CN102714920A - 加热装置及安装体的制造方法 - Google Patents

加热装置及安装体的制造方法 Download PDF

Info

Publication number
CN102714920A
CN102714920A CN2011800059601A CN201180005960A CN102714920A CN 102714920 A CN102714920 A CN 102714920A CN 2011800059601 A CN2011800059601 A CN 2011800059601A CN 201180005960 A CN201180005960 A CN 201180005960A CN 102714920 A CN102714920 A CN 102714920A
Authority
CN
China
Prior art keywords
press section
target thing
heating target
heating
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011800059601A
Other languages
English (en)
Inventor
松村孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Publication of CN102714920A publication Critical patent/CN102714920A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
    • B29C66/816—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps
    • B29C66/8161—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the mounting of the pressing elements, e.g. of the welding jaws or clamps said pressing elements being supported or backed-up by springs or by resilient material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/002—Joining methods not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
    • B29C66/824—Actuating mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/061—Cushion plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/06—Platens or press rams
    • B30B15/062—Press plates
    • B30B15/064—Press plates with heating or cooling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75315—Elastomer inlay
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75314—Auxiliary members on the pressing surface
    • H01L2224/75317—Removable auxiliary member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75754—Guiding structures
    • H01L2224/75755—Guiding structures in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75754—Guiding structures
    • H01L2224/75756—Guiding structures in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83053—Bonding environment
    • H01L2224/83091—Under pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83201—Compression bonding
    • H01L2224/83209—Compression bonding applying isostatic pressure, e.g. degassing using vacuum or a pressurised liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/832—Applying energy for connecting
    • H01L2224/83238—Applying energy for connecting using electric resistance welding, i.e. ohmic heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • Wire Bonding (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

本发明提高加热装置的生产节拍时间。本发明的加热装置包括：第一按压部，对加热对象物进行加热；第二按压部，具有弹性体，且将加热对象物夹在第一按压部与弹性体之间；以及浮动夹具，将第一按压部与加热对象物热隔离，将加热对象物保持在第一按压部与第二按压部之间，当第一按压部及第二按压部的一方朝向另一方按压加热对象物时，将加热对象物与第一按压部热连接。

Description

加热装置及安装体的制造方法
技术领域
本发明涉及一种加热装置及安装体的制造方法。
背景技术
在将电气构件与基板进行电连接的安装步骤中使用压合装置（例如参照专利文献1和专利文献2），该压合装置具有底座及按压头，一边利用按压头来对配置于底座上的电气构件和基板进行按压一遍进行加热。
专利文献1日本专利特开2007-189100
专利文献2日本专利特开平6-252210
发明内容
[发明要解决的问题]
例如，当在压合步骤开始时的设定温度与在压合步骤中或压合步骤结束时的设定温度不同时，如果要使用所述压合装置连续地实施压合步骤，则要在压合步骤结束后且在下一个压合步骤开始前，暂时地对底座进行冷却，在开始压合步骤后，再次将底座升温。因此延长了生产节拍时间（tact time）。本发明一形态的目的在于提供一种能够解决所述问题的加热装置及安装体的制造方法。该目的通过权利要求书中独立权利要求中记载的特征组合而实现。另外，通过从属权利要求来对本发明的更有利的具体例进行了规定。
[解决问题的手段]
为了解决所述问题，在本发明的第一形态中提供了一种加热装置，包括：第一按压部，对加热对象物进行加热；第二按压部，具有弹性体，将加热对象物夹在第一按压部与弹性体之间；浮动夹具，将第一按压部与加热对象物热隔离，将加热对象物保持在第一按压部与第二按压部之间，当第一按压部及第二按压部的一方朝向另一方按压加热对象物时，将加热对象物与第一按压部热连接。
在所述加热装置中还可包括：加热部，对第一按压部进行加热并维持在预定温度。在所述加热装置中，当第一按压部或第二按压部的按压力被释放时，浮动夹具可将第一按压部与加热对象物热隔离。在所述加热装置中，随着第一按压部及第二按压部的一方从另一方离开，浮动夹具可将加热对象物与第一按压部机械隔离。
在所述加热装置中，第二按压部可利用弹性体将由基板、黏着层和电子零件依次层叠而成的加热对象物的电子零件相对于基板进行按压。在所述加热装置中，第二按压部可利用弹性体将由基板、黏着层和多个电子零件依次层叠而成的加热对象物的多个电子零件相对于基板同时进行按压。在所述加热装置中还可包括：多个载体，装载加热对象物；以及输送部，依次选择多个载体，并保持在浮动夹具上。
在本发明第二形态中提供一种安装体的制造方法，包括下述步骤：将由基板、黏着层和电子零件层叠而成的加热对象物与对加热对象物进行加热的第一按压部进行热隔离，将加热对象物保持在第二按压部的弹性体与第一按压部之间；以及通过第一按压部及第二按压部的一方朝向另一方按压加热对象物，而将加热对象物与第一按压部热连接。
在所述制造方法中，还可包括下述步骤，即，通过释放由第一按压部或第二按压部对加热对象物的按压力，而将第一按压部与加热对象物热隔离。在所述制造方法中，还可包括下述步骤，即，在将加热对象物与第一按压部热连接之前，将第一按压部维持在使黏着层热硬化的温度。
另外，所述发明内容并未完全列举出本发明的全部必要特征，而且，也能够得到这些特征群的子组合或发明。
附图说明
图1示意性地表示安装装置100的顶视图的一例。
图2示意性地表示盒子10的截面图的一例。
图3示意性地表示工件20与平台330处于热隔离状态下的加热单元110的截面图的一例。
图4示意性地表示工件20与平台330处于热连接状态下的加热单元110的截面图的一例。
图5示意性地表示加热单元510的截面图的一例。
图6表示安装体的制造方法流程图的一例。
[符号说明]
10 盒子、12 装载构件、20 工件、22 基板、24 黏着层、26 电子零件、30保护膜、100 安装装置、110 加热单元、120 输送单元、122 承载部、124 行进部、126 轨道、128 机械臂、130 输送载体、310 头部、312 头本体、314 按压构件、316 保持构件、320 驱动部、330 平台、332 底座、334 加热平台、336加热面、340 加热器、350 浮动夹具、352 保持构件、354 升降构件、510 加热单元、530 平台、532 底座、534 加热平台、536 加热面、538 凹部、550 浮动夹具、552 支撑销、554 升降构件
具体实施方式
以下通过发明实施方式对本发明进行说明，但以下实施方式并没有对权利要求的发明进行限定。另外，实施方式中说明的全部特征组合并不限定是发明的解决方案所必须的。
以下参照附图对实施方式进行说明，在附图的记载中，对相同或类似部分标注相同的参照编号，且省略了重复的说明。另外，附图是示意性的，厚度与平面尺寸的关系、比例等可能与实物有所不同。另外，为了便于说明，即使在附图相互之间也会包含具有不同尺寸关系或比例的部分。
图1示意性地表示安装装置100的顶视图的一例。安装装置100在基板上安装有集成电路（Integrated Circuit，IC）、大规模集成电路（Large-Scale Integration，LSI）、电阻器、布线、其他基板等电子零件。安装装置100具有加热单元110和输送单元120。安装装置100可具有多个输送载体130。安装装置100及加热单元110可以为加热装置的一例。输送单元120可以为输送部的一例。输送载体130可以为载体的一例。
加热单元110对工件20进行加热。加热单元110在对由基板、黏着层及电子零件依次层叠而成的工件20进行按压的同时进行加热，从而将电子零件安装于基板上。加热单元110可以在同一步骤中将多个电子零件安装于基板上。工件20为加热对象物的一例。
输送单元120将工件20输送到加热单元110。输送单元120可以将装载有工件20的输送载体130输送到加热单元110。输送单元120可以依次选择容纳于盒子10中的多个输送载体130并输送到加热单元110。
输送单元120具有承载部122、行进部124和轨道126。承载部122承载容纳有多个输送载体130的盒子10。行进部124在轨道126上行进，将输送载体130在加热单元110与承载部122之间进行传递。行进部124具有机械臂128。机械臂128从盒子10中取出输送载体130。另外，机械臂128将输送载体130容纳于盒子10中。
输送载体130具有能够装载工件20的平坦表面。输送载体130可以为金属板。输送载体130的材质例如为不锈钢、铜、铝、铜合金、铝合金、合金钢等。输送载体130的热传导率宜大于工件20的热传导率。另外，在本实施方式中，对在将多个输送载体130容纳于盒子10中的状态下被运送到安装装置100的情形进行了说明。但输送载体130并不限于此。例如，也可以将搭载有工件20的输送载体130依次运送到安装装置100。
图2示意性地表示盒子10的截面图的一例。盒子10具有用于支撑多个输送载体130的多个装载构件12。在本实施方式中，多个工件20在被多个输送载体130分别装载的状态下容纳于盒子10中。
工件20具有基板22、黏着层24和电子零件26。工件20宜由基板22、黏着层24及多个电子零件26依次层叠而成。基板22例如可以为印刷布线板、多层布线基板、柔性基板、玻璃基板等。可将电子零件26临时压合到基板22上。临时压合的条件例如可以为：温度为40～90℃、压力为0.3～3MPa、按压时间为0.3～10秒的条件。
黏着层24将基板22与电子零件26进行黏着。黏着层24包含热硬化性树脂和热可塑性树脂中的至少一个。黏着层24可包含成膜树脂、液状硬化成分和硬化剂。成膜树脂例如可以为苯氧树脂、聚酯树脂、聚酰胺树脂、聚酰亚胺树脂。从材料的易获取性和连接可靠性的观点来看，宜包含苯氧树脂。
液状硬化成分例如可以为：液状环氧树脂、丙烯酸酯。从连接可靠性及硬化物的稳定性的观点来看，宜具有两个以上的官能基。当液状硬化成分为液状环氧树脂时，硬化剂例如可以为咪唑、胺类、锍盐、鎓盐。当液状硬化成分为丙烯酸酯时，硬化剂例如可以为有机过氧化物。
黏着层24可以包含各种橡胶成分、柔软剂、各种填料等添加剂，还可以进一步包含导电性粒子。黏着层24可以为浆状的黏着剂，也可以为片状的黏着膜。黏着层24可以为非导电膜（Non Conductive Film，NCF）或各向异性导电膜（AnisotropicConductive Film，ACF）。
图3示意性地表示在工件20与平台330处于热隔离状态下，加热单元110的截面图的一例。加热单元110具有头部310、驱动部320、平台330、加热器340、浮动夹具350。加热单元110将工件20夹在头部310与平台330之间对工件20进行加热。从而能够将电子零件26安装到基板22上。
加热单元110可以将保护膜30夹在头部310与工件20之间，对工件20进行加热。保护膜30防止黏着层24附着到按压构件314上。保护膜30不做特别限定，但优选具有耐热性，并对黏着层24具有剥离性。保护膜30的材质例如可以为：聚四氟乙烯、硅橡胶等。
头部310具有头本体312、按压构件314和保持构件316。头部310通过按压构件314而将工件20的电子零件26相对于基板22进行按压。头部310可以通过按压构件314将工件20的多个电子零件26同时相对于基板22进行按压。头部310可以是第二按压部的一例。
头本体312将按压构件314向平台330进行按压。头本体312将工件20夹在按压构件314与平台330之间，其所具有的刚性达到即使将工件20向平台330按压也不会发生变形的程度。头本体312可以由铁、不锈钢等金属制成。另外，头本体312也可以具有加热器等。
按压构件314配置于头本体312与工件20之间。按压构件314也可以采用弹性大于头本体312的材料。按压构件314可以采用天然橡胶、合成橡胶、硅橡胶等高弹体。按压构件314可以是弹性体的一例。
藉此，能够将电子零件26安装于基板22上，并能够抑制电子零件26的位移。另外，也可以在基板22上安装具有不同高度的多种类型的电子零件26，并将全部的电子零件26相对于基板22进行按压。
保持构件316在头本体312的平台330的侧面保持按压构件314。保持构件316可以保持按压构件314的周缘部。保持构件316可以具有保持按压构件314的周缘部的链状或框状的构件。从保持构件316露出的按压构件314的形状可以与输送载体130的形状大致相同。
例如，输送载体130是外径为Ro的圆形金属板，当保持构件316采用内径为Ri的链状构件对按压构件314的周缘部进行保持时，内径Ri可以比外径Ro稍大。据此，可将工件20紧密地按压。从而能够抑制电子零件26的位移。
驱动部320通过气缸、油压缸、伺服电动机等使头部310向平台330移动。通过本实施方式，驱动部320使头部310上下移动，从而对工件20及输送载体130施加由头部310的按压力，或者释放该按压力。另外，在本实施方式中，虽然已对驱动部320使头部310向平台330移动的情形进行了说明，但驱动部320并不限于此。驱动部320也可以使平台330向头部310移动。
平台330具有底座332和加热平台334。底座332可具有大致的水平面。在底座332的水平面上可配置有加热平台和浮动夹具350。平台330可以是第一按压部的一例。
加热平台334加热工件20。加热平台334可通过输送载体130加热工件20。加热平台334可具有大致水平的加热面336。加热面336的尺寸可比工件20更大。加热面336的尺寸可比输送载体130更小。加热平台334可以是第一按压部的一例。
加热器340配置在加热平台的内部对加热平台334进行加热。加热器340可将加热平台334维持在预定的温度。加热器340可以是加热部的一例。据此，可对多个工件20进行连续加热，从而能够缩短生产节拍时间。另外，与使加热平台334急速升温的情形相比，能够减小对加热器340升温能力的要求。
浮动夹具350将工件20保持在头部310与加热平台334之间。浮动夹具350可具有保持构件352和升降构件354。
保持构件352从输送单元120接收输送载体130。保持构件352将输送载体130保持在头部310与加热平台334之间。保持构件352被支撑在升降构件354上，在图中，能够沿上下方向移动。
据此，保持构件352能够将加热平台334与工件20热隔离，并将工件20保持在头部310与加热平台334之间。此处，加热平台334与工件20的热隔离状态并不仅包含加热平台334与工件20之间的传热被完全阻断的状态，而且还包括与在加热单元110中加热平台334与工件20热连接的状态相比，加热平台334与工件20之间的传热被抑制的状态。
保持构件352可保持输送载体130的周缘部。保持构件352可具有链状或框状的形状。从保持构件352露出的输送载体130的尺寸可与加热面336的尺寸大致相同，或者比加热面336的尺寸更大。
据此，能够使加热面336与输送载体130相接触，并使工件20与加热平台334热连接。因为保持构件352与加热面336不接触，所以能够抑制保持构件352的温度上升。与保持构件352为板状的情形相比，因为保持构件352的热容量小，所以能够在将加热平台334与工件20保持热隔离期间，抑制工件20的温度上升。另外，当加热面336与输送载体130接触时，输送载体130能够阻断来自于加热面336的热。
另外，保持构件352的形状不做限定。例如，保持构件352可具有板状的形状，将输送载体130保持在保持构件352上。另外，也可通过使保持构件352与加热面336相接触，而使工件20与加热平台334热连接。
当驱动部320使头部310向平台330移动时，升降构件354使保持构件352沿头部310的移动方向移动。当驱动部320使平台330向头部310移动时，升降构件354使保持构件352沿与平台330的移动方向相反的方向移动。
据此，当头部310及加热平台334中的一方朝向另一方按压工件20时，升降构件354将工件20与加热平台334热连接。另外，当升降构件354释放由头部310或加热平台334的按压力时，使加热平台334与工件20热隔离。
随着头部310及加热平台334的一方从另一方离开，升降构件354可将装载在输送载体130上的工件20与加热平台334机械隔离。升降构件354例如可以为弹簧、高弹体等弹性体、气缸、油压缸、伺服电动机等。升降构件354还可具有压力检测器，检测与保持构件352或升降构件354相关的压力。
据此，即使在将多个工件20进行连续加热的情形中，也可不用每次对工件20进行处理时都对加热平台334进行冷却和升温。从而能够缩短工件20的生产节拍时间。另外，能够使用升温能力小的加热器，并能省略冷却装置。
例如，在使用包含热硬化性树脂的黏着层24将电子零件26安装于基板22上时，对加热器340进行调整，使加热平台334的温度变为大约180℃。因此，在对工件20的加热结束时，加热平台334的温度大约为180℃左右。
此处，如果黏着层24的温度超过40℃～60℃，则会促进黏着层24的热硬化。因此，如果在加热平台334处于高温的状态下将下一个工件20装载到加热面336上，则会使黏着层24在头部310及平台330对工件20进行按压之前硬化，因此难以将电子零件26安装于基板22上。
然而，通过使用浮动夹具350，能够在将加热平台334与工件20热隔离的状态下保持工件20。据此，不用每次处理工件20时都将加热平台334冷却到40℃～60℃左右，便能够将电子零件26安装于基板22上。
图4示意性地表示在工件20与平台330处于热连接的状态下，加热单元110的截面图的一例。使用图4说明加热单元110的动作的一例。当将工件20装载于浮动夹具350上时，驱动部320使头部310向平台330移动。头部310下降，按压保护膜30、工件20及输送载体130。
当头部310将工件20和输送载体130向平台330按压时，由头部310的按压力施加给浮动夹具350，升降构件354使工件20、输送载体130和保持构件352下降。在本实施方式中，头部310下降，使头部310的保持构件316覆盖浮动夹具350的保持构件352。从而能够抑制浮动夹具350朝水平方向的位移。
头部310进一步下降，使输送载体130与加热平台334的加热面336接触。据此，能够在按压构件314和加热平台334对工件20进行按压的状态下加热工件20。据此，基板22与电子零件26相压合，基板22的电极与电子零件26的电极电气连接。从而能够得到良好的连接可靠性。此时，黏着层24能够使电子零件26的位置稳定。另外，黏着层24能够抑制在基板22的电极与电子零件26的电极之间的区域混入湿气或异物。
当工件20的处理结束时，驱动部320使头部310向上方移动。当头部310向上方移动时，升降构件354从头部310的按压力释放。据此，升降构件354使保持构件352向上方移动。其结果是，输送载体130与加热平台334物理隔离，工件20与加热平台334热隔离。
图5示意性地表示加热单元510的截面图的一例。加热单元510可以是加热装置的另一例。加热单元510具有头部310、驱动部320、平台530、加热器340和浮动夹具550。平台530具有底座532和加热平台534。
加热平台534在加热面536具有凹部538。在凹部538的内部配置有浮动夹具550。浮动夹具550可具有支撑销552和升降构件554。另外，虽然在本实施方式中对不使用输送载体130的情形进行了说明，但也可以在加热单元510中使用输送载体130。
底座532、加热平台534及加热面536对应于加热单元110的底座332、加热平台334和加热面336。升降构件554对应于加热单元110的升降构件354。关于加热单元510的各结构，省略了与加热单元110的相应结构相同事项的相关说明。
支撑销552被升降构件554支撑，在图中，能够沿上下方向移动。当升降构件554使支撑销552向下方移动时，支撑销552被容纳于凹部538的内部，支撑销552的上表面位于加热面536的下方。当升降构件554使支撑销552向上方移动时，支撑销552的上表面位于加热面536的上方。
在支撑销552的上表面位于加热面536上方的状态下，支撑销552从输送单元120接收工件20。支撑销552将工件20保持在头部310与加热平台534之间。据此，支撑销552能够将加热平台534与工件20热隔离，并将工件20保持在头部310与加热平台534之间。
当驱动部320使头部310向平台530移动时，升降构件554使支撑销552沿头部310的移动方向移动。当驱动部320使平台530向头部310移动时，升降构件554使支撑销552沿与平台530的移动方向相反的方向移动。
当头部310及加热平台334的一方朝向另一方按压工件20时，升降构件554使支撑销552下降，使工件20与加热平台534接触。从而使工件20与加热平台534热连接。另外，当升降构件554释放由头部310或加热平台534的按压力时，使支撑销552上升，并使加热平台534与工件20热隔离。
图6表示安装体制造方法流程图的一例。对使用加热单元110制造在基板22上安装有多个电子零件26的安装体的方法的一例进行说明。在本实施方式中，首先准备由基板22、黏着层24和电子零件26依次层叠而成的工件20。将工件20装载于输送载体130上并输送给加热单元110。
在S602中，保持构件352接收输送载体130，将工件20保持在头部310的按压构件314与加热平台334之间。此时，工件20与加热平台334由升降构件354热隔离。
在S604中，加热器340将加热平台334加热至使工件20的黏着层24进行热硬化的温度，并维持该温度。加热器340可将加热平台334加热至180℃左右。此时，当头本体312具有加热器时，该加热器可将头本体312的温度维持在50℃左右。
在S606中，驱动部320使头部310下降，按压构件314将工件20向加热平台334按压。升降构件354使保持构件352下降，使输送载体130与加热平台334接触。据此使工件20与加热平台334热连接。以设定的压力和温度，将工件20进行一定时间的加压和加热，从而能够将电子零件26安装到基板22上，制造成安装体。
在S608中，在安装结束后，当驱动部320使头部310上升时，释放由按压构件314带给工件20的按压力。据此，升降构件354使保持构件352上升，将加热平台334与工件20热隔离。
以上，虽然使用实施方式对本发明进行了说明，但本发明的技术性范围并不限于所述实施方式记载的范围。本领领域技术人员应当理解，可在所述实施方式中添加各种变化或改进。增加了各种变化或改进的形态也包含在本发明的技术性范围内，可从权利要求的记载得到明确。
应当注意的是，权利要求书、说明书以及附图中所示的装置、***、程序及方法中的动作、步骤、步骤及阶段等各种处理的执行顺序，只要没有专用的“之前”、“前”等词进行明确说明，或者没有将前面处理的输出用在后面的处理，则可用任意顺序实现。关于权利要求书、说明书以及附图中的动作流程，即使出于方便而使用“首先”、“其次”等进行说明，也未必意味着以这种顺序实施。

Claims (10)

1.一种加热装置，包括：
第一按压部，对加热对象物进行加热；
第二按压部，具有弹性体，将所述加热对象物夹在所述第一按压部与所述弹性体之间；以及
浮动夹具，将所述第一按压部与所述加热对象物热隔离，将所述加热对象物保持在所述第一按压部与所述第二按压部之间，当所述第一按压部及所述第二按压部的一方朝向另一方按压所述加热对象物时，将所述加热对象物与所述第一按压部热连接。
2.根据权利要求1所述的加热装置，其中，
还包括加热部，该加热部对所述第一按压部进行加热并维持在预定温度。
3.权利要求1或2所述的加热装置，其中，
当所述第一按压部或所述第二按压部的按压力被释放时，所述浮动夹具将所述第一按压部与所述加热对象物热隔离。
4.根据权利要求3所述的加热装置，其中，
随着所述第一按压部及所述第二按压部的一方从另一方离开，所述浮动夹具将所述加热对象物与所述第一按压部机械隔离。
5.根据权利要求1至4中任一项所述的加热装置，其中，
所述第二按压部利用所述弹性体来将由基板、黏着层和电子零件依次层叠而成的所述加热对象物的所述电子零件相对于所述基板进行按压。
6.根据权利要求5所述的加热装置，其中，
所述第二按压部利用所述弹性体来将由所述基板、所述黏着层和多个所述电子零件依次层叠而成的所述加热对象物的所述多个电子零件相对于所述基板同时进行按压。
7.根据权利要求1至6中任一项所述的加热装置，其中，还包括：
多个载体，装载所述加热对象物；以及
输送部，依次选择所述多个载体，并保持在所述浮动夹具上。
8.一种安装体的制造方法，包括下述步骤：
将由基板、黏着层和电子零件层叠而成的加热对象物与对所述加热对象物进行加热的第一按压部进行热隔离，将所述加热对象物保持在第二按压部的弹性体与所述第一按压部之间；
通过所述第一按压部及所述第二按压部的一方朝向另一方按压所述加热对象物，而将所述加热对象物与所述第一按压部热连接。
9.根据权利要求8所述的安装体的制造方法，其中，
还包括下述步骤，即，通过释放由所述第一按压部或所述第二按压部对所述加热对象物的按压力，而将所述第一按压部与所述加热对象物热隔离。
10.根据权利要求8或9所述的安装体的制造方法，其中，
还包括下述步骤，即，在将所述加热对象物与所述第一按压部热连接之前，将所述第一按压部维持在使所述黏着层热硬化的温度。
CN2011800059601A 2010-01-22 2011-01-11 加热装置及安装体的制造方法 Pending CN102714920A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010012426A JP5602439B2 (ja) 2010-01-22 2010-01-22 加熱装置および実装体の製造方法
JP2010-012426 2010-01-22
PCT/JP2011/000077 WO2011089863A1 (ja) 2010-01-22 2011-01-11 加熱装置および実装体の製造方法

Publications (1)

Publication Number Publication Date
CN102714920A true CN102714920A (zh) 2012-10-03

Family

ID=44306666

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011800059601A Pending CN102714920A (zh) 2010-01-22 2011-01-11 加热装置及安装体的制造方法

Country Status (6)

Country Link
US (1) US8708021B2 (zh)
JP (1) JP5602439B2 (zh)
KR (1) KR20120099495A (zh)
CN (1) CN102714920A (zh)
TW (1) TWI501330B (zh)
WO (1) WO2011089863A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015106490A1 (zh) * 2014-01-16 2015-07-23 深圳市优米佳自动化设备有限公司 一种新型无泡真空贴合机
CN108321097A (zh) * 2017-01-17 2018-07-24 行家光电股份有限公司 真空贴膜装置及方法
CN111405697A (zh) * 2019-12-31 2020-07-10 金华市捷欣智能科技有限公司 一种铜线漆皮碳化烧结机

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011080929B4 (de) * 2011-08-12 2014-07-17 Infineon Technologies Ag Verfahren zur Herstellung eines Verbundes und eines Leistungshalbleitermoduls
JP6179843B2 (ja) * 2012-12-04 2017-08-16 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 実装装置及び実装方法
TWI576196B (zh) * 2012-12-05 2017-04-01 Shinkawa Kk The cooling method of the joining tool cooling device and the joining tool
WO2015105149A1 (ja) * 2014-01-08 2015-07-16 東レ株式会社 半導体装置の実装方法および実装装置
CN109643666A (zh) * 2016-08-24 2019-04-16 东丽工程株式会社 安装方法和安装装置
US10730276B2 (en) * 2017-01-17 2020-08-04 Maven Optronics Co., Ltd. System and method for vacuum film lamination
KR102403641B1 (ko) * 2020-07-29 2022-05-27 한화솔루션 주식회사 라미네이트 부품 제작용 지그

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007080956A1 (ja) * 2006-01-13 2007-07-19 Sony Chemical & Information Device Corporation 圧着装置及び実装方法
JP2008159961A (ja) * 2006-12-26 2008-07-10 Ys Kk 基板搬送装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4806195A (en) * 1987-09-28 1989-02-21 Edmond Namysl Printed circuit board laminating machine
JPH06252210A (ja) 1993-02-25 1994-09-09 Nec Kansai Ltd インナーリードボンダ
JPH09141743A (ja) * 1995-11-24 1997-06-03 N P C:Kk ラミネート装置
JPH1012578A (ja) * 1996-06-26 1998-01-16 Mitsubishi Electric Corp ウエハ・支持基板貼付け方法，及びウエハ・支持基板貼付け装置
JP3893930B2 (ja) 2001-10-12 2007-03-14 株式会社デンソー シート材保持具、シート材保持方法、及び多層基板の製造方法
JP3921459B2 (ja) 2003-07-11 2007-05-30 ソニーケミカル＆インフォメーションデバイス株式会社 電気部品の実装方法及び実装装置
US7087138B2 (en) * 2004-01-28 2006-08-08 Meng Pei Chen Machine for making pads having chambers
JP4841431B2 (ja) * 2005-02-02 2011-12-21 ソニーケミカル＆インフォメーションデバイス株式会社 電気部品の実装装置
TWI564106B (zh) * 2011-03-28 2017-01-01 山田尖端科技股份有限公司 接合裝置以及接合方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007080956A1 (ja) * 2006-01-13 2007-07-19 Sony Chemical & Information Device Corporation 圧着装置及び実装方法
JP2008159961A (ja) * 2006-12-26 2008-07-10 Ys Kk 基板搬送装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015106490A1 (zh) * 2014-01-16 2015-07-23 深圳市优米佳自动化设备有限公司 一种新型无泡真空贴合机
CN108321097A (zh) * 2017-01-17 2018-07-24 行家光电股份有限公司 真空贴膜装置及方法
CN108321097B (zh) * 2017-01-17 2021-02-19 行家光电股份有限公司 真空贴膜装置及方法
CN111405697A (zh) * 2019-12-31 2020-07-10 金华市捷欣智能科技有限公司 一种铜线漆皮碳化烧结机

Also Published As

Publication number Publication date
TW201205700A (en) 2012-02-01
JP2011151264A (ja) 2011-08-04
US8708021B2 (en) 2014-04-29
KR20120099495A (ko) 2012-09-10
US20120279653A1 (en) 2012-11-08
JP5602439B2 (ja) 2014-10-08
TWI501330B (zh) 2015-09-21
WO2011089863A1 (ja) 2011-07-28

Similar Documents

Publication Publication Date Title
CN102714920A (zh) 加热装置及安装体的制造方法
KR101203017B1 (ko) 전기 장치, 접속 방법 및 접착 필름
KR100634239B1 (ko) 보강판 부착 장치 및 부착 방법
WO2015166222A1 (en) Method of bonding flexible printed circuits
CN101449426A (zh) 各向异性导电连接器及各向异性导电连接器装置
GB2521619A (en) An apparatus and associated methods for flexible carrier substrates
KR100855302B1 (ko) 프로브 카드 및 접속체 본딩 방법
US20120018084A1 (en) Printed Circuit Board Assembly Manufacturing Device And Method
JP6931311B2 (ja) 異方性導電膜またはペーストを用いて高さの異なる複数のチップを可撓性基板上に同時に接着する方法
CN102005657A (zh) 挠性线束、电连接部件、电气电子部件模块及电连接方法
US9196599B2 (en) Connection device, method for manufacturing connection structure, method for manufacturing stacked chip component and method for mounting electronic component
CN101810067B (zh) 压接装置、压接方法、实装体及按压板
TWI390646B (zh) 電氣元件之安裝方法及安裝裝置
WO2004002203A1 (ja) 回路基板装置および基板間の接続方法
US7950140B2 (en) Connection device for electric components
KR101858783B1 (ko) 접속 구조체의 제조 방법
KR20080114760A (ko) 전기 부품을 갖는 기판의 제조 방법
KR20110045310A (ko) 웨이퍼 레벨 패키지의 제조방법
JP2010171407A5 (zh)
US20180358320A1 (en) Electronic device, electronic device manufacturing method, and electronic apparatus
CN113690149A (zh) 一种芯片键合结构、方法及设备
CN113169148A (zh) 一种柔性模组的制作方法及柔性模组
US7336091B2 (en) Assembly for simultaneously testing multiple electronic components
KR102471283B1 (ko) 전자 부품, 접속체, 접속체의 제조 방법 및 전자 부품의 접속 방법
JP4254849B2 (ja) マルチチップ実装法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1177375

Country of ref document: HK

C53 Correction of patent of invention or patent application
CB02 Change of applicant information

Address after: Tokyo, Japan

Applicant after: Dexerials Corporation

Address before: Tokyo, Japan

Applicant before: Sony Chemicals & Information Device Co., Ltd.

COR Change of bibliographic data

Free format text: CORRECT: APPLICANT; FROM: +AMP;AMP;AMP; TO: DEXERIALS ELECTRONIC MATERIAL LTD.

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20121003