CN102902389A - Method for manufacturing touch sensor - Google Patents
Method for manufacturing touch sensor Download PDFInfo
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- CN102902389A CN102902389A CN2011102121064A CN201110212106A CN102902389A CN 102902389 A CN102902389 A CN 102902389A CN 2011102121064 A CN2011102121064 A CN 2011102121064A CN 201110212106 A CN201110212106 A CN 201110212106A CN 102902389 A CN102902389 A CN 102902389A
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Abstract
The invention provides a method for manufacturing a touch sensor, comprising the following steps: (S11) a layer of acid-resisting printing ink is formed on an indium tin oxide (ITO)-Cu film and the acid-resisting printing ink covers a reserved sensor Cu line area; (S12) a Cu area of the ITO-Cu film with the acid-resisting printing ink, which is not covered by the acid-resisting printing ink, is etched by ferric chloride solution; (S13) the acid-resisting printing ink is demoulded by alkaline solution and cleaned; (S14) a layer of protective glue is formed on the ITO-Cu film which is processed in step S13 and the protective glue covers a sensor visible area; (S15) redundant Cu in the sensor Cu line area and the ITO which is covered by the redundant Cu are etched by a laser dry etching device to form Cu film routing; (S16) the protective glue is removed and the ITO in the sensor visible area is etched by the laser dry etching device to form ITO pattern routing. According to the manufacturing method provided by the invention, a laser drying etching method is adopted to form the Cu film routing and the ITO pattern routing, so that the design requirement of narrow edge of TPSensor is realized and routing with narrow line width can be manufactured at narrow edge.
Description
Technical field
The invention belongs to the touch field, relate in particular to a kind of method for making of touch sensor.
Background technology
In the structure of existing touch-screen, the making of touch sensor (TP Sensor) generally is that the white light processing procedure adopts silk screen printing process, particularly: elder generation's silk-screen acid-proof ink on the film with indium tin oxide (ITO), the ITO part of needs is protected with acid-proof ink, then the solution by acidity etches away unwanted ITO, then slough acid-proof ink by alkaline solution, at last at the circumferential edges silk-screen silver slurry cabling of TP Sensor, thereby partly be electrically connected with ITO after the etching; Wherein, the live width of described silk-screen silver slurry cabling is generally about 100 microns.
But, the structure of existing touch-screen has trended towards full frame, the structure of TP Sensor also trends towards the design of narrow limit, thereby the frame of leaving silver slurry cabling for is fewer and feweri, so the live width of silver slurry cabling is also more and more less, if the live width of silver slurry cabling is less than 50 microns, the making of wanting to finish silver slurry cabling by the mode of silk-screen can't realize.Therefore, the silk screen printing process of white light processing procedure is not in step with the times, needs the formation that a kind of new manufacture craft satisfies narrow limit cabling badly.
Summary of the invention
The method for making that the purpose of this invention is to provide a kind of touch sensor has realized the designing requirement on the narrow limit of TP Sensor, can make the less cabling of live width on the narrow limit of TP Sensor, reduces manufacture difficulty, provides cost savings.
The objective of the invention is to be achieved through the following technical solutions:
A kind of method for making of touch sensor said method comprising the steps of:
S11, form one deck acid-proof ink at the ITO-Cu film, this acid-proof ink covers the sensor Cu line district that reserves;
S12, will be formed with acid-proof ink the ITO-Cu film by ferric chloride solution, etch away the Cu district that is not covered by acid-proof ink;
S13, by alkaline solution the acid-proof ink demoulding is processed, and cleaned;
S14, the ITO-Cu film after processing through step S13 form one deck protection glue, and this protection glue covers the visible area of touch sensor;
S15, the ITO that adopts Cu unnecessary in laser instrument etching at the dried quarter sensor Cu line district and this unnecessary Cu to cover are to form Cu film cabling;
S16, the described protection glue of removal adopt laser to do and carve the interior ITO of instrument etching sensor visible area, with formation ITO pattern cabling.
The method for making of touch sensor provided by the invention; on the ITO-Cu film, will etch away except the sensor Cu line district that reserves first; then the visible area at sensor forms protection glue, then adopts laser to do and carves instrument etching Cu line district and ITO pattern area, to form Cu film cabling and ITO pattern cabling.In the method for making provided by the invention, adopt the dried legal system of carving of laser to make Cu film cabling and ITO pattern cabling, realized the designing requirement on the narrow limit of TP Sensor, can make on the narrow limit of TP Sensor the cabling of live width less (less than 50 microns), reduce manufacture difficulty, provide cost savings.
Description of drawings
Fig. 1 is the schematic flow sheet of the touch sensor method for making that provides of the embodiment of the invention.
Fig. 2 is the Wiring structure synoptic diagram of the touch sensor of reaching the standard grade that provides of the embodiment of the invention.
Fig. 3 is the Wiring structure synoptic diagram of the touch sensor that rolls off the production line that provides of the embodiment of the invention.
Embodiment
In order to make technical matters solved by the invention, technical scheme and beneficial effect clearer, below in conjunction with embodiment, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
Please refer to shown in Figure 1ly, a kind of method for making of touch sensor said method comprising the steps of:
S11, form one deck acid-proof ink at the ITO-Cu film, this acid-proof ink covers the sensor Cu line district that reserves;
S12, will be formed with acid-proof ink the ITO-Cu film by ferric chloride solution, etch away the Cu district that is not covered by acid-proof ink;
S13, by alkaline solution the acid-proof ink demoulding is processed, and cleaned;
S14, the ITO-Cu film after processing through step S13 form one deck protection glue, and this protection glue covers the visible area of touch sensor;
S15, the ITO that adopts Cu unnecessary in laser instrument etching at the dried quarter sensor Cu line district and this unnecessary Cu to cover are to form Cu film cabling;
S16, the described protection glue of removal adopt laser to do and carve the interior ITO of instrument etching sensor visible area, with formation ITO pattern cabling.
The method for making of touch sensor provided by the invention; on the ITO-Cu film, will etch away except the sensor Cu line district that reserves first; then the visible area at sensor forms protection glue, then adopts laser to do and carves instrument etching Cu line district and ITO pattern area, to form Cu film cabling and ITO pattern cabling.In the method for making provided by the invention, adopt the dried legal system of carving of laser to make Cu film cabling and ITO pattern cabling, realized the designing requirement on the narrow limit of TP Sensor, can make on the narrow limit of TP Sensor the cabling of live width less (less than 50 microns), reduce manufacture difficulty, provide cost savings.
As concrete embodiment, described step S11 is specially, at the acid-proof ink of the upper silk-screen one deck 8-12 micron thickness of ITO-Cu film (being a kind of at whole copper-plated film of indium tin oxide surfaces), cover the sensor Cu line district that reserves, and process light accumulated amount is 700-900mj/cm
2Ultraviolet light polymerization, can in the ultra-violet curing machine, carry out when specifically solidifying; The model that described acid-proof ink specifically can select the auspicious too scientific ﹠ technical corporation in Taiwan to provide is the printing ink of ER-110B.Wherein, the thickness of described acid-proof ink is the 8-12 micron, can prevent in the follow-up making step crossing erosion or etching unclean, simultaneously, the pattern edge of acid-proof ink is smooth; Certainly, those skilled in the art should be understood that the thickness of described acid-proof ink is not limited to this, can adjust accordingly according to the manufacture craft of reality, as long as the Cu layer that can guarantee not to be covered by acid-proof ink is by effectively etching.
As concrete embodiment, described step S12 is specially, the ITO-Cu film that will be formed with acid-proof ink is 1%-5% ferric chloride solution spray by mass percent, etches away the Cu line zone that is not covered by acid-proof ink, and its ferric chloride solution is very little on the impact of ITO layer; Further, the time of described spray is 50-60 second, and pressure is 0.2-0.3MPa.Certainly, the specific requirement of described etching solution/spray liquid is not limited to this, if guarantee with the ITO reaction and only with the Cu reaction, preferably pH value greater than 6.5 less than 7 solution; Simultaneously, the condition of described spray also can be adjusted accordingly according to the actual needs of manufacture craft, as long as can guarantee effective etching.
As concrete embodiment, after described step S12, further comprise: with the ITO-Cu film after the pure water cleaning etching, and use air knife drying, the pressure of described air knife is 0.2-0.3MPa, the water after cleaning with effective removal on the ITO-Cu film.Preferably, also available sheet resistance tester is measured the sheet resistance of ITO in the etched zone, with the ITO sheet resistance contrast of introducing in the film section product, to assess etched effect.
As concrete embodiment, described step S13 is specially, and the ITO-Cu film after air-dry is removed acid-proof ink by the sodium hydroxide solution spray, and the volumetric molar concentration of described sodium hydroxide solution is 7.5-8.5mol/L, the time that spray continues is 50-60 second, and the pressure of spray is 0.2-0.3MPa; Wherein, described alkaline solution is not limited to NaOH, also can be other the rigid solution such as potassium hydroxide, and the time of described spray and pressure also can be adjusted according to the actual process of making, as long as acid-proof ink effectively can be removed.Further, also available pure water cleans the ITO-Cu film behind the demoulding, and use air knife drying, and the pressure of described air knife is 0.2-0.3MPa, cleans water on the rear ITO-Cu film with effective removal.So far, can observe and measure the etching size in Cu line zone on the ITO-Cu film material, the assessment etch effect, ferric chloride solution generally side etching phenomenon can occur, as long as the size of lateral erosion is no more than 5 microns.
As concrete embodiment; described step S14 is specially; ITO-Cu film after processing through step S13 forms one deck protection glue; this protection glue covers visible area (" the sensor Cu line district that reserves " described in the step S11 of this zone complementation of touch sensor; both add up and just consist of a whole face), avoid ITO in the visible area to be scratched or dirty, the material requirements of protection glue has Thermocurable; and peel off easily, and be difficult for staying the glue trace.As a kind of embodiment particularly, the blue glue of the peelable protection of silk-screen one deck on the ITO-Cu film, the thickness of the blue glue of described peelable protection is the 30-50 micron, protects thus the visible area of Sensor.
As concrete embodiment, described step S15 is specially, the laser in design Cu line zone is done and is carved the cabling pattern, according to this cabling pattern, adopt the dried instrument of carving of laser to etch away unnecessary Cu, be specially: the water cooling unit power supply of 1, opening first the laser instrument below, the standard temperature of water cooling unit is 18.7-19.3 ℃, water-cooling system was opened rear wait about 20 minutes, the power switch (button and key switch) of opening laser generator after the water-cooled temperature reaches standard loads to laser generator to be finished, and laser generator parameter (electric current, energy etc.) then is set; 2, open laser etching machine device power supply (DPS) switch, open computer host power supply again, starting rear laser etching machine working routine fully until the operating system of host computer will move automatically, clicks " initial point resets "; 3, open the particle collector power switch of laser etching machine back; 4, setting laser etching program; 5, according to scantling with non-dried quarter on the platform, diaphragm was covered in the zone, stick by the angle at the platform correct position, both hands will need etched material to lie against on the platform and make " location is by the angle " in the material lower left corner and the platform lower left corner aliging is close to; 6, material to be etched is after platform is put well, and silver-colored imperial adhesive tape is sticked at middle four target places, is advisable just to cover positive glue target, steps on gently under the etching machine " foot-switch " on the floor about 2 seconds with right crus of diaphragm, to open the platform air draught; 7, pin simultaneously " unlatching " the switch of etching machine with left hand and the right hand, until till the gate of etching machine closes fully, the gate of etching machine is closed the after etching machine fully and is entered etching process, the late gate of finishing to be etched will be opened automatically, and " foot-switch " of stepping on vacuum suction this moment also with the hands takes off the good material of etching and carry out the head inspection.During etching, must do quarter according to the cabling pattern, require etching clean, residual Cu can not be arranged; And the corresponding ITO that exposes also wants etching clean after doing quarter, disconnects to guarantee two adjacent Cu cablings, and phenomenon is not short-circuited.Thus, adopting described laser to do and carving the unnecessary formed Cu film of the Cu trace width of instrument etching is the 40-60 micron, and its linear slit also can be the 40-60 micron, and with respect to white light processing procedure silk screen printing process of the prior art, its live width and linear slit can be done littlely.Preferably, the frequency of described laser generator is 40-60HZ, and electric current is 30-35A, and power is 30-50%, and the hydraulic pressure of water cooling unit is 1.3-1.7Kg/cm
2
As concrete embodiment, described step S16 is specially, and tears through laser and do to carve the blue glue of peelable protection on the ITO-Cu film of Cu line, crosses the ultraviolet light cleaner, dirty on the cleaning ITO-Cu film material.Then design the laser of ITO pattern and do the cabling at quarter, according to this ITO cabling pattern, the ITO that adopts laser to do in instrument etching at the quarter sensor visible area is specially: the water cooling unit power supply of 1, opening first the laser instrument below, the standard temperature of water cooling unit is 18.7-19.3 ℃, water-cooling system was opened rear wait about 20 minutes, the power switch (button and key switch) of opening laser generator after the water-cooled temperature reaches standard loads to laser generator to be finished, and laser generator parameter (electric current, energy etc.) then is set; 2, open laser etching machine device power supply (DPS) switch, open computer host power supply again, starting rear laser etching machine working routine fully until the operating system of host computer will move automatically, clicks " initial point resets "; 3, open the particle collector power switch of laser etching machine back; 4, setting laser etching program; 5, according to scantling with non-dried quarter on the platform, diaphragm was covered in the zone, stick by the angle at the platform correct position, both hands will need etched material to lie against on the platform and make " location is by the angle " in the material lower left corner and the platform lower left corner aliging is close to; 6, material to be etched is after platform is put well, and silver-colored imperial adhesive tape is sticked at middle four target places, is advisable just to cover positive glue target, steps on gently under the etching machine " foot-switch " on the floor about 2 seconds with right crus of diaphragm, to open the platform air draught; 7, pin simultaneously " unlatching " the switch of etching machine with left hand and the right hand, until till the gate of etching machine closes fully, the gate of etching machine is closed the after etching machine fully and is entered etching process, the late gate of finishing to be etched will be opened automatically, and " foot-switch " of stepping on vacuum suction this moment also with the hands takes off the good material of etching and carry out the head inspection.With aforementioned dried quarter Cu cabling pattern similar, during etching, must do quarter according to the cabling pattern, require etching clean, disconnect to guarantee two adjacent ITO cablings, phenomenon is not short-circuited; After etching was complete, the dried groove of observable ITO can not cause the phenomenon of bad order.Preferably, the frequency of described laser generator is 40-60HZ, and electric current is 30-35A, and power is 30-50%, and the hydraulic pressure of water cooling unit is 1.0-1.4Kg/cm
2
Please refer to shown in Fig. 2-3, the Wiring structure synoptic diagram of the touch sensor of reaching the standard grade and roll off the production line that provides for method for making of the present invention is namely done the structural representation of Cu line and ITO cabling after the method etching at quarter through laser.Wherein, in Fig. 2, described ITO cabling 21 along continuous straight runs are arranged, Cu line 22 left and right sides is vertically arranged, Cu line cabling one end of both sides is electrically connected with the ITO cabling of horizontal direction, and the other end is connected with the driving pin of driving circuit (IC) by flexible print circuit board (FPC) after extending to the upper edge of touch sensor; And in Fig. 3, described ITO cabling 31 is vertically arranged, one end of Cu line 32 directly is electrically connected with the ITO cabling of vertical direction, and the other end is connected with the induction pin of driving circuit (IC) by flexible print circuit board (FPC) after extending to the upper edge of touch sensor.
After step S16, can further comprise: the ITO-Cu film of will reaching the standard grade and roll off the production line is crossed the ultraviolet light cleaner, with the cleaning film material; The ITO-Cu film of will reaching the standard grade and roll off the production line at last is by optical cement (OCA) combination, to form TP Sensor.
The above only is preferred embodiment of the present invention, not in order to limiting the present invention, all any modifications of doing within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (11)
1. the method for making of a touch sensor is characterized in that, said method comprising the steps of:
S11, form one deck acid-proof ink at the ITO-Cu film, this acid-proof ink covers the sensor Cu line district that reserves;
S12, will be formed with acid-proof ink the ITO-Cu film by ferric chloride solution, etch away the Cu district that is not covered by acid-proof ink;
S13, by alkaline solution the acid-proof ink demoulding is processed, and cleaned;
S14, the ITO-Cu film after processing through step S13 form one deck protection glue, and this protection glue covers the visible area of touch sensor;
S15, the ITO that adopts Cu unnecessary in laser instrument etching at the dried quarter sensor Cu line district and this unnecessary Cu to cover are to form Cu film cabling;
S16, the described protection glue of removal adopt laser to do and carve the interior ITO of instrument etching sensor visible area, with formation ITO pattern cabling.
2. the method for making of touch sensor according to claim 1 is characterized in that, described step S11 is specially, the acid-proof ink of silk-screen one deck 8-12 micron thickness on the ITO-Cu film, and through ultraviolet light polymerization.
3. the method for making of touch sensor according to claim 1 is characterized in that, described step S12 is specially, and the ITO-Cu film that will be formed with acid-proof ink is 1%-5% ferric chloride solution spray by mass percent.
4. the method for making of touch sensor according to claim 3 is characterized in that, the time of described spray is 50-60 second, and pressure is 0.2-0.3MPa.
5. the method for making of touch sensor according to claim 1 is characterized in that, after described step S12, further comprises: with the ITO-Cu film after the pure water cleaning etching, and use air knife drying.
6. the method for making of touch sensor according to claim 1 is characterized in that, among the described step S14, described protection glue is the blue glue of peelable protection.
7. the method for making of touch sensor according to claim 1, it is characterized in that, among the described step S15, adopting laser to do the unnecessary Cu of instrument etching at quarter specifically comprises, open water cooling unit, after the temperature of water cooling unit reaches standard, open laser generator, then open laser etching machine and hop to it quarter.
8. the method for making of touch sensor according to claim 7 is characterized in that, the frequency of described laser generator is 40-60HZ, and electric current is 30-35A, and power is 30-50%.
9. the method for making of touch sensor according to claim 7 is characterized in that, described employing laser is done and carved unnecessary Cu formed Cu film trace width and the linear slit of instrument etching is the 40-60 micron.
10. the method for making of touch sensor according to claim 1, it is characterized in that, among the described step S16, the ITO that adopts laser to do in instrument etching at the quarter sensor visible area specifically comprises, open water cooling unit, after the temperature of water cooling unit reaches standard, open laser generator, then open laser etching machine and hop to it quarter.
11. the method for making of touch sensor according to claim 10 is characterized in that, the frequency of described laser generator is 40-60HZ, and electric current is 30-35A, and power is 30-50%.
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Cited By (9)
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| CN103436884A (en) * | 2013-09-02 | 2013-12-11 | 中环高科（天津）股份有限公司 | Copper-plated indium tin oxide film etching technology |
| CN103593090A (en) * | 2013-11-30 | 2014-02-19 | 东莞市平波电子有限公司 | Manufacturing technology of touch module of GF2 double-face conducting thin film and silver elargol wiring structure |
| CN103846555A (en) * | 2014-03-05 | 2014-06-11 | 江西省天翌光电有限公司 | Laser etching process for capacitive touch screen |
| CN103885654A (en) * | 2013-03-12 | 2014-06-25 | 深圳市信濠精密技术股份有限公司 | Electromagnetism and capacitance integrated touch screen and manufacturing method thereof |
| CN104281348A (en) * | 2014-09-17 | 2015-01-14 | 福建科创光电有限公司 | Manufacturing method of single-chip capacitive screen |
| CN104532239A (en) * | 2015-01-16 | 2015-04-22 | 模德模具(苏州工业园区)有限公司 | Texture manufacturing method with blue gel protection |
| CN106034378A (en) * | 2015-03-11 | 2016-10-19 | 深圳市英内尔科技有限公司 | Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof |
| CN108227992A (en) * | 2018-01-03 | 2018-06-29 | 京东方科技集团股份有限公司 | The method made for touch screen |
| CN109871141A (en) * | 2018-12-29 | 2019-06-11 | 赣州市德普特科技有限公司 | A kind of wiring region guard method in technology for manufacturing touch screen |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103885654A (en) * | 2013-03-12 | 2014-06-25 | 深圳市信濠精密技术股份有限公司 | Electromagnetism and capacitance integrated touch screen and manufacturing method thereof |
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| CN103593090A (en) * | 2013-11-30 | 2014-02-19 | 东莞市平波电子有限公司 | Manufacturing technology of touch module of GF2 double-face conducting thin film and silver elargol wiring structure |
| CN103846555A (en) * | 2014-03-05 | 2014-06-11 | 江西省天翌光电有限公司 | Laser etching process for capacitive touch screen |
| CN104281348A (en) * | 2014-09-17 | 2015-01-14 | 福建科创光电有限公司 | Manufacturing method of single-chip capacitive screen |
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| CN104532239A (en) * | 2015-01-16 | 2015-04-22 | 模德模具(苏州工业园区)有限公司 | Texture manufacturing method with blue gel protection |
| CN106034378A (en) * | 2015-03-11 | 2016-10-19 | 深圳市英内尔科技有限公司 | Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof |
| CN108227992A (en) * | 2018-01-03 | 2018-06-29 | 京东方科技集团股份有限公司 | The method made for touch screen |
| CN109871141A (en) * | 2018-12-29 | 2019-06-11 | 赣州市德普特科技有限公司 | A kind of wiring region guard method in technology for manufacturing touch screen |
| CN109871141B (en) * | 2018-12-29 | 2023-02-03 | 赣州市德普特科技有限公司 | Wiring area protection method in touch screen manufacturing process |
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| CN102902389B (en) | 2016-04-20 |
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Address after: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee after: Shenzhen helitai photoelectric Co., Ltd Address before: 518119 Guangdong province Shenzhen City Dapeng new Kwai town Yanan Road No. 1 building experimental Byd Co Patentee before: SHENZHEN BYD ELECTRONIC COMPONENT Co.,Ltd. |
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