TWI425220B - Cantilever probe card - Google Patents
Cantilever probe card Download PDFInfo
- Publication number
- TWI425220B TWI425220B TW100108318A TW100108318A TWI425220B TW I425220 B TWI425220 B TW I425220B TW 100108318 A TW100108318 A TW 100108318A TW 100108318 A TW100108318 A TW 100108318A TW I425220 B TWI425220 B TW I425220B
- Authority
- TW
- Taiwan
- Prior art keywords
- pin
- circuit
- circuit board
- probe card
- signal
- Prior art date
Links
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
本發明係與測試電子迴路之探針卡有關，更詳而言之是指一種懸臂式探針卡。The present invention relates to a probe card for testing an electronic circuit, and more particularly to a cantilever probe card.
已知達成設定探針卡具有與檢測機及待測電子組件一致或接近阻抗的方式許多，例如透過改變探針卡上的導電銲接點設置數量或利用更換具有不同阻抗的電子元件等。前述各種方式雖能提升高頻測試訊號的傳輸能力，惟仍有未臻完善之處。It is known that there are many ways to achieve a set probe card having a uniform or close impedance to the detector and the electronic component to be tested, for example by changing the number of conductive pads disposed on the probe card or by replacing electronic components having different impedances. Although the above various methods can improve the transmission capability of the high-frequency test signal, there are still some improvements.
以圖1所示之懸臂式探針卡1為例，其與訊號針2同軸設置並電性連接至接地電位的金屬外管3長度因停留在固定膠4之內，雖有利於維持訊號針2前段2a的彈性，卻因該前段2a長度過長(即訊號針2未受金屬外管3阻抗匹配的區段)，導致訊號針2上的電感性負載增加而影響高頻測試訊號的傳輸品質，因此，較佳的阻抗匹配位置應是延伸至接近訊號針2的針尖2b；其次，前述同軸設置的訊號針2與金屬外管3之間的間隙(pitch)最小僅在120um左右，亦即受制於結構本身尺寸的影響，前述同軸探針的間隙難以再縮小，造成探針卡1無法適用於檢測更精緻的待測電子組件。Taking the cantilever type probe card 1 shown in FIG. 1 as an example, the length of the metal outer tube 3 coaxially disposed with the signal pin 2 and electrically connected to the ground potential stays within the fixing glue 4, which is advantageous for maintaining the signal pin. 2 The elasticity of the front section 2a, because the length of the front section 2a is too long (that is, the section where the signal needle 2 is not matched by the impedance of the metal outer tube 3), the inductive load on the signal pin 2 is increased to affect the transmission of the high frequency test signal. Quality, therefore, the preferred impedance matching position should be extended to the tip 2b of the signal pin 2; secondly, the minimum pitch between the coaxially disposed signal pin 2 and the metal outer tube 3 is only about 120 um, That is, due to the size of the structure itself, the gap of the aforementioned coaxial probe is difficult to be further reduced, so that the probe card 1 cannot be applied to detect a more delicate electronic component to be tested.
圖2所示之另一已知探針卡5的阻抗匹配位置即是接近訊號針6的針尖6a，亦即導線7是以延伸穿出固定膠8的方式設計，且導線7透過金屬線7a而與鄰近的接地針9電性連接。此結構形態雖改善圖1結構中存在電感性負載增加的問題，然其導線7與接地針9之間的金屬線7a是藉由打線接合技術逐一製作始完成電性連接目的，不僅在製作過程中需視施作環境而小心翼翼地繞折或迴避探針，更存在容易折斷之缺失。因此該已知探針卡5的結構亦非完善。The impedance matching position of another known probe card 5 shown in FIG. 2 is close to the needle tip 6a of the signal pin 6, that is, the wire 7 is designed to extend through the fixing glue 8, and the wire 7 is transmitted through the metal wire 7a. It is electrically connected to the adjacent grounding pin 9. Although the structural form improves the problem of the increase of the inductive load in the structure of FIG. 1, the metal line 7a between the wire 7 and the grounding pin 9 is formed by wire bonding technology, and the electrical connection is completed one by one, not only in the manufacturing process. It is necessary to carefully wrap or avoid the probe depending on the application environment, and there is a lack of easy breakage. Therefore, the structure of the known probe card 5 is also not perfect.
有鑑於此，本發明之主要目的在於提供一種懸臂式探針卡，不僅具有良好的阻抗匹配效果以提升訊號針的高頻測試訊號傳輸能力，更具有施作容易的優點。In view of this, the main object of the present invention is to provide a cantilever type probe card, which not only has a good impedance matching effect, but also improves the high-frequency test signal transmission capability of the signal pin, and has the advantage of being easy to apply.
緣以達成上述目的，本發明所提供之懸臂式探針卡包含一電路板、至少一訊號針、至少一接地針、至少一匹配針與一剛性導體。其中，電路板之一表面設有訊號電路、接地電路與一絕緣材料製成的支撐物；訊號針一端電性連接至該電路板之訊號電路，另一端延伸穿出該支撐物；接地針一端電性連接至該電路板之接地電路，另一端延伸穿出該支撐物；匹配針鄰設於該訊號針，且一端電性連接至該電路板之接地電路，另一端延伸穿出該支撐物；而該剛性導體則電性連接該接地針與該匹配針。To achieve the above objective, the cantilever probe card provided by the present invention comprises a circuit board, at least one signal pin, at least one ground pin, at least one matching pin and a rigid conductor. Wherein, one surface of the circuit board is provided with a signal circuit, a grounding circuit and a support made of an insulating material; one end of the signal pin is electrically connected to the signal circuit of the circuit board, and the other end extends through the support; The other end of the circuit is electrically connected to the grounding circuit of And the rigid conductor is electrically connected to the grounding pin and the matching pin.
在一實施例中，本發明的支撐物具有一端面；該訊號針具有一身部穿過該支撐物並突出於該端面外，且身部外包覆有一絕緣層；該剛性導體為導電材料塗佈於該支撐物端面並固化形成的層狀結構，其與該接地針、匹配針及該絕緣層接觸。In one embodiment, the support of the present invention has an end face; the signal pin has a body passing through the support and protruding beyond the end face, and the body is covered with an insulating layer; the rigid conductor is coated with a conductive material a layered structure formed on the end surface of the support and cured, which is in contact with the grounding pin, the matching pin and the insulating layer.
在另一實施例中，本發明的支撐物具有一端面；該接地針具有一穿過該支撐物並突出於該端面外的裸露身部；該剛性導體呈細桿狀，且一端連接於該匹配針穿出支撐物之該端，另一端接觸該接地針的裸露身部。In another embodiment, the support of the present invention has an end surface; the grounding pin has a bare body that passes through the support and protrudes beyond the end surface; the rigid conductor has a thin rod shape, and one end is connected to the The matching needle passes through the end of the support and the other end contacts the exposed body of the grounding pin.
為能更清楚地說明本發明，茲舉較佳實施例並配合圖示詳細說明如后。In order that the present invention may be more clearly described, the preferred embodiments are illustrated in the accompanying drawings.
圖3與圖4所示為本發明第一較佳實施例之懸臂式探針卡100示意圖，揭示包括一電路板10、複數根訊號針24、複數根接地針26、複數根匹配針28與一剛性導體30；其中：電路板10具有一開口12，且其一表面14在該開口12的周圍設置有包含複數個訊號接點16的訊號電路及複數個接地接點18的接地電路；以及一具有絕緣特性的定位環20設置在該開口12的周緣，一黏稠流質狀且具有絕緣特性的固定膠22塗布於該定位環20上，並待固化後形成一支撐物，於此定義已固化的固定膠22之內面構成一端面22a。3 and FIG. 4 are schematic diagrams showing a cantilever probe card 100 according to a first preferred embodiment of the present invention, including a circuit board 10, a plurality of signal pins 24, a plurality of ground pins 26, and a plurality of matching pins 28 and a rigid conductor 30; wherein: the circuit board 10 has an opening 12, and a surface 14 is disposed around the opening 12 with a signal circuit including a plurality of signal contacts 16 and a ground circuit of a plurality of ground contacts 18; A positioning ring 20 having an insulating property is disposed on the periphery of the opening 12, and a viscous fluid-like and insulating property fixing glue 22 is coated on the positioning ring 20, and after being solidified, a support is formed, and the definition is cured. The inner surface of the fixing glue 22 constitutes an end surface 22a.
該些訊號針24係在塗布固定膠22之前即預先以傾斜狀擺放於定位環20上。在本實施例中，訊號針24包括有一身部24a、一針尾24b、一針尖24c與一針先段24d。其中，身部24a擺放於固定膠22上，且外部包覆有一絕緣層25，針尾24b與電路板10上的訊號接點16銲接，針尖24c呈彎折狀並用以接觸待測電子迴路，如圖4所示，部分的訊號針24及絕緣層25一同為該固化後的固定膠22所包覆，於此定義，延伸穿出該固定膠22(即支撐物)端面22a且對應該開口12的針段為該針先段24d，亦即，針先段24d保有彈性可因應針尖24c接觸待測電子迴路時的預壓變形。The signal pins 24 are placed on the positioning ring 20 in an inclined manner before being applied to the fixing glue 22. In the present embodiment, the signal pin 24 includes a body portion 24a, a needle tail 24b, a needle tip 24c and a needle first segment 24d. The body portion 24a is disposed on the fixing glue 22, and is externally covered with an insulating layer 25. The needle tail 24b is soldered to the signal contact 16 on the circuit board 10. The needle tip 24c is bent and is used to contact the electronic circuit to be tested. As shown in FIG. 4, part of the signal pin 24 and the insulating layer 25 are coated together with the cured fixing glue 22, and as defined herein, extend through the end face 22a of the fixing glue 22 (ie, the support) and correspond to the opening. The needle segment of 12 is the needle segment 24d, that is, the needle segment 24d retains elasticity to cope with the pre-pressure deformation when the needle tip 24c contacts the electronic circuit to be tested.
該些接地針26亦在塗布固定膠22之前已以傾斜狀擺放於定位環20上，並與訊號針24相隔一距離，待固定膠22固化後而穩固結合於電路板10。接地針26的尾端26a與電路板10上的接地接點18銲接，其針尖26b呈延伸穿出該固定膠22端面22a，並用於接觸待測電子迴路。The grounding pins 26 are also placed on the positioning ring 20 in an inclined manner before being applied with the fixing glue 22, and spaced apart from the signal pins 24, and are firmly bonded to the circuit board 10 after the fixing glue 22 is cured. The tail end 26a of the grounding pin 26 is soldered to the grounding contact 18 on the circuit board 10. The tip 26b extends through the end face 22a of the fixing adhesive 22 and is used to contact the electronic circuit to be tested.
該些匹配針28為金屬細桿體，且各別平行地擺放於鄰近每一訊號針24之一側，匹配針28一端與電路板10上的接地接點18銲接，另一端則略為延伸穿出該固定膠22的端面22a。The matching pins 28 are metal thin rod bodies, and are respectively placed in parallel adjacent to one side of each of the signal pins 24, one end of the matching pin 28 is welded to the ground contact 18 on the circuit board 10, and the other end is slightly extended. The end face 22a of the fixing glue 22 is worn out.
剛性導體30是以具有良好導電性的材料在已固化之固定膠22的端面22a上施以塗佈作業並經固化後而形成的層狀結構，如圖4所示，剛性導體30同時與接地針26、匹配針28及該訊號針24身部24a所包覆的絕緣層25接觸，易言之，訊號針24為絕緣層25所隔離而未與剛性導體30電性連接，反而是接地針26與匹配針28受到剛性導體30的接觸而彼此互為電性連接並連接至接地電位，進一步而言，匹配針28的兩端是連接至接地電位，且該二接地端距離越長，表示匹配針28可對訊號針24的阻抗匹配影響越大。The rigid conductor 30 is a layered structure formed by applying a coating material on the end surface 22a of the cured fixing adhesive 22 and curing it. As shown in FIG. 4, the rigid conductor 30 is simultaneously grounded. The needle 26, the matching pin 28 and the insulating layer 25 covered by the body portion 24a of the signal pin 24 are in contact with each other. In other words, the signal pin 24 is isolated by the insulating layer 25 and is not electrically connected to the rigid conductor 30, but is instead grounded. 26 and the matching pins 28 are electrically connected to each other and connected to the ground potential by the contact of the rigid conductor 30. Further, both ends of the matching pin 28 are connected to the ground potential, and the longer the distance between the two ground ends, the The greater the effect of the matching pin 28 on the impedance matching of the signal pin 24.
上述探針卡100因作為電性連接接地針26與匹配針28的剛性導體30是設置在已固化之固定膠22端面22a，造成匹配針28得以影響訊號針24阻抗情形的長度近乎接近訊號針24長度，換言之，訊號針24未受阻抗匹配的區段變短，如此將有效地降低訊號針24上的電感性負載以提升其高頻測試訊號傳輸能力。另，剛性導體30是經塗佈並固化而形成，在加工作業上具有全面性及一致性，可有效縮短製作時間，並且無圖2所示利用金屬線電性連接導線與接地針而潛藏容易折斷之缺失。The probe card 100 is disposed on the end face 22a of the cured fixing adhesive 22 as the rigid conductor 30 electrically connected to the grounding pin 26 and the matching pin 28, so that the length of the matching pin 28 affecting the impedance of the signal pin 24 is close to the signal pin. The length of 24, in other words, the section of the signal pin 24 that is not impedance matched is shortened, which effectively reduces the inductive load on the signal pin 24 to enhance its high frequency test signal transmission capability. In addition, the rigid conductor 30 is formed by coating and curing, and has comprehensiveness and consistency in the processing operation, which can effectively shorten the manufacturing time, and is not easy to be hidden by using the metal wire to electrically connect the wire and the grounding pin as shown in FIG. The lack of break.
以下再敘述本發明可達成上述目的之其他可行實施態樣，其中：圖5及圖6為本發明探針卡之第二較佳實施例示意圖，揭示具有與上述探針卡100相同結構的訊號針32、接地針34及固定膠36，但不具有設置在已固化固定膠36(即支撐物)端面36a上的剛性導體。本第二較佳實施例之探針卡最大的不同點在於：匹配針38具有連接成一體的一阻抗匹配段38a及一導電段38b，其中，該阻抗匹配段38a即是用以對訊號針32造成降低電感性負載用，其長度大於或者等於該訊號針32身部的長度，在該阻抗匹配段38a的長度大於該訊號針32身部的長度時，表示該阻抗匹配段38a的長度延伸至訊號針32的針先段32a，又以延伸至接近訊號針32的針尖32b為佳。前述阻抗匹配段38a一端與電路板上的接地接點(圖未示)銲接，另一端延伸穿出該固定膠36的端面36a並連接該導電段38b；該導電段38b呈錐形細桿體，且末端38c延伸至該接地針34的上方，在本實施例中是以接近但未接觸的方式設計，以減少彼此間的磨損情形；導電段38b是在接地針34用於電性檢測且接觸待測電子迴路的接點200時始與接地針34接觸(圖7參照)，據以共同構成一封閉的接地迴路。另說明的是，本發明並不排除匹配針38之導電段38b位在接地針34上方並與接地針34保持在接觸的狀態。Other possible implementations of the present invention can be achieved by the following: FIG. 5 and FIG. 6 are schematic diagrams showing a second preferred embodiment of the probe card of the present invention, revealing a signal having the same structure as the probe card 100 described above. The needle 32, the grounding pin 34 and the fixing glue 36, but do not have a rigid conductor disposed on the end face 36a of the cured fixing glue 36 (i.e., the support). The probe card of the second preferred embodiment has the greatest difference in that the matching pin 38 has an impedance matching section 38a and a conductive section 38b connected together, wherein the impedance matching section 38a is used for the signal pin. 32 causing a reduction in inductive load, the length of which is greater than or equal to the length of the body portion of the signal pin 32. When the length of the impedance matching segment 38a is greater than the length of the body portion of the signal pin 32, it indicates that the length of the impedance matching segment 38a extends. Preferably, the needle first segment 32a of the signal pin 32 is further extended to the needle tip 32b adjacent to the signal pin 32. One end of the impedance matching section 38a is soldered to a ground contact (not shown) on the circuit board, and the other end extends through the end surface 36a of the fixing glue 36 and is connected to the conductive section 38b; the conductive section 38b is a tapered thin rod body. And the end 38c extends above the grounding pin 34, in the present embodiment in a close but not in contact manner to reduce the wear situation between each other; the conductive segment 38b is used in the grounding pin 34 for electrical detection and When the contact 200 of the electronic circuit to be tested is contacted, it is brought into contact with the grounding pin 34 (refer to FIG. 7), thereby jointly forming a closed ground loop. It is also noted that the present invention does not preclude the conductive segment 38b of the matching pin 38 from being positioned above the ground pin 34 and in contact with the ground pin 34.
由於該阻抗匹配段38a的阻抗匹配位置延伸至接近訊號針32的針尖32b，故顯著地降地訊號針32上的電感性負載，確保了訊號針32具有極佳的電性傳輸能力。Since the impedance matching position of the impedance matching section 38a extends to the tip 32b of the signal pin 32, the inductive load on the signal pin 32 is significantly lowered, ensuring that the signal pin 32 has excellent electrical transmission capability.
圖8為本發明第三較佳實施例，揭示匹配針40之導電段42具有一勾部42a，該勾部42a在探針卡實施測試電子迴路前，呈自上包夾接地針44，但未接觸接地針44，僅在待測電子迴路的接點200與接地針44接觸時始與之構成封閉的接地迴路。圖9為第四較佳實施例，其導電段46的勾部46a是呈自下包夾接地針44。同樣地，本發明並不排除導電段之勾部是與接地針保持在接觸的狀態。FIG. 8 is a third embodiment of the present invention. The conductive segment 42 of the matching pin 40 has a hook portion 42a. The hook portion 42a is a self-clamping grounding pin 44 before the probe card performs the test electronic circuit. The grounding pin 44 is not touched, and only when the contact 200 of the electronic circuit to be tested is in contact with the grounding pin 44, it forms a closed grounding loop. Figure 9 is a fourth preferred embodiment in which the hook portion 46a of the conductive segment 46 is a self-clamping grounding pin 44. Similarly, the present invention does not exclude that the hook portion of the conductive segment is in contact with the ground pin.
圖10與圖11為第五較佳實施例，揭示匹配針48之導電段49具有一圈繞部49a纏繞在接地針50外部，在本實施例中，該圈繞部49a在測試電子迴路之前是未與接地針50接觸的，僅在待測電子迴路的接點200與接地針50接觸時始與之構成封閉的接地迴路。同樣地，本發明並不排除導電段之圈繞部49a是與接地針50保持在接觸的狀態。10 and FIG. 11 show a fifth preferred embodiment. The conductive segment 49 of the matching pin 48 has a loop portion 49a wound around the ground pin 50. In the present embodiment, the loop portion 49a is before the test electronic circuit. It is not in contact with the grounding pin 50, and only forms a closed grounding loop when the contact 200 of the electronic circuit to be tested is in contact with the grounding pin 50. Similarly, the present invention does not exclude that the coiled portion 49a of the conductive segment is in contact with the grounding pin 50.
圖12為第六較佳實施例，揭示接地針52近針尖部位具有一穿孔52a，而匹配針54之導電段55前端伸入該穿孔52a中，在測試電子迴路之前，所述導電段55前端是與穿孔52a孔壁保持在未接觸狀態，同樣地，本實施例中的導電段55前端僅在待測電子迴路的接點200與接地針52接觸時始與之構成封閉的接地迴路。當然，本發明並不排除導電段55前端亦可以保持在接觸接地針52的狀態。12 is a sixth preferred embodiment, showing that the ground pin 52 has a through hole 52a near the needle tip portion, and the front end of the conductive segment 55 of the matching pin 54 extends into the through hole 52a. Before the electronic circuit is tested, the front end of the conductive segment 55 The front end of the conductive segment 55 in the present embodiment is configured to form a closed ground loop only when the contact 200 of the electronic circuit to be tested is in contact with the grounding pin 52. Of course, the present invention does not exclude that the front end of the conductive segment 55 can also remain in contact with the grounding pin 52.
圖13為第七較佳實施例，揭示在接地針56延伸穿出支撐物的區段上套設一導電塊58，導電塊58具有一側孔58a，本實施例的匹配針60之導電段61前端伸入該側孔58a中且未與側孔58a孔壁接觸。同樣地，本發明並不排除導電段61前端直接與導電塊58接觸的態樣。FIG. 13 is a seventh preferred embodiment. The conductive block 58 is disposed on a section of the grounding pin 56 extending through the support. The conductive block 58 has a side hole 58a. The conductive segment of the matching pin 60 of this embodiment. The front end of the 61 protrudes into the side hole 58a and is not in contact with the hole wall of the side hole 58a. Similarly, the present invention does not exclude the fact that the front end of the conductive segment 61 is in direct contact with the conductive block 58.
圖14為第八較佳實施例，揭示匹配針62具有一朝下的彎折段62a，且其藉由一以銅箔64為例但不以此為限的導電件一端與匹配針62接觸，另一端與接地針66接觸而與之構成一封閉的接地迴路。必須說明的是，前述彎折段62a之作用僅在於防止銅箔64相對匹配針62滑脫，本發明不排除省略彎折段而將銅箔64直接固定於匹配針62的手段，如銲接。FIG. 14 is an eighth preferred embodiment of the present invention. The matching pin 62 has a downwardly bent portion 62a, and the conductive member is contacted with the matching pin 62 by a copper foil 64 as an example. The other end is in contact with the grounding pin 66 to form a closed ground loop. It should be noted that the above-mentioned bending section 62a functions only to prevent the copper foil 64 from slipping off the matching needle 62. The present invention does not exclude means for directly fixing the copper foil 64 to the matching needle 62, such as welding, by omitting the bending section.
圖15為第九較佳實施例，揭示匹配針68長度減縮至對應訊號針的針先段及固定膠所包覆處，匹配針68是藉由連接一金屬線70，且金屬線70一端銲接於電路板10之接地電路18而達成電性連接目的。更具體地說，金屬線70係平行擺放於鄰近的訊號針69之一側，且金屬線70外部包覆有一絕緣層71，使金屬線70與訊號針69保持固定的間距且電性隔離，另，金屬線70的長度是由訊號針69的針尾69a延伸至訊號針69的身部69b，以使訊號針69的針尾69a到身部69b達到阻抗匹配的效果，以有效地降低訊號針69上的電感性負載以提升其高頻測試訊號傳輸能力。一般來說，金屬線70與訊號針69之間可以如圖15一樣分離，也可以緊靠，由於金屬線70外部包覆有絕緣層71，在金屬線70與訊號針69緊靠的結構下，可以藉由絕緣層71的厚度來控制金屬線70與訊號針69之間的間距。前述匹配針的接地方式亦適用於上述各實施例。FIG. 15 is a ninth preferred embodiment, showing that the length of the matching pin 68 is reduced to the first segment of the corresponding signal pin and the coating of the fixing glue. The matching pin 68 is connected by a metal wire 70, and one end of the metal wire 70 is soldered. The electrical connection purpose is achieved by the ground circuit 18 of the circuit board 10. More specifically, the metal wires 70 are placed in parallel on one side of the adjacent signal pins 69, and the metal wires 70 are externally covered with an insulating layer 71 to keep the metal wires 70 and the signal pins 69 at a fixed pitch and electrically isolated. In addition, the length of the wire 70 extends from the tail 69a of the signal pin 69 to the body 69b of the signal pin 69, so that the needle tail 69a of the signal pin 69 reaches the impedance matching effect of the body 69b, thereby effectively reducing the signal pin. Inductive load on 69 to improve its high frequency test signal transmission capability. Generally, the metal wire 70 and the signal pin 69 can be separated as shown in FIG. 15, or can be abutted, because the outer surface of the metal wire 70 is covered with the insulating layer 71, under the structure in which the metal wire 70 and the signal pin 69 abut. The spacing between the metal line 70 and the signal pin 69 can be controlled by the thickness of the insulating layer 71. The grounding method of the aforementioned matching pin is also applicable to the above embodiments.
圖16為第十較佳實施例，揭示本發明之訊號針72、接地針74及匹配針76是透過連接一軟性電路板78而與電路板80電性連接。即該軟性電路板78一端直接銲固於電路板80上，且軟性電路板78之複數導線(圖未示)一端各別連接電路板80的訊號接點與接地接點，導線另一端則再各別與訊號針72、接地針74及匹配針76連接，以達電性連接目的。前述連接方式亦適用於上述各實施例。FIG. 16 shows a tenth preferred embodiment. The signal pin 72, the grounding pin 74 and the matching pin 76 of the present invention are electrically connected to the circuit board 80 through a flexible circuit board 78. That is, one end of the flexible circuit board 78 is directly soldered to the circuit board 80, and the plurality of wires (not shown) of the flexible circuit board 78 are respectively connected to the signal contacts of the circuit board 80 and the ground contacts, and the other end of the wires is re-connected. Each is connected to the signal pin 72, the grounding pin 74 and the matching pin 76 for electrical connection purposes. The foregoing connection method is also applicable to the above embodiments.
以上所述僅為本發明較佳可行實施例而已，舉凡應用本發明說明書及申請專利範圍所為之等效結構及製作方法變化，理應包含在本發明之專利範圍內。The above description is only for the preferred embodiments of the present invention, and the equivalent structures and manufacturing methods of the present invention and the scope of the patent application are intended to be included in the scope of the present invention.
100．．．探針卡100. . . Probe card
200．．．待測電子迴路接點200. . . Electronic circuit contact to be tested
10．．．電路板10. . . Circuit board
12．．．開口12. . . Opening
14．．．表面14. . . surface
16．．．訊號接點16. . . Signal contact
18．．．接地接點18. . . Ground contact
20．．．定位環20. . . Locating ring
22．．．固定膠twenty two. . . Fixing glue
22a．．．端面22a. . . End face
24．．．訊號針twenty four. . . Signal pin
24a．．．身部24a. . . Body
24b．．．針尾24b. . . Needle tail
24c．．．針尖24c. . . Tip
24d．．．針先段24d. . . Needle segment
25．．．絕緣層25. . . Insulation
26．．．接地針26. . . Grounding pin
26a．．．尾端26a. . . Tail end
26b．．．針尖26b. . . Tip
28．．．匹配針28. . . Matching needle
30．．．剛性導體30. . . Rigid conductor
32．．．訊號針32. . . Signal pin
32a．．．針先段32a. . . Needle segment
32b．．．針尖32b. . . Tip
34．．．接地針34. . . Grounding pin
36．．．固定膠36. . . Fixing glue
36a．．．端面36a. . . End face
38．．．匹配針38. . . Matching needle
38a．．．阻抗匹配段38a. . . Impedance matching segment
38b．．．導電段38b. . . Conductive section
38c．．．末端38c. . . End
40．．．匹配針40. . . Matching needle
42．．．導電段42. . . Conductive section
42a．．．勾部42a. . . Hook
44．．．接地針44. . . Grounding pin
46．．．導電段46. . . Conductive section
46a．．．勾部46a. . . Hook
48．．．匹配針48. . . Matching needle
49．．．導電段49. . . Conductive section
49a．．．圈繞部49a. . . Loop
50．．．接地針50. . . Grounding pin
52．．．接地針52. . . Grounding pin
52a．．．穿孔52a. . . perforation
54．．．匹配針54. . . Matching needle
55．．．導電段55. . . Conductive section
56．．．接地針56. . . Grounding pin
58．．．導電塊58. . . Conductive block
58a．．．側孔58a. . . Side hole
60．．．匹配針60. . . Matching needle
61．．．導電段61. . . Conductive section
62．．．匹配針62. . . Matching needle
62a．．．彎折段62a. . . Bending section
64．．．銅箔64. . . Copper foil
66．．．接地針66. . . Grounding pin
68．．．匹配針68. . . Matching needle
69．．．訊號針69. . . Signal pin
69a．．．針尾69a. . . Needle tail
69b．．．身部69b. . . Body
70．．．金屬線70. . . metal wires
71．．．絕緣層71. . . Insulation
72．．．訊號針72. . . Signal pin
74．．．接地針74. . . Grounding pin
76．．．匹配針76. . . Matching needle
78．．．軟性電路板78. . . Flexible circuit board
80．．．電路板80. . . Circuit board
圖1為一種已知懸臂式探針卡的局部示意圖。Figure 1 is a partial schematic view of a known cantilevered probe card.
圖2為另一種已知懸臂式探針卡的局部示意圖。2 is a partial schematic view of another known cantilevered probe card.
圖3為本發明第一較佳實施例之懸臂式探針卡示意圖。3 is a schematic view of a cantilever probe card according to a first preferred embodiment of the present invention.
圖4為圖3之局部放大圖。Figure 4 is a partial enlarged view of Figure 3.
圖5為本發明第二較佳實施例之局部放大圖。Figure 5 is a partial enlarged view of a second preferred embodiment of the present invention.
圖6為圖5之局部前視圖，揭示匹配針的導電段未接觸接地針。Figure 6 is a partial front elevational view of Figure 5 showing the conductive segments of the mating pins not contacting the ground pins.
圖7類同圖6，揭示匹配針的導電段接觸接地針。Figure 7 is similar to Figure 6, which reveals that the conductive segments of the matching pins contact the ground pins.
圖8為本發明第三較佳實施例之局部前視圖。Figure 8 is a partial front elevational view of a third preferred embodiment of the present invention.
圖9為本發明第四較佳實施例之局部前視圖。Figure 9 is a partial front elevational view of a fourth preferred embodiment of the present invention.
圖10及圖11為本發明第五較佳實施例之局部示意圖。10 and 11 are partial schematic views of a fifth preferred embodiment of the present invention.
圖12為本發明第六較佳實施例之局部前視圖。Figure 12 is a partial front elevational view of a sixth preferred embodiment of the present invention.
圖13為本發明第七較佳實施例之局部前視圖。Figure 13 is a partial front elevational view of a seventh preferred embodiment of the present invention.
圖14為本發明第八較佳實施例之局部前視圖。Figure 14 is a partial front elevational view of an eighth preferred embodiment of the present invention.
圖15為本發明第九較佳實施例之示意圖。Figure 15 is a schematic view of a ninth preferred embodiment of the present invention.
圖16為本發明第十較佳實施例之示意圖Figure 16 is a schematic view of a tenth preferred embodiment of the present invention
22．．．固定膠twenty two. . . Fixing glue
22a．．．端面22a. . . End face
24．．．訊號針twenty four. . . Signal pin
24a．．．身部24a. . . Body
24c．．．針尖24c. . . Tip
24d．．．針先段24d. . . Needle segment
25．．．絕緣層25. . . Insulation
26．．．接地針26. . . Grounding pin
26b．．．針尖26b. . . Tip
28．．．匹配針28. . . Matching needle
30．．．剛性導體30. . . Rigid conductor
Claims (24)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100108318A TWI425220B (en) | 2011-03-11 | 2011-03-11 | Cantilever probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW100108318A TWI425220B (en) | 2011-03-11 | 2011-03-11 | Cantilever probe card |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201237426A TW201237426A (en) | 2012-09-16 |
| TWI425220B true TWI425220B (en) | 2014-02-01 |
Family
ID=47223128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW100108318A TWI425220B (en) | 2011-03-11 | 2011-03-11 | Cantilever probe card |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI425220B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI612312B (en) * | 2017-05-03 | 2018-01-21 | 創意電子股份有限公司 | Probe card system, probe loader device and manufacturing method of the probe loader device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7049835B2 (en) * | 1996-12-12 | 2006-05-23 | Boll Gregory G | Probe card for high speed testing |
| TW201000913A (en) * | 2008-06-19 | 2010-01-01 | King Yuan Electronics Co Ltd | Probe card assembly and probes therein |
| TW201017180A (en) * | 2008-10-28 | 2010-05-01 | Mpi Corp | Vertical-type probe device |
-
2011
- 2011-03-11 TW TW100108318A patent/TWI425220B/en not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7049835B2 (en) * | 1996-12-12 | 2006-05-23 | Boll Gregory G | Probe card for high speed testing |
| TW201000913A (en) * | 2008-06-19 | 2010-01-01 | King Yuan Electronics Co Ltd | Probe card assembly and probes therein |
| TW201017180A (en) * | 2008-10-28 | 2010-05-01 | Mpi Corp | Vertical-type probe device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI612312B (en) * | 2017-05-03 | 2018-01-21 | 創意電子股份有限公司 | Probe card system, probe loader device and manufacturing method of the probe loader device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201237426A (en) | 2012-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI482973B (en) | Wire material for spring, contact probe, and probe unit | |
| US20070200584A1 (en) | High frequency cantilever-type probe card | |
| CN201522509U (en) | High-frequency short arm probe card | |
| TWI447397B (en) | Probe card | |
| TWI405974B (en) | Cantilever high frequency probe card | |
| CN102692528B (en) | Cantilever type probe card | |
| TWI425220B (en) | Cantilever probe card | |
| JP5219633B2 (en) | High frequency measurement probe | |
| JP5572066B2 (en) | Test board | |
| JP2005351731A (en) | Test socket | |
| JP3878578B2 (en) | Contact probe, semiconductor and electrical inspection apparatus using the same | |
| TWM539623U (en) | Probe card | |
| TWI564567B (en) | Probe card and its probe module and signal probe | |
| JP6133664B2 (en) | Manufacturing method of electronic equipment | |
| US7710134B2 (en) | Probe card assembly | |
| TWI741531B (en) | Test device | |
| JP6328284B2 (en) | Electronics | |
| JP3183676U (en) | Probe pin for semiconductor inspection | |
| KR101785636B1 (en) | Coaxial probe needle device | |
| JP6455451B2 (en) | Coaxial probe | |
| JPS63122141A (en) | Semiconductor element inspecting device | |
| US20110043192A1 (en) | Coaxial-cable probe structure | |
| TWI515438B (en) | High frequency probe module | |
| JP2014116541A (en) | Multilayer printed wiring board | |
| TWI461698B (en) | Probe unit and its making method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |