CN102781169A - Method for producing silver-plated ceramic circuit boards - Google Patents
Method for producing silver-plated ceramic circuit boards Download PDFInfo
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- CN102781169A CN102781169A CN2012102565638A CN201210256563A CN102781169A CN 102781169 A CN102781169 A CN 102781169A CN 2012102565638 A CN2012102565638 A CN 2012102565638A CN 201210256563 A CN201210256563 A CN 201210256563A CN 102781169 A CN102781169 A CN 102781169A
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- base plate
- silver
- clad base
- ceramic copper
- copper
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Abstract
The invention discloses a method for producing silver-plated ceramic circuit boards. The method is characterized by including the following steps of cutting, plating silver, transferring patterns, removing silver, etching, removing film, checking the patterns, coating green oil, printing characters, forming, electrically logging, finally checking and packaging. In order to overcome defects in the prior art, the method for producing silver-plated ceramic circuit boards, simple in process and fine in effect of the silver surface is provided.
Description
Technical field
The present invention relates to a kind of production method of silver-plated ceramic circuit board.
Background technology
Chemistry silver is arranged among circuit board surface is handled and electroplate the money kind; Based on the graphic designs of circuit board, after etching, be difficult to make electrosilvering, because want conducting just can plate silver; Because the LED light fixture requires than higher silver-colored face reflecting effect, common chemical silver can not meet the demands.
Summary of the invention
The objective of the invention is provides a kind of technology simple in order to overcome weak point of the prior art, the production method of the silver-plated ceramic circuit board that product silver face is effective.
In order to achieve the above object, the present invention adopts following scheme:
A kind of production method of silver-plated ceramic circuit board is characterized in that may further comprise the steps:
A, open material: ceramic copper-clad base plate is cut out out the size that adheres to specification;
B, silver-plated: on the ceramic copper-clad base plate of steps A, electroplate one deck silver;
C, figure transfer: in step B, stick photosensitive dry film on the plate face of ceramic copper-clad base plate, and the circuit diagram on the film is transferred on the silver layer of the ceramic copper-clad base plate that posts photosensitive dry film;
D, move back silver: adopt and move back silver-colored liquid medicine and need etched that part of silver return and make copper face expose out;
E, etching: the exposed copper face of ceramic copper-clad base plate among the step D is carried out etching with etching liquid medicine;
F, move back film: the photosensitive dry film on the ceramic copper-clad base plate in the step e is all returned, will be exposed as the copper layer of circuit;
G, figure inspection: adopt scanner that ceramic copper-clad base plate circuit in the step e opened short circuit phenomenon inspection;
H, green oil: silk-screen one deck plays the green ink of insulating effect on the ceramic copper-clad base plate skin of above-mentioned steps G;
I, literal: the literal of identification usefulness when element is played in the silk-screen conduct on the ceramic copper-clad base plate plate face of step H;
J, moulding: the ceramic copper-clad base plate gong of step I is gone out the finished product profile;
K, electrical measurement: each layer of ceramic copper-clad base plate to step J opened, short-circuit test;
L, final inspection: finished product inspection, confirm whether to have function and problem of appearance;
M, packing: with the plate packing of passed examination.
The preparation method of aforesaid a kind of specular aluminium base circuit board is characterized in that the silver-colored liquid medicine that moves back described in the step D is that nitric acid falls solution.
The preparation method of aforesaid a kind of specular aluminium base circuit board is characterized in that the etching liquid medicine described in the step e is acid CuCl
2
The preparation method of aforesaid a kind of specular aluminium base circuit board is characterized in that adopting in the step F NaOH stripping soup to move back film.
In sum, beneficial effect of the present invention:
Preparation method of the present invention is simple, and is convenient for production, and the silver-colored face of ceramic circuit board is effective.
Embodiment
Below in conjunction with embodiment the present invention is done and to further describe:
Embodiment 1
The production method of a kind of silver-plated ceramic circuit board of the present invention may further comprise the steps:
A, open material: ceramic copper-clad base plate is cut out out the size that adheres to specification;
B, silver-plated: on the ceramic copper-clad base plate of steps A, electroplate one deck silver;
C, figure transfer: in step B, stick photosensitive dry film on the plate face of ceramic copper-clad base plate, and the circuit diagram on the film is transferred on the silver layer of the ceramic copper-clad base plate that posts photosensitive dry film;
D, move back silver: adopt and move back silver-colored liquid medicine and need etched that part of silver return and make copper face expose out;
E, etching: the exposed copper face of ceramic copper-clad base plate among the step D is carried out etching with etching liquid medicine;
F, move back film: the photosensitive dry film on the ceramic copper-clad base plate in the step e is all returned, will be exposed as the copper layer of circuit;
G, figure inspection: adopt scanner that ceramic copper-clad base plate circuit in the step e opened short circuit phenomenon inspection;
H, green oil: silk-screen one deck plays the green ink of insulating effect on the ceramic copper-clad base plate skin of above-mentioned steps G;
I, literal: the literal of identification usefulness when element is played in the silk-screen conduct on the ceramic copper-clad base plate plate face of step H;
J, moulding: the ceramic copper-clad base plate gong of step I is gone out the finished product profile;
K, electrical measurement: each layer of ceramic copper-clad base plate to step J opened, short-circuit test;
L, final inspection: finished product inspection, confirm whether to have function and problem of appearance;
M, packing: with the plate packing of passed examination.
Embodiment 2
A, open material: ceramic copper-clad base plate is cut out out the size that adheres to specification;
B, silver-plated: on the ceramic copper-clad base plate of steps A, electroplate one deck silver;
C, figure transfer: in step B, stick photosensitive dry film on the plate face of ceramic copper-clad base plate, and the circuit diagram on the film is transferred on the silver layer of the ceramic copper-clad base plate that posts photosensitive dry film;
D, move back silver: adopt nitric acid to fall solution and need etched that part of silver return and make copper face expose out;
E, etching: use acid CuCl
2The copper face exposed to ceramic copper-clad base plate among the step D carries out etching;
F, move back film: adopt NaOH stripping soup to move back film the photosensitive dry film on the ceramic copper-clad base plate in the step e is all returned, will expose as the copper layer of circuit;
G, figure inspection: adopt scanner that ceramic copper-clad base plate circuit in the step e opened short circuit phenomenon inspection;
H, green oil: silk-screen one deck plays the green ink of insulating effect on the ceramic copper-clad base plate skin of above-mentioned steps G;
I, literal: the literal of identification usefulness when element is played in the silk-screen conduct on the ceramic copper-clad base plate plate face of step H;
J, moulding: the ceramic copper-clad base plate gong of step I is gone out the finished product profile;
K, electrical measurement: each layer of ceramic copper-clad base plate to step J opened, short-circuit test;
L, final inspection: finished product inspection, confirm whether to have function and problem of appearance;
M, packing: with the plate packing of passed examination.
Claims (4)
1. the production method of a silver-plated ceramic circuit board is characterized in that may further comprise the steps:
A, open material: ceramic copper-clad base plate is cut out out the size that adheres to specification;
B, silver-plated: on the ceramic copper-clad base plate of steps A, electroplate one deck silver;
C, figure transfer: in step B, stick photosensitive dry film on the plate face of ceramic copper-clad base plate, and the circuit diagram on the film is transferred on the silver layer of the ceramic copper-clad base plate that posts photosensitive dry film;
D, move back silver: adopt and move back silver-colored liquid medicine and need etched that part of silver return and make copper face expose out;
E, etching: the exposed copper face of ceramic copper-clad base plate among the step D is carried out etching with etching liquid medicine;
F, move back film: the photosensitive dry film on the ceramic copper-clad base plate in the step e is all returned, will be exposed as the copper layer of circuit;
G, figure inspection: adopt scanner that ceramic copper-clad base plate circuit in the step e opened short circuit phenomenon inspection;
H, green oil: silk-screen one deck plays the green ink of insulating effect on the ceramic copper-clad base plate skin of above-mentioned steps G;
I, literal: the literal of identification usefulness when element is played in the silk-screen conduct on the ceramic copper-clad base plate plate face of step H;
J, moulding: the ceramic copper-clad base plate gong of step I is gone out the finished product profile;
K, electrical measurement: each layer of ceramic copper-clad base plate to step J opened, short-circuit test;
L, final inspection: finished product inspection, confirm whether to have function and problem of appearance;
M, packing: with the plate packing of passed examination.
2. the preparation method of a kind of specular aluminium base circuit board according to claim 1 is characterized in that the silver-colored liquid medicine that moves back described in the step D is that nitric acid falls solution.
3. the preparation method of a kind of specular aluminium base circuit board according to claim 1 is characterized in that the etching liquid medicine described in the step e is acid CuCl
2
4. the preparation method of a kind of specular aluminium base circuit board according to claim 1 is characterized in that adopting in the step F NaOH stripping soup to move back film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102565638A CN102781169A (en) | 2012-07-24 | 2012-07-24 | Method for producing silver-plated ceramic circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102565638A CN102781169A (en) | 2012-07-24 | 2012-07-24 | Method for producing silver-plated ceramic circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102781169A true CN102781169A (en) | 2012-11-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102565638A Pending CN102781169A (en) | 2012-07-24 | 2012-07-24 | Method for producing silver-plated ceramic circuit boards |
Country Status (1)
| Country | Link |
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| CN (1) | CN102781169A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115551213A (en) * | 2022-11-28 | 2022-12-30 | 江苏富乐华半导体科技股份有限公司 | Method for coating side wall of copper-clad ceramic substrate with silver coating layer |
| CN116489893A (en) * | 2023-04-23 | 2023-07-25 | 南通威斯派尔半导体技术有限公司 | Copper-clad ceramic circuit board with silver-free groove side wall and preparation method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699933A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Production method of bright-copper-face high-heat-conductivity ceramic circuit board |
| CN101699934A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Method for producing conductive high heat conduction ceramic circuit board |
| CN101699932A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Method for producing high thermal conductivity ceramic circuit board |
| CN102264191A (en) * | 2011-06-30 | 2011-11-30 | 中山市达进电子有限公司 | Method for manufacturing high-density interconnected aluminum base circuit board |
| CN102364997A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Production method of Rogers board |
-
2012
- 2012-07-24 CN CN2012102565638A patent/CN102781169A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101699933A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Production method of bright-copper-face high-heat-conductivity ceramic circuit board |
| CN101699934A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Method for producing conductive high heat conduction ceramic circuit board |
| CN101699932A (en) * | 2009-11-02 | 2010-04-28 | 广东达进电子科技有限公司 | Method for producing high thermal conductivity ceramic circuit board |
| CN102264191A (en) * | 2011-06-30 | 2011-11-30 | 中山市达进电子有限公司 | Method for manufacturing high-density interconnected aluminum base circuit board |
| CN102364997A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Production method of Rogers board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115551213A (en) * | 2022-11-28 | 2022-12-30 | 江苏富乐华半导体科技股份有限公司 | Method for coating side wall of copper-clad ceramic substrate with silver coating layer |
| CN116489893A (en) * | 2023-04-23 | 2023-07-25 | 南通威斯派尔半导体技术有限公司 | Copper-clad ceramic circuit board with silver-free groove side wall and preparation method thereof |
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Application publication date: 20121114 |