CN102692528A - Cantilever type probe card - Google Patents
Cantilever type probe card Download PDFInfo
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- CN102692528A CN102692528A CN2011100758311A CN201110075831A CN102692528A CN 102692528 A CN102692528 A CN 102692528A CN 2011100758311 A CN2011100758311 A CN 2011100758311A CN 201110075831 A CN201110075831 A CN 201110075831A CN 102692528 A CN102692528 A CN 102692528A
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- circuit board
- stilt
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Abstract
The invention discloses a cantilever type probe card. The cantilever type probe card comprises a circuit board, at least one signal pin, at least one grounding pin and at least one matching pin, wherein the signal pin is electrically connected to a signal circuit; the grounding pin is electrically connected to a grounding circuit; the matching pin is adjacently arranged in parallel with the signal pin, and the length of the matching pin extends to be close to the pinpoint of the signal pin; and the matching pin is also electrically connected with the grounding pin to form a grounding loop, so that the inductive load on the signal pin is reduced, and the high-frequency test signal transmission capacity of the signal pin is improved.
Description
Technical field
The present invention relates to test the probe of electronic loop, more detailed be meant a kind of cantalever type probe card.
Background technology
Known reaching set probe and had consistently with machines and measured electronic elements or many near the mode of impedance, for example quantity is set or utilizes replacing to have the electronic component etc. of different impedances through changing conductive bond pads on the probe.Though aforementioned variety of way can promote the transmittability of high-frequency test signal, only still have not attain and improve part.
With cantalever type probe card shown in Figure 11 is example; Its with signal pin 2 coaxial settings and metal outer pipe 3 length that are electrically connected to earthing potential because of resting within the fixing glue 4; Though help keeping the elasticity of signal pin 2 leading portion 2a; But because of this leading portion 2a length long (being the section that signal pin 2 does not receive metal outer pipe 3 impedance matchings); Cause the inductive load increase on the signal pin 2 and influence the high-frequency test signal transfer quality, therefore, preferable impedance matching position should be the needle point 2b that extends to approach signal pin 2; Secondly; The signal pin 2 of aforementioned coaxial setting and gap (pitch) minimum between the metal outer pipe 3 are only about 120um; That is being limited by the influence of the size of structure own, the gap of aforementioned coaxial probe is difficult to dwindle again, causes probe 1 can't be applicable to the measured electronic elements that detection is exquisiter.
The impedance matching position of another known probe card 5 shown in Figure 2 promptly is the needle point 6a of approach signal pin 6, that is lead 7 is to design with the mode that extension passes fixing glue 8, and lead 7 electrically connects through metal wire 7a and with contiguous grounding pin 9.Though this structural form improves the problem that exists inductive load to increase in Fig. 1 structure; Metal wire 7a between right its lead 7 and the grounding pin 9 makes the beginning through the routing joining technique to accomplish the electric connection purpose one by one; Not only in manufacturing process, need look to execute and make environment and, more have the disappearance that fractures easily carefully around folding or avoid probe.Therefore the structure of this known probe card 5 is also non-perfect.
Summary of the invention
In view of this, fundamental purpose of the present invention is to provide a kind of cantalever type probe card, not only has good impedance matching effect and makes to be easy to advantage to promote the high-frequency test signal transmission capabilities of signal pin, to have more to execute.
Edge is to reach above-mentioned purpose, and cantalever type probe card provided by the present invention comprises a circuit board, and surface thereof is provided with the stilt that signal circuit, grounding circuit and an insulating material are processed; At least one signal pin, an end is electrically connected to the signal circuit of this circuit board, and other end extension passes this stilt; At least one grounding pin, an end is electrically connected to the grounding circuit of this circuit board, and other end extension passes this stilt; At least one coupling pin is adjacent to this signal pin, and an end is electrically connected to the grounding circuit of this circuit board, and the other end extends and passes this stilt; And a rigid conductor, electrically connect this grounding pin and this coupling pin.
In one embodiment, stilt of the present invention has an end face; This signal pin has the whole body portion and passes this stilt and protrude in outside this end face, and body portion is coated with an insulation course; This rigid conductor is a coated in this stilt end face and the layer structure that solidify to form, and it contacts with this grounding pin, coupling pin and this insulation course.
In another embodiment, stilt of the present invention has an end face; This grounding pin has and passes this stilt and protrude in the outer exposed body portion of this end face; This rigid conductor is thin rod shape, and an end is connected in this end that this coupling pin passes stilt, the exposed body portion of this grounding pin of other end contact.
Description of drawings
Fig. 1 is a kind of partial schematic diagram of known cantalever type probe card;
Fig. 2 is the partial schematic diagram of another kind of known cantalever type probe card;
Fig. 3 is the cantalever type probe card synoptic diagram of the present invention's first preferred embodiment;
Fig. 4 is the partial enlarged drawing of Fig. 3;
Fig. 5 is the partial enlarged drawing of the present invention's second preferred embodiment;
Fig. 6 is the partial front elevation view of Fig. 5, and the conductive segment that discloses the coupling pin does not contact grounding pin;
Fig. 7 is Fig. 6 roughly the same, discloses the conductive segment contact grounding pin of coupling pin;
Fig. 8 is the partial front elevation view of the present invention's the 3rd preferred embodiment;
Fig. 9 is the partial front elevation view of the present invention's the 4th preferred embodiment;
Figure 10 and Figure 11 are the partial schematic diagram of the present invention's the 5th preferred embodiment;
Figure 12 is the partial front elevation view of the present invention's the 6th preferred embodiment;
Figure 13 is the partial front elevation view of the present invention's the 7th preferred embodiment;
Figure 14 is the partial front elevation view of the present invention's the 8th preferred embodiment;
Figure 15 is the synoptic diagram of the present invention's the 9th preferred embodiment;
Figure 16 is the synoptic diagram of the present invention's the tenth preferred embodiment.
[main element symbol description]
100 probe
200 electronic loop contacts to be measured
10 circuit boards
12 openings, 14 surperficial 16 signal contacts
18 ground contacts, 20 locating rings, 22 fixing glue
The 22a end face
24 signal pins
The 24a body 24b of portion backshank 24c needle point
The 24d pin is section 25 insulation courses earlier
26 grounding pins
28 coupling pins
30 rigid conductors
32 signal pin 32a pins are section 32b needle point earlier
34 grounding pins, 36 fixing glue 36a end faces
38 coupling pin 38a impedance matching section 38b conductive segments
The terminal 40 coupling pins of 38c 42 conductive segments
The 49a circle is around portion's 50 grounding pins, 52 grounding pins
56 grounding pins, 58 conducting block 58a side openings
60 coupling pins, 61 conductive segments, 62 coupling pins
68 coupling pins, 69 signal pin 69a backshanks
72 signal pins, 74 grounding pins, 76 coupling pins
78 flexible circuit boards, 80 circuit boards
Embodiment
For being illustrated more clearly in the present invention, lift preferred embodiment now and cooperate diagram to specify as after.
Fig. 3 and shown in Figure 4 is cantalever type probe card 100 synoptic diagram of the present invention's first preferred embodiment, discloses to comprise a circuit board 10, many signal pins 24, many grounding pins 26, many coupling pins 28 and a rigid conductor 30; Wherein:
Those signal pins 24 were promptly put on locating ring 20 with skewed before coating fixing glue 22 in advance.In the present embodiment, signal pin 24 includes the 24a of the whole body portion, a backshank 24b, a needle point 24c and pin section 24d earlier.Wherein, the 24a of body portion puts on fixing glue 22, and external packets is covered with an insulation course 25; Signal contact 16 welding on backshank 24b and the circuit board 10; Needle point 24c is bending and in order to the contact measured electronic loop, as shown in Figure 4, the signal pin 24 of part and insulation course 25 1 are all 22 coatings of fixing glue after this curing; In this definition; Extend and to pass this fixing glue 22 (being stilt) end face 22a and pin section that should opening 12 is this pin section 24d earlier, that is pin section 24d is earlier possessed the precompressed distortion of elasticity can be in response to needle point 24c contact measured electronic loop the time.
Those grounding pins 26 were also put on locating ring 20 with skewed before coating fixing glue 22, and with signal pin 24 distance of being separated by, treat that fixing glue 22 solidifies the back and firmly be incorporated into circuit board 10.The tail end 26a of grounding pin 26 and 18 welding of the ground contact on the circuit board 10, its needle point 26b is extension and passes this fixing glue 22 end face 22a, and is used for the contact measured electronic loop.
Those coupling pins 28 are the thin body of rod of metal, and distinctly put abreast in a side of contiguous each signal pin 24, ground contact 18 welding on coupling pin 28 1 ends and the circuit board 10, and the other end then slightly extends the end face 22a that passes this fixing glue 22.
Above-mentioned probe 100 is because of being arranged on the fixing glue 22 end face 22a that solidified as electrically connecting the rigid conductor 30 of grounding pin 26 with coupling pin 28; Cause coupling pin 28 to be able to influence intimate approach signal pin 24 length of length of signal pin 24 impedance situations; In other words; Signal pin 24 is not shortened by the section of impedance matching, so will reduce inductive load on the signal pin 24 effectively to promote its high-frequency test signal transmission capabilities.In addition, rigid conductor 30 also is solidified to form through coating, on operations, has comprehensive and consistance, can effectively shorten Production Time, and does not have and shown in Figure 2ly utilize metal wire to electrically connect lead to hide the disappearance that fractures easily with grounding pin.
Below narrate other feasible enforcement aspect that the present invention can reach above-mentioned purpose again, wherein:
Fig. 5 and Fig. 6 are the second preferred embodiment synoptic diagram of probe of the present invention; Announcement has signal pin 32, grounding pin 34 and the fixing glue 36 with above-mentioned probe 100 same structures, is not arranged on the rigid conductor that solidifies on fixing glue 36 (being stilt) the end face 36a but do not have.The maximum difference of the probe of this second preferred embodiment is:
Coupling pin 38 has an impedance matching section 38a and a conductive segment 38b who links into an integrated entity; Wherein, This impedance matching section 38a reduces inductive load usefulness in order to signal pin 32 is caused, and its length is greater than or equal to the length of these signal pin 32 body portions, in the length of this impedance matching section 38a during greater than the length of these signal pin 32 body portions; Representing that the length of this impedance matching section 38a extends to the section 32a of pin elder generation of signal pin 32, is good with the needle point 32b that extends to approach signal pin 32 again.Ground contact on aforementioned impedance matching section 38a one end and the circuit board (figure does not show) welding, other end extension passes the end face 36a of this fixing glue 36 and connects this conductive segment 38b; The tapered thin body of rod of this conductive segment 38b, and terminal 38c extends to the top of this grounding pin 34, be in the present embodiment with near but not the mode of contact design, to reduce wearing and tearing situation to each other; Conductive segment 38b begins to contact with grounding pin 34 (Fig. 7 reference) when grounding pin 34 is used for the contact 200 of electrical detection and contact measured electronic loop, constitute the ground loop of a sealing according to this jointly.Explanation is that the present invention does not get rid of the conductive segment 38b position of mating pin 38 and above grounding pin 34 and with grounding pin 34, remains on state of contact in addition.
Because the impedance matching position of this impedance matching section 38a extends to the needle point 32b of approach signal pin 32, so fall the inductive load on the earth signal pin 32 significantly, has guaranteed that signal pin 32 has splendid electrical transmittability.
Fig. 8 is the present invention's the 3rd preferred embodiment; The conductive segment 42 that discloses coupling pin 40 has a hook part 42a; This hook part 42a is before probe is implemented the test electronic loop; Be from last double team grounding pin 44, but do not contact grounding pin 44, only the beginning constitutes the ground loop that seals with it when the contact 200 of electronic loop to be measured contacts with grounding pin 44.Fig. 9 is the 4th preferred embodiment, and the hook part 46a of its conductive segment 46 is certainly double team grounding pin 44 down.Likewise, the present invention's hook part and grounding pin of not getting rid of conductive segment remains on state of contact.
Figure 10 and Figure 11 are the 5th preferred embodiment; The conductive segment 49 that discloses coupling pin 48 has a circle and is wrapped in grounding pin 50 outsides around the 49a of portion; In the present embodiment; This circle is contact with grounding pin 50 in test around the 49a of portion before the electronic loop, only when the contact 200 of electronic loop to be measured contacts with grounding pin 50, begin and the ground loop that seals of formation.Likewise, the present invention's circle of not getting rid of conductive segment remains on state of contact around 49a of portion and grounding pin 50.
Figure 12 is the 6th preferred embodiment; Disclose grounding pin 52 nearly needle point positions and have a perforation 52a; And conductive segment 55 front ends of coupling pin 54 stretch among this perforation 52a, and before the test electronic loop, said conductive segment 55 front ends remain on not contact condition with perforation 52a hole wall; Likewise, 55 front ends of the conductive segment in the present embodiment only constitute the ground loop of sealing with it when the contact 200 of electronic loop to be measured contacts with grounding pin 52.Certainly, the present invention does not get rid of the state that conductive segment 55 front ends can also remain on contact grounding pin 52.
Figure 13 is the 7th preferred embodiment; Be disclosed in grounding pin 56 and extend a sheathed conducting block 58 on the section that passes stilt; Conducting block 58 has a side opening 58a, and conductive segment 61 front ends of the coupling pin 60 of present embodiment stretch among this side opening 58a and do not contact with side opening 58a hole wall.Likewise, the present invention does not get rid of the aspect that conductive segment 61 front ends directly contact with conducting block 58.
Figure 14 is the 8th preferred embodiment; Disclose coupling pin 62 and have down a bending segment 62a; And it be example through one with Copper Foil 64 but does not contact with mating pin 62 as electric-conductor one end of limit, and the other end contacts with grounding pin 66 and constitutes the ground loop that seals with it.Mandatory declaration be, the effect of aforementioned bending segment 62a only is to prevent Copper Foil 64 coupling pins 62 slippages relatively, the present invention does not get rid of and omits bending segment and Copper Foil 64 is directly fixed on the means of coupling pin 62, like welding.
Figure 15 is the 9th preferred embodiment; Disclose coupling pin 68 length and reduce pin section and fixing glue coating place earlier to the respective signal pin; Coupling pin 68 is through connection one metal wire 70, and metal wire 70 1 ends are welded in the grounding circuit 18 of circuit board 10 and reach the electric connection purpose.More particularly; Metal wire 70 laid parallels are in a side of contiguous signal pin 69, and metal wire 70 external packets are covered with an insulation course 71, spacing and electrical isolation that metal wire 70 and signal pin 69 maintenances are fixed; In addition; The length of metal wire 70 extends to the 69b of body portion of signal pin 69 by the backshank 69a of signal pin 69, so that the backshank 69a of signal pin 69 reaches impedance matching effect to the 69b of body portion, to reduce inductive load on the signal pin 69 effectively to promote its high-frequency test signal transmission capabilities.In general; Can as Figure 15, separate between metal wire 70 and the signal pin 69; Also can near; Because metal wire 70 external packets are covered with insulation course 71, metal wire 70 and signal pin 69 near structure under, can control the spacing between metal wire 70 and the signal pin 69 through the thickness of insulation course 71.The earthing mode of aforementioned coupling pin also is applicable to above-mentioned each embodiment.
Figure 16 is the tenth preferred embodiment, discloses signal pin of the present invention 72, grounding pin 74 and coupling pin 76 through connecting a flexible circuit board 78 and electrically connecting with circuit board 80.Promptly these flexible circuit board 78 1 ends directly are welded on the circuit board 80; And the signal contact and the ground contact of the multiple conducting wires of flexible circuit board 78 (figure does not show) end CC plate 80 out of the ordinary; The lead other end then distinctly is connected with signal pin 72, grounding pin 74 and coupling pin 76 again, to reach the electric connection purpose.Aforementioned connected mode also is applicable to above-mentioned each embodiment.
The above is merely the preferable possible embodiments of the present invention, uses equivalent structure and method for making variation that instructions of the present invention and claim are done such as, ought to be included in the claim of the present invention.
Claims (24)
1. cantalever type probe card is characterized in that comprising:
One circuit board, surface thereof are provided with the stilt that signal circuit, grounding circuit and an insulating material are processed;
At least one signal pin, an end is electrically connected to the signal circuit of this circuit board, and other end extension passes this stilt;
At least one grounding pin, an end is electrically connected to the grounding circuit of this circuit board, and other end extension passes this stilt;
At least one coupling pin is adjacent to this signal pin, and an end is electrically connected to the grounding circuit of this circuit board, and the other end extends and passes this stilt; And
One rigid conductor electrically connects this grounding pin and this coupling pin.
2. cantalever type probe card as claimed in claim 1 is characterized in that this stilt has an end face; This signal pin has the whole body portion and passes this stilt and protrude in outside this end face, and body portion is coated with an insulation course; This rigid conductor is a coated in this stilt end face and the layer structure that solidify to form, and it contacts with this grounding pin, coupling pin and this insulation course.
3. cantalever type probe card as claimed in claim 1 is characterized in that, also comprises a flexible circuit board, and this flexible circuit board is in order to electrically connect this circuit board and this signal pin, grounding pin and coupling pin.
4. cantalever type probe card as claimed in claim 1 is characterized in that, comprises a metal wire, and this metal wire one end is welded in the grounding circuit of this circuit board, and the other end is connected with this coupling pin, and metal wire and signal pin electrical isolation.
5. cantalever type probe card in order to the test electronic loop, is characterized in that comprising:
One circuit board, surface thereof are provided with the stilt that signal circuit, grounding circuit and an insulating material are processed, and this stilt has an end face;
At least one signal pin, an end is electrically connected to the signal circuit of this circuit board, and the other end extends the end face that passes this stilt, and in order to contact above-mentioned electronic loop;
At least one grounding pin, an end is electrically connected to the grounding circuit of this circuit board, and the other end extends the end face that passes this stilt, and in order to contact above-mentioned electronic loop; And
At least one coupling pin; Be adjacent to this signal pin; And an end is electrically connected to the grounding circuit of this circuit board, and other end extension passes the end face of this stilt and is bent to form a conductive segment, and this conductive segment contacts with this grounding pin when grounding pin contacts above-mentioned electronic loop.
6. cantalever type probe card as claimed in claim 5 is characterized in that, conductive segment of this coupling pin before the test electronic loop, be positioned near but do not contact a side of this grounding pin.
7. cantalever type probe card as claimed in claim 6 is characterized in that, the conductive segment of this coupling pin has a hook part and is the outside of double team in grounding pin.
8. cantalever type probe card as claimed in claim 5 is characterized in that, the conductive segment of this coupling pin twines this grounding pin with the mode of not contact before the test electronic loop.
9. cantalever type probe card as claimed in claim 5 is characterized in that this grounding pin has a perforation, and the conductive segment front end of this coupling pin stretches in this perforation, and before the test electronic loop, keeps not contact condition with the perforation hole wall.
10. cantalever type probe card as claimed in claim 5; It is characterized in that; Including a conducting block is sheathed on this grounding pin and extends and pass on the section of stilt; This conducting block has a side opening, and the conductive segment front end of this coupling pin stretches into, and before the test electronic loop, keeps not contact condition with the side opening hole wall.
11. cantalever type probe card as claimed in claim 5 is characterized in that, comprises a flexible circuit board, this flexible circuit board is in order to electrically connect this circuit board and this signal pin, grounding pin and coupling pin.
12. cantalever type probe card as claimed in claim 5 is characterized in that, comprises a metal wire, this metal wire one end is welded in the grounding circuit of this circuit board, and the other end is connected with this coupling pin, and metal wire and signal pin electrical isolation.
13. a cantalever type probe card in order to the test electronic loop, is characterized in that comprising:
One circuit board, surface thereof are provided with the stilt that signal circuit, grounding circuit and an insulating material are processed, and this stilt has an end face;
At least one signal pin, an end is electrically connected to the signal circuit of this circuit board, and the other end extends the end face that passes this stilt, and in order to contact above-mentioned electronic loop;
At least one grounding pin, an end is electrically connected to the grounding circuit of this circuit board, and the other end extends the end face that passes this stilt, and in order to contact above-mentioned electronic loop; And
At least one coupling pin is adjacent to this signal pin, and an end is electrically connected to the grounding circuit of this circuit board, and the other end extends and passes the end face of this stilt and be bent to form a conductive segment, and this conductive segment contacts with this grounding pin.
14. cantalever type probe card as claimed in claim 13 is characterized in that, the conductive segment of this coupling pin has a hook part and colludes to this grounding pin.
15. cantalever type probe card as claimed in claim 13 is characterized in that, the conductive segment of this coupling pin has a circle and twines this grounding pin around portion.
16. cantalever type probe card as claimed in claim 13 is characterized in that, this grounding pin has a perforation, during the conductive segment front end of this coupling pin inserts and should bore a hole.
17. cantalever type probe card as claimed in claim 13 is characterized in that, includes a conducting block and is sheathed on this grounding pin and extends and pass on the section of stilt, this conducting block has a side opening and supplies the conductive segment front end of this coupling pin to stretch into.
18. cantalever type probe card as claimed in claim 13 is characterized in that, comprises a flexible circuit board, this flexible circuit board is in order to electrically connect this circuit board and this signal pin, grounding pin and coupling pin.
19. cantalever type probe card as claimed in claim 13 is characterized in that, comprises a metal wire, this metal wire one end is welded in the grounding circuit of this circuit board, and the other end is connected with this coupling pin, and metal wire and signal pin electrical isolation.
20. a cantalever type probe card in order to the test electronic loop, is characterized in that comprising:
One circuit board, surface thereof are provided with the stilt that signal circuit, grounding circuit and an insulating material are processed, and this stilt has an end face;
At least one signal pin, an end is electrically connected to the signal circuit of this circuit board, and the other end extends the end face that passes this stilt, and in order to contact above-mentioned electronic loop;
At least one grounding pin, an end is electrically connected to the grounding circuit of this circuit board, and the other end extends the end face that passes this stilt, and in order to contact above-mentioned electronic loop; And
At least one coupling pin is adjacent to this signal pin, and an end is electrically connected to the grounding circuit of this circuit board, and the other end extends the end face that passes this stilt; And
One electric-conductor, these electric-conductor two ends pass the grounding pin of stilt and mate pin with extension respectively and contact.
21. cantalever type probe card as claimed in claim 20 is characterized in that, this electric-conductor is a Copper Foil.
22. cantalever type probe card as claimed in claim 20 is characterized in that, this coupling needle set has a bending segment.
23. cantalever type probe card as claimed in claim 20 is characterized in that, comprises a flexible circuit board, this flexible circuit board is in order to electrically connect this circuit board and this signal pin, grounding pin and coupling pin.
24. cantalever type probe card as claimed in claim 20 is characterized in that, comprises a metal wire, this metal wire one end is welded in the grounding circuit of this circuit board, and the other end is connected with this coupling pin, and metal wire and signal pin electrical isolation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110075831.1A CN102692528B (en) | 2011-03-24 | 2011-03-24 | Cantilever type probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110075831.1A CN102692528B (en) | 2011-03-24 | 2011-03-24 | Cantilever type probe card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102692528A true CN102692528A (en) | 2012-09-26 |
| CN102692528B CN102692528B (en) | 2015-05-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110075831.1A Expired - Fee Related CN102692528B (en) | 2011-03-24 | 2011-03-24 | Cantilever type probe card |
Country Status (1)
| Country | Link |
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| CN (1) | CN102692528B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103901239A (en) * | 2012-12-26 | 2014-07-02 | 旺矽科技股份有限公司 | High-frequency probe card |
| CN105403739A (en) * | 2015-10-28 | 2016-03-16 | 上海华力微电子有限公司 | WAT (Wafer Acceptance Test) probe card |
| CN108072776A (en) * | 2016-11-14 | 2018-05-25 | 旺矽科技股份有限公司 | Probe card and multi-signal transmission board thereof |
| CN111587377A (en) * | 2018-01-17 | 2020-08-25 | 泰克诺探头公司 | Cantilever probe head and corresponding contact probe |
| CN111707850A (en) * | 2019-03-18 | 2020-09-25 | 旺矽科技股份有限公司 | Probe apparatus |
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| EP0180013A1 (en) * | 1984-09-21 | 1986-05-07 | International Business Machines Corporation | Test probe system |
| JP2004247459A (en) * | 2003-02-13 | 2004-09-02 | Seiko Epson Corp | Semiconductor device, manufacturing method therefor, probe card, probe device and probe testing method |
| CN101135701A (en) * | 2006-08-29 | 2008-03-05 | 旺矽科技股份有限公司 | Vertical type high frequency probe card |
| CN101221194A (en) * | 2007-01-09 | 2008-07-16 | 旺矽科技股份有限公司 | High-frequency probe |
| US20080191726A1 (en) * | 2007-02-13 | 2008-08-14 | Mjc Probe Incorporation | Cantilever-type probe card for high frequency application |
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2011
- 2011-03-24 CN CN201110075831.1A patent/CN102692528B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0180013A1 (en) * | 1984-09-21 | 1986-05-07 | International Business Machines Corporation | Test probe system |
| JP2004247459A (en) * | 2003-02-13 | 2004-09-02 | Seiko Epson Corp | Semiconductor device, manufacturing method therefor, probe card, probe device and probe testing method |
| CN101135701A (en) * | 2006-08-29 | 2008-03-05 | 旺矽科技股份有限公司 | Vertical type high frequency probe card |
| CN101221194A (en) * | 2007-01-09 | 2008-07-16 | 旺矽科技股份有限公司 | High-frequency probe |
| US20080191726A1 (en) * | 2007-02-13 | 2008-08-14 | Mjc Probe Incorporation | Cantilever-type probe card for high frequency application |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103901239A (en) * | 2012-12-26 | 2014-07-02 | 旺矽科技股份有限公司 | High-frequency probe card |
| CN103901239B (en) * | 2012-12-26 | 2017-04-12 | 旺矽科技股份有限公司 | High-frequency probe card |
| CN105403739A (en) * | 2015-10-28 | 2016-03-16 | 上海华力微电子有限公司 | WAT (Wafer Acceptance Test) probe card |
| CN108072776A (en) * | 2016-11-14 | 2018-05-25 | 旺矽科技股份有限公司 | Probe card and multi-signal transmission board thereof |
| CN108072776B (en) * | 2016-11-14 | 2020-05-26 | 旺矽科技股份有限公司 | Probe card and multi-signal transmission board thereof |
| CN111587377A (en) * | 2018-01-17 | 2020-08-25 | 泰克诺探头公司 | Cantilever probe head and corresponding contact probe |
| CN111587377B (en) * | 2018-01-17 | 2023-07-14 | 泰克诺探头公司 | Cantilever probe head and corresponding contact probe |
| CN111707850A (en) * | 2019-03-18 | 2020-09-25 | 旺矽科技股份有限公司 | Probe apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102692528B (en) | 2015-05-13 |
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