CN102781172A - Production method for mirror-surface aluminum base board - Google Patents
Production method for mirror-surface aluminum base board Download PDFInfo
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- CN102781172A CN102781172A CN2012102566289A CN201210256628A CN102781172A CN 102781172 A CN102781172 A CN 102781172A CN 2012102566289 A CN2012102566289 A CN 2012102566289A CN 201210256628 A CN201210256628 A CN 201210256628A CN 102781172 A CN102781172 A CN 102781172A
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Abstract
The invention discloses a production method for a mirror-surface aluminum base board. The production method is characterized by comprising the following steps: cutting the materials; laminating a film; transferring inner patterns; etching patterns; removing the film; checking the patterns; browning; turning a slot; composing; pressing; drilling; applying green oil; forming characters; forming; electrically measuring; finally checking; and packaging. In order to overcome the defects in the prior art, the invention aims at providing the production method for the mirror-surface aluminum base board, which has a simple process.
Description
Technical field
The present invention relates to a kind of production method of specular aluminium substrate.
Background technology
The specular aluminium circuit board generally is to be used in LED lamp illumination aspect, and the specular aluminium position that the circuit surface on the specular aluminium substrate exposes need guarantee foreign material such as bright and clean no PP gummosis, need use not gummosis PP when pressing is made; During the sheet material mixed pressure of unlike material, plate is bent, plate sticks up seriously because of harmomegathus coefficient difference can cause in addition, and the PP gummosis also can inequality, is prone to cause specular aluminium dirt to be arranged and influence light efficiency.
Summary of the invention
The objective of the invention is provides the production method of the simple specular aluminium substrate of a kind of technology in order to overcome weak point of the prior art.
In order to achieve the above object, the present invention adopts following scheme:
A kind of production method of specular aluminium substrate is characterized in that may further comprise the steps:
A, open material: specular aluminium sheet material, FR-4 substrate, glass layer are cut out out the size that adheres to specification;
B, pad pasting: on the plate face of FR-4 substrate, stick photosensitive dry film;
C, internal layer figure transfer: the circuit diagram on the film is transferred on the plate face of the FR-4 substrate that posts photosensitive dry film;
D, figure etching: with removing without the copper layer exposed part of photosensitive dry film protection on the FR-4 substrate among the step C, keep copper layer as circuit with etching liquid medicine;
E, move back film: the photosensitive dry film on the FR-4 substrate among the step D is all returned, will be exposed as the copper layer of circuit;
F, figure inspection: adopt scanner that circuit on the FR-4 substrate in the step e opened short circuit phenomenon inspection;
G, brown: on the alligatoring FR-4 substrate as the copper face and the line face of internal layer;
H, gong groove: gong goes out PP glue groove on the FR-4 substrate;
I, composing: successively specular aluminium sheet material, FR-4 substrate, glass layer are stacked together, and between each layer, place an amount of PP viscose glue;
J, pressing: each lamination among the step I is lumped together;
K, boring: get out the via of each layer and beat component hole;
L, green oil: silk-screen one deck plays the green ink of insulating effect on above-mentioned steps K sheet material skin;
M, literal: the literal of identification usefulness when element is played in the silk-screen conduct on the specular aluminium sheet material plate face of step L;
N, moulding: the sheet material gong of step M is gone out the finished product profile;
O, electrical measurement: each layer of material to step N opened, short-circuit test;
P, final inspection: finished product inspection, confirm whether to have function and problem of appearance;
Q, packing: with the plate packing of passed examination.
The production method of aforesaid a kind of specular aluminium substrate is characterized in that the described etching liquid medicine of step D is acid CuCl
2
The preparation method of the aluminium base circuit board of aforesaid a kind of high density interconnect is characterized in that adopting in the step e NaOH stripping soup to move back film.
In sum, beneficial effect of the present invention:
Preparation method of the present invention is simple, and is convenient for production, efficiently solves the inaccessiable reflecting effect of conventional aluminium substrate, is aluminium base combination with common FR4 plate; Optimal design has been carried out in the groove position, fundamentally improved the excessive problem of gummosis.
Embodiment
Below in conjunction with embodiment the present invention is done and to further describe:
Embodiment 1
The production method of a kind of specular aluminium substrate of the present invention may further comprise the steps:
A, open material: specular aluminium sheet material, FR-4 substrate, glass layer are cut out out the size that adheres to specification;
B, pad pasting: on the plate face of FR-4 substrate, stick photosensitive dry film;
C, internal layer figure transfer: the circuit diagram on the film is transferred on the plate face of the FR-4 substrate that posts photosensitive dry film;
D, figure etching: with removing without the copper layer exposed part of photosensitive dry film protection on the FR-4 substrate among the step C, keep copper layer as circuit with etching liquid medicine;
E, move back film: the photosensitive dry film on the FR-4 substrate among the step D is all returned, will be exposed as the copper layer of circuit;
F, figure inspection: adopt scanner that circuit on the FR-4 substrate in the step e opened short circuit phenomenon inspection;
G, brown: on the alligatoring FR-4 substrate as the copper face and the line face of internal layer;
H, gong groove: gong goes out PP glue groove on the FR-4 substrate;
I, composing: successively specular aluminium sheet material, FR-4 substrate, glass layer are stacked together, and between each layer, place an amount of PP viscose glue;
J, pressing: each lamination among the step I is lumped together;
K, boring: get out the via of each layer and beat component hole;
L, green oil: silk-screen one deck plays the green ink of insulating effect on above-mentioned steps K sheet material skin;
M, literal: the literal of identification usefulness when element is played in the silk-screen conduct on the specular aluminium sheet material plate face of step L;
N, moulding: the sheet material gong of step M is gone out the finished product profile;
O, electrical measurement: each layer of material to step N opened, short-circuit test;
P, final inspection: finished product inspection, confirm whether to have function and problem of appearance;
Q, packing: with the plate packing of passed examination.
Embodiment 2
The production method of a kind of specular aluminium substrate of the present invention may further comprise the steps:
A, open material: specular aluminium sheet material, FR-4 substrate, glass layer are cut out out the size that adheres to specification;
B, pad pasting: on the plate face of FR-4 substrate, stick photosensitive dry film;
C, internal layer figure transfer: the circuit diagram on the film is transferred on the plate face of the FR-4 substrate that posts photosensitive dry film;
D, figure etching: use acid CuCl
2With removing without the copper layer exposed part of photosensitive dry film protection on the FR-4 substrate among the step C, keep copper layer as circuit;
E, move back film: adopt NaOH stripping soup that the photosensitive dry film on the FR-4 substrate among the step D is all returned, will expose as the copper layer of circuit;
F, figure inspection: adopt scanner that circuit on the FR-4 substrate in the step e opened short circuit phenomenon inspection;
G, brown: on the alligatoring FR-4 substrate as the copper face and the line face of internal layer;
H, gong groove: gong goes out PP glue groove on the FR-4 substrate;
I, composing: successively specular aluminium sheet material, FR-4 substrate, glass layer are stacked together, and between each layer, place an amount of PP viscose glue;
J, pressing: each lamination among the step I is lumped together;
K, boring: get out the via of each layer and beat component hole;
L, green oil: silk-screen one deck plays the green ink of insulating effect on above-mentioned steps K sheet material skin;
M, literal: the literal of identification usefulness when element is played in the silk-screen conduct on the specular aluminium sheet material plate face of step L;
N, moulding: the sheet material gong of step M is gone out the finished product profile;
O, electrical measurement: each layer of material to step N opened, short-circuit test;
P, final inspection: finished product inspection, confirm whether to have function and problem of appearance;
Q, packing: with the plate packing of passed examination.
Circuit board plate of the present invention is formed by an aluminium base and a single sided board pressing, wants before the pressing come out single sided board and PP groove position gong earlier, and for reduce the flow of trough rim glue after the pressing as far as possible, the PP groove is than the monolateral little 8mil of single sided board during the gong plate;
During brown, only single sided board is done brown, aluminium base does not need (clear water of wanting before setting type is washed); During composing, upper and lower surface all will be used the reverse side Copper Foil, comes the cleaning of holding plate face.
Preparation method of the present invention is simple, and is convenient for production, efficiently solves the inaccessiable reflecting effect of conventional aluminium substrate, is aluminium base combination with common FR4 plate; Optimal design has been carried out in the groove position, fundamentally improved the excessive problem of gummosis.
Claims (3)
1. the production method of a specular aluminium substrate is characterized in that may further comprise the steps:
A, open material: specular aluminium sheet material, FR-4 substrate, glass layer are cut out out the size that adheres to specification;
B, pad pasting: on the plate face of FR-4 substrate, stick photosensitive dry film;
C, internal layer figure transfer: the circuit diagram on the film is transferred on the plate face of the FR-4 substrate that posts photosensitive dry film;
D, figure etching: with removing without the copper layer exposed part of photosensitive dry film protection on the FR-4 substrate among the step C, keep copper layer as circuit with etching liquid medicine;
E, move back film: the photosensitive dry film on the FR-4 substrate among the step D is all returned, will be exposed as the copper layer of circuit;
F, figure inspection: adopt scanner that circuit on the FR-4 substrate in the step e opened short circuit phenomenon inspection;
G, brown: on the alligatoring FR-4 substrate as the copper face and the line face of internal layer;
H, gong groove: gong goes out PP glue groove on the FR-4 substrate;
I, composing: successively specular aluminium sheet material, FR-4 substrate, glass layer are stacked together, and between each layer, place an amount of PP viscose glue;
J, pressing: each lamination among the step I is lumped together;
K, boring: get out the via of each layer and beat component hole;
L, green oil: silk-screen one deck plays the green ink of insulating effect on above-mentioned steps K sheet material skin;
M, literal: the literal of identification usefulness when element is played in the silk-screen conduct on the specular aluminium sheet material plate face of step L;
N, moulding: the sheet material gong of step M is gone out the finished product profile;
O, electrical measurement: each layer of material to step N opened, short-circuit test;
P, final inspection: finished product inspection, confirm whether to have function and problem of appearance;
Q, packing: with the plate packing of passed examination.
2. the production method of a kind of specular aluminium substrate according to claim 1 is characterized in that the described etching liquid medicine of step D is acid CuCl
2
3. the preparation method of the aluminium base circuit board of a kind of high density interconnect according to claim 1 is characterized in that adopting in the step e NaOH stripping soup to move back film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102566289A CN102781172A (en) | 2012-07-24 | 2012-07-24 | Production method for mirror-surface aluminum base board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102566289A CN102781172A (en) | 2012-07-24 | 2012-07-24 | Production method for mirror-surface aluminum base board |
Publications (1)
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| CN102781172A true CN102781172A (en) | 2012-11-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2012102566289A Pending CN102781172A (en) | 2012-07-24 | 2012-07-24 | Production method for mirror-surface aluminum base board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068168A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Manufacture method for mirror surface blind trough aluminum substrate |
| CN105282966A (en) * | 2015-11-05 | 2016-01-27 | 惠州市煜鑫达科技有限公司 | Composite base circuit board making method, vacuum lamination structure and composite base circuit board |
| CN112203420A (en) * | 2020-09-04 | 2021-01-08 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of mirror-surface aluminum plate |
| CN117881112A (en) * | 2024-03-12 | 2024-04-12 | 四川英创力电子科技股份有限公司 | 28-layer 8-order Ultra HDI and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101990374A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Method for manufacturing ceramic-base rigid circuit board |
| CN102364998A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Production method of high-precision circuit board |
| CN102365001A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacture method for multiple surface treatments on one board |
| CN102364999A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacturing method of mechanical conduction hole circuit board without holes on surface |
| CN102365000A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacturing method of single-side aluminum circuit board |
-
2012
- 2012-07-24 CN CN2012102566289A patent/CN102781172A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101990374A (en) * | 2010-08-03 | 2011-03-23 | 广东达进电子科技有限公司 | Method for manufacturing ceramic-base rigid circuit board |
| CN102364998A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Production method of high-precision circuit board |
| CN102365001A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacture method for multiple surface treatments on one board |
| CN102364999A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacturing method of mechanical conduction hole circuit board without holes on surface |
| CN102365000A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacturing method of single-side aluminum circuit board |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068168A (en) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | Manufacture method for mirror surface blind trough aluminum substrate |
| CN105282966A (en) * | 2015-11-05 | 2016-01-27 | 惠州市煜鑫达科技有限公司 | Composite base circuit board making method, vacuum lamination structure and composite base circuit board |
| CN112203420A (en) * | 2020-09-04 | 2021-01-08 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of mirror-surface aluminum plate |
| CN117881112A (en) * | 2024-03-12 | 2024-04-12 | 四川英创力电子科技股份有限公司 | 28-layer 8-order Ultra HDI and manufacturing method thereof |
| CN117881112B (en) * | 2024-03-12 | 2024-05-07 | 四川英创力电子科技股份有限公司 | 28-Layer 8-order Ultra HDI and manufacturing method thereof |
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Application publication date: 20121114 |