CN102904539A - 电子器件、振荡器以及电子器件的制造方法 - Google Patents
电子器件、振荡器以及电子器件的制造方法 Download PDFInfo
- Publication number
- CN102904539A CN102904539A CN2012102623934A CN201210262393A CN102904539A CN 102904539 A CN102904539 A CN 102904539A CN 2012102623934 A CN2012102623934 A CN 2012102623934A CN 201210262393 A CN201210262393 A CN 201210262393A CN 102904539 A CN102904539 A CN 102904539A
- Authority
- CN
- China
- Prior art keywords
- substrate
- electronic device
- moulded parts
- basal substrate
- basal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- 230000007547 defect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 26
- 239000002184 metal Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 14
- 239000005361 soda-lime glass Substances 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 238000000465 moulding Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000012467 final product Substances 0.000 description 5
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- 238000012856 packing Methods 0.000 description 5
- 235000012239 silicon dioxide Nutrition 0.000 description 5
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
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- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
- H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
- H03B5/30—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator
- H03B5/32—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element being electromechanical resonator being a piezoelectric resonator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
- H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
- H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Acoustics & Sound (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Oscillators With Electromechanical Resonators (AREA)
Abstract
Description
Claims (12)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011165291A JP5779030B2 (ja) | 2011-07-28 | 2011-07-28 | 電子デバイス、発振器及び電子デバイスの製造方法 |
JP2011-165291 | 2011-07-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102904539A true CN102904539A (zh) | 2013-01-30 |
Family
ID=46320763
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012102623934A Pending CN102904539A (zh) | 2011-07-28 | 2012-07-27 | 电子器件、振荡器以及电子器件的制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130027145A1 (zh) |
EP (1) | EP2552020A3 (zh) |
JP (1) | JP5779030B2 (zh) |
KR (1) | KR20130014384A (zh) |
CN (1) | CN102904539A (zh) |
TW (1) | TW201306475A (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6516399B2 (ja) * | 2013-10-25 | 2019-05-22 | セイコーインスツル株式会社 | 電子デバイス |
JP6342643B2 (ja) * | 2013-10-25 | 2018-06-13 | セイコーインスツル株式会社 | 電子デバイス |
KR101675453B1 (ko) | 2015-05-15 | 2016-11-11 | 주식회사 바디프랜드 | 성장 발육 및 정서적 안정을 촉진하는 마사지 기능을 포함하는 안마의자 |
JP2022002249A (ja) * | 2020-06-19 | 2022-01-06 | キオクシア株式会社 | 半導体装置およびその製造方法 |
KR20240100764A (ko) * | 2022-12-23 | 2024-07-02 | 성균관대학교산학협력단 | 전자 패키지 및 전자 패키지 제조방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3599428B2 (ja) | 1995-06-19 | 2004-12-08 | キヤノン株式会社 | 導電体薄膜と非晶質絶縁体との接合体及びその形成方法 |
JP2000174151A (ja) * | 1998-12-10 | 2000-06-23 | Sharp Corp | 半導体搭載基板の気密封止構造とその製造方法 |
JP2002231843A (ja) * | 2001-02-01 | 2002-08-16 | Tdk Corp | 電子部品保護用キャップおよびその製造方法ならびに電子装置およびその製造方法 |
WO2002078085A1 (fr) * | 2001-03-27 | 2002-10-03 | Sumitomo Special Metals C0., Ltd. | Boitier pour piece electronique et son procede de production |
JP3879923B2 (ja) * | 2002-09-25 | 2007-02-14 | セイコーエプソン株式会社 | 電子部品用蓋体の製造方法 |
JP4889974B2 (ja) * | 2005-08-01 | 2012-03-07 | 新光電気工業株式会社 | 電子部品実装構造体及びその製造方法 |
US7649235B2 (en) * | 2006-02-07 | 2010-01-19 | Panasonic Corporation | Electronic component package |
JP2009194091A (ja) * | 2008-02-13 | 2009-08-27 | Seiko Instruments Inc | 電子部品、電子機器、及びベース部材製造方法 |
JP5121493B2 (ja) * | 2008-02-21 | 2013-01-16 | セイコーインスツル株式会社 | 圧電振動子の製造方法 |
JP2009283553A (ja) * | 2008-05-20 | 2009-12-03 | Nec Electronics Corp | 電子装置およびその製造方法 |
JP2010187326A (ja) * | 2009-02-13 | 2010-08-26 | Seiko Instruments Inc | 圧電振動子の製造方法、圧電振動子および発振器 |
JP2011049992A (ja) * | 2009-08-28 | 2011-03-10 | Seiko Instruments Inc | 圧電デバイス及び圧電デバイスの製造方法 |
-
2011
- 2011-07-28 JP JP2011165291A patent/JP5779030B2/ja not_active Expired - Fee Related
-
2012
- 2012-04-24 TW TW101114535A patent/TW201306475A/zh unknown
- 2012-05-16 EP EP12168387.4A patent/EP2552020A3/en not_active Withdrawn
- 2012-06-07 US US13/490,910 patent/US20130027145A1/en not_active Abandoned
- 2012-07-26 KR KR1020120081526A patent/KR20130014384A/ko not_active Application Discontinuation
- 2012-07-27 CN CN2012102623934A patent/CN102904539A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20130014384A (ko) | 2013-02-07 |
EP2552020A2 (en) | 2013-01-30 |
EP2552020A3 (en) | 2014-01-08 |
TW201306475A (zh) | 2013-02-01 |
JP5779030B2 (ja) | 2015-09-16 |
US20130027145A1 (en) | 2013-01-31 |
JP2013030957A (ja) | 2013-02-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: JINGGONG ELECTRONIC CRYSTAL TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SEIKO INSTRUMENTS, INC. Effective date: 20131219 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20131219 Address after: Chiba, Chiba, Japan Applicant after: Jinggong Electronic Crystal Technology Co., Ltd. Address before: Chiba, Chiba, Japan Applicant before: Seiko Instruments Inc. |
|
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130130 |