CN102681334B - 从容纳容器取出大型表膜构件的取出方法 - Google Patents
从容纳容器取出大型表膜构件的取出方法 Download PDFInfo
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- CN102681334B CN102681334B CN201210140722.8A CN201210140722A CN102681334B CN 102681334 B CN102681334 B CN 102681334B CN 201210140722 A CN201210140722 A CN 201210140722A CN 102681334 B CN102681334 B CN 102681334B
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-179041 | 2007-07-06 | ||
JP2007179054 | 2007-07-06 | ||
JP2007179041 | 2007-07-06 | ||
JP2007-179054 | 2007-07-06 | ||
CN200880023582.8A CN101689018B (zh) | 2007-07-06 | 2008-07-02 | 大型表膜构件的框体及该框体的把持方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200880023582.8A Division CN101689018B (zh) | 2007-07-06 | 2008-07-02 | 大型表膜构件的框体及该框体的把持方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102681334A CN102681334A (zh) | 2012-09-19 |
CN102681334B true CN102681334B (zh) | 2015-09-30 |
Family
ID=40228472
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210140722.8A Active CN102681334B (zh) | 2007-07-06 | 2008-07-02 | 从容纳容器取出大型表膜构件的取出方法 |
CN200880023582.8A Active CN101689018B (zh) | 2007-07-06 | 2008-07-02 | 大型表膜构件的框体及该框体的把持方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200880023582.8A Active CN101689018B (zh) | 2007-07-06 | 2008-07-02 | 大型表膜构件的框体及该框体的把持方法 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP2010102357A (ko) |
KR (2) | KR101264571B1 (ko) |
CN (2) | CN102681334B (ko) |
TW (2) | TWI498671B (ko) |
WO (1) | WO2009008294A1 (ko) |
Families Citing this family (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5051840B2 (ja) * | 2007-11-22 | 2012-10-17 | 信越化学工業株式会社 | ペリクル収納容器内にペリクルを保管する方法 |
JP5134436B2 (ja) * | 2008-05-27 | 2013-01-30 | 信越化学工業株式会社 | リソグラフィ用ペリクル |
CN102944973B (zh) * | 2008-09-12 | 2015-01-21 | 旭化成电子材料株式会社 | 表膜构件框体、表膜构件和表膜构件框体的使用方法 |
JP5411595B2 (ja) * | 2009-06-24 | 2014-02-12 | 信越化学工業株式会社 | ペリクルフレーム及びリソグラフィ用ペリクル |
JP5411596B2 (ja) * | 2009-06-24 | 2014-02-12 | 信越化学工業株式会社 | ペリクルフレーム及びリソグラフィ用ペリクル |
JP2011034020A (ja) * | 2009-08-06 | 2011-02-17 | Shin-Etsu Chemical Co Ltd | ペリクル収納容器 |
KR101306352B1 (ko) | 2009-10-07 | 2013-09-09 | 미쓰이 가가쿠 가부시키가이샤 | 펠리클 및 그의 마스크 접착제 |
JP4879308B2 (ja) * | 2009-10-29 | 2012-02-22 | 信越化学工業株式会社 | ペリクル剥離用冶具および剥離方法 |
JP4951051B2 (ja) * | 2009-10-30 | 2012-06-13 | 信越化学工業株式会社 | ペリクルフレーム及びペリクル |
JP5731147B2 (ja) * | 2010-09-01 | 2015-06-10 | 旭化成イーマテリアルズ株式会社 | ペリクル用枠体及びペリクル |
JP5579545B2 (ja) * | 2010-09-03 | 2014-08-27 | 旭化成イーマテリアルズ株式会社 | 大型ペリクル用枠体、大型ペリクル及び大型ペリクル用枠体の製造方法 |
JP2012093595A (ja) * | 2010-10-28 | 2012-05-17 | Shin Etsu Chem Co Ltd | ペリクルフレームおよびペリクル |
JP5649134B2 (ja) * | 2011-02-08 | 2015-01-07 | 信越化学工業株式会社 | ペリクルフレーム |
JP5722760B2 (ja) * | 2011-02-08 | 2015-05-27 | 信越化学工業株式会社 | ペリクル製造用キット |
JP5663376B2 (ja) * | 2011-04-04 | 2015-02-04 | 信越化学工業株式会社 | ペリクルフレーム、その製造方法、及びペリクル |
JP5618888B2 (ja) * | 2011-04-04 | 2014-11-05 | 信越化学工業株式会社 | ペリクル及びペリクル膜の製造方法 |
JP5940283B2 (ja) * | 2011-11-04 | 2016-06-29 | 信越化学工業株式会社 | ペリクル |
JP2013195950A (ja) * | 2012-03-22 | 2013-09-30 | Toppan Printing Co Ltd | ベルクル及びフォトマスク |
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JP5984187B2 (ja) * | 2013-04-22 | 2016-09-06 | 信越化学工業株式会社 | ペリクルとフォトマスクのアセンブリ |
WO2014203992A1 (ja) * | 2013-06-21 | 2014-12-24 | 三井屋工業株式会社 | 板材の端部の処理方法、板材の製造方法、板材の端部の処理装置、及び、板材 |
JP6389353B2 (ja) * | 2013-08-15 | 2018-09-12 | 旭化成株式会社 | ペリクル枠体及びペリクル |
KR101918687B1 (ko) | 2014-01-28 | 2018-11-14 | 삼성전자주식회사 | 펠리클 |
WO2015166927A1 (ja) * | 2014-05-02 | 2015-11-05 | 三井化学株式会社 | ペリクル枠、ペリクル及びその製造方法、露光原版及びその製造方法、露光装置、並びに半導体装置の製造方法 |
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CN106796391B (zh) | 2014-09-19 | 2020-02-11 | 三井化学株式会社 | 防护膜组件、防护膜组件的制造方法及使用了防护膜组件的曝光方法 |
SG11201701805QA (en) * | 2014-09-19 | 2017-04-27 | Mitsui Chemicals Inc | Pellicle, production method thereof, exposure method |
JP6304884B2 (ja) * | 2014-09-22 | 2018-04-04 | 信越化学工業株式会社 | ペリクルの貼り付け方法 |
US10558129B2 (en) | 2014-11-17 | 2020-02-11 | Asml Netherlands B.V. | Mask assembly |
KR102082784B1 (ko) * | 2014-12-11 | 2020-03-02 | 삼성디스플레이 주식회사 | 마스크 프레임 조립체, 그 제조 방법 및 유기 발광 표시 장치의 제조 방법 |
JP6347741B2 (ja) * | 2014-12-25 | 2018-06-27 | 信越化学工業株式会社 | ペリクル |
JP6519190B2 (ja) * | 2015-01-16 | 2019-05-29 | 日本軽金属株式会社 | ペリクル用支持枠 |
JP2016139103A (ja) * | 2015-01-29 | 2016-08-04 | 日本軽金属株式会社 | ペリクル用支持枠 |
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JP7103252B2 (ja) * | 2019-02-01 | 2022-07-20 | 信越化学工業株式会社 | ペリクルフレーム、ペリクル、マスク粘着剤付ペリクルフレーム、ペリクル付露光原版、露光方法及び半導体の製造方法 |
JP7347789B2 (ja) * | 2019-07-09 | 2023-09-20 | 三井化学株式会社 | ペリクル枠体及びペリクル |
TW202129404A (zh) * | 2020-01-21 | 2021-08-01 | 日商信越化學工業股份有限公司 | 防護薄膜框架、防護薄膜、帶防護薄膜的曝光原版及曝光方法、以及半導體或液晶顯示器的製造方法 |
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TWI498671B (zh) | 2015-09-01 |
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CN101689018B (zh) | 2013-03-20 |
CN101689018A (zh) | 2010-03-31 |
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JP2014098913A (ja) | 2014-05-29 |
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TW200919081A (en) | 2009-05-01 |
TW201523125A (zh) | 2015-06-16 |
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TWI641904B (zh) | 2018-11-21 |
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