CN102832317B - Red-light LED method for packing - Google Patents
Red-light LED method for packing Download PDFInfo
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- CN102832317B CN102832317B CN201210291760.3A CN201210291760A CN102832317B CN 102832317 B CN102832317 B CN 102832317B CN 201210291760 A CN201210291760 A CN 201210291760A CN 102832317 B CN102832317 B CN 102832317B
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Abstract
The invention discloses a kind of red-light LED method for packing, it comprises the following steps: 1) prepare red light chips; 2) support is made; 3) white glue is prepared; 4) the first baking; 5) bonding wire; 6) glue is put; 7) the second baking; 8) sealing, obtained red-light LED product; Method manufacturing process provided by the invention is simple and easy, cost is low, be easy to realize and ensure product quality, meet the requirement of mass production, and red light chips is preferably AlGaInP quaternary chip, and the material component of the silver-colored optical cement of scientific and reasonable allotment and epoxy cap seal glue and proportioning, can not only improve outside the centrality in red light color district, color rendering index and luminous flux and reduce outside discreteness, also substantially prolongs useful life, combination property is high, is beneficial to wide popularization and application.
Description
Technical field
The invention belongs to LED field, be specifically related to a kind of red-light LED method for packing.
Background technology
Light-emitting diode (LightEmittingDiode, be called for short LED), it is a kind of element made by semi-conducting material, because can light be converted electrical energy into, so belong to a kind of fine solid state light emitter, not only possess that volume is little, the life-span is long, driving voltage is low, reaction rate is fast and vibration strength is special good, and can light, thin, short, little design requirement be coordinated, be widely used in the various product of daily life.
The most frequently used is exactly white light LEDs at present, and its principle sends white light by blue chip with fluorescent material mixing energising, and this white light instead of incandescent lamp and fluorescent lamp in the future gradually.
But in actual application, some lighting installation needs red effect, illumination as various in indoor, stop-light, street lamp, automobile tail light, advertising lighting, the fields such as font display.Although existing red-light LED can reach the effect sending ruddiness, packaging technology is loaded down with trivial details, and cost is high, and its red light color rendering index made is not high, and the life-span is relatively not long, and look district discreteness is large, is difficult to the requirement ensureing product quality and meet mass production.
Summary of the invention
For above-mentioned deficiency, the object of the invention is to, provide a kind of manufacturing process simple and easy, cost is low, production efficiency is high and the red-light LED method for packing of guarantee product quality.
For achieving the above object, technical scheme provided by the present invention is: a kind of red-light LED method for packing, and it comprises the following steps: (1) preparation red light chips; (2) making support, being provided with the bowl cup for placing red light chips at the top of this support; (3) prepare white glue, by this white glue point in the bottom of bowl cup, then red light chips is placed on this white glue, and then is fixed on bowl cup; (4) first bakings, the support being fixed with red light chips is moved to baking box, and the temperature of this baking box is set to 140 ~ 160 DEG C, and baking time is set to 1.5 ~ 2.5 hours; (5) bonding wire: preparation gold thread, be welded on red light chips by ultrasonic gold wire bonder by gold thread one end, the other end is welded on support, realizes red light chips and is connected with support; (6) put glue, prepare silver-colored optical cement, this silver-colored optical cement is clicked and entered in the bowl cup of described support, until the glue face of clicking and entering the silver-colored optical cement in bowl cup is concordant with the rim of a cup of described bowl cup; (7) second bakings, have the support of silver-colored optical cement to move to baking box point, the temperature of this baking box is set to 120 ~ 140 DEG C, and baking time is set to 1 ~ 2 hour; (8) sealing, prepare epoxy cap seal glue, this epoxy cap seal glue is placed in the case of 40 DEG C of constant temperature, and vacuumize 10 ~ 20 minutes, according to the required shaping corresponding mould of red-light LED shape preparation, this mould to be placed in more than 120 DEG C baking ovens preheating 30 ~ 40 minutes, epoxy cap seal glue is poured in mould, then the top of support is inserted in mould, and dislocation baking box, the temperature of this baking box is set to 120 ~ 140 DEG C, baking time is set to 60 ~ 70 minutes, treat that barbecue is complete, support is taken out from mould, obtained red-light LED product.
It is further comprising the steps of: (9) once before cut: excised by the horizontal bar between the negative pole pin of red-light LED product and positive pole pin, and then anticathode pin and positive pole pin carry out zinc-plated operation; (10) cut before secondary: treat that zinc-plated operation is complete, negative pole pin is cut into short pin, positive pole pin wouldn't cut off; (11) test: test, by not luminous, IR(VR=5V with test machine constant current 20mA) the red-light LED product of >5ma gets as defective products; (12) outward appearance is detected: outward appearance detection is carried out to red-light LED product, gets as substandard products to the red-light LED product containing one or more the bad outward appearances in colloid foreign material, colloid bubble, burr, scuffing, sizing material deficiency, support variable color, silver-colored optical cement variable color, support stain; (13) cut after: by the company's muscle excision between each red-light LED product, form single red-light LED product; (14) classify: according to voltage, brightness, colourity, a point BIN is carried out to single red-light LED product, to form the red-light LED product of all size.
The AlGaInP quaternary chip of described red light chips to be model be ED-008UOV, its optical wavelength section is 630 ~ 635nm.
The diameter of described gold thread is 22 ~ 24 μm.
The white glue of described white glue to be model be EP-1000.
Fluorescent material, model that described silver-colored optical cement is 11001 by model are the fluorescent material of UC-900, white light glue mixes mutually with epoxy curing agent; Wherein the weight proportion of the fluorescent material of model to be fluorescent material, the model of 11001 be UC-900, white light glue and epoxy curing agent is: 0.14:0.002:0.25:0.25.
Silver-colored optical cement prepared in described step (6) need be finished within half an hour, causes glow color deviation to avoid precipitation.
Described epoxy cap seal glue is mixed by epoxide-resin glue A and epoxide-resin glue B, and wherein the weight proportion of epoxide-resin glue A and epoxide-resin glue B is 1:1.
Described epoxide-resin glue A is epoxy resin, and described epoxide-resin glue B is polyamide curing agent.
The tin coating thickness of the zinc-plated operation in described step (9) is 2-8 μm.
Beneficial effect of the present invention is: method manufacturing process provided by the invention is simple and easy, cost is low, be easy to realize and ensure product quality, meet the requirement of mass production, and red light chips is preferably AlGaInP quaternary chip, and the material component of the silver-colored optical cement of scientific and reasonable allotment and epoxy cap seal glue and proportioning, can not only improve outside the centrality in red light color district, color rendering index and luminous flux and reduce outside discreteness, also substantially prolongs useful life, combination property is high, is beneficial to wide popularization and application.
Below in conjunction with drawings and Examples, the invention will be further described.
Accompanying drawing explanation
Fig. 1 is preparation flow figure of the present invention.
Embodiment
Embodiment: see Fig. 1, present embodiments provide a kind of red-light LED method for packing, it comprises the following steps: (1) preparation red light chips; (2) making support, being provided with the bowl cup for placing red light chips at the top of this support; (3) prepare white glue, by this white glue point in the bottom of bowl cup, then red light chips is placed on this white glue, and then is fixed on bowl cup; (4) first bakings, the support being fixed with red light chips is moved to baking box, and the temperature of this baking box is set to 140 ~ 160 DEG C, and baking time is set to 1.5 ~ 2.5 hours; (5) bonding wire: preparation gold thread, be welded on red light chips by ultrasonic gold wire bonder by gold thread one end, the other end is welded on support, realizes red light chips and is connected with support; (6) put glue, prepare silver-colored optical cement, this silver-colored optical cement is clicked and entered in the bowl cup of described support, until the glue face of clicking and entering the silver-colored optical cement in bowl cup is concordant with the rim of a cup of described bowl cup; (7) second bakings, have the support of silver-colored optical cement to move to baking box point, the temperature of this baking box is set to 120 ~ 140 DEG C, and baking time is set to 1 ~ 2 hour; (8) sealing, prepare epoxy cap seal glue, this epoxy cap seal glue is placed in the case of 40 DEG C of constant temperature, and vacuumize 10 ~ 20 minutes, according to the required shaping corresponding mould of red-light LED shape preparation, this mould to be placed in more than 120 DEG C baking ovens preheating 30 ~ 40 minutes, epoxy cap seal glue is poured in mould, then the top of support is inserted in mould, and dislocation baking box, the temperature of this baking box is set to 120 ~ 140 DEG C, baking time is set to 60 ~ 70 minutes, treat that barbecue is complete, support is taken out from mould, obtained red-light LED product.
It is further comprising the steps of: (9) once before cut: excised by the horizontal bar between the negative pole pin of red-light LED product and positive pole pin, and then anticathode pin and positive pole pin carry out zinc-plated operation; (10) cut before secondary: treat that zinc-plated operation is complete, negative pole pin is cut into short pin, positive pole pin wouldn't cut off; (11) test: test, by not luminous, IR(VR=5V with test machine constant current 20mA) the red-light LED product of >5ma gets as defective products; (12) outward appearance is detected: outward appearance detection is carried out to red-light LED product, gets as substandard products to the red-light LED product containing one or more the bad outward appearances in colloid foreign material, colloid bubble, burr, scuffing, sizing material deficiency, support variable color, silver-colored optical cement variable color, support stain; (13) cut after: by the company's muscle excision between each red-light LED product, form single red-light LED product; (14) classify: according to voltage, brightness, colourity, a point BIN is carried out to single red-light LED product, to form the red-light LED product of all size.
The AlGaInP quaternary chip of described red light chips to be model be ED-008UOV, its optical wavelength section is 630 ~ 635nm.
The white glue of described white glue to be model be EP-1000.
Fluorescent material, model that described silver-colored optical cement is 11001 by model are the fluorescent material of UC-900, white light glue mixes mutually with epoxy curing agent; Wherein the weight proportion of the fluorescent material of model to be fluorescent material, the model of 11001 be UC-900, white light glue and epoxy curing agent is: 0.14:0.002:0.25:0.25.
Silver-colored optical cement prepared in described step (6) need be finished within half an hour, causes glow color deviation to avoid precipitation.
Described epoxy cap seal glue is mixed by epoxide-resin glue A and epoxide-resin glue B, and wherein the weight proportion of epoxide-resin glue A and epoxide-resin glue B is 1:1.
Described epoxide-resin glue A is epoxy resin, and described epoxide-resin glue B is polyamide curing agent.
The tin coating thickness of the zinc-plated operation in described step (9) is 2-8 μm.
In the present embodiment, the diameter of gold thread is preferably 23 μm.In other embodiment, the diameter of described gold thread is 22 ~ 24 μm.
Method manufacturing process provided by the invention is simple and easy, cost is low, be easy to realize and ensure product quality, meet the requirement of mass production, and red light chips is preferably AlGaInP quaternary chip, and the material component of the silver-colored optical cement of scientific and reasonable allotment and epoxy cap seal glue and proportioning, can not only improve outside the centrality in red light color district, color rendering index and luminous flux and reduce outside discreteness, also substantially prolongs useful life, combination property is high, is beneficial to wide popularization and application.
In actual production, be also noted that in needle tubing, silver-colored optical cement must be finished within half an hour, otherwise easily precipitation causes glow color deviation.
As described in the above embodiment the present invention, technical characteristic same or similar with it is adopted and other light fixture preparation method obtained, all in scope.
Claims (4)
1. a red-light LED method for packing, is characterized in that, it comprises the following steps:
(1) red light chips is prepared;
(2) making support, being provided with the bowl cup for placing red light chips at the top of this support;
(3) prepare white glue, by this white glue point in the bottom of bowl cup, then red light chips is placed on this white glue, and then is fixed on bowl cup;
(4) first bakings: the support being fixed with red light chips is moved to baking box, and the temperature of this baking box is set to 140 ~ 160 DEG C, and baking time is set to 1.5 ~ 2.5 hours;
(5) bonding wire: preparation gold thread, gold thread diameter is 22 ~ 24 μm; Be welded on red light chips by ultrasonic gold wire bonder by gold thread one end, the other end is welded on support, realizes red light chips and is connected with support;
(6) glue is put: prepare silver-colored optical cement, click and enter in the bowl cup of described support by this silver-colored optical cement, until the glue face of clicking and entering the silver-colored optical cement in bowl cup is concordant with the rim of a cup of described bowl cup;
(7) second bakings: have the support of silver-colored optical cement to move to baking box point, the temperature of this baking box is set to 120 ~ 140 DEG C, and baking time is set to 1 ~ 2 hour;
(8) sealing: prepare epoxy cap seal glue, epoxy cap seal glue is mixed by epoxide-resin glue A and epoxide-resin glue B, and epoxide-resin glue A is epoxy resin, and described epoxide-resin glue B is polyamide curing agent; Wherein the weight proportion of epoxide-resin glue A and epoxide-resin glue B is 1:1; This epoxy cap seal glue is placed in the case of 40 DEG C of constant temperature, and vacuumize 10 ~ 20 minutes, according to the required shaping corresponding mould of red-light LED shape preparation, this mould to be placed in more than 120 DEG C baking ovens preheating 30 ~ 40 minutes, epoxy cap seal glue is poured in mould, then the top of support is inserted in mould, and dislocation baking box, the temperature of this baking box is set to 120 ~ 140 DEG C, and baking time is set to 60 ~ 70 minutes, treat that barbecue is complete, support is taken out from mould;
(9) once before cut: excised by the horizontal bar between the negative pole pin of red-light LED product and positive pole pin, then anticathode pin and positive pole pin carry out zinc-plated operation; Tin coating thickness is 2-8 μm;
(10) cut before secondary: treat that zinc-plated operation is complete, negative pole pin is cut into short pin, positive pole pin wouldn't cut off;
(11) test: test, by not luminous, IR(VR=5V with test machine constant current 20mA) the red-light LED product of >5ma gets as defective products;
(12) outward appearance is detected: outward appearance detection is carried out to red-light LED product, gets as substandard products to the red-light LED product containing one or more the bad outward appearances in colloid foreign material, colloid bubble, burr, scuffing, sizing material deficiency, support variable color, silver-colored optical cement variable color, support stain;
(13) cut after: by the company's muscle excision between each red-light LED product, form single red-light LED product;
(14) classify: according to voltage, brightness, colourity, a point BIN is carried out to single red-light LED product, to form the red-light LED product of all size, the AlGaInP quaternary chip of described red light chips to be model be ED-008UOV, its optical wavelength section is 630 ~ 635nm.
2. red-light LED method for packing according to claim 1, is characterized in that, the white glue of described white glue to be model be EP-1000.
3. red-light LED method for packing according to claim 1, is characterized in that, fluorescent material, model that described silver-colored optical cement is 11001 by model are the fluorescent material of UC-900, white light glue mixes mutually with epoxy curing agent; Wherein the weight proportion of the fluorescent material of model to be fluorescent material, the model of 11001 be UC-900, white light glue and epoxy curing agent is: 0.14:0.002:0.25:0.25.
4. red-light LED method for packing according to claim 1, is characterized in that, silver-colored optical cement prepared in described step (6) need be finished within half an hour, causes glow color deviation to avoid precipitation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210291760.3A CN102832317B (en) | 2012-08-16 | 2012-08-16 | Red-light LED method for packing |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210291760.3A CN102832317B (en) | 2012-08-16 | 2012-08-16 | Red-light LED method for packing |
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| CN102832317A CN102832317A (en) | 2012-12-19 |
| CN102832317B true CN102832317B (en) | 2015-12-16 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103354259A (en) * | 2013-06-25 | 2013-10-16 | 宁波协源光电科技有限公司 | Structure and method for packaging small-module high-refractive-index LED formed by green chip and red phosphor |
| CN103682049B (en) * | 2013-12-26 | 2016-09-14 | 四川柏狮光电技术有限公司 | A kind of waterproof paster LED and production technology thereof |
| CN104465952A (en) * | 2014-12-16 | 2015-03-25 | 常熟卓辉光电科技股份有限公司 | LED packaging method |
| CN105977363B (en) * | 2016-07-01 | 2018-09-21 | 安徽亮亮电子科技有限公司 | A kind of method of LED substandard products lamp bead recycling |
| CN110975742A (en) * | 2019-12-26 | 2020-04-10 | 重庆切普电子技术有限公司 | Dripping and sealing material for LED bare chip and preparation method thereof |
| CN111189853A (en) * | 2020-01-10 | 2020-05-22 | 盐城东山精密制造有限公司 | Detection method of LED packaging adhesive |
| CN114744482B (en) * | 2022-06-10 | 2022-09-23 | 吉麦思科技（深圳）有限公司 | Surface-mounted-package laser diode manufacturing equipment and process thereof |
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| CN1945803A (en) * | 2006-10-27 | 2007-04-11 | 杭州中宙光电有限公司 | Packaging method for high power LED expansion light source device |
| CN1949553A (en) * | 2006-11-23 | 2007-04-18 | 保定市宝新世纪路灯厂 | LED of sodium imitation light source and mfg. technique thereof |
| CN101197412A (en) * | 2007-12-20 | 2008-06-11 | 宁波安迪光电科技有限公司 | Packaging method for white light LED |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20090096347A1 (en) * | 2007-10-11 | 2009-04-16 | Xu Chao-Feng | LED Flat Light and A Manufacturing Method Thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1945803A (en) * | 2006-10-27 | 2007-04-11 | 杭州中宙光电有限公司 | Packaging method for high power LED expansion light source device |
| CN1949553A (en) * | 2006-11-23 | 2007-04-18 | 保定市宝新世纪路灯厂 | LED of sodium imitation light source and mfg. technique thereof |
| CN101197412A (en) * | 2007-12-20 | 2008-06-11 | 宁波安迪光电科技有限公司 | Packaging method for white light LED |
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Granted publication date: 20151216 Termination date: 20160816 |