;
(4) alloy ingot blank weight is 100g～1000g, oxygen level <0.01%;
(5) alloy is processed by casting forming, rolling, drawing, thermal treatment process, and net shape is sheet, tabular, bar-shaped or thread finished product.
3. the preparation method of a kind of alloy material according to claim 2, is characterized in that: described board dimension is: thickness 6～10mm, width 40～80mm; Bar size is: diameter Ф 8～Ф 16mm; Ingot casting is of a size of: diameter Ф 20～Ф 40mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210513938.4A CN103014401B (en) | 2012-12-05 | 2012-12-05 | Novel aurum alloy and preparation method for same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210513938.4A CN103014401B (en) | 2012-12-05 | 2012-12-05 | Novel aurum alloy and preparation method for same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103014401A CN103014401A (en) | 2013-04-03 |
| CN103014401B true CN103014401B (en) | 2014-12-03 |
Family
ID=47963511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210513938.4A Expired - Fee Related CN103014401B (en) | 2012-12-05 | 2012-12-05 | Novel aurum alloy and preparation method for same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103014401B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101839876B1 (en) * | 2015-04-09 | 2018-03-20 | 한국전자통신연구원 | Noble metal material for 3-dimension printing, method for fabricating the same, and method for printing using the same |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10612112B2 (en) * | 2015-04-09 | 2020-04-07 | Electronics And Telecommunications Research Institute | Noble metal material for 3-dimensional printing, method for manufacturing the same, and method for 3-dimensional printing using the same |
| CN108091631A (en) * | 2017-12-13 | 2018-05-29 | 汕头市骏码凯撒有限公司 | The compound bonding wire of billon and its manufacturing method with golden clad |
| CN111199940B (en) * | 2018-11-16 | 2022-03-25 | 泰州友润电子科技股份有限公司 | Coating material coating method for lead frame |
| CN109750182A (en) * | 2019-03-25 | 2019-05-14 | 杭州辰卓科技有限公司 | A kind of billon used for electronic packaging and technique having reuse and high-damping |
| CN113000601B (en) * | 2021-01-21 | 2023-05-23 | 西安诺博尔稀贵金属材料股份有限公司 | Method for preparing gold-tin alloy foil |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3211703A1 (en) * | 1982-03-30 | 1983-10-20 | C. Hafner GmbH + Co., 7530 Pforzheim | Use of low-gold noble-metal alloys for dental purposes |
| CN1507499A (en) * | 2001-05-28 | 2004-06-23 | ����Τ�����ʹ�˾ | Compositions, methods and devices for high temperature lead-free solder |
| CN101948965A (en) * | 2010-07-27 | 2011-01-19 | 昆明贵金属研究所 | Novel platinum alloy electrical contact material and preparation method thereof |
| CN102083582A (en) * | 2008-07-24 | 2011-06-01 | 田中贵金属工业株式会社 | Au-Ga-In brazing filler metal |
-
2012
- 2012-12-05 CN CN201210513938.4A patent/CN103014401B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3211703A1 (en) * | 1982-03-30 | 1983-10-20 | C. Hafner GmbH + Co., 7530 Pforzheim | Use of low-gold noble-metal alloys for dental purposes |
| CN1507499A (en) * | 2001-05-28 | 2004-06-23 | ����Τ�����ʹ�˾ | Compositions, methods and devices for high temperature lead-free solder |
| CN102083582A (en) * | 2008-07-24 | 2011-06-01 | 田中贵金属工业株式会社 | Au-Ga-In brazing filler metal |
| CN101948965A (en) * | 2010-07-27 | 2011-01-19 | 昆明贵金属研究所 | Novel platinum alloy electrical contact material and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101839876B1 (en) * | 2015-04-09 | 2018-03-20 | 한국전자통신연구원 | Noble metal material for 3-dimension printing, method for fabricating the same, and method for printing using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103014401A (en) | 2013-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103014401B (en) | Novel aurum alloy and preparation method for same | |
| CN102601542B (en) | A kind of brazing solder alloy | |
| JP6423447B2 (en) | Lead-free eutectic solder alloy containing zinc as the main component and aluminum as alloying metal | |
| US8845828B2 (en) | Pb-free solder alloy mainly containing Zn | |
| CN101716703B (en) | Low-silver SnAgCuBi series lead-free solder alloy and preparation method thereof | |
| KR20150114381A (en) | Alloys | |
| CN108161274A (en) | It is a kind of for sealing-in solder of electron tube and preparation method thereof | |
| JP2007301570A (en) | Solder alloy | |
| CN102581516A (en) | Super-plastic copper and phosphorous welding rod and preparation method thereof | |
| JP5962461B2 (en) | Au-Ge-Sn solder alloy | |
| CN103624415A (en) | Boron-containing stannum-based lead-free solder and manufacturing method thereof | |
| JP5672132B2 (en) | Pb-free solder alloy mainly composed of Zn and method for producing the same | |
| Liu et al. | Interfacial reactions between Sn–8Zn–3Bi–xNi lead-free solders and Cu substrate during isothermal aging | |
| US20160234945A1 (en) | Bi-BASED SOLDER ALLOY, METHOD OF BONDING ELECTRONIC COMPONENT USING THE SAME, AND ELECTRONIC COMPONENT-MOUNTED BOARD | |
| JP6136878B2 (en) | Bi-based solder alloy, method for manufacturing the same, electronic component bonding method using the same, and electronic component mounting board | |
| CN112222552B (en) | Gamma electrode wire and preparation method thereof | |
| JP5979083B2 (en) | Pb-free Au-Ge-Sn solder alloy | |
| Hasan et al. | Microstructure and Bulk Material Properties of Zn-Al Alloys as an Exciting Replacement of Lead Based High Temperature Interconnect Materials | |
| JP5652001B2 (en) | Pb-free solder alloy based on Zn | |
| Hanim et al. | Intermetallic evolution for isothermal aging up to 2000 hours on sn-4ag-0.5 cu and sn-37pb solders with ni/au layers | |
| JP6128062B2 (en) | Au-Ge-Sn solder alloy | |
| JP2017035708A (en) | Sb-Cu SOLDER ALLOY CONTAINING NO Pb | |
| JP2018149554A (en) | Pb-FREE Bi SOLDER ALLOY, ELECTRONIC COMPONENT PREPARED WITH THE SAME, AND ELECTRONIC COMPONENT-MOUNTING SUBSTRATE | |
| Xiao et al. | Study on interface of Sn-Ag-Zn lead free solder with low silver content | |
| JP2015020189A (en) | Pb-FREE Au-Ge-Sn-BASED SOLDER ALLOY MAINLY CONTAINING Au |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20130403 Assignee: Kunming Guiyan New Material Technology Co.,Ltd. Assignor: Kunming Institute of Precious Metals Contract record no.: X2019530000002 Denomination of invention: Gold alloy and preparation method thereof Granted publication date: 20141203 License type: Common License Record date: 20190929 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141203 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |