CN108227992A - The method made for touch screen - Google Patents
The method made for touch screen Download PDFInfo
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- CN108227992A CN108227992A CN201810004967.5A CN201810004967A CN108227992A CN 108227992 A CN108227992 A CN 108227992A CN 201810004967 A CN201810004967 A CN 201810004967A CN 108227992 A CN108227992 A CN 108227992A
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- Prior art keywords
- film layer
- conductive film
- layer
- touch screen
- ink
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Electric Cables (AREA)
- Laminated Bodies (AREA)
Abstract
The disclosure provides a kind of method made for touch screen.This is used for the method that touch screen makes and includes：Conductive film layer is formed on substrate；Ink is protected in the predeterminable area silk-screen printing of the conductive film layer；The conductive film layer is etched, removal does not cover the conductive film layer in other regions of the protection ink；It dissolves the protection ink and forms conductive pattern.The disclosure can replace exposure manufacture process by silk-screen printing, so that the production link of touch screen does not need to, using lithographic process, to substantially reduce the cost of manufacture and process complexity of touch screen.
Description
Technical field
This disclosure relates to touch screen technology field, in particular to a kind of method made for touch screen.
Background technology
Touch screen (Touch Panel) is also known as touch screen, touch panel, is the spy that layer of transparent is sticked in glass surface
Different metallic conduction substance.When finger touches on the metal layer, the capacitance of contact will change so that is be attached thereto shakes
It swings device frequency to change, can determine that touch location obtains information by measurement frequency variation.
With the continuous improvement of people's levels of substance, touch-control product is also put forward higher requirements, current consumer
Touch-control product is not required nothing more than with good touch-control performance, and also requiring product, the appearance is beautiful and elegant.As touch-control product manufacturing
Quotient has to spend more energy and the appearance requirement for into meeting consumer originally and increasingly changing for touch-control product.
It in order to meet client's increasing demand, must weed out the old and bring forth the new as touchscreen manufacturer, constantly release new production
Product can take the good opportunity on the market.
Therefore, also there is the part that has much room for improvement in technical solution of the prior art.
It should be noted that information is only used for strengthening the reason to the background of the disclosure disclosed in above-mentioned background technology part
Solution, therefore can include not forming the information to the prior art known to persons of ordinary skill in the art.
Invention content
The disclosure is designed to provide a kind of method made for touch screen, and then overcome at least to a certain extent
One or more problem caused by the limitation of the relevant technologies and defect.
Other characteristics and advantages of the disclosure will be by the following detailed description apparent from or partially by this public affairs
The practice opened and acquistion.
According to one aspect of the disclosure, a kind of method made for touch screen is provided, including：It is formed and led on substrate
Electrolemma layer；Ink is protected in the predeterminable area silk-screen printing of the conductive film layer；The conductive film layer is etched, removal does not cover
The conductive film layer in other regions of the protection ink；It dissolves the protection ink and forms conductive pattern.
In a kind of exemplary embodiment of the disclosure, the method further includes：Silk-screen printing BM hides on the substrate
Photosphere.
In a kind of exemplary embodiment of the disclosure, the BM light shield layers are made of black out ink.
In a kind of exemplary embodiment of the disclosure, the method further includes：The shadow that disappears is formed on the conductive pattern
Layer.
In a kind of exemplary embodiment of the disclosure, the shadow layer that disappears is inorganic transparent film layer.
In a kind of exemplary embodiment of the disclosure, the method further includes：Protective film is formed on the shadow layer that disappears
Layer.
In a kind of exemplary embodiment of the disclosure, the conduction is formed by magnetron sputtering mode on the substrate
Film layer.
In a kind of exemplary embodiment of the disclosure, the conductive film layer is etched using wet etching mode.
In a kind of exemplary embodiment of the disclosure, the protection ink is dissolved using weak caustic solution.
In the method made for touch screen in some embodiments of the disclosure, exposure system is replaced by silk-screen printing
Journey, so that the production link of touch screen does not need to that, using lithographic process, being fabricated to for touch screen can be substantially reduced
Sheet and process complexity.
It should be understood that above general description and following detailed description are only exemplary and explanatory, not
The disclosure can be limited.
Description of the drawings
Attached drawing herein is incorporated into specification and forms the part of this specification, shows the implementation for meeting the disclosure
Example, and for explaining the principle of the disclosure together with specification.It should be evident that the accompanying drawings in the following description is only the disclosure
Some embodiments, for those of ordinary skill in the art, without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 shows a kind of flow chart of the method made for touch screen in disclosure exemplary embodiment.
Fig. 2 shows a kind of flow charts of yellow light BM techniques.
Fig. 3 shows flow chart prepared by a kind of conventional pilot electric layer.
Fig. 4 shows a kind of flow chart of silk-screen printing BM techniques in disclosure exemplary embodiment.
Fig. 5 shows a kind of flow chart of conductive film layer technique in disclosure exemplary embodiment.
Fig. 6 shows the flow chart of another method made for touch screen in disclosure exemplary embodiment.
Fig. 7 shows a kind of schematic diagram of process black BM outer rims in disclosure exemplary embodiment.
Fig. 8 shows a kind of schematic diagram for sputtering conductive film layer in disclosure exemplary embodiment.
Fig. 9 shows a kind of schematic diagram of conductive film layer Pattern printings in disclosure exemplary embodiment.
Figure 10 shows a kind of schematic diagram of conductive film layer etching in disclosure exemplary embodiment.
Figure 11 shows a kind of schematic diagram for protecting ink dissolving in disclosure exemplary embodiment.
Specific embodiment
Example embodiment is described more fully with reference to the drawings.However, example embodiment can be with a variety of shapes
Formula is implemented, and is not understood as limited to example set forth herein；Described feature, structure or characteristic can be with any suitable
Mode be incorporated in one or more embodiments.In the following description, many details are provided so as to provide to this
Disclosed embodiment is fully understood.It it will be appreciated, however, by one skilled in the art that can be with technical solution of the disclosure
And it omits one or more in the specific detail or other methods, constituent element, device, step etc. may be used.
It should be pointed out that in the accompanying drawings, for the size that may clearly exaggerate layer and region of diagram.It and can be with
Understand, when element or layer be referred to as another element or layer " on " when, it directly in other elements or can may have
Intermediate layer.Additionally, it is appreciated that when element or layer be referred to as another element or layer " under " when, it can be directly at other
Under element or there may be the layer or element of more than one centre.In addition, it is to be appreciated that when layer or element are referred to as
Two layers or two elements " between " when, it can between two layers or two elements unique layer or there may also be one
Above middle layer or element.Similar reference marker indicates similar element in the whole text.
Fig. 1 shows a kind of flow chart of the method made for touch screen in disclosure exemplary embodiment.
As shown in Figure 1, the method for being used for touch screen making may comprise steps of.
In step s 110, conductive film layer is formed on substrate.
In the exemplary embodiment, the substrate can be glass plate, acrylic board or transparent PC plate etc..In this embodiment party
In formula, the substrate can be glass plate (glass).
In the step s 120, ink is protected in the predeterminable area silk-screen printing of the conductive film layer.
In step s 130, the conductive film layer is etched, removal does not cover leading for other regions of the protection ink
Electrolemma layer.
In step S140, dissolve the protection ink and form conductive pattern.
The disclosed method for making touch screen of embodiment of the present invention can replace exposure system by silk-screen printing
Journey, so that the production link of touch screen does not need to that, using lithographic process, being fabricated to for touch screen can be substantially reduced
Sheet and process complexity.It is illustrated below by following embodiments.
At present, touch screen production mostly ((is also known as dependent on yellow light processing procedure by the photosensitive material to being coated in glass surface
For photoresist or photoresist), then the part left afterwards through exposure and development is etched demoulding and most to its protective effect of bottom
Obtain the process of permanent figure eventually) complete the preparation of BM light shield layers and each conductive film layer, i.e., by exposing, developing, etching
To complete.But the country can independently produce the enterprise of exposure machine not yet now, exposure machine and relevant device are required to from outer
State purchases, and equipment investment cost is very high.
In addition, yellow light processing procedure, which also relies on Mask, (is also mask plate, circuit diagram is to be transferred to from Mask by exposing
On glass), in general one piece of G6 is for Mask used in substrate, and expense is as high as 200,000, and a product at least needs 4
To 5 pieces of Mask, i.e., a product light Mask jigs cost is just up to million.
It can be seen that the cost input for reducing equipment and Mask jigs is that most of touch screen manufacturing enterprises carry out profit now
Moisten the necessary mode promoted.
Yellow light making technology flow generally comprises following steps：Glass-BM processing procedure-ITO1 processing procedure-OC1 processing procedure-IOT2 systems
Journey-MAM processing procedure-OC2 processing procedures.
Fig. 2 shows a kind of flow charts of yellow light BM techniques.
As shown in Fig. 2, yellow light BM techniques include photoresist coating, exposure, development and OVEN (baking).
In the prior art, (One Glass Solution, i.e., integrated touch-control, is directly formed on protective glass to OGS
The electronic product protection screen made under a kind of technology of ITO conductive films and sensor.One block of glass play simultaneously protective glass and
The double action of touch sensor.) touch screen scheme generally can complete BM light shield layers using yellow light processing procedure, yellow light processing procedure needs
It is realized using Mask, and the price is very expensive by the Mask of advanced lines line, this results in its production cost to remain high.
Fig. 3 shows flow chart prepared by a kind of conventional pilot electric layer.
As shown in figure 3, conventional pilot electric layer preparation method includes sputtering conductive film layer, photoresist coating, exposure, development, carves
Erosion, Pattern molding and etc..
Specifically, first in the uniform figure last layer photoactive substance-photoresist of glass front.Photoresist (PhotoResist, PR)
It is the media that pattern transfer is carried out using material photochemical reaction, there is positivity photoresist and negativity photoresist.Positivity photoresist passes through
After uv-exposure, make the region of exposure that photodegradation or degradation reaction occur, property made to change preferentially and is dissolved in positivity developer solution,
Unexposed part is then retained and forms eurymeric figure.The property of negativity photoresist is just the part not being exposed in contrast
It is dissolved in negativity developer solution.By exposure, the part photoresist by illumination is made to be dissolved in the speed of developer solution different from unexposed
Part photoresist, so as to reach the process of figure on transfer light shield.The part photoresist being exposed in positivity photoresist is dissolved
In rapid development liquid (negativity photoresist just in contrast), unexposed part photoresist solution rate is slow, so as to pass through control
Developing time processed, it is possible to visualise the figure in light exit cover.It will not corroded in glass by the part ITO that photoresist is protected with strong acid,
The process of figure needed for leaving.
It can be seen that in the prior art no matter OGS schemes or on-cell schemes, the preparation of conductive film layer is required to make
With yellow light processing procedure, that is, expose, develop, etching.This is very big cost input for touch screen manufacturing enterprise, Er Qiehuang
The light processing procedure production cycle is longer.
Embodiment of the present invention provides a kind of touch screen production decision for not needing to carry out lithographic process.The non-lithographic is touched
Two parts can be included by touching screen production decision：
First part, with the BM processing procedures of screen printing ink substitution black photoresist exposure imaging.
Second part carries out conductive film layer sputtering-wire mark Pattern (by protecting ink)-conductive film layer after BM processing procedures
A series of processing procedures such as etching-protection ink dissolving, ultimately form conductive Pattern (pattern).The non-lithographic touch screen scheme with
Wire mark (abbreviation of silk-screen printing) substitution exposure manufacture process (PR glue coating-exposure-development) so that the production link of touch screen is not required to
It to use to exposure sources.
Fig. 4 shows a kind of flow chart of silk-screen printing BM techniques in disclosure exemplary embodiment.
As shown in figure 4, the silk-screen printing BM techniques in the embodiment of the present invention may comprise steps of；Ink print and
OVEN (baking).
Fig. 5 shows a kind of flow chart of conductive film layer technique in disclosure exemplary embodiment.
As shown in figure 5, the conductive film layer technique in the embodiment of the present invention may comprise steps of：Sputtering conductive film layer,
Print Pattern, etching, the dissolving of protection ink and Pattern moldings.
In the exemplary embodiment, above-mentioned touch screen (or touch screen) production technology for not needing to exposure is as follows：Printing
BM light shield layers-magnetron sputtering conductive layer (ITO＆Metal)-wire mark Pattern (protection ink)-conductive layer etches-protect ink
It dissolves-disappears shadow layer and prepare (such as SiOxNy)-protection film layer and prepare (abbreviation of OC, Over Coat).
Fig. 6 shows the flow chart of another method made for touch screen in disclosure exemplary embodiment.
As shown in fig. 6, the method for being used for touch screen making may comprise steps of.
In step S610, the printing of BM light shield layers.
Fig. 7 shows a kind of schematic diagram of process black BM outer rims in disclosure exemplary embodiment.
As described in Figure 7, BM light shield layers are printed, i.e., using screen printing mode, BM photoresists is replaced with ink, are directly passed through
Printing forms light shield layer.
In the embodiment of the present invention, BM (Black Matrix, black matrix") refers in glass, plastics, metal or resin etc.
The electronic printing carried out on material.
In the exemplary embodiment, the ink of the BM light shield layers can include one layer of black ink layer and two layers of white oil
Layer of ink, protecting effect are more preferable.
In the exemplary embodiment, black dielectric ink, shading and insulation effect may be used in the ink of the light shield layer
More preferably.
In step S620, conductive film layer is sputtered.
Fig. 8 shows a kind of schematic diagram for sputtering conductive film layer in disclosure exemplary embodiment.
As described in Figure 8, magnetron sputtering conductive film may be used, i.e., sputter conductive film (such as ITO＆ under vacuum conditions
Metal)。
In the exemplary embodiment, the method can also include glass cleaning step, by element glass through over cleaning, baking
Enter vacuum chamber afterwards and carry out sputter ITO.The dirty of glass surface, greasy dirt etc. are removed, cleans glass surface.
In the embodiment of the present invention, sputter principle connects cathode for target, and glass connects anode or ground connection, imports argon gas, and electronics exists
Accelerate to collide with Ar atoms during flying to glass under the action of electric field, ionize out a large amount of Ar cations and negative electricity
Son forms plasma (plasma-based).Ar cations accelerate to bombard target under the action of electric field, and it is former to sputter a large amount of target
Son, the target atom being in neutrality (or molecule) glass deposition film forming.
Wherein, TIO (Indium Tin Oxide) is a kind of semiconductor of the wide energy gap of N types, have high transparency and
Therefore electric conductivity quite meets is applied to equally need on the Related products material such as high transparency and the display screen of electric conductivity.
It should be noted that, although conductive film layer is formed in above-described embodiment in a manner of magnetron sputtering, but the disclosure is not
This is defined in, for example, in other embodiments, one layer of ITO conductive film can also be electroplated on the substrate by plating mode
Layer.
In step S630, Pattern is printed.
Fig. 9 shows a kind of schematic diagram of conductive film layer Pattern printings in disclosure exemplary embodiment.
As described in Figure 9, wire mark Pattern is printed at the Pattern for needing to retain by the way of silk-screen printing and protected
Protect ink.
In step S640, etching.
Figure 10 shows a kind of schematic diagram of conductive film layer etching in disclosure exemplary embodiment.
As described in Figure 10, conductive film layer etches, and wet etching mode may be used by the conduction in the region of non-covering protection ink
Layer or conductive film layer removal.Shower in diagram is spray thrower.
In TFT-LCD array fabrication process, wet-etching technology is because used etching liquid is cheap, isotropism
The advantages that be widely used.At present, in TFT-LCD industries, wet etching master etching liquid to be used has AL etching liquids and ITO
Etching liquid.ITO etching liquids can use the nitration mixture of HNO3 and HCl.The effect of etching liquid is with being quilt by the etching liquid of debita spissitudo
It protects the metallic diaphragm of ink protection that relevant chemical reaction occurs, removes the metallic diaphragm of unprotected ink protection, later
Final required metal Pattern is obtained using the protection ink above dissolution process removal metallic diaphragm.
In the exemplary embodiment, equipment sprays liquid and all filters out impurity particle via filter, then carries out
Etching.
In the exemplary embodiment, glass substrate is rinsed between entering pool after the completion of the reaction of liquid section, mainly
It is to be rinsed out etching liquid of glass baseplate surface and reactant etc. by water.
In step S650, protection ink dissolving.
Figure 11 shows a kind of schematic diagram for protecting ink dissolving in disclosure exemplary embodiment.
As described in Figure 11, dissolving protection ink, i.e., immerse substrate in weak caustic solution, by protection ink dissolving.
In step S660, the shadow layer that disappears is prepared.
In the embodiment of the present invention, the shadow layer that disappears is prepared, i.e., increases by one layer of SiOxNy or IM (Inorganic after conductive film layer
Membrane, inoranic membrane) etc. inorganic transparents film layer, play reduce Pattern segment differences effect.
In step S670, protective layer is prepared.
It should be noted that, although silk-screen printing is only used with BM processing procedures and/or conductive film layer processing procedure in above-described embodiment
It is illustrated, but in fact, the making of touch screen can also include the system of multiple conductive film layers for substitution yellow light processing procedure
Make and the intersection of BM processing procedures and conductive film layer processing procedure carry out, this can according to the type of the currently practical touch screen to be made and
Selection, and the manufacture craft in terms of the production method of the touch screen can also include other conducting wires or circuit structure,
The content of the prior art is may refer to, details are not described herein.
The method made for touch screen that embodiment of the present invention is provided, on the one hand, yellow light is replaced with silk-screen printing
Processing procedure can reduce the equipment investments such as exposure machine, save Mask jig expenses.Meanwhile BM photoresist systems are replaced with black ink
Standby BM light shield layers, can also substantially reduce material cost.On the other hand, conductive film layer preparation is used with " Magnetron Sputtering Thin Film-net
Print Pattern (printing protection ink)-conductive film etches-protects ink to dissolve " the conventional " magnetron sputtering of technological process substitution
Film-PR glue coating-exposure-development-etching " without carrying out lithographic process, therefore does not need to set in exposure machine, developing machine etc.
It is put on standby, has saved equipment cost and Mask jig expenses, reduced production cost, while shorten the production cycle.
Meanwhile the method for the embodiment of the present invention, it is low to processing request, yields can be improved, the production is simple and convenient.
Those skilled in the art will readily occur to the disclosure its after considering specification and putting into practice invention disclosed herein
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principle of the disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.Description and embodiments are considered only as illustratively, and the true scope and spirit of the disclosure are by appended
Claim is pointed out.
Claims (9)
- A kind of 1. method made for touch screen, which is characterized in that including：Conductive film layer is formed on substrate；Ink is protected in the predeterminable area silk-screen printing of the conductive film layer；The conductive film layer is etched, removal does not cover the conductive film layer in other regions of the protection ink；It dissolves the protection ink and forms conductive pattern.
- 2. it according to the method described in claim 1, it is characterized in that, further includes：Silk-screen printing BM light shield layers on the substrate.
- 3. according to the method described in claim 2, it is characterized in that, the BM light shield layers are made of black out ink.
- 4. it according to the method described in claim 1, it is characterized in that, further includes：The shadow layer that disappears is formed on the conductive pattern.
- 5. according to the method described in claim 4, it is characterized in that, the shadow layer that disappears is inorganic transparent film layer.
- 6. it according to the method described in claim 1, it is characterized in that, further includes：Protection film layer is formed on the shadow layer that disappears.
- 7. it according to the method described in claim 1, it is characterized in that, is formed on the substrate by magnetron sputtering mode described Conductive film layer.
- 8. according to the method described in claim 1, it is characterized in that, the conductive film layer is etched using wet etching mode.
- 9. according to the method described in claim 1, it is characterized in that, the protection ink is dissolved using weak caustic solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810004967.5A CN108227992A (en) | 2018-01-03 | 2018-01-03 | The method made for touch screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810004967.5A CN108227992A (en) | 2018-01-03 | 2018-01-03 | The method made for touch screen |
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Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102279682A (en) * | 2011-08-30 | 2011-12-14 | 深圳市豪威薄膜技术有限公司 | Novel capacitive touch screen, manufacturing method thereof and touch screen terminal |
| CN102902389A (en) * | 2011-07-27 | 2013-01-30 | 比亚迪股份有限公司 | Method for manufacturing touch sensor |
| CN103309510A (en) * | 2013-06-08 | 2013-09-18 | 南昌欧菲光科技有限公司 | Touch screen electrode manufacturing method |
| CN103593089A (en) * | 2013-11-30 | 2014-02-19 | 东莞市平波电子有限公司 | Manufacturing technology of touch screen of GG structure |
| CN103593090A (en) * | 2013-11-30 | 2014-02-19 | 东莞市平波电子有限公司 | Manufacturing technology of touch module of GF2 double-face conducting thin film and silver elargol wiring structure |
| CN104035642A (en) * | 2014-06-16 | 2014-09-10 | 南京点面光电有限公司 | OGS (one glass solution) capacitive touch screen and preparation method thereof |
| CN104156115A (en) * | 2014-08-15 | 2014-11-19 | 无锡宇宁光电科技有限公司 | Multi-point touch screen with single-layer film and production method thereof |
| CN104238824A (en) * | 2014-09-30 | 2014-12-24 | 江西省平波电子有限公司 | Manufacturing technology for touch screen of improved GFF structure |
| CN104866152A (en) * | 2015-05-20 | 2015-08-26 | 陈彦林 | Preparation process of capacitive touch screen, and capacitive touch screen |
| KR101708918B1 (en) * | 2016-05-02 | 2017-02-22 | 주식회사 파인텍 | Touch panel printed by silber screen |
| CN106681563A (en) * | 2017-01-05 | 2017-05-17 | 京东方科技集团股份有限公司 | Method for manufacturing touch panel and touch panel |
| CN107512050A (en) * | 2017-09-15 | 2017-12-26 | 京东方科技集团股份有限公司 | Contact panel and preparation method thereof, touch control display apparatus |
-
2018
- 2018-01-03 CN CN201810004967.5A patent/CN108227992A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102902389A (en) * | 2011-07-27 | 2013-01-30 | 比亚迪股份有限公司 | Method for manufacturing touch sensor |
| CN102279682A (en) * | 2011-08-30 | 2011-12-14 | 深圳市豪威薄膜技术有限公司 | Novel capacitive touch screen, manufacturing method thereof and touch screen terminal |
| CN103309510A (en) * | 2013-06-08 | 2013-09-18 | 南昌欧菲光科技有限公司 | Touch screen electrode manufacturing method |
| CN103593089A (en) * | 2013-11-30 | 2014-02-19 | 东莞市平波电子有限公司 | Manufacturing technology of touch screen of GG structure |
| CN103593090A (en) * | 2013-11-30 | 2014-02-19 | 东莞市平波电子有限公司 | Manufacturing technology of touch module of GF2 double-face conducting thin film and silver elargol wiring structure |
| CN104035642A (en) * | 2014-06-16 | 2014-09-10 | 南京点面光电有限公司 | OGS (one glass solution) capacitive touch screen and preparation method thereof |
| CN104156115A (en) * | 2014-08-15 | 2014-11-19 | 无锡宇宁光电科技有限公司 | Multi-point touch screen with single-layer film and production method thereof |
| CN104238824A (en) * | 2014-09-30 | 2014-12-24 | 江西省平波电子有限公司 | Manufacturing technology for touch screen of improved GFF structure |
| CN104866152A (en) * | 2015-05-20 | 2015-08-26 | 陈彦林 | Preparation process of capacitive touch screen, and capacitive touch screen |
| KR101708918B1 (en) * | 2016-05-02 | 2017-02-22 | 주식회사 파인텍 | Touch panel printed by silber screen |
| CN106681563A (en) * | 2017-01-05 | 2017-05-17 | 京东方科技集团股份有限公司 | Method for manufacturing touch panel and touch panel |
| CN107512050A (en) * | 2017-09-15 | 2017-12-26 | 京东方科技集团股份有限公司 | Contact panel and preparation method thereof, touch control display apparatus |
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Application publication date: 20180629 |