CN102891098A - 用于制造半导体的设备和方法 - Google Patents
用于制造半导体的设备和方法 Download PDFInfo
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- CN102891098A CN102891098A CN2012102567737A CN201210256773A CN102891098A CN 102891098 A CN102891098 A CN 102891098A CN 2012102567737 A CN2012102567737 A CN 2012102567737A CN 201210256773 A CN201210256773 A CN 201210256773A CN 102891098 A CN102891098 A CN 102891098A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 230000001105 regulatory effect Effects 0.000 claims description 6
- 238000009434 installation Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 description 28
- 230000033001 locomotion Effects 0.000 description 28
- 150000001875 compounds Chemical class 0.000 description 12
- 230000002950 deficient Effects 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 9
- 238000005520 cutting process Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 6
- 238000007689 inspection Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000007781 pre-processing Methods 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
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Claims (5)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011160984A JP5920864B2 (ja) | 2011-07-22 | 2011-07-22 | 半導体製造装置及び半導体製造方法 |
JP2011-160984 | 2011-07-22 | ||
KR1020120034225A KR101665393B1 (ko) | 2011-07-22 | 2012-04-03 | 반도체 제조 장치 |
KR10-2012-0034225 | 2012-04-03 |
Publications (2)
Publication Number | Publication Date |
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CN102891098A true CN102891098A (zh) | 2013-01-23 |
CN102891098B CN102891098B (zh) | 2016-12-21 |
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Application Number | Title | Priority Date | Filing Date |
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CN201210256773.7A Active CN102891098B (zh) | 2011-07-22 | 2012-07-23 | 用于制造半导体的设备和方法 |
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CN (1) | CN102891098B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090101632A (ko) * | 2008-03-24 | 2009-09-29 | 미래산업 주식회사 | 반도체 소자 이송장치, 핸들러, 및 반도체 소자 제조방법 |
CN101804405A (zh) * | 2009-02-17 | 2010-08-18 | 先进自动器材有限公司 | 包含有双缓冲器的电子器件分选机 |
JP2010245479A (ja) * | 2009-04-10 | 2010-10-28 | Akim Kk | 半導体チップ搭載装置 |
US20100299916A1 (en) * | 2009-06-02 | 2010-12-02 | Panasonic Corporation | Components packaging system |
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2012
- 2012-07-23 CN CN201210256773.7A patent/CN102891098B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20090101632A (ko) * | 2008-03-24 | 2009-09-29 | 미래산업 주식회사 | 반도체 소자 이송장치, 핸들러, 및 반도체 소자 제조방법 |
CN101804405A (zh) * | 2009-02-17 | 2010-08-18 | 先进自动器材有限公司 | 包含有双缓冲器的电子器件分选机 |
JP2010245479A (ja) * | 2009-04-10 | 2010-10-28 | Akim Kk | 半導体チップ搭載装置 |
US20100299916A1 (en) * | 2009-06-02 | 2010-12-02 | Panasonic Corporation | Components packaging system |
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Publication number | Publication date |
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CN102891098B (zh) | 2016-12-21 |
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Address after: Gyeongnam Changwon City, South Korea Applicant after: HANWHA TECHWIN Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Applicant before: Samsung Techwin Co.,Ltd. |
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Free format text: CORRECT: ADDRESS; FROM: Free format text: CORRECT: APPLICANT; FROM: SAMSUNG TAI KEWEI CO., LTD. TO: HANWHA TECHWIN CO., LTD. |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: Gyeongnam Changwon City, South Korea Patentee after: HANWHA AEROSPACE Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Patentee before: HANWHA TECHWIN Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190403 Address after: Gyeongnam Changwon City, South Korea Patentee after: Hanwha Precision Machinery Co.,Ltd. Address before: Gyeongnam Changwon City, South Korea Patentee before: HANWHA AEROSPACE Co.,Ltd. |
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