CN108091631A - The compound bonding wire of billon and its manufacturing method with golden clad - Google Patents
The compound bonding wire of billon and its manufacturing method with golden clad Download PDFInfo
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- CN108091631A CN108091631A CN201711332193.0A CN201711332193A CN108091631A CN 108091631 A CN108091631 A CN 108091631A CN 201711332193 A CN201711332193 A CN 201711332193A CN 108091631 A CN108091631 A CN 108091631A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 229910052737 gold Inorganic materials 0.000 claims abstract description 129
- 239000010931 gold Substances 0.000 claims abstract description 129
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 122
- 229910052738 indium Inorganic materials 0.000 claims abstract description 23
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 15
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 13
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 9
- 239000000654 additive Substances 0.000 claims abstract description 8
- 238000000137 annealing Methods 0.000 claims description 96
- 238000000034 method Methods 0.000 claims description 52
- 238000005491 wire drawing Methods 0.000 claims description 34
- 238000001994 activation Methods 0.000 claims description 32
- 239000005416 organic matter Substances 0.000 claims description 32
- 238000004140 cleaning Methods 0.000 claims description 26
- 238000009713 electroplating Methods 0.000 claims description 22
- 239000007788 liquid Substances 0.000 claims description 22
- 238000012545 processing Methods 0.000 claims description 22
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 16
- 238000001035 drying Methods 0.000 claims description 16
- XTLNYNMNUCLWEZ-UHFFFAOYSA-N ethanol;propan-2-one Chemical compound CCO.CC(C)=O XTLNYNMNUCLWEZ-UHFFFAOYSA-N 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 10
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 8
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical group [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 8
- 230000003247 decreasing effect Effects 0.000 claims description 8
- 235000019441 ethanol Nutrition 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 8
- 230000008018 melting Effects 0.000 claims description 8
- 229910017604 nitric acid Inorganic materials 0.000 claims description 8
- 229910052700 potassium Inorganic materials 0.000 claims description 8
- 239000011591 potassium Substances 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 8
- 238000005266 casting Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000007654 immersion Methods 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- 238000005987 sulfurization reaction Methods 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 7
- 239000003963 antioxidant agent Substances 0.000 abstract description 6
- 230000003078 antioxidant effect Effects 0.000 abstract description 6
- 235000006708 antioxidants Nutrition 0.000 abstract description 6
- 238000005253 cladding Methods 0.000 description 15
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 9
- 239000002352 surface water Substances 0.000 description 6
- 230000035939 shock Effects 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000004626 scanning electron microscopy Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000004073 vulcanization Methods 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Natural products CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/48—Electroplating: Baths therefor from solutions of gold
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4889—Connection or disconnection of other leads to or from wire-like parts, e.g. wires
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrochemistry (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
A kind of compound bonding wire of billon with golden clad, it is characterised in that including cored wire and the golden clad being coated on outside cored wire；For the cored wire by weight containing Ag 25 49%, Pd 0.2 5%, In 0.5 2%, 2 200 ppm of trace additives, surplus is gold；The trace additives are the combinations of one or both of Ca and Be；The thickness of the gold clad is 20 200nm.The present invention also provides a kind of manufacturing methods of the above-mentioned compound bonding wire of billon with golden clad.The compound bonding wire of billon of the present invention can effectively improve the anti-oxidant and sulfuration resistant performance of wire rod, two weldering pulling force and a weldering pulling force can be increased, can effectively promote the bonding wire workability of billon, the adhesion property of wire rod and chip and substrate can be enhanced, it is promoted and trusts performance, and cost can be reduced.
Description
Technical field
The present invention relates to the bonding wires of IC, LED encapsulation, and in particular to a kind of billon compound keys with golden clad
Plying and its manufacturing method.
Background technology
Bonding wire（Bonding wire, also known as bonding line）It is connection chip and outer enclosure substrate（substrate）With/
Or multilayer circuit board（PCB）Main connection mode.
Traditional gold bonding silk made of proof gold material possesses excellent chemical stability and electrical and thermal conductivity performance,
Thus it is widely used as IC leads.But with rising steadily for international price of gold, the price also rising all the way of gold bonding silk is led
The cost for causing end product is excessively high, is unfavorable for enterprise and improves competitiveness.In addition, the tensile strength of gold bonding silk is relatively low（Example
Such as 20 microns of gold bonding silk of diameter, after welding, maximum pulling strength is less than 5 gram forces）, elongation percentage is not easily controlled.With
Upper two aspects factor, which becomes, hinders gold bonding silk using the bottleneck with development.To solve disadvantages described above, new bonding need to be developed
Silk.
The content of the invention
The technical problems to be solved by the invention be to provide a kind of compound bonding wire of billon with golden clad and
The manufacturing method of this compound bonding wire of billon, this compound bonding wire of billon can effectively improve the anti-oxidant of wire rod and
Sulfuration resistant performance can increase by two weldering pulling force and a weldering pulling force, can effectively promote the bonding wire workability of billon, can enhance wire rod with
The adhesion property of chip and substrate is promoted and trusts performance, and can reduce cost.The technical solution of use is as follows：
A kind of compound bonding wire of billon with golden clad, it is characterised in that including cored wire and the gold being coated on outside cored wire
Clad；The cored wire contains Ag 25-49%, Pd 0.2-5%, In 0.5-2%, trace additives 2-200 by weight
Ppm, surplus are gold；The trace additives are the combinations of one or both of Ca and Be；The thickness of the gold clad
For 20-200nm.
The present invention promotes the tensile strength of wire rod by the control of element of cored wire；Proof gold is coated on the surface of cored wire simultaneously,
The problem of billon solder joint associativity can be improved, also promotes the oxidation resistance of wire rod and sulfuration resistant ability, so as to obtain solder joint
The compound bonding wire of billon that zygosity is good, anti-oxidant sulfuration resistant ability is strong, tensile strength is high.Compared with proof gold bonding wire
Speech during the compound bonding wire of billon of the invention encapsulates for IC, LED, can reduce cost and improve gold line tensile strength not
The problem of sufficient, and other performances can reach the performance requirement of proof gold bonding wire.
In the compound bonding wire of billon of the present invention, in cored wire except for gold, the also silver containing 25-49%, silver and gold
It can fully be dissolved, play the role of solution strengthening, improve the tensile strength of wire rod, but since silver itself is easily aoxidized and vulcanized,
Can cause wire rod in terms of the workability and reliability in terms of all Shortcomings, therefore add in Ca and/or Be on this basis, can have
Effect ground improves the anti-oxidant and sulfuration resistant performance of wire rod.In has wettability effect, can increase by two weldering pulling force and a weldering pulling force, energy
The bonding wire workability of billon is effectively promoted, the adhesion property of wire rod and chip and substrate can be enhanced, promoted and trust performance.In core
Line surface sets golden clad, can effectively play the characteristic of gold, further functions as the effect of anti-oxidant and sulfuration resistant；Moreover, because
Wire surface is coated with layer gold, can effectively promote wire rod and chip and the joint capacity of substrate, effectively promote reliability.
It is preferred that it is 99% that above-mentioned gold cladding composition of layer, which is purity,（2N）-99.99%（4N）Gold.
The present invention also provides a kind of manufacturing method of the above-mentioned compound bonding wire of billon with golden clad, feature exists
In comprising the following steps：
（1）Founding：Ag, Pd, In and trace additives are added in golden raw material in proportion, connected by vacuum melting and orientation
It is continuous to draw casting process, obtain core wires 6-8 millimeters a diameter of；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain the bonding wire cored wire of a diameter of 50-280um；
（3）Using electroplating technology in step（2）Gold plate is formed on the bonding wire cored wire surface of acquisition, the thickness of gold plate is
150-500nm；
（4）To step（3）The obtained bonding wire cored wire for being coated with gold plate continues wire drawing, obtains a diameter of 15-40 um
The compound bonding wire of billon, and the thickness of gold plate is made to be decreased to 20-200nm；
（5）Finally anneal：Step（4）After the completion of wire drawing, finally annealed to the compound bonding wire of billon, in annealing process
Using N2Come as annealing atmosphere, annealing furnace effective length is 600-1000mm, and annealing temperature is 300-600 DEG C, annealing rate
For 60-120m/min；
（6）Cooling：After finally annealing, the compound bonding wire of billon is cooled to 20-30 DEG C, obtains required there is Jin Bao
The compound bonding wire of billon of coating.
In above-mentioned manufacturing method, gold plate is formed when wire drawing is to line footpath 50-280um, afterwards again wire drawing to line footpath 15-40
Um can effectively control the uniformity of golden coating thickness on the compound bonding wire of finished product billon；In addition, in line footpath 50-280um
Para-linkage silk cored wire is electroplated, and efficiency is higher, and cost is relatively low, wire surface in order, therefore prepared finished product gold close
The golden clad uniformity of the compound bonding wire of gold is good, and bonding wire workability and reliability are all more preferably.
It is preferred that above-mentioned steps（2）In drawing process, intermediate annealing several times is carried out to wire rod, is used in annealing process
N2As annealing atmosphere, annealing furnace effective length is 600-2000mm, and annealing temperature is 500-800 DEG C, annealing rate 30-
100m/min。
It is preferred that above-mentioned steps（3）In electroplating technology comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The bonding wire cored wire of acquisition immerses the acetone ethanol that temperature is 70-150 DEG C
In mixed liquor, it is 1.4-8 seconds to immerse the time, the organic matter on removing bonding wire cored wire surface；Third in the acetone ethanol mixed liquor
The weight ratio of ketone and ethyl alcohol is 1:5-10；
（3-2）Remove oxide process：It it is 70-150 DEG C, again by the bonding wire cored wire immersion temperature by removing organic matter processing
It measures in the nitric acid that percent concentration is 30-50%, it is 1.4-8 seconds to immerse the time, the oxide on removing bonding wire cored wire surface；
（3-3）Surface activation process：It is 70-150 DEG C, weight by temperature is immersed by the bonding wire cored wire of removing oxide process
Percent concentration is in the sulfuric acid of 10-30%, and it is 1.4-8 seconds to immerse the time, and para-linkage silk cored wire carries out surface activation process；
（3-4）It is gold-plated：Bonding wire cored wire Jing Guo surface activation process is immersed in the gold plating liquid that concentration is 2-4g/L, electroplated
Electric current is gold-plated under conditions of being 0.2-0.8A, and the gold plate that thickness is 150-500nm is formed on the surface of bonding wire cored wire, should
Gold plate coats bonding wire cored wire；
（3-5）Cleaning：Using pure water as cleaning solution, ultrasonic cleaning is carried out to the bonding wire cored wire for being coated with gold plate；
（3-6）Drying：The water being attached on gold plate surface is blown away using air knife；
When being electroplated, with the continuous release steps of the speed of 5-30m/min（2）The bonding wire cored wire of acquisition, bonding wire cored wire according to
It is secondary to be handled, after removing oxide process, surface activation process, gold-plated, cleaning and drying by above-mentioned removing organic matter, it is wrapped
It is covered with the bonding wire cored wire of gold plate and take-up.
It is preferred that above-mentioned steps（3-4）In, the gold plating liquid of use is potassium auricyanide solution.
It is preferred that above-mentioned steps（3-5）In, using pure water as cleaning solution, two are carried out to the bonding wire cored wire for being coated with gold plate
Road ultrasonic cleaning.
It is preferred that above-mentioned steps（3-6）In, air knife air-flow is N2, flow velocity 5-20L/min.
The compound bonding wire of billon of the present invention compared with prior art, has the advantages that：
（1）By gold plate cladding possess special elements combine billon cored wire, can effectively improve the anti-oxidant of wire rod and
Sulfuration resistant performance；
（2）By principal component institute added elements, two weldering pulling force and a weldering pulling force can be increased, can effectively promote the bonding wire operation of billon
Property, the adhesion property of wire rod and chip and substrate can be enhanced, promoted and trust performance.
（3）Cost is relatively low.
Specific embodiment
Embodiment 1
The present embodiment has the gold cladding that the compound bonding wire of billon of golden clad includes cored wire and is coated on outside cored wire
Layer；Cored wire is by weight containing Ag 35%, and Pd 3%, In 1%, Ca 50 ppm of 50 ppm, Be, surplus is gold；Golden clad
Thickness be 40nm.
In the present embodiment, the manufacturing method with the compound bonding wire of billon of golden clad comprises the following steps：
（1）Founding：Ag, Pd, In, Ca and Be are added in golden raw material in proportion, continuously draw casting by vacuum melting and orientation
Technique obtains a diameter of 8 millimeters of core wires；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain the bonding wire cored wire of a diameter of 100um；
This step（2）In, in drawing process, intermediate annealing several times is carried out to wire rod, N is used in annealing process2As
Annealing atmosphere, annealing furnace effective length are 950mm, and annealing temperature is 600 DEG C, annealing rate 50m/min；
（3）Using electroplating technology in step（2）Gold plate is formed on the bonding wire cored wire surface of acquisition, the thickness of gold plate is
200nm；
（4）To step（3）The obtained bonding wire cored wire for being coated with gold plate continues wire drawing, obtains a diameter of 20 um's
The compound bonding wire of billon, and the thickness of gold plate is made to be decreased to 40nm；
（5）Finally anneal：Step（4）After the completion of wire drawing, finally annealed to the compound bonding wire of billon, in annealing process
Using N2Come as annealing atmosphere, annealing furnace effective length is 800mm, and annealing temperature is 500 DEG C, annealing rate 80m/min；
（6）Cooling：After finally annealing, the compound bonding wire of billon is cooled to 25 DEG C, obtains required there is gold cladding
The compound bonding wire of billon of layer.
Above-mentioned steps（3）In electroplating technology comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The bonding wire cored wire of acquisition, which immerses the acetone ethanol that temperature is 110 DEG C, to be mixed
It closes in liquid, it is 2.5 seconds to immerse the time, the organic matter on removing bonding wire cored wire surface；In the acetone ethanol mixed liquor acetone with
The weight ratio of ethyl alcohol is 1:7.5；
（3-2）Remove oxide process：It is 110 DEG C, weight by temperature is immersed by the bonding wire cored wire of removing organic matter processing
Percent concentration is in 45% nitric acid, and it is 2.5 seconds to immerse the time, the oxide on removing bonding wire cored wire surface；
（3-3）Surface activation process：It is 110 DEG C, weight hundred by temperature is immersed by the bonding wire cored wire of removing oxide process
Divide in the sulfuric acid that specific concentration is 18%, it is 2.5 seconds to immerse the time, and para-linkage silk cored wire carries out surface activation process；
（3-4）It is gold-plated：Bonding wire cored wire Jing Guo surface activation process is immersed in the gold plating liquid that concentration is 3g/L（The plating of use
Golden liquid is potassium auricyanide solution）, it is gold-plated under conditions of electroplating current is 0.5A, form thickness on the surface of bonding wire cored wire
For the gold plate of 200nm, which coats bonding wire cored wire；
（3-5）Cleaning：Using pure water as cleaning solution, twice ultrasonic cleaning is carried out to the bonding wire cored wire for being coated with gold plate；
（3-6）Drying：Utilize air knife（Air knife air-flow is N2, flow velocity 12L/min）It blows away and is attached on gold plate surface
Water；
When being electroplated, with the continuous release steps of the speed of 18m/min（2）The bonding wire cored wire of acquisition, bonding wire cored wire is successively
After the processing of above-mentioned removing organic matter, removing oxide process, surface activation process, gold-plated, cleaning and drying, coated
There are the bonding wire cored wire of gold plate and take-up.
Embodiment 2
The present embodiment has the gold cladding that the compound bonding wire of billon of golden clad includes cored wire and is coated on outside cored wire
Layer；Cored wire is by weight containing Ag 25%, and 20 ppm of Pd 5%, In 0.6%, Ca, surplus is gold；The thickness of golden clad is
60nm。
In the present embodiment, the manufacturing method with the compound bonding wire of billon of golden clad comprises the following steps：
（1）Founding：Ag, Pd, In and Ca are added in golden raw material in proportion, continuously draw foundry work by vacuum melting and orientation
Skill obtains a diameter of 6 millimeters of core wires；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain the bonding wire cored wire of a diameter of 80um；
This step（2）In, in drawing process, intermediate annealing several times is carried out to wire rod, N is used in annealing process2As
Annealing atmosphere, annealing furnace effective length are 1200mm, and annealing temperature is 550 DEG C, annealing rate 50m/min；
（3）Using electroplating technology in step（2）Gold plate is formed on the bonding wire cored wire surface of acquisition, the thickness of gold plate is
320nm；
（4）To step（3）The obtained bonding wire cored wire for being coated with gold plate continues wire drawing, obtains the gold of a diameter of 15um
The compound bonding wire of alloy, and the thickness of gold plate is made to be decreased to 60nm；
（5）Finally anneal：Step（4）After the completion of wire drawing, finally annealed to the compound bonding wire of billon, in annealing process
Using N2Come as annealing atmosphere, annealing furnace effective length is 800mm, and annealing temperature is 600 DEG C, annealing rate 100m/
min；
（6）Cooling：After finally annealing, the compound bonding wire of billon is cooled to 28 DEG C, obtains required there is gold cladding
The compound bonding wire of billon of layer.
Above-mentioned steps（3）In electroplating technology comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The bonding wire cored wire of acquisition, which immerses the acetone ethanol that temperature is 145 DEG C, to be mixed
It closes in liquid, it is 1.4 seconds to immerse the time, the organic matter on removing bonding wire cored wire surface；In the acetone ethanol mixed liquor acetone with
The weight ratio of ethyl alcohol is 1:6；
（3-2）Remove oxide process：It is 145 DEG C, weight by temperature is immersed by the bonding wire cored wire of removing organic matter processing
Percent concentration is in 48% nitric acid, and it is 1.4 seconds to immerse the time, the oxide on removing bonding wire cored wire surface；
（3-3）Surface activation process：It is 145 DEG C, weight hundred by temperature is immersed by the bonding wire cored wire of removing oxide process
Divide in the sulfuric acid that specific concentration is 30%, it is 1.4 seconds to immerse the time, and para-linkage silk cored wire carries out surface activation process；
（3-4）It is gold-plated：Bonding wire cored wire Jing Guo surface activation process is immersed in the gold plating liquid that concentration is 3.5g/L（It uses
Gold plating liquid is potassium auricyanide solution.）, it is gold-plated under conditions of electroplating current is 0.25A, it is formed on the surface of bonding wire cored wire
Thickness is the gold plate of 320nm, which coats bonding wire cored wire；
（3-5）Cleaning：Using pure water as cleaning solution, twice ultrasonic cleaning is carried out to the bonding wire cored wire for being coated with gold plate；
（3-6）Drying：Utilize air knife（Air knife air-flow is N2, flow velocity 15L/min）It blows away and is attached on gold plate surface
Water；
When being electroplated, with the continuous release steps of the speed of 30m/min（2）The bonding wire cored wire of acquisition, bonding wire cored wire is successively
After the processing of above-mentioned removing organic matter, removing oxide process, surface activation process, gold-plated, cleaning and drying, coated
There are the bonding wire cored wire of gold plate and take-up.
Embodiment 3
The present embodiment has the gold cladding that the compound bonding wire of billon of golden clad includes cored wire and is coated on outside cored wire
Layer；The cored wire is by weight containing Ag 49%, and Pd 1%, In 2%, Ca 10 ppm of 100 ppm, Be, surplus is gold；Jin Bao
The thickness of coating is 80nm.
In the present embodiment, the manufacturing method with the compound bonding wire of billon of golden clad comprises the following steps：
（1）Founding：Ag, Pd, In, Ca and Be are added in golden raw material in proportion, continuously draw casting by vacuum melting and orientation
Technique obtains a diameter of 8 millimeters of core wires；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain the bonding wire cored wire of a diameter of 250um；
This step（2）In, in drawing process, intermediate annealing several times is carried out to wire rod, N is used in annealing process2As
Annealing atmosphere, annealing furnace effective length are 1800mm, and annealing temperature is 650 DEG C, annealing rate 100m/min；
（3）Using electroplating technology in step（2）Gold plate is formed on the bonding wire cored wire surface of acquisition, the thickness of gold plate is
500nm；
（4）To step（3）The obtained bonding wire cored wire for being coated with gold plate continues wire drawing, obtains a diameter of 40 um's
The compound bonding wire of billon, and the thickness of gold plate is made to be decreased to 80nm；
（5）Finally anneal：Step（4）After the completion of wire drawing, finally annealed to the compound bonding wire of billon, in annealing process
Using N2Come as annealing atmosphere, annealing furnace effective length is 700mm, and annealing temperature is 450 DEG C, annealing rate 70m/min；
（6）Cooling：After finally annealing, the compound bonding wire of billon is cooled to 20 DEG C, obtains required there is gold cladding
The compound bonding wire of billon of layer.
Above-mentioned steps（3）In electroplating technology comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The bonding wire cored wire of acquisition immerses the acetone ethanol that temperature is 75 DEG C and mixes
In liquid, it is 7 seconds to immerse the time, the organic matter on removing bonding wire cored wire surface；Acetone and ethyl alcohol in the acetone ethanol mixed liquor
Weight ratio be 1: 9；
（3-2）Remove oxide process：It is 75 DEG C, weight hundred by temperature is immersed by the bonding wire cored wire of removing organic matter processing
Divide in the nitric acid that specific concentration is 35%, it is 7 seconds to immerse the time, the oxide on removing bonding wire cored wire surface；
（3-3）Surface activation process：It is 75 DEG C, weight percent by temperature is immersed by the bonding wire cored wire of removing oxide process
Specific concentration is in 12% sulfuric acid, and it is 7 seconds to immerse the time, and para-linkage silk cored wire carries out surface activation process；
（3-4）It is gold-plated：Bonding wire cored wire Jing Guo surface activation process is immersed in the gold plating liquid that concentration is 2g/L（The plating of use
Golden liquid is potassium auricyanide solution）, it is gold-plated under conditions of electroplating current is 0.8A, form thickness on the surface of bonding wire cored wire
For the gold plate of 500nm, which coats bonding wire cored wire；
（3-5）Cleaning：Using pure water as cleaning solution, twice ultrasonic cleaning is carried out to the bonding wire cored wire for being coated with gold plate；
（3-6）Drying：Utilize air knife（Air knife air-flow is N2, flow velocity 5L/min）It blows away and is attached on gold plate surface
Water；
When being electroplated, with the continuous release steps of the speed of 5m/min（2）The bonding wire cored wire of acquisition, bonding wire cored wire is successively
After the processing of above-mentioned removing organic matter, removing oxide process, surface activation process, gold-plated, cleaning and drying, coated
There are the bonding wire cored wire of gold plate and take-up.
Embodiment 4
The present embodiment has the gold cladding that the compound bonding wire of billon of golden clad includes cored wire and is coated on outside cored wire
Layer；Cored wire is by weight containing Ag 40%, and 80 ppm of Pd 2.5%, In 0.5%, Be, surplus is gold；The thickness of golden clad is
200nm。
In the present embodiment, the manufacturing method with the compound bonding wire of billon of golden clad comprises the following steps：
（1）Founding：Ag, Pd, In and Be are added in golden raw material in proportion, continuously draw foundry work by vacuum melting and orientation
Skill obtains a diameter of 7 millimeters of core wires；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain the bonding wire cored wire of a diameter of 50um；
This step（2）In, in drawing process, intermediate annealing several times is carried out to wire rod, N is used in annealing process2As
Annealing atmosphere, annealing furnace effective length are 1200mm, and annealing temperature is 600 DEG C, annealing rate 60m/min；
（3）Using electroplating technology in step（2）Gold plate is formed on the bonding wire cored wire surface of acquisition, the thickness of gold plate is
500nm；
（4）To step（3）The obtained bonding wire cored wire for being coated with gold plate continues wire drawing, obtains a diameter of 20 um's
The compound bonding wire of billon, and the thickness of gold plate is made to be decreased to 200nm；
（5）Finally anneal：Step（4）After the completion of wire drawing, finally annealed to the compound bonding wire of billon, in annealing process
Using N2Come as annealing atmosphere, annealing furnace effective length is 1000mm, and annealing temperature is 500 DEG C, annealing rate 80m/
min；
（6）Cooling：After finally annealing, the compound bonding wire of billon is cooled to 28 DEG C, obtains required there is gold cladding
The compound bonding wire of billon of layer.
Above-mentioned steps（3）In electroplating technology comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The bonding wire cored wire of acquisition, which immerses the acetone ethanol that temperature is 120 DEG C, to be mixed
It closes in liquid, it is 4 seconds to immerse the time, the organic matter on removing bonding wire cored wire surface；Acetone and second in the acetone ethanol mixed liquor
The weight ratio of alcohol is 1:8；
（3-2）Remove oxide process：It is 120 DEG C, weight by temperature is immersed by the bonding wire cored wire of removing organic matter processing
Percent concentration is in 40% nitric acid, and it is 4 seconds to immerse the time, the oxide on removing bonding wire cored wire surface；
（3-3）Surface activation process：It is 120 DEG C, weight hundred by temperature is immersed by the bonding wire cored wire of removing oxide process
Divide in the sulfuric acid that specific concentration is 15%, it is 4 seconds to immerse the time, and para-linkage silk cored wire carries out surface activation process；
（3-4）It is gold-plated：Bonding wire cored wire Jing Guo surface activation process is immersed in the gold plating liquid that concentration is 3g/L（The plating of use
Golden liquid is potassium auricyanide solution）, it is gold-plated under conditions of electroplating current is 0.5A, form thickness on the surface of bonding wire cored wire
For the gold plate of 500nm, which coats bonding wire cored wire；
（3-5）Cleaning：Using pure water as cleaning solution, twice ultrasonic cleaning is carried out to the bonding wire cored wire for being coated with gold plate；
（3-6）Drying：Utilize air knife（Air knife air-flow is N2, flow velocity 20L/min）It blows away and is attached on gold plate surface
Water；
When being electroplated, with the continuous release steps of the speed of 15m/min（2）The bonding wire cored wire of acquisition, bonding wire cored wire is successively
After the processing of above-mentioned removing organic matter, removing oxide process, surface activation process, gold-plated, cleaning and drying, coated
There are the bonding wire cored wire of gold plate and take-up.
Embodiment 5
The present embodiment has the gold cladding that the compound bonding wire of billon of golden clad includes cored wire and is coated on outside cored wire
Layer；Cored wire is by weight containing Ag 35%, and Pd 3%, In 1%, Ca 60 ppm of 100 ppm, Be, surplus is gold；Gold cladding
The thickness of layer is 30nm.
In the present embodiment, the manufacturing method with the compound bonding wire of billon of golden clad comprises the following steps：
（1）Founding：Ag, Pd, In, Ca and Be are added in golden raw material in proportion, continuously draw casting by vacuum melting and orientation
Technique obtains a diameter of 8 millimeters of core wires；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain the bonding wire cored wire of a diameter of 200um；
This step（2）In, in drawing process, intermediate annealing several times is carried out to wire rod, N is used in annealing process2As
Annealing atmosphere, annealing furnace effective length are 1200mm, and annealing temperature is 800 DEG C, annealing rate 80m/min；
（3）Using electroplating technology in step（2）Gold plate is formed on the bonding wire cored wire surface of acquisition, the thickness of gold plate is
150nm；
（4）To step（3）The obtained bonding wire cored wire for being coated with gold plate continues wire drawing, obtains a diameter of 40 um's
The compound bonding wire of billon, and the thickness of gold plate is made to be decreased to 30nm；
（5）Finally anneal：Step（4）After the completion of wire drawing, finally annealed to the compound bonding wire of billon, in annealing process
Using N2Come as annealing atmosphere, annealing furnace effective length is 800mm, and annealing temperature is 550 DEG C, annealing rate 80m/min；
（6）Cooling：After finally annealing, the compound bonding wire of billon is cooled to 20 DEG C, obtains required there is gold cladding
The compound bonding wire of billon of layer.
Above-mentioned steps（3）In electroplating technology comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The bonding wire cored wire of acquisition immerses acetone ethanol mixing at a temperature of 90 °C
In liquid, it is 5.5 seconds to immerse the time, the organic matter on removing bonding wire cored wire surface；Acetone and second in the acetone ethanol mixed liquor
The weight ratio of alcohol is 1:6；
（3-2）Remove oxide process：It is 90 DEG C, weight hundred by temperature is immersed by the bonding wire cored wire of removing organic matter processing
Divide in the nitric acid that specific concentration is 30%, it is 5.5 seconds to immerse the time, the oxide on removing bonding wire cored wire surface；
（3-3）Surface activation process：It is 90 DEG C, weight percent by temperature is immersed by the bonding wire cored wire of removing oxide process
Specific concentration is in 15% sulfuric acid, and it is 5.5 seconds to immerse the time, and para-linkage silk cored wire carries out surface activation process；
（3-4）It is gold-plated：Bonding wire cored wire Jing Guo surface activation process is immersed in the gold plating liquid that concentration is 3.5g/L（It uses
Gold plating liquid is potassium auricyanide solution）, it is gold-plated under conditions of electroplating current is 0.6A, it is formed on the surface of bonding wire cored wire thick
The gold plate for 150nm is spent, which coats bonding wire cored wire；
（3-5）Cleaning：Using pure water as cleaning solution, twice ultrasonic cleaning is carried out to the bonding wire cored wire for being coated with gold plate；
（3-6）Drying：Utilize air knife（Air knife air-flow is N2, flow velocity 15L/min）It blows away and is attached on gold plate surface
Water；
When being electroplated, with the continuous release steps of the speed of 10m/min（2）The bonding wire cored wire of acquisition, bonding wire cored wire is successively
After the processing of above-mentioned removing organic matter, removing oxide process, surface activation process, gold-plated, cleaning and drying, coated
There are the bonding wire cored wire of gold plate and take-up.
Embodiment 6
The present embodiment has the gold cladding that the compound bonding wire of billon of golden clad includes cored wire and is coated on outside cored wire
Layer；Cored wire is by weight containing Ag 42%, and Pd 0.5%, In 0.6%, Ca 80 ppm of 20 ppm, Be, surplus is gold；Jin Bao
The thickness of coating is 80nm.
In the present embodiment, the manufacturing method with the compound bonding wire of billon of golden clad comprises the following steps：
（1）Founding：Ag, Pd, In, Ca and Be are added in golden raw material in proportion, continuously draw casting by vacuum melting and orientation
Technique obtains a diameter of 6 millimeters of core wires；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain the bonding wire cored wire of a diameter of 200um；
This step（2）In, in drawing process, intermediate annealing several times is carried out to wire rod, N is used in annealing process2As
Annealing atmosphere, annealing furnace effective length are 800mm, and annealing temperature is 700 DEG C, annealing rate 50m/min；
（3）Using electroplating technology in step（2）Gold plate is formed on the bonding wire cored wire surface of acquisition, the thickness of gold plate is
400nm；
（4）To step（3）The obtained bonding wire cored wire for being coated with gold plate continues wire drawing, obtains a diameter of 40 um's
The compound bonding wire of billon, and the thickness of gold plate is made to be decreased to 80nm；
（5）Finally anneal：Step（4）After the completion of wire drawing, finally annealed to the compound bonding wire of billon, in annealing process
Using N2Come as annealing atmosphere, annealing furnace effective length is 900mm, and annealing temperature is 450 DEG C, annealing rate 60m/min；
（6）Cooling：After finally annealing, the compound bonding wire of billon is cooled to 30 DEG C, obtains required there is gold cladding
The compound bonding wire of billon of layer.
Above-mentioned steps（3）In electroplating technology comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The bonding wire cored wire of acquisition, which immerses the acetone ethanol that temperature is 115 DEG C, to be mixed
It closes in liquid, it is 3 seconds to immerse the time, the organic matter on removing bonding wire cored wire surface；Acetone and second in the acetone ethanol mixed liquor
The weight ratio of alcohol is 1:7；
（3-2）Remove oxide process：It is 115 DEG C, weight by temperature is immersed by the bonding wire cored wire of removing organic matter processing
Percent concentration is in 35% nitric acid, and it is 3 seconds to immerse the time, the oxide on removing bonding wire cored wire surface；
（3-3）Surface activation process：It is 115 DEG C, weight hundred by temperature is immersed by the bonding wire cored wire of removing oxide process
Divide in the sulfuric acid that specific concentration is 25%, it is 3 seconds to immerse the time, and para-linkage silk cored wire carries out surface activation process；
（3-4）It is gold-plated：Bonding wire cored wire Jing Guo surface activation process is immersed in the gold plating liquid that concentration is 2g/L（The plating of use
Golden liquid is potassium auricyanide solution）, it is gold-plated under conditions of electroplating current is 0.8A, form thickness on the surface of bonding wire cored wire
For the gold plate of 400nm, which coats bonding wire cored wire；
（3-5）Cleaning：Using pure water as cleaning solution, twice ultrasonic cleaning is carried out to the bonding wire cored wire for being coated with gold plate；
（3-6）Drying：Utilize air knife（Air knife air-flow is N2, flow velocity 12L/min）It blows away and is attached on gold plate surface
Water；
When being electroplated, with the continuous release steps of the speed of 25m/min（2）The bonding wire cored wire of acquisition, bonding wire cored wire is successively
After the processing of above-mentioned removing organic matter, removing oxide process, surface activation process, gold-plated, cleaning and drying, coated
There are the bonding wire cored wire of gold plate and take-up.
The compound bonding wire of billon with golden clad that above example 1-6 is obtained is tested for the property（Comparative example is adopted
With the conventional 80%Au alloy gold wires bought in the market）.
1st, the test method of HAZ length
Embodiment 1-6 and the wire rod of comparative example are subjected to the cutting of FIB (Focused Ion beam) focused ion beam, utilize SEM
(scanning electron microscopy) scanning electron microscope is observed, by comparing the crystal size of different wire positions
Variation, the length information of HAZ can be obtained.
2nd, ageing testing method
Obtained by embodiment 1-6 and comparative example wire rod in the difference of reliability mainly in thermal shock part.Specific degradation item
Part such as table 1.Experiment packing forms be LED encapsulation in SMD2835, BSOB routings, packaging silicon rubber use DOW CORNING OE6650,
For packaged sample after each thermal shock for completing 50 Xun Huans, seeing whether can also be electric bright, records the number for the dead lamp that fails.
Table 1
| Test condition | Duration (Hour)/bout (Cycle) |
| 305 alloy, 8 warm area standard circumfluence welds (265 DEG C) | 1 |
| - 40 DEG C of * 30min-100 DEG C * 30min (conversion time is less than 20 seconds) | 50/100/…/500 |
3rd, test method is vulcanized
The good sample lamp bead of embedding is positioned in closed container（Distil certain sulphur concentration）, 85 DEG C of constant temperature；One timing of vulcanization
Between after take out test light decay.
The performance test results are as shown in table 2.
Table 2
Note：Shape-changeable ball out of roundness number of non-compliances is the summation of the undesirable alternating compression ball of out of roundness and eccentric sphere.
Above-mentioned the performance test results show：
1st, 1-6's of the embodiment of the present invention has the HAZ that the compound bonding wire of billon of golden clad obtains well below comparative example
Wire rod.
2nd, the routing performance of the compound bonding wire of billon with golden clad of 1-6 of the embodiment of the present invention（Shape-changeable ball is true
Circularity）It is substantially better than comparative example.
The excellent routing performance of wire rod of the present invention, which is primarily due to the wire rod, to ensure stable burning ball performance（Including
The property placed in the middle of FAB is to prevent the suitable column crystal of symmetrical and number generated in eccentric sphere and FAB）.
3rd, 1-6's of the embodiment of the present invention has the compound bonding wire of billon of golden clad compared with comparative example, reliability
It is greatly improved.
The compound bonding wire of billon with golden clad of 1-6 of the embodiment of the present invention passes through 450 thermal shocks cycled
Afterwards, still without the dead lamp situation that fails（Wherein embodiment 4,6 is after the thermal shock of 500 Xun Huans, still without the dead lamp feelings that fail
Condition）；And has then there is the dead lamp that fails in comparative example（Comparative example can only be subjected to the thermal shock of 400 Xun Huans）.This illustrates the present invention
The reliability higher of technology wire rod.
4th, vulcanize
The compound bonding wire of billon with golden clad of 1-6 of the embodiment of the present invention is tested by vulcanization, light decay 20% with
Under；And comparative example light decay is 25%.This illustrates that the sulfuration resistant ability of the technology of the present invention wire rod is stronger.
Claims (7)
1. a kind of compound bonding wire of billon with golden clad, it is characterised in that including cored wire and be coated on outside cored wire
Golden clad；The cored wire contains Ag 25-49%, Pd 0.2-5%, In 0.5-2%, trace additives 2-200 by weight
Ppm, surplus are gold；The trace additives are the combinations of one or both of Ca and Be；The thickness of the gold clad
For 20-200nm.
2. the manufacturing method of the billon compound bonding wire described in claim 1 with golden clad, it is characterised in that including
Following step：
（1）Founding：Ag, Pd, In and trace additives are added in golden raw material in proportion, connected by vacuum melting and orientation
It is continuous to draw casting process, obtain core wires 6-8 millimeters a diameter of；
（2）Wire drawing：To step（1）Obtained core wires carry out wire drawing, obtain the bonding wire cored wire of a diameter of 50-280um；
（3）Using electroplating technology in step（2）Gold plate is formed on the bonding wire cored wire surface of acquisition, the thickness of gold plate is
150-500nm；
（4）To step（3）The obtained bonding wire cored wire for being coated with gold plate continues wire drawing, obtains a diameter of 15-40 um
The compound bonding wire of billon, and the thickness of gold plate is made to be decreased to 20-200nm；
（5）Finally anneal：Step（4）After the completion of wire drawing, finally annealed to the compound bonding wire of billon, in annealing process
Using N2Come as annealing atmosphere, annealing furnace effective length is 600-1000mm, and annealing temperature is 300-600 DEG C, annealing rate
For 60-120m/min；
（6）Cooling：After finally annealing, the compound bonding wire of billon is cooled to 20-30 DEG C, obtains required there is Jin Bao
The compound bonding wire of billon of coating.
3. the manufacturing method of the billon compound bonding wire according to claim 1 with golden clad, it is characterised in that：
Step（2）In drawing process, intermediate annealing several times is carried out to wire rod, N is used in annealing process2As annealing atmosphere,
Annealing furnace effective length is 600-2000mm, and annealing temperature is 500-800 DEG C, annealing rate 30-100m/min.
4. the manufacturing method of the billon compound bonding wire according to claim 1 with golden clad, it is characterised in that
The step（3）In electroplating technology comprise the following steps：
（3-1）Remove organic matter processing：By step（2）The bonding wire cored wire of acquisition immerses the acetone ethanol that temperature is 70-150 DEG C
In mixed liquor, it is 1.4-8 seconds to immerse the time, the organic matter on removing bonding wire cored wire surface；Third in the acetone ethanol mixed liquor
The weight ratio of ketone and ethyl alcohol is 1:5-10；
（3-2）Remove oxide process：It it is 70-150 DEG C, again by the bonding wire cored wire immersion temperature by removing organic matter processing
It measures in the nitric acid that percent concentration is 30-50%, it is 1.4-8 seconds to immerse the time, the oxide on removing bonding wire cored wire surface；
（3-3）Surface activation process：It is 70-150 DEG C, weight by temperature is immersed by the bonding wire cored wire of removing oxide process
Percent concentration is in the sulfuric acid of 10-30%, and it is 1.4-8 seconds to immerse the time, and para-linkage silk cored wire carries out surface activation process；
（3-4）It is gold-plated：Bonding wire cored wire Jing Guo surface activation process is immersed in the gold plating liquid that concentration is 2-4g/L, electroplated
Electric current is gold-plated under conditions of being 0.2-0.8A, and the gold plate that thickness is 150-500nm is formed on the surface of bonding wire cored wire, should
Gold plate coats bonding wire cored wire；
（3-5）Cleaning：Using pure water as cleaning solution, ultrasonic cleaning is carried out to the bonding wire cored wire for being coated with gold plate；
（3-6）Drying：The water being attached on gold plate surface is blown away using air knife；
When being electroplated, with the continuous release steps of the speed of 5-30m/min（2）The bonding wire cored wire of acquisition, bonding wire cored wire according to
It is secondary to be handled, after removing oxide process, surface activation process, gold-plated, cleaning and drying by above-mentioned removing organic matter, it is wrapped
It is covered with the bonding wire cored wire of gold plate and take-up.
5. the manufacturing method of the billon compound bonding wire according to claim 4 with golden clad, it is characterised in that：
Step（3-4）In, the gold plating liquid of use is potassium auricyanide solution.
6. the manufacturing method of the billon compound bonding wire according to claim 4 with golden clad, it is characterised in that：
Step（3-5）In, using pure water as cleaning solution, twice ultrasonic cleaning is carried out to the bonding wire cored wire for being coated with gold plate.
7. the manufacturing method of the billon compound bonding wire according to claim 4 with golden clad, it is characterised in that：
Step（3-6）In, air knife air-flow is N2, flow velocity 5-20L/min.
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Cited By (1)
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|---|---|---|---|---|
| CN108796269A (en) * | 2018-06-30 | 2018-11-13 | 汕头市骏码凯撒有限公司 | Billon bonding wire and its manufacturing method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1145899A (en) * | 1997-07-25 | 1999-02-16 | Sumitomo Metal Mining Co Ltd | Bonding wire |
| CN102437136A (en) * | 2011-11-16 | 2012-05-02 | 浙江佳博科技股份有限公司 | Bonding alloy wire and production technology thereof |
| CN103014401A (en) * | 2012-12-05 | 2013-04-03 | 昆明贵金属研究所 | Novel aurum alloy and preparation method for same |
| CN105908002A (en) * | 2016-04-22 | 2016-08-31 | 汕头市骏码凯撒有限公司 | Gold alloy bonding wire and manufacturing method thereof |
-
2017
- 2017-12-13 CN CN201711332193.0A patent/CN108091631A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1145899A (en) * | 1997-07-25 | 1999-02-16 | Sumitomo Metal Mining Co Ltd | Bonding wire |
| CN102437136A (en) * | 2011-11-16 | 2012-05-02 | 浙江佳博科技股份有限公司 | Bonding alloy wire and production technology thereof |
| CN103014401A (en) * | 2012-12-05 | 2013-04-03 | 昆明贵金属研究所 | Novel aurum alloy and preparation method for same |
| CN105908002A (en) * | 2016-04-22 | 2016-08-31 | 汕头市骏码凯撒有限公司 | Gold alloy bonding wire and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108796269A (en) * | 2018-06-30 | 2018-11-13 | 汕头市骏码凯撒有限公司 | Billon bonding wire and its manufacturing method |
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