CN102818324B - Semiconductor fan - Google Patents
Semiconductor fan Download PDFInfo
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- CN102818324B CN102818324B CN201210281804.4A CN201210281804A CN102818324B CN 102818324 B CN102818324 B CN 102818324B CN 201210281804 A CN201210281804 A CN 201210281804A CN 102818324 B CN102818324 B CN 102818324B
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Abstract
The invention discloses a semiconductor fan comprising a casing, a draught fan I and a refrigeration component. The refrigeration component at least comprises a semiconductor refrigeration plate which is arranged in the casing, and a refrigeration cavity is formed between the cold end surface of the semiconductor refrigeration plate and the internal wall of the casing; and the refrigeration cavity is provided with an air inlet for air intake through air blowing by the draught fan I and an air outlet for air exhaust. The semiconductor fan provided by the invention has the advantages of refrigeration by using the Peltier effect of a semiconductor material, wide refrigeration temperature range, capability of meeting the needs of people without using any gas and liquid working mediums, no pollution to the environment, simple structure, few parts and low manufacture cost, thereby being a safe and reliable cold-hot air fan.
Description
Technical field
The present invention relates to a kind of cold-hot wind equipment, particularly relate to a kind of semiconductor fan.
Background technology
Along with improving constantly of living standard, the higher requirement that people also propose life living environment, cold-hot wind equipment improves the requisite a kind of apparatus of people's living environment, as comparatively conventional cold/hot air-conditioning and fan, be significant for optimizing the environment, fan wherein for freezing is by promoting that the heat exchange of air flow enhuancement body surface and air is carried out freezing, refrigeration depends on air themperature and flow velocity, little and the action space of usual refrigeration temperature levels is limited in scope, operating noise is large, long-time air-flow flow at high speed also easily causes human body uncomfortable, Hot-air fan is generally based on refrigerating fan, air draft path is installed electric network realize and heat, electric network is generally made up of thermal resistance, and power is larger, energy consumption is high, use cost is high, and operating noise is large, and hot and cold fan functionality is single, cooling and warming can not be held concurrently in one, fragile, service life is generally shorter, has the limitation in use, and the cooling and warming of air-conditioning to utilize under normal temperature as gas but the conversion of the liquid state of the cold-producing medium that can liquefy at a lower temperature realizes, generally comprise compressor, condenser, throttle part and evaporimeter four essential parts, connect successively with pipeline between them, form an airtight system, cold-producing medium constantly circulates in systems in which, generation state changes, and then carry out exchange heat with the external world, the freon that adopts as cold-producing medium more at present, freon is a kind of colourless, odorless, transparent, the cold-producing medium of almost non-toxic property, but suffocating of people can be caused when content is more than 80% in air, can not burn and also can not explode in fluorine Lyons, but contact with naked light or temperature reaches more than 400 DEG C time, harmful hydrogen fluoride can be decomposited, hydrogen chloride photoreactive gas, if because air-conditioning cause for quality causes the contingency such as refrigrant leakage or breaking out of fire to cause cold-producing medium to decompose, not only can cause environmental pollution but also very easily injure the life security of people, moreover, the refrigeration of air-conditioning by cold-producing medium, condition conversion ceaselessly occurs in the circulatory system of sealing to realize, energy consumption is high, there is operating noise, complex structure, precise part is many, manufacturing cost is high, price is general more expensive.
Therefore, need a kind of safe, reliable, refrigeration plant that temperature regulating range is large, to make up the deficiency of existing cold-hot wind equipment on using, fill up the vacancy of cooling and warming technology, improve the life living environment of people more reliably, meet the needs of social development.
Summary of the invention
In view of this, the object of this invention is to provide a kind of semiconductor fan, utilize the peltier effect of semi-conducting material to carry out freezing and heating, temperature regulating range is large, can meet the needs of people, free from environmental pollution, and structure is simple, low cost of manufacture, long service life.
Semiconductor fan of the present invention, comprise housing, blower fan I and cooling assembly, described cooling assembly at least comprises semiconductor chilling plate, described semiconductor chilling plate to be installed in housing and to form refrigerating chamber between its cold end surface and inner walls, and described refrigerating chamber is provided with and promotes the air inlet of air intake and the air outlet of air-out by blower fan I air blast.
Further, the cold end surface of semiconductor chilling plate is provided with fin side by side along wind flow direction, described fin, between inner walls and the cold end surface of semiconductor chilling plate, form multiple refrigerating channel, described fin is also distributed with air vent, and the low spot being positioned at refrigerating chamber is provided with the header tank for collecting condensed water communicated with refrigerating chamber; Described blower fan I is fixedly installed in refrigerating chamber;
Further, described semiconductor chilling plate is provided with the cold and hot switch in its electric current changeable access direction;
Further, described semiconductor chilling plate entirety is built in housing, also forms heat dissipation cavity between the hot end surface of semiconductor chilling plate and inner walls;
Further, described cooling assembly also comprises water-cooling system, and described water-cooling system at least comprises water pump, and the water inlet of described water pump is communicated in header tank, and the delivery port of water pump is communicated in heat dissipation cavity;
Further, described semiconductor chilling plate hot end surface is vertically provided with fin side by side, described fin, forms multiple heat dissipation channel between inner walls and the hot end surface of semiconductor chilling plate, and described fin is also distributed with through hole;
Further, described water-cooling system also comprise by water-supply-pipe be communicated in pump outlet for water being sprayed on the spraying pack unit of semiconductor chilling plate fin surface and being arranged at the storage tank being used for collecting cooling water that heat dissipation cavity low spot communicates with heat dissipation cavity;
Further, described cooling assembly also comprises air cooling system, and described air cooling system at least comprises blower fan II, and described blower fan II is fixedly installed in heat dissipation cavity, and heat dissipation cavity is provided with and promotes the air intake passage of air intake and the air-out passage of air-out by blower fan II air blast;
Further, described air intake passage and air-out passage are and are communicated with heat dissipation cavity to outdoor ventilation duct, described semiconductor chilling plate hot end surface is provided with fin along air intake passage side by side to air-out passage direction, described fin, between inner walls and the hot end surface of semiconductor chilling plate, form multiple heat dissipation channel, described fin is also distributed with through hole;
Further, described cooling assembly also comprises and to be connected with the heat conduction of semiconductor chilling plate hot junction and to extend outdoor heat pipe and heat conduction is connected to the radiator that heat pipe is positioned at outdoor end, and described radiator outside is provided with case.
The invention has the beneficial effects as follows: semiconductor fan of the present invention, the peltier effect of semi-conducting material is utilized to carry out freezing and heating, namely when direct current is by the galvanic couple that is in series by different semi-conducting material, can absorb at the two ends of an idol respectively and release heat, subzero 130 DEG C of adjustments to 90 DEG C of temperature ranges above freezing can be realized, temperature regulating range is large, the needs of people can be met, without the need to any gas, liquid working media, free from environmental pollution, structure is simple, and parts are few, low cost of manufacture is a kind of safe and reliable Cold-warm fan.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described:
Fig. 1 is semiconductor fan one body swimming air-cooled structure schematic diagram of the present invention;
Fig. 2 is semiconductor fan integral type air-cooled structure schematic diagram of the present invention;
Fig. 3 is semiconductor fan indoor and outdoor separate type schematic diagram of the present invention;
Fig. 4 is semiconductor chilling plate cold junction fin structure schematic diagram
Fig. 5 is semiconductor chilling plate place in circuit and cold and hot on-off circuit figure.
Detailed description of the invention
Embodiment one:
Fig. 1 is semiconductor fan one body swimming air-cooled structure schematic diagram of the present invention, Fig. 4 is semiconductor chilling plate cold junction fin structure schematic diagram, Fig. 5 is semiconductor chilling plate place in circuit and cold and hot on-off circuit figure, as shown in the figure: the semiconductor fan of the present embodiment, comprise housing 1, blower fan I 2 and cooling assembly 3, described cooling assembly 3 at least comprises semiconductor chilling plate 31, described semiconductor chilling plate 31 to be installed in housing 1 and to form refrigerating chamber 13 between its cold end surface and housing 1 inwall, described refrigerating chamber 13 is provided with and promotes the air inlet 11 of air intake and the air outlet 12 of air-out by blower fan I 2 air blast, semiconductor chilling plate 31 passes through seal diaphragm 4 with cold, what hot junction was separated is sealingly fastened in housing 1, be positioned at gauge tap housing 1 arranged for controlling semiconductor chilling plate 31 on/off and the access sense of current, the sense of current being changed access semiconductor chilling plate 31 by gauge tap can be realized refrigeration or heat, it is convenient to control, subzero 130 DEG C of adjustments to 90 DEG C of temperature ranges above freezing can be realized, temperature regulating range is large, the needs of people can be met, free from environmental pollution, structure is simple, low cost of manufacture, long service life, be positioned at refrigerating chamber 13 can arrange near air outlet 12 one end and filter the damping device 5 of humidification for carrying out air, the humidity through the hydronic room air of refrigerating chamber 13 can be kept, avoid because of the too dry human body sense of discomfort caused of room air, damping device 5 can be the suction hole cotton being arranged at air outlet 12 place in refrigerating chamber 13 and immersing condensed water, moistened by the cotton filtration to air of suction hole and do in order to increase air humidity, also can adopt with condensed water is the negative oxygen ion air wetting machine of humidification water.
In the present embodiment, the cold end surface of semiconductor chilling plate 31 is provided with fin 32 side by side along wind flow direction, described fin 32, multiple refrigerating channel is formed between the cold end surface of housing 1 inwall and semiconductor chilling plate 31, described fin 32 is also distributed with air vent 321, the low spot being positioned at refrigerating chamber 13 is provided with the header tank 15 for collecting condensed water communicated with refrigerating chamber 13, as shown in Figure 4, air vent 321 to be positioned on adjacent two fins 32 respectively near and arrange away from semiconductor chilling plate cold junction 311, the air vent 321 of each fin 32 can be set to multiple and arrange along the straight uniform being parallel to semiconductor chilling plate cold junction 311 surface, air vent 321 aperture and quantity unimpededly can flow through with air and be as the criterion under the promotion of blower fan I 2, after air enters refrigerating chamber 13 by air inlet 11, the zigzag channel formed along gap between each fin 32 and air vent 321 flows to air outlet 12 place and discharges, air and each fin 32 surface contact abundant, heat exchange action area is large, cold or the heat utilization ratio of semiconductor chilling plate 31 are high, cooling or heating effect is good.
In the present embodiment, described semiconductor chilling plate 31 is provided with the cold and hot switch 16 in its electric current changeable access direction, cold and hot switch 16 is installed on housing 1, be provided with a pair movable contact electrode 161 being connected with power supply and oppositely access two pairs of fixed contact electrodes (being respectively 162a, 162b in Fig. 5) that semiconductor chilling plate 31 switchable current accesses direction each other, structure is simple, low cost of manufacture, described power supply is dc source, is realized by civil power by rectifier rectification; Cold and hot switch 16 also can arrange one with the two pairs of fixed contact electrodes arranged side by side for cutting off the disconnection shelves 163 that semiconductor chilling plate 31 is connected with power supply, the on/off of collection semiconductor chilling plate is arranged at one, controls more convenient.
In the present embodiment, described semiconductor chilling plate 31 entirety is built in housing 1, heat dissipation cavity 14 is also formed between the hot end surface of semiconductor chilling plate 31 and housing 1 inwall, semiconductor chilling plate 31 cold and hot two ends isolation effectively can avoid the portion temperature neutralization because environment seepage causes, ensure semiconductor chilling plate 31 produce making full use of of cold or heat, also can arrange water-cooled or air cooling system 35 to produce heat to semiconductor chilling plate hot junction 312 and carry out concentrating cooling, hot-side temperature is reduced by the mode of active heat removal, cold junction temperature is reduced further when making dc source electric current constant, improve its refrigeration.
In the present embodiment, described cooling assembly 3 also comprises water-cooling system 34, described water-cooling system 34 at least comprises water pump 341, the water inlet of described water pump 341 is communicated in header tank 15, the delivery port of water pump 341 is communicated in heat dissipation cavity 14, usual semiconductor chilling plate is cold, the temperature difference in hot junction can reach between 40 DEG C ~ 65 DEG C, when semiconductor fan of the present invention is for freezing, can open water cooling system 34 take the initiative heat radiation mode to reduce hot-side temperature, cold junction temperature can be reduced further when dc source electric current is constant, and then reach lower temperature, refrigerating capacity is large, the needs of people can be met, water-cooling system 34 reliability is high, good heat dissipation effect.
In the present embodiment, surface, described semiconductor chilling plate hot junction 312 is vertically provided with fin 33 side by side, described fin 33, between housing 1 inwall and the hot end surface of semiconductor chilling plate 31, form multiple heat dissipation channel, described fin 33 is also distributed with through hole 331, can increase semiconductor chilling plate hot junction 312 surface area and the contact area with cooling water, cooling effectiveness is high.
In the present embodiment, described water-cooling system 34 also comprise by water-supply-pipe 342 be communicated in water pump 341 delivery port for water being sprayed on the spraying pack unit 343 on semiconductor chilling plate 31 fin 33 surface and being arranged at the storage tank 344 being used for collecting cooling water that heat dissipation cavity 14 low spot communicates with heat dissipation cavity 14, water-supply-pipe is fixed on seal diaphragm 4, reasonable in design, be beneficial to fully contacting of cooling water and fin 33, storage tank 344 can arrange liquid level meter and draining valve so that observe its water level inside and draining timely.
Embodiment two:
Fig. 2 is semiconductor fan integral type air-cooled structure schematic diagram of the present invention, Fig. 4 is semiconductor chilling plate cold junction fin structure schematic diagram, Fig. 5 is semiconductor chilling plate place in circuit and cold and hot on-off circuit figure, as shown in the figure: the semiconductor fan of the present embodiment, comprise housing 1, blower fan I 2 and cooling assembly 3, described cooling assembly 3 at least comprises semiconductor chilling plate 31, described semiconductor chilling plate 31 to be installed in housing 1 and to form refrigerating chamber 13 between its cold end surface and housing 1 inwall, described refrigerating chamber 13 is provided with and promotes the air inlet 11 of air intake and the air outlet 12 of air-out by blower fan I 2 air blast, semiconductor chilling plate 31 passes through seal diaphragm 4 with cold, what hot junction was separated is sealingly fastened in housing 1, be positioned at gauge tap housing 1 arranged for controlling semiconductor chilling plate 31 on/off and the access sense of current, the sense of current being changed access semiconductor chilling plate 31 by gauge tap can be realized refrigeration or heat, it is convenient to control, subzero 130 DEG C of adjustments to 90 DEG C of temperature ranges above freezing can be realized, temperature regulating range is large, the needs of people can be met, free from environmental pollution, structure is simple, low cost of manufacture, long service life, be positioned at refrigerating chamber 13 can arrange near air outlet 12 one end and filter the damping device 5 of humidification for carrying out air, the humidity through the hydronic room air of refrigerating chamber 13 can be kept, avoid because of the too dry human body sense of discomfort caused of room air, damping device 5 can be the suction hole cotton being arranged at air outlet 12 place in refrigerating chamber 13 and immersing condensed water, moistened by the cotton filtration to air of suction hole and do in order to increase air humidity, also can adopt with condensed water is the negative oxygen ion air wetting machine of humidification water.
In the present embodiment, the cold end surface of semiconductor chilling plate 31 is provided with fin 32 side by side along wind flow direction, described fin 32, multiple refrigerating channel is formed between the cold end surface of housing 1 inwall and semiconductor chilling plate 31, described fin 32 is also distributed with air vent 321, the low spot being positioned at refrigerating chamber 13 is provided with the header tank 15 for collecting condensed water communicated with refrigerating chamber 13, in the present embodiment, header tank 15 is hexahedron structure, header tank 15 to be fixedly connected with housing 1 bottom surface by its end face and to be positioned at header tank 15 end face and housing 1 bottom surface offers the hole that header tank 15 is communicated with refrigerating chamber 13, as shown in Figure 4, air vent 321 to be positioned on adjacent two fins 32 respectively near and arrange away from semiconductor chilling plate cold junction 311, the air vent 321 of each fin 32 can be set to multiple and arrange along the straight uniform being parallel to semiconductor chilling plate cold junction 311 surface, air vent 321 aperture and quantity unimpededly can flow through with air and be as the criterion under the promotion of blower fan I 2, after air enters refrigerating chamber 13 by air inlet 11, the zigzag channel formed along gap between each fin 32 and air vent 321 flows to air outlet 12 place and discharges, air and each fin 32 surface contact abundant, heat exchange action area is large, cold or the heat utilization ratio of semiconductor chilling plate 31 are high, cooling or heating effect is good.
In the present embodiment, described semiconductor chilling plate 31 is provided with the cold and hot switch 16 in its electric current changeable access direction, cold and hot switch 16 is installed on housing 1, be provided with a pair movable contact electrode 161 being connected with power supply and oppositely access two pairs of fixed contact electrodes (being respectively 162a, 162b in Fig. 5) that semiconductor chilling plate 31 switchable current accesses direction each other, structure is simple, low cost of manufacture, described power supply is dc source, is realized by civil power by rectifier rectification; Cold and hot switch 16 also can arrange one with the two pairs of fixed contact electrodes arranged side by side for cutting off the disconnection shelves 163 that semiconductor chilling plate 31 is connected with power supply, the on/off of collection semiconductor chilling plate is arranged at one, controls more convenient.
In the present embodiment, described semiconductor chilling plate 31 entirety is built in housing 1, heat dissipation cavity 14 is also formed between the hot end surface of semiconductor chilling plate 31 and housing 1 inwall, semiconductor chilling plate 31 cold and hot two ends isolation effectively can avoid the portion temperature neutralization because environment seepage causes, ensure semiconductor chilling plate 31 produce making full use of of cold or heat, also can arrange water-cooled or air cooling system 35 to produce heat to semiconductor chilling plate hot junction 312 and carry out concentrating cooling, hot-side temperature is reduced by the mode of active heat removal, cold junction temperature is reduced further when making dc source electric current constant, improve its refrigeration.
In the present embodiment, described cooling assembly 3 also comprises air cooling system 35, described air cooling system 35 at least comprises blower fan II 351, described blower fan II 351 is fixedly installed in heat dissipation cavity 14, heat dissipation cavity 14 is provided with and promotes the air intake passage 352 of air intake and the air-out passage 353 of air-out by blower fan II 351 air blast, usual semiconductor chilling plate is cold, the temperature difference in hot junction can reach between 40 DEG C ~ 65 DEG C, when semiconductor fan of the present invention is for freezing, open air cooling system 35 take the initiative heat radiation mode to reduce hot-side temperature, cold junction temperature can be reduced further when dc source electric current is constant, and then reach lower temperature, refrigerating capacity is large, the needs of people can be met.
In the present embodiment, described air intake passage 352 and air-out passage 353 are and are communicated with heat dissipation cavity 14 to outdoor ventilation duct, surface, described semiconductor chilling plate hot junction 312 is provided with fin 33 along air intake passage 352 side by side to air-out passage 353 direction, described fin 33, multiple heat dissipation channel is formed between the hot end surface of housing 1 inwall and semiconductor chilling plate 31, described fin 33 is also distributed with through hole 331, can increase semiconductor chilling plate hot junction 312 surface area and with cross-ventilation area, cooling effectiveness is high, radiating tube and blast pipe are and can extend outdoor long tube structure, be positioned at blast pipe tube wall and be also provided with the fresh air inlet 354 communicated with indoor, with make full use of indoor-outdoor air semiconductor chilling plate hot junction 312 cooled and by temperature and rear gas drain into outdoor, be unlikely to affect indoor temperature, structure is simple, reasonable in design, low cost of manufacture.
Embodiment three:
Fig. 3 is semiconductor fan indoor and outdoor separate type schematic diagram of the present invention, Fig. 4 is semiconductor chilling plate cold junction fin structure schematic diagram, Fig. 5 is semiconductor chilling plate place in circuit and cold and hot on-off circuit figure, as shown in the figure: the semiconductor fan of the present embodiment, comprise housing 1, blower fan I 2 and cooling assembly 3, described cooling assembly 3 at least comprises semiconductor chilling plate 31, described semiconductor chilling plate 31 to be installed in housing 1 and to form refrigerating chamber 13 between its cold end surface and housing 1 inwall, described refrigerating chamber 13 is provided with and promotes the air inlet 11 of air intake and the air outlet 12 of air-out by blower fan I 2 air blast, semiconductor chilling plate 31 passes through seal diaphragm 4 with cold, what hot junction was separated is sealingly fastened in housing 1, be positioned at gauge tap housing 1 arranged for controlling semiconductor chilling plate 31 on/off and the access sense of current, the sense of current being changed access semiconductor chilling plate 31 by gauge tap can be realized refrigeration or heat, it is convenient to control, subzero 130 DEG C of adjustments to 90 DEG C of temperature ranges above freezing can be realized, temperature regulating range is large, the needs of people can be met, free from environmental pollution, structure is simple, low cost of manufacture, long service life, be positioned at refrigerating chamber 13 can arrange near air outlet 12 one end and filter the damping device 5 of humidification for carrying out air, the humidity through the hydronic room air of refrigerating chamber 13 can be kept, avoid because of the too dry human body sense of discomfort caused of room air, damping device 5 can be the suction hole cotton being arranged at air outlet 12 place in refrigerating chamber 13 and immersing condensed water, moistened by the cotton filtration to air of suction hole and do in order to increase air humidity, also can adopt with condensed water is the negative oxygen ion air wetting machine of humidification water.
In the present embodiment, the cold end surface of semiconductor chilling plate 31 is provided with fin 32 side by side along wind flow direction, described fin 32, multiple refrigerating channel is formed between the cold end surface of housing 1 inwall and semiconductor chilling plate 31, described fin 32 is also distributed with air vent 321, the low spot being positioned at refrigerating chamber 13 is provided with the header tank 15 for collecting condensed water communicated with refrigerating chamber 13, as shown in Figure 4, air vent 321 to be positioned on adjacent two fins 32 respectively near and arrange away from semiconductor chilling plate cold junction 311, the air vent 321 of each fin 32 can be set to multiple and arrange along the straight uniform being parallel to semiconductor chilling plate cold junction 311 surface, air vent 321 aperture and quantity unimpededly can flow through with air and be as the criterion under the promotion of blower fan I 2, after air enters refrigerating chamber 13 by air inlet 11, the zigzag channel formed along gap between each fin 32 and air vent 321 flows to air outlet 12 place and discharges, air and each fin 32 surface contact abundant, heat exchange action area is large, cold or the heat utilization ratio of semiconductor chilling plate 31 are high, cooling or heating effect is good.
In the present embodiment, described semiconductor chilling plate 31 is provided with the cold and hot switch 16 in its electric current changeable access direction, cold and hot switch 16 is installed on housing 1, be provided with a pair movable contact electrode 161 being connected with power supply and oppositely access two pairs of fixed contact electrodes (being respectively 162a, 162b in Fig. 5) that semiconductor chilling plate 31 switchable current accesses direction each other, structure is simple, low cost of manufacture, described power supply is dc source, is realized by civil power by rectifier rectification; Cold and hot switch 16 also can arrange one with the two pairs of fixed contact electrodes arranged side by side for cutting off the disconnection shelves 163 that semiconductor chilling plate 31 is connected with power supply, the on/off of collection semiconductor chilling plate is arranged at one, controls more convenient.
In the present embodiment, described cooling assembly 3 also comprises and to be connected with semiconductor chilling plate hot junction 312 heat conduction and to extend outdoor heat pipe 36 and heat conduction is connected to the radiator 37 that heat pipe 36 is positioned at outdoor end, described radiator 37 outside is provided with case 6, indoor and outdoor separate type can reduce indoor set volume and then reduce floor space, save space, radiator 37 can be set to radiating fin 32 structure for being derived by heat that heat-conducting plate and heat conduction are connected and fixed on heat-conducting plate two sides, make full use of outdoor air Effect of Nature Convection by radiator 37 to dispel the heat, ensure that semiconductor chilling plate hot junction 312 temperature is unlikely too high, semiconductor chilling plate cold junction 311 is made to be in lower temperature, the refrigeration needs of people's living and working environment can be met, energy consumption is lower, be beneficial to and promote the use of.
What finally illustrate is, above embodiment is only in order to illustrate technical scheme of the present invention and unrestricted, although with reference to preferred embodiment to invention has been detailed description, those of ordinary skill in the art is to be understood that, can modify to technical scheme of the present invention or equivalent replacement, and not departing from aim and the scope of technical solution of the present invention, it all should be encompassed in the middle of right of the present invention.
Claims (10)
1. a semiconductor fan, it is characterized in that: comprise housing, blower fan I and cooling assembly, described cooling assembly at least comprises semiconductor chilling plate, described semiconductor chilling plate to be installed in housing and to form refrigerating chamber between its cold end surface and inner walls, and described refrigerating chamber is provided with and promotes the air inlet of air intake and the air outlet of air-out by blower fan I air blast; The cold end surface of semiconductor chilling plate is provided with fin side by side along wind flow direction, described fin, between inner walls and the cold end surface of semiconductor chilling plate, form multiple refrigerating channel, described fin is also distributed with air vent, air vent to be positioned on adjacent two fins respectively near and arrange away from semiconductor chilling plate cold junction.
2. semiconductor fan according to claim 1, is characterized in that: the low spot being positioned at refrigerating chamber is provided with the header tank for collecting condensed water communicated with refrigerating chamber; Described blower fan I is fixedly installed in refrigerating chamber.
3. semiconductor fan according to claim 2, is characterized in that: described semiconductor chilling plate is provided with the cold and hot switch in its electric current changeable access direction.
4. semiconductor fan according to claim 3, is characterized in that: described semiconductor chilling plate entirety is built in housing, also forms heat dissipation cavity between the hot end surface of semiconductor chilling plate and inner walls.
5. semiconductor fan according to claim 4, is characterized in that: described cooling assembly also comprises water-cooling system, and described water-cooling system at least comprises water pump, and the water inlet of described water pump is communicated in header tank, and the delivery port of water pump is communicated in heat dissipation cavity.
6. semiconductor fan according to claim 5, it is characterized in that: described semiconductor chilling plate hot end surface is vertically provided with fin side by side, described fin, between inner walls and the hot end surface of semiconductor chilling plate, form multiple heat dissipation channel, described fin is also distributed with through hole.
7. semiconductor fan according to claim 6, is characterized in that: described water-cooling system also comprise by water-supply-pipe be communicated in pump outlet for water being sprayed on the spraying pack unit of semiconductor chilling plate fin surface and being arranged at the storage tank being used for collecting cooling water that heat dissipation cavity low spot communicates with heat dissipation cavity.
8. semiconductor fan according to claim 4, it is characterized in that: described cooling assembly also comprises air cooling system, described air cooling system at least comprises blower fan II, described blower fan II is fixedly installed in heat dissipation cavity, and heat dissipation cavity is provided with and promotes the air intake passage of air intake and the air-out passage of air-out by blower fan II air blast.
9. semiconductor fan according to claim 8, it is characterized in that: described air intake passage and air-out passage are and are communicated with heat dissipation cavity to outdoor ventilation duct, described semiconductor chilling plate hot end surface is provided with fin along air intake passage side by side to air-out passage direction, described fin, between inner walls and the hot end surface of semiconductor chilling plate, form multiple heat dissipation channel, described fin is also distributed with through hole.
10. semiconductor fan according to claim 3, it is characterized in that: described cooling assembly also comprises and to be connected with the heat conduction of semiconductor chilling plate hot junction and to extend outdoor heat pipe and heat conduction is connected to the radiator that heat pipe is positioned at outdoor end, and described radiator outside is provided with case.
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| CN201210281804.4A CN102818324B (en) | 2012-08-09 | 2012-08-09 | Semiconductor fan |
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| CN201210281804.4A CN102818324B (en) | 2012-08-09 | 2012-08-09 | Semiconductor fan |
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| CN102818324A CN102818324A (en) | 2012-12-12 |
| CN102818324B true CN102818324B (en) | 2015-01-28 |
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| GB2267338A (en) * | 1992-05-21 | 1993-12-01 | Chang Pen Yen | Thermoelectric air conditioning |
| CN1587830A (en) * | 2004-09-23 | 2005-03-02 | 上海交通大学 | Movable household air conditioner |
| CN2837721Y (en) * | 2005-10-20 | 2006-11-15 | 张强 | Semiconductor refrigerator for household use |
| CN200975760Y (en) * | 2006-11-23 | 2007-11-14 | 刘端肃 | Water cooled semi-conductor cold-hot air-conditioner |
| CN101382326A (en) * | 2008-10-14 | 2009-03-11 | 游海珠 | Split type semiconductor air conditioner |
| CN101922778A (en) * | 2010-09-26 | 2010-12-22 | 广东新创意专利发展有限公司 | Semiconductor refrigerating air conditioning device |
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- 2012-08-09 CN CN201210281804.4A patent/CN102818324B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2267338A (en) * | 1992-05-21 | 1993-12-01 | Chang Pen Yen | Thermoelectric air conditioning |
| CN1587830A (en) * | 2004-09-23 | 2005-03-02 | 上海交通大学 | Movable household air conditioner |
| CN2837721Y (en) * | 2005-10-20 | 2006-11-15 | 张强 | Semiconductor refrigerator for household use |
| CN200975760Y (en) * | 2006-11-23 | 2007-11-14 | 刘端肃 | Water cooled semi-conductor cold-hot air-conditioner |
| CN101382326A (en) * | 2008-10-14 | 2009-03-11 | 游海珠 | Split type semiconductor air conditioner |
| CN101922778A (en) * | 2010-09-26 | 2010-12-22 | 广东新创意专利发展有限公司 | Semiconductor refrigerating air conditioning device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111124003A (en) * | 2019-10-09 | 2020-05-08 | 珠海格力电器股份有限公司 | Cooling system and method for power module and computer readable storage medium |
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| CN102818324A (en) | 2012-12-12 |
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